Millimeter wave packaging structure

Abstract

The utility model discloses a millimeter wave packaging structure, which comprises a lead frame, a millimeter wave transmitting module and a millimeter wave receiving module, the lead frame is provided with a first base island and a second base island which are independently distributed from top to bottom in the vertical direction, and the millimeter wave transmitting module is arranged on one side, away from the second base island, of the first base island. The millimeter wave receiving module is arranged on the side, close to the first base island, of the second base island, and a distance exists between the millimeter wave receiving module and the first base island. The lead frame is of a three-dimensional structure, transmission of millimeter wave signals in the vertical direction is achieved, space pressure in the horizontal direction is reduced, and the chip area is effectively reduced while the same function is achieved. And the receiving and transmitting are arranged in a layered manner, so that an independent space is provided, an independent functional unit is formed, the functions are separated in performance, and the performance of each unit can be optimized.

Description

Technical Field

[0001] The utility model relates to a millimeter wave transmission technology, in particular to a millimeter wave packaging structure. Background Art

[0002] The existing millimeter wave packaging structure usually includes a lead frame and a millimeter wave transceiver module, and the millimeter wave transceiver module is arranged on the lead frame. The existing packaging structure is a two-dimensional space arrangement, and the millimeter wave transceiver module channel occupies a large space. The module that realizes the same function is often much larger than the traditional chip. Utility Model Content

[0003] In view of the above-mentioned deficiencies in the prior art, an object of the present invention is to provide a millimeter wave packaging structure arranged in three dimensions.

[0004] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0005] A millimeter wave packaging structure comprises a lead frame, a millimeter wave transmitting module and a millimeter wave receiving module, wherein the lead frame has a first base island and a second base island independently distributed from top to bottom in the vertical direction, the millimeter wave transmitting module is arranged on a side of the first base island away from the second base island, the millimeter wave receiving module is arranged on a side of the second base island close to the first base island, and there is a distance between the millimeter wave receiving module and the first base island.

[0006] Optionally, the millimeter wave transmitting module includes a millimeter wave transmitting antenna, and the millimeter wave receiving module includes a millimeter wave receiving antenna, and the millimeter wave transmitting antenna and the millimeter wave receiving antenna are both integrated on a lead frame.

[0007] Optionally, a power module is also included, and the lead frame also has a third base island, which is arranged below the second base island and has a distance between the third base island and the second base island, and the power module is arranged on a side of the third base island close to the second base island, and there is a distance between the power module and the second base island.

[0008] Optionally, a package is also included, in which the millimeter wave transmitting module, the millimeter wave receiving module, the power module, the first base island, the second base island and the third base island are arranged.

[0009] The beneficial effect of the utility model is that the millimeter wave signal is transmitted in the vertical direction through the three-dimensional lead frame, reducing the space pressure in the horizontal direction, and effectively reducing the chip area while achieving the same function. The power module is set at the bottom layer, not in the same plane as the transceiver module, has an exclusive power channel and heat dissipation path, and is completely isolated from the millimeter wave transceiver module signal. The transmitting module, receiving module, and power module are arranged in layers, have their own independent space, form a separate functional unit, achieve functional separation in performance, and ensure that the performance of each unit can be optimized. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 Shown is a schematic diagram of a millimeter wave packaging structure of the first embodiment of the present utility model;

[0011] Figure 2 The figure is a top view of the lead frame layout of the millimeter wave packaging structure of the first embodiment of the utility model;

[0012] Figure 3 Shown is a schematic diagram of a millimeter wave packaging structure of a second embodiment of the present utility model;

[0013] Figure 4 The figure is a top view of the lead frame layout of the millimeter wave packaging structure of the second embodiment of the present utility model;

[0014] Figure 5 Shown is a schematic diagram of a millimeter wave packaging structure of a third embodiment of the present utility model;

[0015] Figure 6 Shown is a top view of the lead frame layout of the millimeter wave packaging structure of the third embodiment of the present invention.

[0016] Description of labels:

[0017] 1. Lead frame; 11. First base island; 12. Second base island; 13. Third base island; 2. Millimeter wave transmitting module; 21. Millimeter wave transmitting antenna; 3. Millimeter wave receiving module; 31. Millimeter wave receiving antenna; 4. Package; 5. Power module. DETAILED DESCRIPTION

[0018] In order to more clearly understand the technical content, achieved purposes and effects of the utility model, the utility model is described in detail below in combination with specific implementation methods and in conjunction with the accompanying drawings. It should be noted that the implementation methods of the utility model and the features in the implementation methods can be combined with each other without conflict. In the following description, many specific details are set forth in order to fully understand the utility model. The implementation methods described are only part of the implementation methods of the utility model, not all of the implementation methods. Based on the implementation methods in the utility model, all other implementation methods obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0019] Please refer to Figure 1-6 As shown, the technical solution provided by the utility model is:

[0020] A millimeter wave packaging structure comprises a lead frame, a millimeter wave transmitting module and a millimeter wave receiving module, wherein the lead frame has a first base island and a second base island independently distributed from top to bottom in the vertical direction, the millimeter wave transmitting module is arranged on a side of the first base island away from the second base island, the millimeter wave receiving module is arranged on a side of the second base island close to the first base island, and there is a distance between the millimeter wave receiving module and the first base island.

[0021] From the above description, we can know that the lead frame has a three-dimensional structure, which enables the millimeter wave signal to be transmitted in the vertical direction, reduces the space pressure in the horizontal direction, and effectively reduces the chip area while achieving the same function. The transceiver is layered and has its own independent space, forming a separate functional unit, achieving functional separation in terms of performance, ensuring that the performance of each unit can be optimized.

[0022] Optionally, the millimeter wave transmitting module includes a millimeter wave transmitting antenna, and the millimeter wave receiving module includes a millimeter wave receiving antenna, and the millimeter wave transmitting antenna and the millimeter wave receiving antenna are both integrated on a lead frame.

[0023] Optionally, a power module is also included, and the lead frame also has a third base island, which is arranged below the second base island and has a distance between the third base island and the second base island, and the power module is arranged on a side of the third base island close to the second base island, and there is a distance between the power module and the second base island.

[0024] From the above description, it can be seen that the existing receiving module and power module are arranged on the same base island or adjacent base islands on the same plane. Under a certain area, both heat and electricity will have a certain degree of impact. The utility model places the power module on the bottom layer, which is not on the same plane as the transceiver module. It has an exclusive power channel and heat dissipation path, and is completely isolated from the millimeter wave transceiver module signal.

[0025] Optionally, a package is also included, in which the millimeter wave transmitting module, the millimeter wave receiving module, the power module, the first base island, the second base island and the third base island are arranged.

[0026] Please refer to Figure 1 and 2 , Embodiment 1 of the present utility model is:

[0027] A millimeter wave packaging structure includes a lead frame 1, a millimeter wave transmitting module 2, a millimeter wave receiving module 3 and a package 4, wherein the millimeter wave transmitting module 2 includes a millimeter wave transmitting antenna, the millimeter wave receiving module 3 includes a millimeter wave receiving antenna, the lead frame 1 has a first base island 11 and a second base island 12 independently distributed from top to bottom in the vertical direction, the millimeter wave transmitting module 2 is arranged on a side of the first base island 11 away from the second base island 12, the millimeter wave receiving module 3 is arranged on a side of the second base island 12 close to the first base island 11, and there is a distance between the millimeter wave receiving module 3 and the first base island 11. The millimeter wave transmitting module 2, the millimeter wave receiving module 3, the first base island 11 and the second base island 12 are arranged in the package 4.

[0028] The above-mentioned millimeter wave packaging structure can be prepared by the following manufacturing process:

[0029] S1. Customized transceiver module including millimeter wave antenna.

[0030] S2, customized base island is completely isolated in vertical direction and is suitable for lead frame of all millimeter wave antenna products.

[0031] S3. Bond the high and low voltage domain communication signals to the external pins of the frame through wire bonding.

[0032] S4, overall plastic packaging finished product

[0033] Please refer to Figure 3 and 4 , Embodiment 2 of the present utility model is:

[0034] A millimeter wave packaging structure, which differs from the above-mentioned embodiment 1 in that it further includes a power module 5, the lead frame 1 further has a third base island 13, the third base island 13 is arranged below the second base island 12 and has a distance between the second base island 12, the power module 5 is arranged on a side of the third base island 13 close to the second base island 12, and the power module 5 has a distance between the second base island 12. The power module 5 and the third base island 13 are arranged in the package 4.

[0035] Please refer to Figure 5 and 6 , Embodiment 3 of the present utility model is:

[0036] A millimeter wave packaging structure includes a lead frame 1, a millimeter wave transmitting module, a millimeter wave receiving module and a package 4, wherein the millimeter wave transmitting module is composed of a millimeter wave transmitting antenna 21, and the millimeter wave receiving module is composed of a millimeter wave receiving antenna 31. The lead frame 1 has a first base island 11 and a second base island 12 independently distributed from top to bottom in the vertical direction, the millimeter wave transmitting module is arranged on the side of the first base island 11 away from the second base island 12, and the millimeter wave receiving module is arranged on the side of the second base island 12 close to the first base island 11, and the millimeter wave transmitting antenna 21 and the millimeter wave receiving antenna 31 are both integrated on the lead frame 1. There is a distance between the millimeter wave receiving module and the first base island 11. The millimeter wave transmitting module, the millimeter wave receiving module, the first base island 11 and the second base island 12 are arranged in the package 4.

[0037] In this embodiment, the transceiver module is composed of a millimeter wave antenna, and the millimeter wave antenna is integrated on the lead frame, which can make the overall millimeter wave packaging structure smaller.

[0038] The fourth embodiment of the present utility model is:

[0039] A millimeter wave packaging structure, which differs from the above-mentioned embodiment 3 in that it further includes a power module, the lead frame further has a third base island, the third base island is arranged below the second base island and has a distance between the third base island and the second base island, the power module is arranged on a side of the third base island close to the second base island, and the power module and the second base island have a distance between them. The power module and the third base island are arranged in the package.

[0040] The bottom layer can be made by etching and stamping with peelable copper foil, or it can be plastic-sealed for the second time in the packaging process to achieve three-dimensional stacking.

[0041] In summary, the millimeter wave packaging structure of the utility model adopts a three-dimensional lead frame, which can effectively reduce the pressure of two-dimensional space; the power module is placed at the bottom layer, has an exclusive power channel and heat dissipation path, and is completely isolated from the millimeter wave transceiver module signal; it is divided into independent functional units to ensure the optimal performance of each unit.

[0042] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Therefore, any modification, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A millimeter wave packaging structure, comprising a lead frame, a millimeter wave transmitting module and a millimeter wave receiving module, characterized in that: The lead frame has a first base island and a second base island independently distributed from top to bottom in the vertical direction. The millimeter wave transmitting module is arranged on the side of the first base island away from the second base island, and the millimeter wave receiving module is arranged on the side of the second base island close to the first base island. There is a distance between the millimeter wave receiving module and the first base island.

2. The millimeter wave packaging structure according to claim 1, characterized in that: The millimeter wave transmitting module includes a millimeter wave transmitting antenna, and the millimeter wave receiving module includes a millimeter wave receiving antenna. The millimeter wave transmitting antenna and the millimeter wave receiving antenna are both integrated on a lead frame.

3. The millimeter wave packaging structure according to claim 1 or 2, characterized in that: It also includes a power module. The lead frame also has a third base island. The third base island is arranged below the second base island and has a distance between the third base island and the second base island. The power module is arranged on a side of the third base island close to the second base island, and there is a distance between the power module and the second base island.

4. The millimeter wave packaging structure according to claim 3, characterized in that: It also includes a package, in which the millimeter wave transmitting module, the millimeter wave receiving module, the power module, the first base island, the second base island and the third base island are arranged.

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