Radiator for computer central processing unit

Abstract

The utility model relates to a radiator for a computer central processing unit, which belongs to the technical field of central processing units and comprises a main board body and a processor body fixedly mounted at the top of the main board body, a heat conducting plate is arranged on one side of the processor body far away from the main board body, and a mounting structure is arranged between the heat conducting plate and the main board body. The mounting structure comprises connecting plates fixedly connected to the front face and the back face of the heat conduction plate, and mounting plates are fixedly mounted at the bottoms of the connecting plates. According to the radiator for the computer central processing unit, a heat conducting plate can be positioned at the top of the mainboard body by arranging a mounting plate and a positioning stand column, and then the mounting plate can be fixed by arranging a mounting bottom plate and a first fixing bolt, so that the heat conducting plate can be fixed on the mainboard body, and at the moment, the heat conducting plate is attached to the processor body; and meanwhile, a user can conveniently install the radiator on the mainboard body.

Description

Technical Field

[0001] The utility model relates to the technical field of central processing units, in particular to a radiator used for a central processing unit of a computer. Background Art

[0002] The central processing unit (CPU) is the computing and control core of the computer system and the final execution unit for information processing and program running. Since its inception, the CPU has made great progress in logical structure, operating efficiency and functional extension. The CPU appeared in the era of large-scale integrated circuits. The iterative updates of processor architecture design and the continuous improvement of integrated circuit technology have led to its continuous development and improvement. From being originally used exclusively for mathematical calculations to being widely used in general-purpose computing, from 4-bit to 8-bit, 16-bit, 32-bit processors, and finally to 64-bit processors, from incompatibility among manufacturers to the emergence of different instruction set architecture specifications, the CPU has been developing rapidly since its birth.

[0003] A large amount of heat will be generated when the CPU is working. If the heat is not dissipated in time, the computer will freeze and freeze. After searching, the announcement number CN219456834U discloses a heat sink for a computer central processing unit, including a rotating fan A, a rectangular fixed plate, an air chamber and a processing control module. The upper part of the rectangular fixed plate is equipped with an air chamber through a support frame provided on both sides of the rectangular fixed plate, and the top of the rectangular fixed plate is evenly provided with a heat conduction sheet B, and the upper part of the heat conduction sheet B is equipped with a rotating fan B, and the bottom of the rectangular fixed plate is equipped with a heat absorption plate, and a storage bin is provided in the rectangular fixed plate above the heat absorption plate, and a rectangular low-boiling point solvent box is provided inside the storage bin, and a conduit is installed in parallel on the outer wall of the storage bin. The utility model controls the rotation speed of the rotating fan A and the rotating fan B through the processing control module, while ensuring the heat dissipation effect, reducing excessive energy consumption.

[0004] However, during use, the utility model does not clearly show how to install the radiator on the motherboard, and no corresponding mounting structure is provided, which affects the practicability of the device and cannot meet production needs. Therefore, a radiator for a computer central processing unit is proposed to solve the above-mentioned problems. Utility Model Content

[0005] In view of the deficiencies in the prior art, the utility model provides a radiator for a computer central processing unit, which has the advantage of being easy to install the radiator, and solves the problem that it is unclear how to install the radiator on the motherboard and there is no corresponding installation structure, which affects the practicability of the device and cannot meet production needs.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a heat sink for a computer central processing unit, comprising a mainboard body and a processor body fixedly mounted on the top of the mainboard body, a heat conducting plate being arranged on a side of the processor body away from the mainboard body, and a mounting structure being arranged between the heat conducting plate and the mainboard body;

[0007] The mounting structure includes a connecting plate fixedly connected to the front and back sides of the heat conducting plate, a mounting plate fixedly mounted on the bottom of the connecting plate, a positioning column extending to the bottom of the mainboard body fixedly connected to the side of the mounting plate close to the processor body, a mounting base plate is provided on the side of the mainboard body away from the processor body, the mounting base plate is slidably connected to the bottom end of the positioning column, and the bottom of the mounting base plate is threadedly connected to a first fixing bolt extending to the inside of the positioning column.

[0008] Furthermore, a second fixing bolt that penetrates the connecting plate is threadedly connected to one side of the mounting plate close to the mainboard body, and the number of the positioning columns is four.

[0009] Furthermore, thermal conductive silicone grease is provided on one side of the heat conductive plate close to the processor body, and the thermal conductive silicone grease is in contact with the processor body.

[0010] Furthermore, a top plate is provided on the top of the heat conducting plate, a side of the top plate close to the heat conducting plate is fixedly connected with a heat dissipation fin, and a side of the heat conducting plate is fixedly connected with a heat conducting copper tube that runs through the heat dissipation fin and the top plate.

[0011] Furthermore, a mounting frame is fixedly mounted on the back of the heat dissipation fins, and a heat dissipation fan is fixedly connected inside the mounting frame.

[0012] Furthermore, a dustproof plate is fixedly mounted on a side of the mounting frame away from the heat dissipation fins, a dustproof cover is fixedly connected to the bottom of the top plate, and the heat dissipation fins are located inside the dustproof cover.

[0013] Furthermore, a clamping block extending into the interior of the dustproof plate is fixedly connected to one side of the dustproof plate close to the mounting frame, and a mounting bolt penetrating the clamping block is threadedly connected to the top of the mounting frame.

[0014] Compared with the prior art, the utility model provides a heat sink for a computer central processing unit, which has the following beneficial effects:

[0015] 1. The heat sink for the computer central processing unit can position the heat conduction plate on the top of the mainboard body by setting the mounting plate and the positioning column, and then fix the mounting plate by setting the mounting base plate and the first fixing bolt, so that the heat conduction plate can be fixed on the mainboard body. At this time, the heat conduction plate fits the processor body, thereby facilitating the heat dissipation of the processor body and facilitating the user to install the heat sink on the mainboard body.

[0016] 2. The radiator for the computer central processing unit can absorb the heat generated by the processor body by arranging a thermal copper tube, and then dissipate the heat by arranging cooling fins and a cooling fan, thereby achieving the effect of cooling the processor body. By arranging a dustproof plate, it can prevent external dust from entering and prevent dust from affecting the heat dissipation effect. It solves the problem that it is unclear how to install the radiator on the motherboard and there is no corresponding installation structure, which affects the practicability of the device and cannot meet production needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a cross-sectional view of the structure of the utility model;

[0018] Figure 2 This is a bottom view of the structure of the heat conducting plate of the utility model;

[0019] Figure 3 This is a side view of the structure of the utility model;

[0020] Figure 4 It is a structural stereogram of the heat dissipation fin of the utility model.

[0021] In the figure: 1 main board body, 2 processor body, 3 heat conduction plate, 4 connecting plate, 5 mounting plate, 6 positioning column, 7 mounting base plate, 8 first fixing bolt, 9 second fixing bolt, 10 thermal grease, 11 top plate, 12 thermal copper tube, 13 heat sink fin, 14 mounting frame, 15 cooling fan, 16 dust plate, 17 dust cover. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] See also Figure 1-4A heat sink for a computer central processing unit in this embodiment includes a mainboard body 1 and a processor body 2 fixedly mounted on the top of the mainboard body 1, a heat conducting plate 3 is arranged on the side of the processor body 2 away from the mainboard body 1, a mounting structure is arranged between the heat conducting plate 3 and the mainboard body 1, the mounting structure includes a connecting plate 4 fixedly connected to the front and back sides of the heat conducting plate 3, a mounting plate 5 is fixedly mounted on the bottom of the connecting plate 4, a positioning column 6 extending to the bottom of the mainboard body 1 is fixedly connected to the side of the mounting plate 5 close to the processor body 2, a mounting base plate 7 is arranged on the side of the mainboard body 1 away from the processor body 2, the mounting base plate 7 is slidably connected to the bottom end of the positioning column 6, and the bottom of the mounting base plate 7 is threadedly connected to a first fixing bolt 8 extending to the inside of the positioning column 6.

[0024] Among them, a second fixing bolt 9 penetrating the connecting plate 4 is threadedly connected to one side of the mounting plate 5 close to the mainboard body 1 , and the number of the positioning columns 6 is four.

[0025] It should be noted that when the heat conducting plate 3 is in contact with the processor body 2 , the positioning column 6 just passes through the bottom of the motherboard body 1 . At this time, the positioning column 6 is located inside the mounting base plate 7 , and the mounting base plate 7 can be fixed by the first fixing bolt 8 .

[0026] In this embodiment, a thermal grease 10 is provided on the side of the heat conducting plate 3 close to the processor body 2, and the thermal grease 10 is in contact with the processor body 2. A top plate 11 is provided on the top of the heat conducting plate 3, and a heat dissipation fin 13 is fixedly connected to the side of the top plate 11 close to the heat conducting plate 3. A thermal copper tube 12 that passes through the heat dissipation fin 13 and the top plate 11 is fixedly connected to one side of the heat conducting plate 3.

[0027] Among them, a mounting frame 14 is fixedly installed on the back of the heat dissipation fin 13, and a heat dissipation fan 15 is fixedly connected to the inside of the mounting frame 14. By setting the thermal conductive copper tube 12, the heat generated by the processor body 2 can be absorbed, and then the heat dissipation is dissipated by setting the heat dissipation fins 13 and the heat dissipation fan 15, thereby achieving the effect of heat dissipation of the processor body 2.

[0028] It should be noted that there are eight thermally conductive copper tubes 12, and four thermally conductive copper tubes 12 are arranged on both sides of the heat conducting plate 3. At the same time, the staff can change the number of thermally conductive copper tubes 12 during the production process. When the number of thermally conductive copper tubes 12 is more, the thermal conductivity efficiency is higher, and the heat dissipation effect provided is better.

[0029] In this embodiment, a dustproof plate 16 is fixedly installed on the side of the mounting frame 14 away from the heat dissipation fins 13, a dustproof cover 17 is fixedly connected to the bottom of the top plate 11, the heat dissipation fins 13 are located inside the dustproof cover 17, and a clamping block extending into the inside of the dustproof plate 16 is fixedly connected to the side of the mounting frame 14 close to the mounting frame 14, and a mounting bolt that passes through the clamping block is threadedly connected to the top of the mounting frame 14.

[0030] It should be noted that by providing the dustproof plate 16 and the dustproof cover 17 , it is possible to prevent external dust from entering the heat dissipation fins 13 , thereby improving the cleanliness of the heat dissipation fins 13 and preventing dust from affecting the heat dissipation effect.

[0031] The working principle of the above embodiment is:

[0032] First, apply thermal grease 10 to the bottom of the heat conducting plate 3, and then place the heat conducting plate 3 together with the heat dissipation fins 13 on the main board body 1. At this time, pass the four positioning columns 6 through the main board body 1 to make the heat conducting plate 3 fit with the processor body 2. Then, put the installation base plate 7 on the positioning columns 6 and fix it with the first fixing bolts 8. Then connect the wires on the cooling fan 15 to the corresponding sockets on the main board body 1.

[0033] The electrical components mentioned in the text are all electrically connected to the main controller and the power supply. The main controller can be a conventional known device for control such as a computer, and the existing public power connection technology is not described in detail in the text.

[0034] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0035] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heat sink for a computer central processing unit, comprising a mainboard body (1) and a processor body (2) fixedly mounted on the top of the mainboard body (1), characterized in that: A heat conducting plate (3) is provided on a side of the processor body (2) away from the mainboard body (1), and a mounting structure is provided between the heat conducting plate (3) and the mainboard body (1); The mounting structure comprises a connecting plate (4) fixedly connected to the front and back sides of the heat conducting plate (3); a mounting plate (5) is fixedly mounted on the bottom of the connecting plate (4); a side of the mounting plate (5) close to the processor body (2) is fixedly connected to a positioning column (6) extending to the bottom of the mainboard body (1); a side of the mainboard body (1) away from the processor body (2) is provided with a mounting base plate (7); the mounting base plate (7) is slidably connected to the bottom end of the positioning column (6); and the bottom of the mounting base plate (7) is threadedly connected to a first fixing bolt (8) extending to the inside of the positioning column (6).

2. A heat sink for a computer central processing unit according to claim 1, characterized in that: A second fixing bolt (9) that penetrates the connecting plate (4) is threadedly connected to one side of the mounting plate (5) close to the main board body (1), and the number of the positioning columns (6) is four.

3. The heat sink for a computer central processing unit according to claim 1, characterized in that: A thermally conductive silicone grease (10) is provided on one side of the heat conducting plate (3) close to the processor body (2), and the thermally conductive silicone grease (10) is in contact with the processor body (2).

4. The heat sink for a computer central processing unit according to claim 1, characterized in that: A top plate (11) is arranged on the top of the heat conducting plate (3); a heat dissipation fin (13) is fixedly connected to one side of the top plate (11) close to the heat conducting plate (3); and a heat conducting copper tube (12) penetrating the heat dissipation fin (13) and the top plate (11) is fixedly connected to one side of the heat conducting plate (3).

5. The heat sink for a computer central processing unit according to claim 4, characterized in that: A mounting frame (14) is fixedly mounted on the back of the heat dissipation fin (13), and a heat dissipation fan (15) is fixedly connected inside the mounting frame (14).

6. A heat sink for a computer central processing unit according to claim 5, characterized in that: A dustproof plate (16) is fixedly mounted on one side of the mounting frame (14) away from the heat dissipation fins (13); a dustproof cover (17) is fixedly connected to the bottom of the top plate (11); and the heat dissipation fins (13) are located inside the dustproof cover (17).

7. A heat sink for a computer central processing unit according to claim 6, characterized in that: A clamping block extending into the interior of the dustproof plate (16) is fixedly connected to one side of the dustproof plate (16) close to the mounting frame (14), and a mounting bolt penetrating the clamping block is threadedly connected to the top of the mounting frame (14).

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