Power module

Abstract

The utility model discloses a power module, which comprises a shell, a heat dissipation plate, a cover body and an insulating substrate, a plurality of mounting grooves are formed on the shell, the plurality of mounting grooves are respectively positioned at two ends of the first direction of the shell, and a groove is formed on the inner side wall of each mounting groove; the heat dissipation plate is arranged on one side of the shell in the second direction, and the second direction is perpendicular to the first direction. The cover body is arranged on the other side of the second direction of the shell, the cover body, the heat dissipation plate and the shell jointly define a containing cavity, and the multiple installation grooves are located in the outer side of the containing cavity; the insulating substrate is arranged in the containing cavity, and one side of the insulating substrate is electrically connected with the heat dissipation plate. According to the power module provided by the utility model, the inner side wall of each mounting groove is provided with the groove, so that compared with a traditional power module, the creepage distance between the heat dissipation plate and the bottom plate can be increased while a baffle plate is saved, the power module can meet the creepage requirement, and the cost and the weight are reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of power modules, in particular to a power module. Background Art

[0002] In the related art, the power module includes a housing, a bottom plate, a substrate and a connection terminal. The housing and the bottom plate are connected by rivets, and the substrate is arranged in the housing and connected to the connection terminal. Since the creepage distance between the connection terminal and the rivet is smaller than the creepage distance between the connection terminal and the bottom plate, in order to increase the creepage distance between the connection terminal and the rivet, a blocking plate is usually arranged between the connection terminal and the substrate. However, the above-mentioned method of adding a blocking plate will increase the cost of the power module, and due to the small thickness of the blocking plate, the structural strength of the power module will be reduced. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, one purpose of the utility model is to provide a power module that can increase the creepage distance between the heat sink and the base plate while saving the barrier plate, so that the power module can meet the creepage requirements and reduce the cost and weight.

[0004] According to the power module of the embodiment of the utility model, it includes: a shell, a plurality of mounting grooves are formed on the shell, the plurality of mounting grooves are respectively located at both ends of the first direction of the shell, and a groove is formed on the inner side wall of each mounting groove; a heat sink, the heat sink is arranged on one side of the second direction of the shell, and the second direction is perpendicular to the first direction; a cover body, the cover body is arranged on the other side of the second direction of the shell, the cover body, the heat sink and the shell jointly define a accommodating cavity, and the plurality of mounting grooves are located on the outside of the accommodating cavity; an insulating substrate, the insulating substrate is arranged in the accommodating cavity, and one side of the insulating substrate is electrically connected to the heat sink.

[0005] According to the power module of the embodiment of the utility model, by setting a groove on the inner wall of each installation groove, compared with the traditional power module, while saving the barrier plate, it is possible to increase the creepage distance between the heat sink and the base plate, so that the power module can meet the creepage requirements and reduce the cost and weight.

[0006] According to some embodiments of the present invention, the inner side wall of the mounting groove is recessed in a direction away from the center of the mounting groove to form the groove, and the groove extends along the circumference of the mounting groove.

[0007] According to some embodiments of the present invention, the mounting groove is a U-shaped groove, and an opening of the U-shaped groove is connected to the side wall of the shell in the first direction.

[0008] According to some embodiments of the utility model, the shell includes: a connecting part, wherein the two surfaces of the connecting part in the second direction are respectively a first surface and a second surface, the heat dissipation plate is arranged on the first surface, and a portion of the second surface is recessed along the direction toward the first surface to form the mounting groove; and a boss, wherein the boss is arranged on the second surface, and the boss is located between the connecting part and the cover plate.

[0009] According to some embodiments of the present invention, in the third direction, the plurality of mounting grooves are located in the middle of the connecting portion, and the third direction, the second direction and the first direction are orthogonal to each other.

[0010] According to some embodiments of the present invention, in the third direction, the side wall of the connecting portion is flush with the side wall of the boss.

[0011] According to some embodiments of the utility model, the power module also includes: a plurality of conductive parts, the plurality of conductive parts correspond one-to-one to the plurality of mounting slots, each of the conductive parts passes through the corresponding mounting slot and is electrically connected to the heat sink; a plurality of positioning columns, the plurality of positioning columns are arranged on the second surface, the plurality of positioning columns are spaced apart along the circumference of the boss, and the positioning columns support the cover body.

[0012] According to some embodiments of the present invention, a cross-section of the groove in the thickness direction of the shell is in the shape of a triangle, a rectangle or a trapezoid.

[0013] According to some embodiments of the present invention, the insulating substrate includes a conductive layer, an insulating layer and a heat dissipation layer stacked along the first direction, the heat dissipation layer is electrically connected to the heat dissipation plate, and the conductive layer is provided with electronic components.

[0014] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0016] Figure 1 is a schematic diagram of a power module according to an embodiment of the utility model, wherein a cover is not shown;

[0017] Figure 2 yes Figure 1 A front view of the power module shown in FIG.

[0018] Figure 3 yes Figure 1 Side view of the power module shown in .

[0019] Reference numerals:

[0020] 100: power module;

[0021] 10: housing; 101: mounting groove; 102: groove; 103: connecting portion; 1031: first surface; 1032: second surface; 104: boss; 20: heat dissipation plate; 30: accommodating cavity; 40: insulating substrate; 50: conductive member; 60: positioning column; 70: connecting terminal. DETAILED DESCRIPTION

[0022] Reference below Figure 1-Figure 3 A power module 100 according to an embodiment of the present invention is described.

[0023] like Figure 1-Figure 3 As shown, the power module 100 according to the embodiment of the present utility model includes: a housing 10 , a heat sink 20 , a cover (not shown) and an insulating substrate 40 .

[0024] Specifically, a plurality of mounting grooves 101 are formed on the housing 10. The plurality of mounting grooves 101 are respectively located in a first direction (eg, Figure 1 In the description of the utility model, the meaning of "multiple" is two or more. The heat sink 20 is arranged in the second direction of the housing 10 (for example, Figure 1 The first direction is perpendicular to the first direction, the cover is disposed on the other side of the second direction of the shell 10, the cover, the heat sink 20 and the shell 10 together define a housing cavity 30, a plurality of mounting grooves 101 are located on the outside of the housing cavity 30, an insulating substrate 40 is disposed in the housing cavity 30, and one side of the insulating substrate 40 is electrically connected to the heat sink 20.

[0025] For example, in Figure 1-Figure 3 In the example, the housing 10 is substantially rectangular in shape and may be a hollow structure. Two mounting grooves 101 are formed on the housing 10. The two mounting grooves 101 and the accommodating cavity 30 are arranged along the length direction of the housing 10 (for example, Figure 1 The housing 10 is arranged in a spaced relationship in the left and right directions, and the accommodating cavity 30 is located between the two mounting grooves 101. Figure 1The cover is provided on the open side of the housing 10, and a matching groove is formed on the other side of the housing 10 in the thickness direction. The heat sink 20 is provided in the matching groove, and the surface of the heat sink 20 away from the housing 10 is flush with the surface of the housing 10 in the thickness direction. One end of the connection terminal 70 passes through the cover and the housing 10 and is electrically connected to the other side of the insulating substrate 40, and the other end of the connection terminal 70 is located outside the cover. The power module 100 can be connected to other electrical components through the connection terminal 70.

[0026] Optionally, the heat sink 20 may be a metal member such as a copper plate, but is not limited thereto.

[0027] Reference Figure 1 and Figure 3 , the inner wall of each mounting groove 101 may be formed with five grooves 102, and the five grooves 102 are spacers along the thickness direction of the shell 10. Among them, the creepage distance is usually related to the working voltage of the power module 100, that is, the working voltage is proportional to the creepage distance. The higher the working voltage of the power module 100, the larger the creepage distance between the conductors needs to be set. Since the shell 10 and the cover are both insulating parts such as PPS ((Polyphenylene Sulfide, polyphenylene sulfide)) parts or PBT (Polybutylene terephthalate, polybutylene terephthalate) parts, the insulating substrate 40 and the heat sink 20 are electrically connected. By setting the grooves 102 on the inner wall of the mounting groove 101, the creepage distance between the heat sink 20 and the bottom plate can be increased to ensure the creepage requirement when the power module 100 is a high-voltage power module 100, and at the same time save the setting of the barrier plate, thereby reducing the cost and weight of the power module 100, and the power module 100 can have better impact resistance.

[0028] Optionally, the accommodating cavity 30 is filled with a potting packaging material covering the insulating substrate 40 and the electronic components such as power chips. The potting packaging material is made of silicone resin such as silicone gel, for example.

[0029] Figure 1 It is shown that the inner wall of each mounting groove 101 is provided with five grooves 102 for the purpose of illustration, but after reading the technical solution of the present application, ordinary technicians can obviously understand that the solution can be applied to technical solutions with other numbers of grooves 102, which also falls within the protection scope of the present utility model.

[0030] According to the power module 100 of the embodiment of the utility model, by setting a groove 102 on the inner wall of each installation groove 101, compared with the traditional power module 100, while saving the barrier plate, it is possible to increase the creepage distance between the heat sink 20 and the base plate, so that the power module 100 can meet the creepage requirements and reduce the cost and weight.

[0031] According to some aspects of the present invention, the inner side wall of the mounting groove 101 is recessed in a direction away from the center of the mounting groove 101 to form a groove 102, and the groove 102 extends along the circumference of the mounting groove 101. In other words, the shape of the groove 102 is substantially consistent with the shape of the mounting groove 101. Thus, the length of the groove 102 can be increased as much as possible, so that the creepage distance between the heat sink 20 and the insulating substrate 40 can be increased as much as possible, and the weight of the power module 100 is further reduced, which is conducive to the miniaturization design of the power module 100.

[0032] In some optional embodiments, the mounting groove 101 is a U-shaped groove, and the opening of the U-shaped groove is connected to the side wall of the housing 10 in the first direction. Figure 1 As shown, the opening of the U-shaped groove faces the outside of the shell 10, and the U-shaped groove is connected to the outside. The groove 102 on the side wall of the U-shaped groove can play an anti-slip role, which is conducive to installing components in the installation groove 101 to ensure the connection reliability between the shell 10 and the heat sink 20, increase the operability of the power module 100, and facilitate processing, which can improve the production efficiency of the power module 100.

[0033] According to some aspects of the present invention, the housing 10 includes a connecting portion 103 and a boss 104. The two surfaces of the connecting portion 103 in the second direction are respectively a first surface 1031 and a second surface 1032. The heat sink 20 is arranged on the first surface 1031. A portion of the second surface 1032 is recessed in a direction toward the first surface 1031 to form a mounting groove 101. The boss 104 is arranged on the second surface 1032. The boss 104 is located between the connecting portion 103 and the cover plate. Figure 1 and Figure 3 , a portion of the first surface 1031 is recessed toward the direction of the second surface 1032 to form a matching groove, the heat sink 20 is arranged in the matching groove, the mounting groove 101 and the boss 104 are located on the same side of the thickness direction of the connecting portion 103, and the boss 104 is located between the two mounting grooves 101, and the cover plate is arranged on the side of the boss 104 away from the connecting portion 103, and in the third direction (for example, Figure 1 In the front-to-back direction (in the longitudinal direction), the side wall of the upper connecting portion 103 is flush with the side wall of the boss 104, making the structure of the power module 100 more regular.

[0034] Further, in the third direction (for example, Figure 1 In the front-to-back direction, a plurality of mounting grooves 101 are located in the middle of the connecting portion 103, and the third direction, the second direction and the first direction are orthogonal to each other. Figure 1 and Figure 2As shown, the two mounting grooves 101 are respectively located at the two ends of the length direction of the connecting portion 103, and the mounting groove 101 is located in the middle of the connecting portion 103 in the width direction of the connecting portion 103. Thus, it can be ensured that the heat sink 20 and the housing 10 can be evenly stressed, avoiding stress concentration that causes the housing 10 or the heat sink 20 to break.

[0035] According to some aspects of the present invention, the power module 100 further includes a plurality of conductive members 50 and a plurality of positioning posts 60. The plurality of conductive members 50 correspond to the plurality of mounting slots 101 one by one, and each conductive member 50 passes through the corresponding mounting slot 101 and is electrically connected to the heat sink 20. The plurality of positioning posts 60 are disposed on the second surface 1032, and the plurality of positioning posts 60 are spaced apart along the circumference of the boss 104, and the positioning posts 60 support the cover. For example, Figure 1-Figure 3 In the example, there are two conductive members 50, and the two conductive members 50 are connected to the heat sink 20 through two mounting grooves 101 respectively, so as to fix the heat sink 20 on the housing 10. There are four positioning posts 60, and the four positioning posts 60 are respectively located at the four corners of the boss 104. The cover plate can be connected to the four positioning posts 60 by four fasteners such as bolts to realize the connection between the cover plate and the housing 10. At the same time, the four positioning posts 60 can be supported at the four corners of the cover plate to prevent the cover plate from being deformed. Optionally, the conductive member 50 can be a rivet. But it is not limited to this.

[0036] In some optional embodiments, the cross-section of the groove 102 in the thickness direction of the housing 10 is in the shape of a triangle, a rectangle or a trapezoid.

[0037] In some optional embodiments, the insulating substrate 40 includes a conductive layer, an insulating layer and a heat dissipation layer stacked along a first direction, the heat dissipation layer is electrically connected to the heat dissipation plate 20, and the conductive layer is provided with electronic components. For example, the insulating substrate 40 may be a ceramic copper-clad plate, and electronic components such as power chips may be provided on the conductive layer, and the conductive layer and the heat dissipation layer are respectively provided on both sides of the thickness direction of the insulating layer. When the power chip generates heat during operation, the heat can be transferred to the heat dissipation layer through the conductive layer and the insulating layer, and the heat dissipation layer contacts the heat dissipation plate 20 to transfer the heat to the heat dissipation plate 20, and the heat dissipation plate 20 performs heat exchange with the outside to achieve heat dissipation of the power module 100. For example, the materials of the conductive layer, the insulating layer and the heat dissipation layer can be set to a copper layer, a ceramic layer, and a copper layer, respectively, so as to facilitate the normal use of the insulating substrate 40.

[0038] Among them, the power chip can be an IGBT (Insulated Gate Bipolar Transistor) chip, an RC-IGBT (Reverse-Conducting Insulated Gate Bipolar Transistor) chip or a MOS (Metal Oxide Semiconductor) tube.

[0039] Other structures and operations of the power module 100 according to the embodiment of the present invention are known to those skilled in the art and will not be described in detail here.

[0040] In the description of the present invention, it should be understood that the terms "center", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0041] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0042] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example.

[0043] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A power module, characterized in that: include: A housing, wherein a plurality of mounting grooves are formed on the housing, the plurality of mounting grooves are respectively located at two ends of the housing in a first direction, and a groove is formed on an inner side wall of each mounting groove; a heat dissipation plate, the heat dissipation plate being arranged on one side of the housing in a second direction, the second direction being perpendicular to the first direction; A cover body, the cover body is arranged on the other side of the housing in the second direction, the cover body, the heat sink and the housing together define an accommodating cavity, and the plurality of mounting grooves are located outside the accommodating cavity; An insulating substrate is disposed in the accommodating cavity, and one side of the insulating substrate is electrically connected to the heat sink.

2. The power module according to claim 1, characterized in that: The inner side wall of the mounting groove is recessed in a direction away from the center of the mounting groove to form the groove, and the groove extends along the circumference of the mounting groove.

3. The power module according to claim 2, characterized in that: The mounting groove is a U-shaped groove, and an opening of the U-shaped groove is communicated with the side wall of the housing in the first direction.

4. The power module according to any one of claims 1 to 3, characterized in that: The housing comprises: A connecting portion, wherein two surfaces of the connecting portion in the second direction are respectively a first surface and a second surface, the heat dissipation plate is arranged on the first surface, and a portion of the second surface is recessed in a direction toward the first surface to form the mounting groove; A boss is provided on the second surface, and the boss is located between the connecting portion and the cover body.

5. The power module according to claim 4, characterized in that: In the third direction, the plurality of mounting grooves are located in the middle of the connecting portion, and the third direction, the second direction and the first direction are orthogonal to each other.

6. The power module according to claim 5, characterized in that: In the third direction, the side wall of the connecting portion is flush with the side wall of the boss.

7. The power module according to claim 4, characterized in that: Also includes: A plurality of conductive members, each of which corresponds to the plurality of mounting slots one by one, and each of the conductive members passes through the corresponding mounting slot and is electrically connected to the heat sink; A plurality of positioning posts are provided on the second surface, the plurality of positioning posts are spaced apart along the circumference of the boss, and the positioning posts support the cover body.

8. The power module according to claim 1, characterized in that: The cross-section of the groove in the thickness direction of the shell is in the shape of a triangle, a rectangle or a trapezoid.

9. The power module according to claim 1, characterized in that: The insulating substrate includes a conductive layer, an insulating layer and a heat dissipation layer stacked along the first direction, the heat dissipation layer is electrically connected to the heat dissipation plate, and the conductive layer is provided with electronic components.

Images