Radio frequency chip aging test bench and device

Abstract

The utility model relates to the field of chip intelligent testing, and discloses a radio frequency chip aging test seat and device. In the utility model, a chip link seat used for connecting a signal pin of a radio frequency chip to be tested comprises one or more radiation probes; one end of the radiation probe is connected with a signal pin carrying a radio frequency test signal in the radio frequency chip to be tested, and the radiation probe keeps open circuit in the aging test process of the radio frequency chip to be tested and is not connected with other signals except the radio frequency test signal. In the aging test process of the radio frequency chip to be tested, the radio frequency test signal generated on the signal pin is radiated, so that when the radio frequency reaches a millimeter wave level, link matching can be accurately realized in the aging test.

Description

Technical Field

[0001] The utility model relates to the field of chip intelligent testing, in particular to a radio frequency chip aging test and device. Background Art

[0002] The service life of a car is bound to be much longer than that of an average smartphone, and the failure of key components in automotive electronics may have safety consequences. With the development of automotive electronics, the concern about semiconductor aging is increasing.

[0003] High Temperature Operating Life Test (HTOL) is a key basic test for chip circuit reliability. It simulates the long-term operation of the chip in a stress acceleration manner to evaluate the chip life and long-term power-on reliability at one time. It is usually called aging test.

[0004] For power amplifiers, the design of the power amplifier matching network is the key to achieving optimal performance. The output impedance controls the power, gain, and noise transmitted to the output. When the output impedance (amplifier) ​​can fully match the power amplifier, the power amplifier works in the optimal state, and the output power of the power amplifier is fully transmitted to the RF link; when the output impedance and the power amplifier are not fully matched, the power amplifier will be affected by the power reflected from the external RF link. In the HTOL test, when the power amplifier is not well matched, the power reflected from the outside will bring additional aging effects to the circuit, making the link aging worse than the actual working state. Similarly, there is a similar situation for the RX link. Utility Model Content

[0005] The purpose of the embodiments of the utility model is to provide a radio frequency chip aging test socket and device, so that when the radio frequency reaches the millimeter wave level, link matching can be accurately achieved in the aging experiment.

[0006] In order to solve the above technical problems, an embodiment of the utility model provides a radio frequency chip aging test socket, comprising: a chip link socket, used to connect the signal pin of the radio frequency chip to be tested, and radiate the radio frequency test signal generated on the signal pin during the aging test of the radio frequency chip to be tested to achieve impedance matching; the chip link socket comprises: one or more radiation probes; one end of the radiation probe is connected to the signal pin carrying the radio frequency test signal in the radio frequency chip to be tested, and remains open during the aging test of the radio frequency chip to be tested, and is not connected to any signal other than the radio frequency test signal, and is used to radiate the radio frequency test signal.

[0007] An embodiment of the utility model provides a radio frequency chip aging test device, and the device comprises the above-mentioned radio frequency chip aging test socket.

[0008] In an embodiment of the utility model, a chip link socket for connecting a signal pin of the RF chip to be tested contains one or more radiation probes; one end of the radiation probe is connected to a signal pin carrying a RF test signal in the RF chip to be tested, and remains open during the aging test of the RF chip to be tested, and is not connected to any signal other than the RF test signal. During the aging test of the RF chip to be tested, the RF test signal generated on the signal pin is radiated, so that when the RF frequency reaches the millimeter wave level, link matching can be accurately achieved in the aging experiment. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0010] Figure 1 This is a schematic diagram of the structure of the radio frequency chip test socket provided by the utility model;

[0011] Figure 2 It is a principle schematic diagram of the monopole antenna provided by the utility model;

[0012] Figure 3 It is a schematic diagram of the structure of the chip link seat provided by the utility model;

[0013] Figure 4 This is an equivalent schematic diagram of the probe on the chip link base provided by the utility model as a monopole antenna;

[0014] Figure 5 It is a structural schematic diagram of a test circuit board provided by the utility model and provided with a metal conductor;

[0015] Figure 6 It is an equivalent schematic diagram of using the probe as a loop antenna according to the metal connector provided by the utility model. DETAILED DESCRIPTION

[0016] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, each embodiment of the utility model will be described in detail below in conjunction with the accompanying drawings. However, it can be understood by those skilled in the art that in each embodiment of the utility model, many technical details are proposed in order to enable readers to better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical scheme claimed in the present application can also be implemented. The division of the following embodiments is for the convenience of description, and should not constitute any limitation on the specific implementation of the utility model. The various embodiments can be combined and referenced with each other under the premise of no contradiction.

[0017] The chip test socket currently used for aging test is as follows Figure 1 As shown, during the test, the chip will be placed in the device area (Housing) in the chip test seat (see Figure 1 No. 1 in the figure), when the upper cover part (see Figure 1 When the chip is covered with the cover number 2), a downward pressure is applied to the chip, which causes the spring pins under the chip pins (such as Figure 1 The enlarged partial diagram on the right) is in a compressed state, thereby achieving metal connection between the pins on the chip and the PCB board below.

[0018] In the related technologies in this field, when the frequency of the RF link is relatively low, impedance matching can generally be performed by adjusting the resistors, capacitors, inductors and other electronic components on the PCB board to achieve link matching, ensuring that the output impedance can be fully matched with the power amplifier and the power amplifier can operate in the optimal state; however, when the RF frequency reaches the millimeter wave level, traditional resistors, capacitors, inductors and other electronic components can no longer play their role at low frequencies, and because the wavelength of millimeter waves is very short and very sensitive to size and working environment, the existing link matching method will no longer be applicable. At the same time, the chip test socket also has one or more probes for connecting to the signal pins of the RF chip to be tested under the RF chip, such as Figure 1 As shown in the partially enlarged schematic diagram on the right, during the aging test, such a signal pin probe will introduce a relatively large inductance into the RF link for testing the millimeter-wave RF chip to be tested, and due to the influence of factors such as the length of the probe itself and the environment inside the chip test socket on the RF link, it will make it difficult to achieve link matching.

[0019] This application takes into account the requirements of the millimeter wave radio frequency link for external impedance and combines the structural features of the chip test socket to propose the use of a radiation structure to achieve the external matching state of the radio frequency link; the purpose is to achieve the matching of the radio frequency link without increasing or reducing the process cost. The specific embodiments are further described below.

[0020] The present application discloses a radio frequency chip aging test socket, including a chip link socket, which is used to connect the signal pins of the radio frequency chip to be tested, and radiate the radio frequency test signal generated on the signal pins during the aging test of the radio frequency chip to be tested, thereby performing an aging test; in addition to the chip link socket involved in the present application, it may also include a cover plate for pressing the radio frequency chip to be tested and other features and components known to ordinary technicians in the field, which will not be elaborated here.

[0021] Under normal circumstances, the chip link socket includes many probes for connecting to the pins on the RF chip to be tested. These probes will produce different functions depending on the connected pins. For example, the probes connected to the power supply are used for conduction, and the probes connected to various signals are used to transmit test signals. The embodiments of the present application mainly relate to the improvement of the probes that are connected to the signal pins carrying the RF test signals in the RF chip to be tested.

[0022] Specifically, the chip link socket includes one or more radiation probes; one end of the radiation probe is used to connect to the signal pin carrying the RF test signal in the RF chip to be tested, and remains open during the aging test of the RF chip to be tested, and is not connected to any signals other than the RF test signal. An open circuit can be achieved without connecting any electronic components or devices under the probe. Keeping the open circuit also means that no current will flow through the position of the radiation probe in the equivalent circuit, which also means that it will not be connected to the power supply through a conductor. The radiation probe is used to radiate the RF test signal generated on the signal pin during the aging test of the RF chip to be tested, so that very little energy is returned to the chip, thereby enabling accurate link matching in the aging experiment when the RF frequency reaches the millimeter wave level.

[0023] The principle of the radiation probe radiating the RF test signal generated on the signal pin during the aging test of the RF chip to be tested is similar to the principle of the monopole antenna radiating the signal, such as Figure 2 As shown, the monopole antenna is mainly composed of a vertical monopole antenna with a quarter wavelength (λ / 4). The monopole antenna is installed on a ground plane to radiate the received signal and direct the excess power into the ground. Therefore, after applying this principle to the chip link socket of the present application, the power reflected back from the external RF link to the RF chip under test during the test can be greatly reduced through signal radiation, thereby reducing link aging. The ground plane on which the monopole antenna is installed can be the actual ground or an artificial ground plane such as a vehicle body carrying a tool. The feeding of the monopole antenna is carried out at the lower end using a coaxial cable, and the ground conductor of the feeder is connected to the platform.

[0024] Figure 3 This is the overall structure of the socket when the HTOL test is proposed in this application. Figure 3 The middle probe B is the radiation probe proposed in this application. The signal pin A1 on the chip is in contact with the radiation probe and is used to transmit the radio frequency test signal. The signal pin A1 utilizes the ball grid array (BGA) integrated circuit packaging technology to make spherical bumps on the back of the packaging structure to replace traditional pins. The signal pin A1 is used to assemble the chip on the front side of the substrate. Figure 3 In the embodiment, the chip has a metal structure on the chip as shown in the figure, and the package structure is immediately below the metal structure on the chip. Figure 3 The chip pins in the chip adopt the ball grid array structure (Ball Grid Array, referred to as BGA). Figure 3 The probes (PIN needles) in the socket that are not connected to the signal pin A1 on the chip with the RF test signal are all conventional probes. The conventional probes will be connected to the conventional pin A2 on the corresponding chip respectively, and their corresponding functions will not be discussed in detail here. The printed circuit board (PCB) plate, metal gasket and metal conductor on the PCB shown in the figure are all structures on the test circuit board, which will be explained in detail in the examples related to the test circuit board below. It should be noted here that the radiation probe B needs to remain open at the PCB end and not be connected to other signals, especially not to the GND signal. The PCB board here can be selected from a regular thickness plate or a thicker plate, so that the impedance matching effect during the test process is better.

[0025] The length of the radiation probe used in the HTOL experiment can be specially customized to a certain length. If the length is selected appropriately, it can reach the length required for monopole radiation, thereby achieving the effect of signal energy being radiated to the chip end through the radiation probe and having a good echo characteristic. The equivalent model reference Figure 4 As shown, it can be seen that the signal pin A1 and the radiation probe B form a structure similar to a monopole antenna. The length of each probe in the figure (including the radiation probe B) and the RF wavelength of the RF test signal during the aging test of the RF chip to be tested can satisfy the following functional relationship:

[0026] H1=(2n+1)λ / 4;

[0027] Wherein, H1 is the length of the radiation probe, λ is the operating wavelength of the radio frequency test signal, and n is a natural number.

[0028] When the above functional relationship is satisfied, the radiation probe can better radiate the signal transmitted on it based on the principle of a monopole antenna, so that the energy returned to the chip is very small, thereby achieving impedance matching in the HTOL test environment. Furthermore, the effect is best when the length of the probe is 1 / 4 of the RF wavelength of the RF test signal during the aging test of the RF chip to be tested. If the length of the probe cannot reach 1 / 4 of the working wavelength due to actual conditions, the length of the probe can be extended to 2n+1 times of the 1 / 4 working wavelength, so that the signal transmitted on the probe is radiated, so that the energy returned to the chip is very small, thereby achieving impedance matching in the HTOL test environment.

[0029] In one example, the aging test socket of the RF chip to be tested in the present application also includes a test circuit board, which is placed under the chip link socket. Affected by actual test conditions, since the adjustment range of the spacing between the chip and the test circuit board is subject to certain restrictions, the spacing between the chip and the test circuit board may be too low to satisfy the above functional relationship. In this regard, in an example Figure 5 In the example shown, a metal conductor C is arranged on the test circuit board and is located directly below the radiation probe B. The metal conductor C can be a metal hole structure or a metal part structure, but unlike those metal hole structures that run through the entire PCB board, the metal conductor C here is connected to the radiation probe B, and together with the radiation probe B and the signal pin A1, radiates the RF test signal using the monopole antenna principle. The metal conductor C does not penetrate the test circuit board and is used to enhance the radiation effect of the radiation probe on the RF test signal during the aging test of the RF chip to be tested.

[0030] When the sum of the length of the radiation probe and the length of the metal conductor satisfies the following functional relationship with the RF wavelength of the RF test signal during the aging test of the RF chip to be tested:

[0031] H2=(2n+1)λ / 4;

[0032] Wherein, H2 is the sum of the length of the probe and the length of the metal conductor, λ is the operating wavelength of the radio frequency test signal, and n is a natural number.

[0033] When the above functional relationship is satisfied, the radiation probe can better radiate the signal transmitted on it based on the principle of a monopole antenna, so that the energy returned to the chip is very small, thereby achieving impedance matching in the HTOL test environment. Furthermore, the sum of the length of the probe and the length of the metal conductor is an integer multiple of 1 / 4 of the working wavelength of the RF test signal during the aging test of the RF chip to be tested. It can be seen that the role of the metal conductor is to make an equivalent extension of the radiation probe to achieve the same or similar radiation effect as the above embodiment, thereby achieving impedance matching in the HTOL test environment.

[0034] In addition to radiating signals using the principle of a monopole antenna, the principle of a loop antenna can also radiate signals transmitted on it, so that very little energy is returned to the chip. A loop antenna is a structure in which a metal wire is wound into a certain shape, such as a circle, square, triangle, etc., with both ends of the conductor as output ends. Such a loop antenna structure can radiate the received transmission signal based on the duality principle of electromagnetic radiation, so that the radiation along the ring axis of the loop antenna remains zero. The specific method of using the principle of a loop antenna to radiate signals in this application can be as follows: Figure 6 As shown, in Figure 6 In the example shown in the figure, the signal pin A1 is connected to the radiation probe B, and the ground probe B' is connected to the signal pin A3 connected to the ground wire in the RF chip to be tested. Figure 6The probes (PIN needles) that are not directly or indirectly connected to the signal pin A1 on the chip with the RF test signal are all conventional probes, which are connected to other conventional pins A2 on the chip. The aging test socket of the RF chip to be tested in this application also includes: a metal connector D, which is located on the test circuit board and is used to connect a radiation probe B and a ground probe B' (that is, the radiation probe B and the ground probe B' are connected through the metal connector D to form a path). The radiation probe B and the ground probe B' will form a series structure under the action of the metal connector D to enhance the radiation effect of the RF test signal; since the ground probe B' is connected to the signal pin A3 connected to the ground wire in the RF chip to be tested, the radiation probe B is connected to the signal pin A1. Thus, the metal connector D, the radiation probe B and the ground probe B', the signal pin A3 connected to the ground, and the signal pin A1 can form a square ring antenna structure together, and therefore, according to the duality principle of electromagnetic radiation, the received transmission signal can be radiated and the excess power can be introduced into the ground. Therefore, after applying this principle to the chip link seat of the present application, the power reflected from the external RF link during the test process can be eliminated, reducing link aging. It is worth noting that since the ring antenna structure uses the duality principle of electromagnetic radiation to eliminate the power reflected from the external RF link during the test process, unlike a monopole antenna installed on a ground plane, the ring antenna structure does not need to use a monopole antenna with a quarter wavelength (λ / 4) to introduce excess power into the ground, so there is no need to adjust the length of the radiation probe B and the ground probe B'. In one example, the metal connector preferably uses a sheet-like metal gasket, which can protect the test circuit board and further prevent the radiation probe or the ground probe from piercing the test circuit board.

[0035] In addition, the chip test socket used for aging test mostly places the chip in the device area (Housing) in the chip test socket. When the upper cover is closed, a downward pressure will be applied to the chip. In order to avoid chip damage caused by direct rigid contact between the chip, each probe and the PCB board, a spring or spring needle can be added to the chip test socket. The spring or spring needle mainly plays a buffering role. The spring can be added to the probe including the above-mentioned radiation probe, so that the probe with the added spring has the function of the spring needle while retaining its original function. When the upper cover is closed, the spring needle under the chip pin will be in a compressed state, thereby ensuring that the connection between the pins on the chip, the PCB board below and the each probe is tight enough and will not damage the chip and the PCB board.

[0036] In addition, by using the aging test socket for the RF chip to be tested proposed in the HTOL test of this application, after the RF signal is radiated at the aging test socket for the RF chip to be tested, the corresponding aging board can be manufactured using the most economical and affordable board materials and manufacturing processes.

[0037] In this embodiment, a chip link socket for connecting a signal pin of a RF chip to be tested contains one or more radiation probes; one end of the radiation probe is connected to a signal pin carrying a RF test signal in the RF chip to be tested, and remains open during the aging test of the RF chip to be tested, and is not connected to any signal other than the RF test signal. During the aging test of the RF chip to be tested, the RF test signal generated on the signal pin is radiated, so that when the RF frequency reaches the millimeter wave level, link matching can be accurately achieved in the aging experiment.

[0038] It is worth mentioning that all modules involved in this embodiment are logic modules. In practical applications, a logic unit can be a physical unit, a part of a physical unit, or a combination of multiple physical units. In addition, in order to highlight the innovative part of the utility model, this embodiment does not introduce units that are not closely related to solving the technical problems proposed by the utility model, but this does not mean that there are no other units in this embodiment.

[0039] The description of the embodiments of the present application includes and contemplates the combination of features and elements known to those of ordinary skill in the art. The embodiments, features and elements disclosed in the present application may also be combined with any conventional features or elements to form a unique scheme defined by the claims. Any features or elements of any embodiment may also be combined with features or elements from other schemes to form another unique scheme defined by the claims. Therefore, it should be understood that any feature shown and / or discussed in the present application may be implemented individually or in any appropriate combination. Therefore, except for the limitations made according to the attached claims and their equivalents, the embodiments are not subject to other restrictions. In addition, various modifications and changes may be made within the scope of protection of the attached claims.

[0040] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0041] In the description of the embodiments of the present application, the orientations or positional relationships indicated by technical terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", and "circumferential" are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0042] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0043] Another embodiment of the utility model relates to a radio frequency chip aging test device, wherein the radio frequency chip aging test device structure includes the radio frequency chip aging test seat.

[0044] That is, those skilled in the art can understand that all or part of the capabilities of the RF chip aging test seat in the above-mentioned embodiment can be achieved through related hardware. In addition, in addition to the RF chip aging test seat, in order to realize the RF chip aging test, related equipment, programs or storage media are also required to cooperate with the RF chip aging test seat. The program needs to be stored in a storage medium, including several instructions to enable a device (which can be a single-chip microcomputer, chip, etc.) or a processor (processor) to execute all or part of the structures in the RF chip aging test seat in various embodiments of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk and other media that can store program codes.

[0045] Those skilled in the art will appreciate that the above-mentioned embodiments are specific examples for implementing the present invention, and in actual applications, various changes may be made thereto in form and detail without departing from the spirit and scope of the present invention.

Claims

1. A radio frequency chip aging test socket, characterized in that: include: Chip connector, used to connect the signal pins of the RF chip to be tested; The chip link seat includes at least one radiation probe; one end of the radiation probe is connected to a signal pin carrying a radio frequency test signal in the radio frequency chip to be tested, and the other end of the radiation probe remains open, and the radiation probe is used to radiate the radio frequency test signal.

2. The RF chip aging test socket according to claim 1, characterized in that: The length of the probe and the working wavelength of the RF test signal satisfy the following functional relationship: H1=(2n+1)λ / 4; Wherein, H1 is the length of the probe, λ is the working wavelength of the radio frequency test signal, and n is a natural number.

3. The RF chip aging test socket according to claim 2, characterized in that: The length of the probe is 1 / 4 of the radio frequency wavelength of the radio frequency test signal during the aging test of the radio frequency chip to be tested.

4. The RF chip aging test socket according to claim 1, characterized in that: The test socket further includes: A test circuit board, the test circuit board is located below the chip link seat, and the test circuit board has a metal conductor arranged below the radiation probe; The metal conductor is connected to the radiation probe, and the metal conductor does not penetrate the test circuit board.

5. The RF chip aging test socket according to claim 4, characterized in that: The sum of the length of the probe and the length of the metal conductor satisfies the following functional relationship with the RF wavelength of the RF test signal during the aging test of the RF chip to be tested: H2=(2n+1)λ / 4; Among them, H2 is the sum of the length of the probe and the length of the metal conductor, λ is the radio frequency wavelength of the radio frequency test signal during the aging test of the radio frequency chip to be tested, and n is a natural number.

6. The RF chip aging test socket according to claim 4, characterized in that: The sum of the length of the probe and the length of the metal conductor is 1 / 4 of the radio frequency wavelength of the radio frequency test signal during the aging test of the radio frequency chip to be tested.

7. The RF chip aging test socket according to claim 4, characterized in that: The metal conductor is a metal hole structure on the test circuit board.

8. The RF chip aging test socket according to claim 4, characterized in that: The test seat also includes: A metal connector, the metal connector is located on the test circuit board and is used to connect one of the radiation probes and a ground probe. The radiation probe and the ground probe will form a series structure under the action of the metal connector to enhance the radiation effect of the radio frequency test signal; Wherein, the ground wire probe is connected to a signal pin connected to the ground wire in the radio frequency chip to be tested.

9. The RF chip aging test socket according to claim 8, characterized in that: The metal connecting piece is a metal gasket, which is used to protect the test circuit board and prevent the radiation probe and / or the ground probe from piercing the test circuit board.

10. A radio frequency chip aging test device, characterized in that: include: The RF chip aging test socket according to any one of claims 1 to 9.

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