Stacking structure for reducing metallic luster of metal circuit

Abstract

The utility model discloses a stack structure for reducing metallic luster of a metal circuit. The stack structure comprises a conductive layer, a black adhesive layer and a transparent medium layer which are sequentially arranged from top to bottom, according to the utility model, the conductive layer is pasted on the transparent dielectric layer by using the black adhesive layer, the metal circuit unit is manufactured on the conductive layer by using an etching process, and the corresponding black adhesive layer below the groove structure of the metal circuit unit is removed, so that the hollow part in the circuit hollow unit can also transmit light, and the transmittance is increased; the bottom of the metal circuit unit is provided with the black glue part, and the black glue part shields the metal luster of the metal circuit unit, so that under the condition that the transmittance is ensured, the bottom black is increased, and the recognition degree of human eyes on the back surface is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of metal circuits, and more specifically, particularly to a stacking structure for reducing the metallic luster of metal circuits. Background Art

[0002] Metal materials realize electrical conduction of devices and are widely used in touch screens, liquid crystal panels and semiconductor fields. The traditional method of preparing metal circuits is yellow light process or laser process. The metal itself has a metallic luster, and the human eye is more sensitive to the metallic luster and easy to identify. In order to reduce the metallic luster, the metal circuit is usually blackened after the circuit is prepared so that it cannot be recognized by the human eye. However, the metallic luster on the back still exists. If viewed from the back, it is still easy to be discovered by the naked eye, which has a great impact on the appearance of the product. Utility Model Content

[0003] The utility model provides a stacking structure for reducing the metallic gloss of a metal circuit to solve the problems raised in the above background technology. To achieve the above purpose, the utility model provides the following technical solutions: a stacking structure for reducing the metallic gloss of a metal circuit, comprising a conductive layer, a black glue layer and a transparent medium layer arranged in sequence from top to bottom, wherein the black glue layer adheres the conductive layer and the transparent medium layer together; a plurality of metal circuit units are arranged on the conductive layer, and the metal circuit units are provided with a plurality of groove structures;

[0004] The black glue layer is provided with a circuit hollowing unit matched with the metal circuit unit, and the circuit hollowing unit includes a black glue part and a hollowing part, the black glue part is provided at the bottom of the metal circuit unit, and the hollowing part overlaps with the groove structure in the vertical direction.

[0005] Preferably, the circuit hollow layer is formed by dissolving the black glue layer not covered by the metal circuit unit with an acidic or alkaline solution.

[0006] Preferably, the material of the transparent medium layer includes but is not limited to PET, COP, CPI, glass and other transparent substrates.

[0007] Preferably, the thickness of the transparent medium layer includes but is not limited to 50 micrometers, 100 micrometers and 125 micrometers.

[0008] Preferably, the metal circuit unit is formed on the conductive layer by an additive method or an etching subtractive method.

[0009] Preferably, a blackening layer is provided on the outer surface of the metal circuit unit.

[0010] Preferably, the metal circuit unit has a mesh structure.

[0011] Preferably, the line width of the mesh structure is 0.1 to 2 microns.

[0012] Preferably, the thickness of the black glue layer is 25 to 75 microns.

[0013] Compared with the prior art, the utility model has the following beneficial effects: the utility model uses a black glue layer to stick the conductive layer on the transparent medium layer, uses an etching process to make a metal circuit unit on the conductive layer, and removes the corresponding black glue layer under the groove structure of the metal circuit unit at the same time, so that the hollow part in the circuit hollow unit can also transmit light, thereby increasing the transmittance; since there is a black glue part at the bottom of the metal circuit unit, the black glue part blocks the metallic luster of the metal circuit unit, and while ensuring the transmittance, the bottom black is increased, thereby reducing the recognition of the human eye on the back. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A schematic diagram of a stacked structure for reducing the metallic gloss of a metal circuit according to an embodiment of the utility model;

[0015] Figure 2 This is a cross-sectional view of a stacked structure for reducing the metallic gloss of a metal circuit according to an embodiment of the utility model;

[0016] exist Figure 1 and Figure 2 In the figure, the corresponding relationship between the names of the components and the numbers of the drawings is as follows:

[0017] 1--conductive layer, 11--metal line unit, 12--groove structure, 2--black glue layer, 21--black glue part, 22--hollow part, 3--transparent medium layer. DETAILED DESCRIPTION

[0018] The following is a further detailed description of the implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.

[0019] In the description of the present invention, unless otherwise specified, "multiple" means two or more; the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third" and the like are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0020] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0021] Please refer to Figure 1 and Figure 2 The utility model provides a stacked structure for reducing the metallic gloss of a metal circuit, comprising a conductive layer 1, a black glue layer 2 and a transparent medium layer 3 arranged in sequence from top to bottom, wherein the black glue layer 2 adheres the conductive layer 1 and the transparent medium layer 3 together; a plurality of metal circuit units 11 are arranged on the conductive layer 1, and the metal circuit units 11 are provided with a plurality of groove structures 12;

[0022] The black glue layer 2 is provided with a circuit hollowing unit that matches the metal circuit unit 11. The circuit hollowing unit includes a black glue portion 21 and a hollowing portion 22. The black glue portion 21 is provided at the bottom of the metal circuit unit 11. The hollowing portion 22 overlaps with the groove structure 12 in the vertical direction.

[0023] The utility model provides a metal circuit stack with no metallic luster on the bottom surface, and the stack structure is arranged as a conductive layer 1, a black glue layer 2 and a transparent medium layer 3. The metal circuit unit 11 can be formed directly on the conductive layer 1 by using an additive method or an etching subtractive process, and the conductive layer 1 is made of a conductive material. The black glue layer 2 is a medium for adhering the conductive layer 1 and the transparent medium layer 3. The black glue layer 2 is a black glue that can adhere the conductive layer 1 and the transparent medium. The black glue layer 2 is in a dark state and can cover the metallic luster of the metal. While preparing the metal circuit by a subtractive etching process, the black glue layer 2 under the metal to be etched is also removed, so that the hollowed-out part of the circuit can also transmit light, increasing the transmittance. The bottom of the circuit part has black glue, which blocks the metallic luster of the metal. While ensuring the transmittance, the bottom black is increased, which reduces the recognition of the human eye on the back.

[0024] Preferably, the circuit hollow layer is formed by using an acidic or alkaline solution to dissolve the black glue layer 2 not covered by the metal circuit unit 11. In this embodiment, the low-polymer ester components can be hydrolyzed after being subjected to an acidic solution (etching solution) or an alkaline solution (film stripping solution), thereby dissolving in the solution, so that the portion of the black glue layer 2 not covered by the metal circuit unit 11 is washed away, and then the transparent medium layer 3 located at the lower layer is leaked out for light transmission.

[0025] Preferably, the material of the transparent medium layer 3 includes but is not limited to PET, COP, CPI, glass and other transparent substrates.

[0026] Preferably, the thickness of the transparent medium layer 3 includes but is not limited to 50 microns, 100 microns and 125 microns. In this embodiment, the transparent medium layer 3 is a carrier of the conductive layer 1, and the material includes but is not limited to transparent substrates such as PET, COP, CPI, and glass, and the thickness is generally but not limited to conventional sizes such as 50um, 100um, and 125um.

[0027] Preferably, the metal line unit 11 is formed on the conductive layer 1 by an additive method or an etching subtractive method.

[0028] Preferably, a black layer is provided on the outer surface of the metal circuit unit 11. Since the back of the metal circuit unit 11 is covered by the black glue layer 2 and the front is exposed, the front can be blackened to form a black layer, so as to shield the front and back of the metal circuit unit 11 and achieve a better dimming effect.

[0029] Preferably, the metal circuit unit 11 has a mesh structure.

[0030] Preferably, the line width of the mesh structure is 0.1 to 2 microns.

[0031] Preferably, the black glue layer 2 has a thickness of 25 to 75 microns.

[0032] Compared with the prior art, the utility model has the following beneficial effects: the utility model uses a black glue layer to stick the conductive layer on the transparent medium layer, uses an etching process to make a metal circuit unit on the conductive layer, and removes the corresponding black glue layer under the groove structure of the metal circuit unit at the same time, so that the hollow part in the circuit hollow unit can also transmit light, thereby increasing the transmittance; since there is a black glue part at the bottom of the metal circuit unit, the black glue part blocks the metallic luster of the metal circuit unit, and while ensuring the transmittance, the bottom black is increased, thereby reducing the recognition of the human eye on the back.

[0033] The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

Claims

1. A stacked structure for reducing the metallic gloss of a metal circuit, characterized in that: The invention comprises a conductive layer (1), a black glue layer (2) and a transparent medium layer (3) which are arranged in sequence from top to bottom, wherein the black glue layer adheres the conductive layer and the transparent medium layer together; a plurality of metal circuit units (11) are arranged on the conductive layer, and the metal circuit units are provided with a plurality of groove structures (12); A circuit hollowing unit matching the metal circuit unit is provided on the black glue layer, the circuit hollowing unit comprising a black glue portion (21) and a hollowing portion (22), the black glue portion is provided at the bottom of the metal circuit unit, and the hollowing portion overlaps with the groove structure in the vertical direction.

2. The stacking structure for reducing the metallic gloss of a metal circuit according to claim 1, characterized in that: The circuit hollow layer is formed by dissolving the black glue layer not covered by the metal circuit unit with an acidic or alkaline solution.

3. The stacking structure for reducing the metallic gloss of a metal circuit according to claim 1, characterized in that: The material of the transparent medium layer includes but is not limited to PET, COP, CPI, glass and other transparent substrates.

4. The stacked structure for reducing the metallic gloss of a metal circuit according to claim 3, characterized in that: The thickness of the transparent medium layer includes but is not limited to 50 micrometers, 100 micrometers and 125 micrometers.

5. The stacked structure for reducing the metallic gloss of a metal circuit according to claim 1, characterized in that: The metal circuit unit is formed on the conductive layer by using an additive method or an etching subtractive method.

6. The stacked structure for reducing the metallic gloss of a metal circuit according to claim 1, characterized in that: A blackening layer is provided on the outer surface of the metal circuit unit.

7. The stacked structure for reducing the metallic gloss of a metal circuit according to claim 1, characterized in that: The metal line unit has a mesh structure.

8. The stacked structure for reducing the metallic gloss of a metal circuit according to claim 7, characterized in that: The line width of the mesh structure is 0.1 to 2 microns.

9. The stacked structure for reducing the metallic gloss of a metal circuit according to claim 1, characterized in that: The thickness of the black glue layer is 25 to 75 microns.

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