LED packaging structure and backlight module

Abstract

The utility model provides an LED packaging structure and a backlight module, wherein the LED packaging structure comprises a substrate, an LED crystal arranged on the substrate, and a light-transmitting body arranged on the substrate and covering the LED crystal, the light-transmitting body is provided with a groove, a reflecting film is deposited on the groove wall of the groove, and the reflecting film is used for reflecting light emitted by the LED crystal, so that the LED crystal emits large-angle light. According to the technical scheme, the LED packaging structure has a reflective lens function compared with a traditional scheme by combining concave surface mold pressing with a reflective film deposition process, an external reflective lens and an installation process are directly omitted, loss of light reflection is reduced, brightness is improved, meanwhile, the use amount of a light-transmitting body is reduced, and cost is reduced. And the weight and the thickness are reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of backlight modules, and more specifically to an LED packaging structure and a backlight module. Background Art

[0002] like Figure 1 As shown, the current LED packaging structure with secondary optical function is mainly realized by a silicone convex refraction solution, or by placing a large refractive lens 102 or a reflective lens on an ordinary SMD (Surface Mounted Devices) packaging device 101. The above solution increases the processing distance from the primary optics to the secondary optics of the package and the lens is large in size. In actual applications, the light mixing distance is large, resulting in an increase in the overall backlight module thickness and a corresponding increase in weight.

[0003] like Figure 2 As shown, in addition, the LED packaging structure with a large angle is currently provided by covering the surface of the SMD packaging device 201 with a mixed TiO 2 The solution of granular silica gel 202 can only achieve simple plane reflection and sacrifices brightness, while increasing the thickness and weight of the LED packaging structure, further increasing the thickness and weight of the overall backlight module.

[0004] Therefore, the existing LED packaging structure with large-angle light emission has the disadvantages of large volume and low brightness, which easily causes the thickness and weight of the backlight module to increase. Utility Model Content

[0005] The purpose of the utility model is to provide an LED packaging structure and a backlight module to solve the technical problem that the LED packaging structure with large-angle light emission in the prior art has the disadvantages of large volume and low brightness, which easily causes the thickness and weight of the backlight module to increase.

[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0007] In a first aspect, an LED packaging structure is provided, comprising:

[0008] A substrate, an LED crystal disposed on the substrate, and a light-transmitting body disposed on the substrate and covering the LED crystal, wherein the light-transmitting body is provided with a groove, a reflective film is deposited on the groove wall, and the reflective film is used to reflect the light emitted by the LED crystal so that the LED crystal emits light at a large angle.

[0009] By adopting the above-mentioned technical solution, this embodiment realizes the LED packaging structure with a reflective lens function through concave molding combined with a reflective film deposition process, compared with the traditional solution, directly eliminating the external reflective lens and installation process, reducing the loss of light reflection, and improving the brightness. At the same time, it reduces the amount of light-transmitting body used, and reduces the weight and thickness.

[0010] In one embodiment, the reflective film includes at least one coating layer, and the coating layer is sequentially deposited on the groove wall of the groove.

[0011] By adopting the above technical solution, a single coating layer can further reduce the thickness of the reflective film, making the reflective film thinner; and multiple coating layers deposited in sequence can increase the reflectivity of the reflective film, ensuring the reflectivity of light.

[0012] In one embodiment, the coating is SiO 2 Coating, TiO 2 Coating and Al 2 O 3 At least one of the coatings.

[0013] By adopting the above technical solution, different coatings can be selected according to the actual application scenario, thereby improving the reflectivity and firmness of the reflective film.

[0014] In one embodiment, the SiO 2 The thickness of the coating is 50nm-150nm. 2 The Al coating and 2 O 3 The thickness of the coating is 30nm-3μm.

[0015] By adopting the above technical solution, the reflectivity and firmness of the reflective film are further improved.

[0016] In one embodiment, the groove is arranged close to the LED crystal relative to the lowest part of the substrate, and the structure of the groove gradually expands from its lowest part in a direction away from the LED crystal.

[0017] By adopting the above technical solution, the reflective film can emit the light of the LED crystal toward both sides of the LED crystal.

[0018] In one embodiment, the groove is directly opposite to the LED crystal at a lowest portion relative to the substrate.

[0019] By adopting the above technical solution, the light output uniformity of the LED crystal is improved.

[0020] In one embodiment, the groove is in the shape of an inverted pyramid, an inverted cone or an inverted terrace.

[0021] By adopting the above technical solution, it is easier to obtain the groove of the above shape on the light-transmitting body, thereby reducing the processing difficulty and improving the processing efficiency.

[0022] In one embodiment, the cross-section of the light-transmitting body is square, hemispherical or trapezoidal.

[0023] By adopting the above technical solution, the processing difficulty is reduced and the processing efficiency is improved.

[0024] In one embodiment, the LED crystal is an uncoated crystal.

[0025] By adopting the above technical solution, the LED crystal is easy to process.

[0026] In a second aspect, a backlight module is provided, comprising a plurality of the above-mentioned LED packaging structures.

[0027] By adopting the above technical solution, on the basis of having the advantages of the LED packaging structure of the above embodiment, the backlight module of this embodiment also has the advantage of uniform light output. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0029] Figure 1 It is a schematic diagram of prior art one.

[0030] Figure 2 It is a schematic diagram of the second prior art.

[0031] Figure 3 It is a schematic diagram of the LED packaging structure provided in the first embodiment of the utility model.

[0032] Figure 4 This is a schematic diagram of the LED packaging structure provided by the embodiment of the utility model. Figure 1 .

[0033] Figure 5 This is a schematic diagram of the LED packaging structure provided by the embodiment of the utility model. Figure 2 .

[0034] Figure 6 This is a schematic diagram of the LED packaging structure provided by the embodiment of the utility model. Figure 3 .

[0035] Figure 7 This is a schematic diagram of the LED packaging structure provided by the embodiment of the utility model. Figure 4 .

[0036] Figure 8 This is a schematic diagram of the LED packaging structure provided by the embodiment of the utility model. Figure 5 .

[0037] Fig. 9 It is a schematic diagram of the LED packaging structure provided by the second embodiment of the present utility model.

[0038] The reference numerals in the figures are:

[0039] 101, packaging device; 102, refractive lens; 201, packaging device; 202, silicone;

[0040] 1. Substrate; 2. LED crystal; 3. Translucent body; 4. Reflective film;

[0041] 31. Groove; 41. Coating. DETAILED DESCRIPTION

[0042] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0043] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly located on the other element or indirectly located on the other element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or indirectly connected to the other element.

[0044] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention, and do not indicate that a device or element must have a specific direction, be constructed and operated in a specific direction. Therefore, it should not be understood as a limitation on the present invention.

[0045] In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating relative importance or indicating the number of technical features. In the description of the present utility model, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined. The following is a more detailed description of the specific implementation of the present utility model in conjunction with specific embodiments:

[0046] like Figure 3 As shown, an LED packaging structure provided by an embodiment of the utility model has a secondary optical function inside, that is, the light emitted by the LED crystal forms a large light output angle after reflection; the LED packaging structure of this embodiment takes into account the large-angle light output, small volume, and small impact on the light output brightness; the following is an explanation through a specific implementation method:

[0047] The LED packaging structure of this embodiment includes:

[0048] A substrate 1, an LED crystal 2 on the substrate 1, a light-transmitting body 3 arranged on the substrate 1 and covering the LED crystal 2, the light-transmitting body 3 is provided with a groove 31, the groove wall of the groove 31 is deposited with a reflective film 4, the reflective film 4 is used to reflect the light emitted by the LED crystal 2, so that the LED crystal 2 emits light at a large angle.

[0049] The substrate 1 refers to a base for setting the LED crystal 2. The base is provided with a circuit electrically connected to the LED crystal 2. The substrate 1 plays the role of fixing and electrically connecting the LED crystal 2.

[0050] The LED crystal 2 refers to a light-emitting unit, and the LED crystal 2 is used to emit light; the LED crystal 2 is arranged on the substrate 1, and the LED crystal 2 is electrically connected to the circuit of the substrate 1;

[0051] The light-transmitting body 3 refers to a base body with a certain light transmittance, and the light-transmitting body 3 includes but is not limited to silica gel. The light-transmitting body 3 is arranged on the substrate 1 and covers the LED crystal 2, so that the light emitted by the LED crystal 2 enters the light-transmitting body 3 from the LED crystal 2 and then emits from the light-transmitting body 3;

[0052] The light-transmitting body 3 is provided with a groove 31, and the groove wall of the groove 31 is provided with a reflective film 4, which is arranged on the groove wall of the groove 31 by deposition. The reflective film 4 is used to emit the light emitted by the LED crystal 2, so that the LED crystal 2 emits light at a large angle;

[0053] Here, it is necessary to further explain that, due to the characteristics of the LED crystal 2 itself, most of the light emitted by it is emitted in the direction away from the substrate 1. In this way, the light intensity on both sides of the LED crystal 2 is weak, causing the LED crystal 2 to only emit light at a small angle. The small-angle light here means that the beam angle of the LED crystal 2 is small, that is, the angle of the beam formed by most of the light is small;

[0054] By setting a groove 31 in the light-transmitting body 3 and a reflective film 4 on the groove wall of the groove 31, the light emitted by the LED crystal 2 enters the light-transmitting body 3 and is partially emitted toward the groove 31, and is reflected by the reflective film 4 and emitted toward both sides of the LED crystal 2, thereby forming a large-angle light. The large-angle light here refers to the large beam angle of the LED crystal 2, that is, the angle of the light beam formed by most of the light is large.

[0055] The working principle of the LED packaging structure provided in this embodiment is as follows:

[0056] The LED crystal 2 is arranged on the substrate 1, and the LED crystal 2 emits divergent light from the substrate 1 in a direction away from the substrate 1, wherein part of the light from the LED crystal 2 enters the light-transmitting body 3 and reaches the position of the groove 31, and is reflected by the reflective film 4 on the groove wall of the groove 31, thereby changing the angle of the light, so that the light is emitted to both sides of the LED crystal 2, thereby expanding the angle of the light emitted by the LED crystal 2, that is, expanding the beam angle of the LED crystal 2.

[0057] It needs to be further explained that a groove 31 is provided on the light-transmitting body 3, and the groove 31 is concave toward the LED crystal 2. This is equivalent to arranging a convex reflector structure on the LED crystal 2. The convex reflector structure can expand the emission angle of the light, thereby expanding the light-emitting angle of the LED crystal 2.

[0058] like Figures 4 to 8 As shown, the packaging principle of the LED packaging structure provided in this embodiment is as follows:

[0059] A substrate 1 is provided, and at least one LED crystal 2 is fixed on the substrate 1; a light-transmitting body 3 to be melted is arranged on the substrate 1, and at the same time, the light-transmitting body 3 covers the LED crystal 2; a groove 31 is formed on the light-transmitting body 3 by a molding process; then, a film 5 is attached to the light-transmitting body 3, that is, a layer of film is covered on the light-transmitting body 3 and the position where the groove 31 is arranged is avoided; an inorganic target material is formed into atoms and deposited on the groove wall of the groove 31 by inorganic deposition; if a plurality of LED crystals 2 are arranged on the substrate 1, the light-transmitting body 3 and the substrate 1 are cut to form a plurality of LED packaging structures.

[0060] By adopting the above-mentioned technical solution, this embodiment realizes the LED packaging structure with a reflective lens function through concave molding combined with the reflective film 4 deposition process, compared with the traditional solution, directly eliminating the external reflective lens and installation process, reducing the loss of light reflection, and improving the brightness. At the same time, it reduces the amount of translucent body 3, and reduces weight and thickness.

[0061] Please refer again Figure 7 In one embodiment, the reflective film 4 includes at least one coating layer 41 , and the coating layer 41 is sequentially deposited on the groove wall of the groove 31 .

[0062] Here, it can be understood that the reflective film 4 includes one coating 41 or multiple coatings 41; when the reflective film 4 has only one coating 41, the coating 41 is deposited on the groove wall of the groove 31; and when the reflective film 4 includes multiple coatings 41, the multiple coatings 41 are deposited on the groove wall of the groove 31 in sequence.

[0063] Specifically, the coating 41 is fixed on the groove wall of the groove 31 by inorganic deposition; more specifically, inorganic plating atoms are deposited on the groove wall of the groove 31 .

[0064] By adopting the above technical solution, a single coating layer 41 can further reduce the thickness of the reflective film 4, making the reflective film 4 thinner; and multiple coating layers 41 deposited in sequence can increase the reflectivity of the reflective film 4 and ensure the reflectivity of light.

[0065] In one embodiment, the coating 41 is SiO 2 Coating 41, TiO 2 Coating 41 and Al 2 O 3 At least one of the plating layers 41.

[0066] Here, it can be understood that the reflective film 4 includes SiO 2 Coating 41, TiO 2 Coating 41 or Al 2 O 3 One of the coating layers 41; or, the reflective film 4 includes SiO 2 Coating 41, TiO 2 Coating 41 and Al 2 O 3 At least two of the coating layers 41; or, the reflective film 4 includes SiO 2 Coating 41, TiO 2 Coating 41 and Al 2 O 3 Plating 41.

[0067] By adopting the above technical solution, different coating layers 41 can be selected according to actual application scenarios, thereby improving the reflectivity and firmness of the reflective film 4.

[0068] In one embodiment, SiO 2 The thickness of the coating 41 is 50nm-150nm, TiO 2 Coating 41 and Al 2 O 3 The thickness of the plating layer 41 is 30 nm-3 μm.

[0069] Here, it can be understood that the above thickness of SiO 2 Coating 41, TiO 2 Coating 41 and Al 2 O 3 The coating 41 makes the reflective film 4 have a good reflectivity and a firm fixation;

[0070] Preferably, SiO 2The thickness of the coating 41 is 50nm-100nm, TiO 2 Coating 41 and Al 2 O 3 The thickness of the plating layer 41 is 35 nm-2 μm.

[0071] By adopting the above technical solution, the reflectivity and firmness of the reflective film 4 are further improved.

[0072] like Fig. 9 As shown, in one embodiment, the groove 31 is arranged near the LED crystal 2 relative to the lowest part of the substrate 1 , and the structure of the groove 31 gradually expands from its lowest part in a direction away from the LED crystal 2 .

[0073] Here, it can be understood that the shape of the groove 31 is gradually expanding along the direction away from the LED substrate, so that the reflective film 4 on the groove wall of the groove 31 also adapts to the shape of the groove 31 and is gradually expanding. In this way, when the light emitted by the LED crystal 2 is reflected by the reflective film 4, it is emitted toward both sides of the LED crystal 2.

[0074] By adopting the above technical solution, the reflective film 4 can emit the light of the LED crystal 2 toward both sides of the LED crystal 2 .

[0075] In one embodiment, the lowest portion of the groove 31 relative to the substrate 1 faces the LED crystal 2 .

[0076] Here, it can be understood that the grooves 31 are arranged symmetrically based on the central axis of the LED crystal 2 , so that the reflective film 4 on the grooves 31 can evenly reflect the light emitted by the LED crystal 2 to both sides of the LED crystal 2 .

[0077] By adopting the above technical solution, the light emission uniformity of the LED crystal 2 is improved.

[0078] In one embodiment, the shape of the groove 31 is an inverted pyramid, an inverted cone, or an inverted terrace.

[0079] Here, it can be understood that the light-transmitting body 3 forms the groove 31 by molding, and the groove 31 of the above shape is easy to obtain by molding, so the groove 31 of the above shape can reduce the processing difficulty and improve the processing efficiency.

[0080] By adopting the above technical solution, it is easier to obtain the groove 31 of the above shape on the light-transmitting body 3, thereby reducing the processing difficulty and improving the processing efficiency.

[0081] In one embodiment, the cross section of the light-transmitting body 3 is square, hemispherical or trapezoidal.

[0082] Here, it can be understood that the light-transmitting body 3 having the above-mentioned shape is easier to process.

[0083] By adopting the above technical solution, the processing difficulty is reduced and the processing efficiency is improved.

[0084] In one embodiment, the LED crystal 2 is an uncoated crystal.

[0085] Here, it can be understood that the conventional LED crystal 2 is an uncoated crystal.

[0086] By adopting the above technical solution, the LED crystal 2 is easy to process.

[0087] In a second aspect, a backlight module is provided, comprising a plurality of the above-mentioned LED packaging structures.

[0088] Optionally, a plurality of LED package structures are arranged in an array.

[0089] By adopting the above technical solution, on the basis of having the advantages of the LED packaging structure of the above embodiment, the backlight module of this embodiment also has the advantage of uniform light output.

[0090] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An LED packaging structure, characterized in that: include: A substrate, an LED crystal provided on the substrate, and a light-transmitting body provided on the substrate and covering the LED crystal, wherein the light-transmitting body is provided with a groove, and a reflective film is deposited on the groove wall of the groove, and the reflective film is used to reflect the light emitted by the LED crystal, so that the LED crystal emits light at a large angle; The LED crystal emits divergent light from the substrate in a direction away from the substrate, wherein part of the light from the LED crystal enters the light-transmitting body and reaches the groove position, and is reflected by the reflective film on the groove wall of the groove, thereby changing the angle of the light, so that the light is emitted to both sides of the LED crystal, thereby expanding the angle of the light emitted by the LED crystal, that is, expanding the beam angle of the LED crystal.

2. The LED packaging structure according to claim 1, characterized in that: The reflective film includes at least one coating layer, and the coating layers are sequentially deposited on the groove wall of the groove.

3. The LED packaging structure according to claim 2, characterized in that: The coating is at least one of a SiO2 coating, a TiO2 coating and an Al2O3 coating.

4. The LED packaging structure according to claim 3, characterized in that: The thickness of the SiO2 coating is 50nm-150nm, and the thickness of the TiO2 coating and the Al2O3 coating is 30nm-3μm.

5. The LED packaging structure according to any one of claims 1 to 4, characterized in that: The groove is arranged close to the LED crystal relative to the lowest part of the substrate, and the structure of the groove gradually expands from the lowest part of the groove in a direction away from the LED crystal.

6. The LED packaging structure according to claim 5, characterized in that: The groove is opposite to the LED crystal at the lowest part of the substrate.

7. The LED packaging structure according to any one of claims 1 to 4, characterized in that: The groove is in the shape of an inverted pyramid, an inverted cone or an inverted terrace.

8. The LED packaging structure according to any one of claims 1 to 4, characterized in that: The cross section of the light-transmitting body is square, hemispherical or trapezoidal.

9. The LED packaging structure according to any one of claims 1 to 4, characterized in that: The LED crystal is a non-coated crystal.

10. A backlight module, characterized in that: The LED packaging structure comprises a plurality of LED packaging structures according to any one of claims 1 to 9.

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