Electronic equipment and functional module

Abstract

The utility model provides electronic equipment and a functional module, the electronic equipment comprises a target interface and a target card board, the target interface is configured on a mainboard, and when a target card board is configured on the target interface, one side, close to the mainboard, of the target card board is provided with a first functional layer; the first functional layer is used for providing a first energy source acting on the mainboard, and the first energy source is obtained by converting a second energy source provided by the target interface. According to the application, the target interface is configured on the mainboard, and the target board card is configured in the target interface, so that the first functional layer of the target board card is stably attached and contacted with the mainboard, and the first functional layer can convert the second energy provided by the target interface into the first energy, thereby realizing transmission of the first energy to the mainboard.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment and a functional module. Background Art

[0002] Electronic equipment is a related product that uses electrical energy as the basis for its operation. It is found that temperature changes will affect the performance of electronic equipment during use. The reason is that capacitors will gradually lose their electrical properties in an ultra-low temperature environment. Therefore, in order to solve this technical problem, some embodiments have configured a heating device in the electronic equipment to cope with the ultra-low temperature environment. Specifically, a ceramic heating plate with an electrical connection is bonded to the control motherboard or the central processing unit to cope with the ultra-low temperature situation. Since the electrical connection method and installation method of the ceramic heating plate are relatively simple, and the temperature of the environment will also change dramatically with different situations, reliability problems of the installation structure are likely to occur in the long run, and the current assembly method is not conducive to maintenance and replacement of new heating devices. Utility Model Content

[0003] The embodiments of the present application provide an electronic device and a functional module.

[0004] The present application embodiment provides a functional module, including:

[0005] A target interface, wherein the target interface is configured on the main board;

[0006] A target board, wherein when the target board is configured on the target interface, a side of the target board close to the mainboard has a first functional layer;

[0007] The first functional layer is used to provide a first energy source acting on the mainboard, and the first energy source is obtained by converting a second energy source provided by the target interface.

[0008] In some embodiments of the first aspect of the present application, the first functional layer is a surface layer of the target board or a heating component detachably disposed on one side of the target board.

[0009] In some implementations of the first aspect of the present application, the target board further includes:

[0010] A micro control unit is arranged on a side of the target board away from the first functional layer, and is used to control the conversion between the first energy and the second energy.

[0011] In some embodiments of the first aspect of the present application, the micro control unit has a first functional module and a second functional module, and the first functional module is the same as or different from the second functional module;

[0012] The first functional module is used to trigger the target interface to transmit the second energy to the first functional layer when the ambient temperature meets the first condition;

[0013] The second functional module is used to prohibit the target interface from transmitting the second energy to the first functional layer when the ambient temperature does not meet the first condition.

[0014] In some implementations of the first aspect of the present application, the target board further includes a third functional module, and the third functional module is used to detect ambient temperature.

[0015] In some embodiments of the first aspect of the present application, the first functional layer is a surface layer of the target board, and a surface material of the surface layer close to the target board is a heat-insulating material for heat-insulating the first functional layer from the target board.

[0016] In some embodiments of the first aspect of the present application, the first functional layer is a heating component detachably disposed on one side of the target board, and the heating component includes a first sub-functional layer, a second sub-functional layer, and a third sub-functional layer;

[0017] One side of the second sub-functional layer is disposed in contact with one side of the third sub-functional layer to provide the first energy source;

[0018] The first sub-functional layer is bonded to the other side of the second sub-functional layer and is used to transfer the first energy to the main board;

[0019] The other side of the third sub-functional layer is in contact with or non-contact with the target board, and is used to thermally insulate the second sub-functional layer from the target board.

[0020] In some embodiments of the first aspect of the present application, the heating component further comprises:

[0021] Fixings and mounting parts;

[0022] The mounting piece is fixedly arranged on a side of the target board close to the main board, and is used for being detachably connected to the fixing piece;

[0023] The fixing member forms an assembly space for supporting the first sub-functional layer, the second sub-functional layer, and the third sub-functional layer.

[0024] In some embodiments of the first aspect of the present application, the number of the mounting members is plural and they are circumferentially arranged at the edge of the target board, the mounting members have a clamping opening, and the clamping opening faces a side away from the target board;

[0025] The fixing member includes a side surrounding portion and a limiting portion;

[0026] One side of the side surrounding portion is detachably connected to the mounting member by entering or exiting the clamping opening;

[0027] The limiting portion is arranged at the other side of the side surrounding portion, and forms the assembly space with the side surrounding portion.

[0028] A second aspect of the present application provides an electronic device, comprising:

[0029] Mainboard and functional modules;

[0030] The functional modules include:

[0031] A target interface, wherein the target interface is configured on the main board;

[0032] A target board, wherein when the target board is configured on the target interface, a side of the target board close to the mainboard has a first functional layer;

[0033] The first functional layer is used to provide a first energy source acting on the mainboard, and the first energy source is obtained by converting a second energy source provided by the target interface. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] By reading the detailed description below with reference to the accompanying drawings, the above and other purposes, features and advantages of the exemplary embodiments of the present application will become easy to understand. In the accompanying drawings, several embodiments of the present application are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0035] Figure 1 The structure diagram of the functional module provided in this embodiment is schematically shown;

[0036] Figure 2 The exploded diagram of the functional module provided in this embodiment is schematically shown;

[0037] Figure 3 The schematic diagram schematically shows the assembly of the target board and the fixing member provided by the present embodiment;

[0038] Figure 4 Schematically shows Figure 3 A partial enlarged view of .

[0039] Description of Figure Numbers:

[0040] 1. Target interface; 2. Target board; 21. First functional layer; 211. First sub-functional layer; 222. Second sub-functional layer; 223. Third sub-functional layer; 3. Fixing member; 31. Assembly space; 32. Side surrounding part; 33. Limiting part; 4. Mounting member; 41. Clamp. DETAILED DESCRIPTION

[0041] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0042] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application should have the common meanings understood by technicians in the field to which this application belongs.

[0043] The technical solution of the embodiment of the present application is to solve the above technical problems, and the overall idea is as follows:

[0044] Example 1

[0045] Reference Figure 1-4 The functional module provided in the embodiment of the present application includes: a target interface 1 and a target board 2, wherein the target interface 1 is configured on a main board; when the target board 2 is configured on the target interface 1, the target board 2 has a first functional layer 21 on a side close to the main board; the first functional layer 21 is used to provide a first energy acting on the main board, and the first energy is converted from a second energy provided by the target interface 1.

[0046] Specifically, in order to improve the installation reliability of the heating device and the motherboard in the prior art, to provide a firm installation guarantee, and to be able to heat and transfer to the motherboard, to provide the motherboard with the heat required for starting in an ultra-low temperature environment, thereby ensuring that the motherboard or functional components on the motherboard (such as CPU, GPU, etc.) can work normally in an ultra-low temperature environment.

[0047] This embodiment provides a functional module, which includes a target interface 1 and a target board 2. The target interface 1 is arranged on the mainboard of the computer near the functional component that needs to be heated, such as near the CPU, and realizes the electrical connection between the target interface 1 and the mainboard. The target interface 1 is oriented parallel to the mainboard body and is used to plug the target board 2, thereby realizing the direct connection between the target board 2 and the mainboard, without the need to use data cables or power cables for connection and adhesive fixation.

[0048] Among them, a number of protrusions are provided in the target interface 1, and one end of the target board 2 is a plug-in end, and a number of grooves are provided on the plug-in end. By using the grooves to correspond to the protrusions of the target interface 1, light pressure is applied to press the plug-in end of the target board 2 into the target interface 1 and lock it to achieve a firm connection.

[0049] The other end of the target board 2 is a fixed end, which is provided with a concave notch. The concave notch is embedded in the locking column on the mainboard, and then the screws on the locking column are tightened. The fixed end is locked and fixed with the screws, so that one end of the target board 2 is fixedly connected to the target interface 1, and the other end is fixedly connected to the locking column on the mainboard, thereby achieving stable installation of the target board 2 and the mainboard.

[0050] When the target board 2 is plugged into the target interface 1, the first functional layer 21 on one side of the target board 2 is in contact with the board body of the mainboard. When the power supply is connected and the machine is turned on, the target interface 1 obtains the second energy as electrical energy, and transmits the electrical energy to the target board 2 plugged into the target interface 1. The target board 2 transmits the electrical energy to the first functional layer 21, and the first functional layer 21 converts the electrical energy into the first energy, which is thermal energy. Since the first functional layer 21 is in contact with the board body of the mainboard, it can transmit thermal energy to the mainboard, thereby increasing the temperature of the CPU area of ​​the mainboard to create a temperature environment for the normal startup and operation of the CPU, and provide guarantee for its normal operation in an ultra-low temperature environment.

[0051] The target interface 1 is an expansion slot arranged on a computer motherboard, the target board 2 is an M.2 board, and the expansion slot is used to plug in M.2 boards of different sizes.

[0052] According to the above, the functional module provided by the present application configures a target interface 1 on the mainboard and configures a target board 2 in the target interface 1 so that the first functional layer 21 of the target board 2 is in stable fit contact with the mainboard, and the first functional layer 21 can convert the second energy provided by the target interface 1 into the first energy, thereby realizing the transmission of the first energy to the mainboard.

[0053] Furthermore, in the functional module provided in this embodiment, the first functional layer 21 is a surface layer of the target board 2 or a heating component detachably disposed on one side of the target board 2 .

[0054] Specifically, the first functional layer 21 can be a surface layer integrally provided with the target board 2 and located on one side of the target board 2. When the target board 2 is plugged into the target interface 1, the surface layer is in contact with the board body of the mainboard, and the surface layer is used to provide heat energy. The surface layer can be integrally provided with the target board 2 by welding or bonding.

[0055] The first functional layer 21 can also be a heating component that is detachably connected to the target board 2 and is disposed on one side of the board. When the target board 2 is plugged into the target interface 1, the heating component is used to fit in contact with the board of the mainboard, and the heating component is used to provide heat energy. The detachable connection between the heating component and the target board 2 can be a detachable connection such as a snap connection, a magnetic connection, or a screw connection.

[0056] The above two configurations can both enable the first functional layer 21 to be electrically connected to the target board 2 .

[0057] Furthermore, in this embodiment, the target board 2 further includes: a micro control unit, which is arranged on a side of the target board 2 away from the first functional layer 21 and is used to control the conversion of the first energy and the second energy.

[0058] Specifically, a micro control unit is integrated on the target board 2 to control the conversion between the electric energy provided at the target interface 1 and the heat energy generated by the first functional layer 21 on the target board 2 .

[0059] Further, in this embodiment, the micro control unit has a first functional module and a second functional module, and the first functional module is the same as or different from the second functional module;

[0060] The first functional module is used to trigger the target interface 1 to transmit the second energy to the first functional layer 21 when the ambient temperature meets the first condition;

[0061] The second functional module is used to prohibit the target interface 1 from transmitting the second energy to the first functional layer 21 when the ambient temperature does not meet the first condition.

[0062] Specifically, the first function module and the second function module can issue commands according to the first condition. When the ambient temperature is too low, the motherboard CPU cannot start up. To solve this problem, the first condition is defined as the ambient temperature that does not reach the normal startup temperature of the motherboard CPU.

[0063] In this embodiment, the ambient temperature is set to 5°C. When it is lower than this temperature, the first functional module issues a trigger command. At this time, the target interface 1 transmits the second energy (electric energy) to the first functional layer 21. At this time, the first functional layer 21 starts to work and converts the second energy (electric energy) into the first energy (heat energy), thereby raising the ambient temperature until it is higher than 5°C, so that the ambient temperature does not meet the first condition. At this time, the second functional module issues a prohibition command to stop the target interface 1 from transmitting the second energy (electric energy) to the first functional layer 21, and the first functional layer 21 stops converting the second energy (electric energy) into the first energy (heat energy). Among them, the setting of the specific ambient temperature can be adjusted according to the actual situation and is not limited here.

[0064] Furthermore, in this embodiment, the target board 2 further includes a third functional module, and the third functional module is used to detect the ambient temperature.

[0065] Specifically, in order to obtain the ambient temperature, the third functional module is set as a temperature sensing module, which can be integrated with the microcontroller unit or set in an external manner. It is used to detect the ambient temperature and transmit the corresponding electrical signal back to the microcontroller unit to obtain the ambient temperature information, and then send the temperature information to the first functional module and the second functional module to make a comparison according to the ambient temperature value set according to the first condition, thereby issuing a command to trigger or prohibit the target interface 1 from transmitting the second energy (electrical energy) to the first functional layer 21.

[0066] Furthermore, in this embodiment, the first functional layer 21 is the surface layer of the target board 2 , and the surface material of the surface layer close to the target board 2 is a heat insulating material for heat insulating the first functional layer 21 from the target board 2 .

[0067] Specifically, when the temperature of the first functional layer 21 rises as it converts the second energy into the first energy, in order to avoid the electrical components on the target board 2 being affected by the excessive temperature of the first functional layer 21, the surface material of the surface layer close to the target board 2 is set to a heat-insulating material. The heat-insulating material can be any one of nano-composite materials, aerogel, heat-insulating cotton or heat-insulating felt.

[0068] Further, see Attachment Figure 2 , in this embodiment,

[0069] The first functional layer 21 is a heating component detachably disposed on one side of the target board 2, and the heating component includes a first sub-functional layer 211, a second sub-functional layer 212, and a third sub-functional layer 213;

[0070] One side of the second sub-functional layer 212 is disposed in contact with one side of the third sub-functional layer 213 to provide the first energy source;

[0071] The first sub-functional layer 211 is attached to the other side of the second sub-functional layer 212 and is used to transfer the first energy to the main board;

[0072] The other side of the third sub-functional layer 213 is in contact with or non-contact with the target board 2 , and is used to thermally insulate the second sub-functional layer 212 from the target board 2 .

[0073] Specifically, the first sub-functional layer 211, the second sub-functional layer 212, and the third sub-functional layer 213 are overlapped in sequence from bottom to top;

[0074] The second functional layer is located in the middle layer and has a heating function. It can convert the second energy into the first energy, specifically converting electrical energy into thermal energy; and the second functional layer is connected to the target board 2 through a conductive wire. The second functional layer is made of a material that can be heated by electricity, such as a ceramic heating plate or an FPC heating film, etc. The specific material is not limited here.

[0075] The first functional layer 21 is located at the lower side of the second functional layer, and is used for contacting with the mainboard. It has a heat conducting function and can transfer the heat energy converted by the second functional layer to the mainboard. A conductive gasket or thermal conductive silicone can be used.

[0076] The third functional layer is located on the upper side of the second functional layer, close to the target board 2, and is used to isolate the conduction of heat. It can use an insulating vacuum board and aerogel felt, or a traditional insulating gasket made of glass fiber and asbestos materials.

[0077] Further, see Attachment Figure 2-4 In this embodiment, the heating assembly further includes a fixing member 3 and a mounting member 4;

[0078] The mounting member 4 is fixedly arranged on a side of the target board 2 close to the main board, and is used for being detachably connected to the fixing member 3;

[0079] The fixing member 3 forms an assembly space 31 for supporting the first sub-functional layer 211 , the second sub-functional layer 212 , and the third sub-functional layer 213 .

[0080] Specifically, the placement member and the fixing member 3 can be detached by magnetic attraction, snap connection, or embedded connection;

[0081] For example, a socket is provided on the mounting member 4, and a pin is correspondingly provided on the fixing member 3, and the pin is inserted into the socket through interference fit to achieve a detachable connection.

[0082] Among them, in order to improve the integrity of the device, the fixing part 3 is configured as a shell or frame with a certain depth, so that an assembly space 31 can be formed therein, and the above-mentioned three sub-functional layers are assembled together, and the fixing part 3 has a horizontal end face in contact with the main board, and an opening is provided on the horizontal end face, so that the first functional layer 21 can leak out from the opening and fit into contact with the main board to transfer heat energy.

[0083] Further, see Attachment Figure 3-4 In this embodiment, the mounting member 4 is multiple and circumferentially arranged at the edge of the target board 2. The mounting member 4 has a clamping opening 41, and the clamping opening 41 faces the side away from the target board 2;

[0084] The fixing member 3 includes a side surrounding portion 32 and a limiting portion 33;

[0085] One side of the side surrounding portion 32 is detachably connected to the mounting member 4 by entering or exiting the clamping opening 41;

[0086] The limiting portion 33 is disposed on the other side of the side surrounding portion 32 , and forms the assembly space 31 together with the side surrounding portion 32 .

[0087] Specifically, there are multiple mounting members 4, which are circumferentially arranged on the upper edge or outer edge of the target board 2. The mounting member 4 has a clamping seat and a clamping grip. The clamping seat is fixedly connected to the target board 2 by welding. At least two clamping claws are provided on the clamping seat. A clamping opening 41 is formed between two adjacent clamping claws. The clamping claws are elastic and can be closed or opened by moving closer or farther from each other.

[0088] The fixing member 3 is a frame structure, the side surrounding portion 32 is an outer peripheral side wall of the frame structure, and the limiting portion 33 is a limiting frame or a limiting plate, which is arranged on the outer peripheral side wall.

[0089] One side of the outer peripheral side wall is used to snap into the clamping opening 41 of the mounting member 4, so as to achieve connection with the mounting seat.

[0090] A limiting frame or a limiting plate is provided on the other side of the outer peripheral side wall, which is used to prevent the first sub-functional layer 211, the second sub-functional layer 212 and the third sub-functional layer 213 from being removed from the frame structure.

[0091] When the limiting portion 33 is a limiting frame, the limiting frame is arranged along the outer peripheral side wall and extends toward the inner side of the frame structure, and the middle of the limiting frame is hollowed out to expose the first sub-functional layer 211 .

[0092] Among them, when the limiting part 33 is a limiting plate, there is at least one limiting plate, and the two ends are respectively arranged on the two side walls opposite to each other of the frame structure, which plays a role in blocking and limiting the first sub-functional layer 211, the second sub-functional layer 212, and the third sub-functional layer 213 in the frame structure.

[0093] When there is one limiting plate, it is centrally arranged on the frame structure; when there are multiple limiting plates, they are spaced apart from each other.

[0094] Example 2

[0095] This embodiment provides an electronic device, which includes: a mainboard and a functional module; the functional module includes: a target interface 1 and a target board 2, wherein the target interface 1 is configured on the mainboard; when the target board 2 is configured on the target interface 1, the target board 2 has a first functional layer 21 on a side close to the mainboard;

[0096] The first functional layer 21 is used to provide a first energy source acting on the mainboard, and the first energy source is converted from a second energy source provided by the target interface 1 .

[0097] Specifically, the functional module is connected to a mainboard, and the mainboard can be mounted on an industrial computer or a home computer to ensure that the computer can work normally in an ultra-low temperature environment.

[0098] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A functional module, characterized in that: include: A target interface, wherein the target interface is configured on the main board; A target board, wherein when the target board is configured on the target interface, a side of the target board close to the mainboard has a first functional layer; The first functional layer is used to provide a first energy source acting on the mainboard, and the first energy source is obtained by converting a second energy source provided by the target interface.

2. The functional module according to claim 1, characterized in that: include: The first functional layer is a surface layer of the target board or a heating component detachably arranged on one side of the target board.

3. The functional module according to claim 1, characterized in that: The target board also includes: A micro control unit is arranged on a side of the target board away from the first functional layer, and is used to control the conversion between the first energy and the second energy.

4. The functional module according to claim 3, characterized in that: The micro control unit comprises a first functional module and a second functional module, wherein the first functional module is the same as or different from the second functional module; The first functional module is used to trigger the target interface to transmit the second energy to the first functional layer when the ambient temperature meets the first condition; The second functional module is used to prohibit the target interface from transmitting the second energy to the first functional layer when the ambient temperature does not meet the first condition.

5. The functional module according to claim 4, characterized in that: The target board also includes a third functional module, and the third functional module is used to detect the ambient temperature.

6. The functional module according to claim 2, characterized in that: The first functional layer is the surface layer of the target board, and the surface material of the surface layer close to the target board is a heat-insulating material for heat-insulating the first functional layer from the target board.

7. The functional module according to claim 2, characterized in that: The first functional layer is a heating component detachably arranged on one side of the target board, and the heating component includes a first sub-functional layer, a second sub-functional layer, and a third sub-functional layer; One side of the second sub-functional layer is disposed in contact with one side of the third sub-functional layer to provide the first energy source; The first sub-functional layer is bonded to the other side of the second sub-functional layer and is used to transfer the first energy to the main board; The other side of the third sub-functional layer is in contact with or non-contact with the target board, and is used to thermally insulate the second sub-functional layer from the target board.

8. The functional module according to claim 7, characterized in that: The heating assembly also includes: Fixings and mounting parts; The mounting piece is fixedly arranged on a side of the target board close to the main board, and is used for being detachably connected to the fixing piece; The fixing member forms an assembly space for supporting the first sub-functional layer, the second sub-functional layer, and the third sub-functional layer.

9. The functional module according to claim 8, characterized in that: The mounting members are multiple and are circumferentially arranged at the edge of the target board. The mounting members have a clamping opening, and the clamping opening faces a side away from the target board. The fixing member includes a side surrounding portion and a limiting portion; One side of the side surrounding portion is detachably connected to the mounting member by entering or exiting the clamping opening; The limiting portion is arranged at the other side of the side surrounding portion, and forms the assembly space with the side surrounding portion.

10. An electronic device, characterized in that: include: Mainboard and functional modules; The functional modules include: A target interface, wherein the target interface is configured on the main board; A target board, wherein when the target board is configured on the target interface, a side of the target board close to the mainboard has a first functional layer; The first functional layer is used to provide a first energy source acting on the mainboard, and the first energy source is obtained by converting a second energy source provided by the target interface.

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