Electronic accessory glue removing device

Abstract

The utility model relates to a degumming device for electronic accessories, which comprises a heating part provided with a heating groove for accommodating the electronic accessories and provided with a heat source at the bottom; and the cleaning part is movably arranged above the heating groove in the vertical direction, and the adhesive surface of the electronic accessory and the heat source are arranged at an interval and are contacted, adhered and taken away by the cleaning part. Compared with the prior art, the device is high in automation degree, electronic accessories are not prone to being damaged, the working efficiency is high, and the force of the flexible connecting piece is easy to control.

Description

Technical Field

[0001] The utility model relates to the technical field of glue removal, in particular to a glue removal device for electronic accessories. Background Art

[0002] Electronic components are basic elements in electronic circuits. They are usually individually packaged and have two or more leads or metal contacts. Electronic components must be connected to each other to form an electronic circuit with specific functions, such as amplifiers, radio receivers, oscillators, etc. One of the common ways to connect electronic components is to solder them to printed circuit boards. Electronic components may be individual packages (resistors, capacitors, inductors, transistors, diodes, etc.) or groups of varying complexity, such as integrated circuits (operational amplifiers, resistor arrays, logic gates, etc.);

[0003] During the processing or maintenance of electronic components, the glue on the pins or connections needs to be cleaned. The existing glue removal operation is performed manually, which is inefficient, or the glue is scraped off with a scraper, and the scraper force is difficult to adjust, which can easily cause damage to the electronic components. Utility Model Content

[0004] The purpose of the utility model is to provide an electronic parts glue removal device in order to overcome the problems of the prior art, such as low automation, easy damage to electronic parts, low working efficiency and difficult control of scraper force.

[0005] The purpose of the utility model can be achieved through the following technical solutions:

[0006] An electronic parts glue removal device, comprising:

[0007] A heating part, which has a heating tank for accommodating the electronic accessories and a heat source at the bottom;

[0008] And a cleaning part, which is movably arranged above the heating tank in the vertical direction, the adhesive surface of the electronic component is spaced apart from the heat source and is contacted, adhered and carried away by the cleaning part.

[0009] Furthermore, the cleaning part includes flexible adhesive members which are movably arranged in a vertical direction above the heating slot and arranged in an array, and the flexible adhesive members are in contact with the adhesive surface of the electronic accessory.

[0010] Furthermore, the flexible adhesive member is a flexible sphere with adhesiveness.

[0011] Furthermore, the cleaning part also includes a movable plate arranged above the heating tank and movable in a vertical direction, and a mounting plate fixedly connected to the movable plate, and the flexible adhesive member is mounted on the mounting plate.

[0012] Furthermore, flexible connecting members arranged in an array are provided between the mounting plate and the flexible adhesive member.

[0013] Furthermore, the device further comprises a top plate and a bottom plate respectively arranged at intervals on the upper and lower sides of the movable plate, and the heating tank is mounted on the bottom plate;

[0014] A plurality of driving motors are installed at the bottom of the base plate, and a screw rod that passes through the moving plate and is connected to the driving motor is installed above the base plate, and the moving plate moves along the screw rod.

[0015] Furthermore, the heating part also includes a limiting frame installed on the bottom plate, the heating groove is formed inside the limiting frame, and a heating plate is provided at the bottom of the limiting frame.

[0016] Furthermore, U-shaped limiting frames are provided on both sides of the limiting frame, and the height of the limiting frames is at least not less than the height of the limiting frame.

[0017] Furthermore, a plurality of slide bars are provided between the top plate and the bottom plate, and the movable plate moves up and down along the slide bars.

[0018] Furthermore, a plurality of base frames are provided at the bottom of the base plate.

[0019] Compared with the prior art, the utility model has the following beneficial effects:

[0020] 1. The utility model separates the adhesive from the electronic parts through the soft connector, the flexible adhesive and the slightly melted adhesive, so as to prevent the residue from being removed. The electronic parts will not be scratched during the adhesive removal process, thus ensuring the integrity of the electronic parts. The utility model is suitable for uneven adhesive surfaces.

[0021] 2. The utility model drives the moving plate by driving the screw rod to rotate through a driving motor, and there is no need for manual alignment of the mounting plate and the electronic accessories. The limit frame limits the placement position of the electronic accessories to prevent the electronic accessories from shifting during the degumming process. The heating plate slowly heats the non-adhesive surface of the electronic accessories to slightly melt the adhesive surface of the electronic accessories to prevent the adhesive from spreading due to excessive melting of the adhesive. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 Schematic diagram of the structure of the adhesive removal device in the embodiment.

[0023] Figure 2 Schematic diagram of the structure of the adhesive removal device in the embodiment from a bottom view.

[0024] Figure 3 Schematic diagram of the structure of the cleaning part of the glue removal device in the embodiment.

[0025] Numbers in the figure:

[0026] 100-heating part, 110-heating tank, 120-limiting frame, 130-heating plate, 140-limiting frame;

[0027] 200-cleaning part, 210-flexible adhesive part, 220-moving plate, 230-flexible connecting part, 240-installing plate;

[0028] 300-top plate;

[0029] 400-bottom plate, 410-driving motor, 420-screw rod, 430-sliding rod, 440-bottom frame. DETAILED DESCRIPTION

[0030] The present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. This embodiment is implemented based on the technical solution of the present invention, and provides a detailed implementation method and specific operation process, but the protection scope of the present invention is not limited to the following embodiments.

[0031] Features such as component models, material names, connection structures, control methods, etc. that are not clearly stated in this technical solution shall be deemed as common technical features disclosed in the prior art.

[0032] In the description of the present invention, it should be understood that the terms "upper", "lower", "vertical", "horizontal", "top", "bottom", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0033] In the description of the present invention, "multiple" means two or more than two, unless otherwise specifically defined. In addition, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a bolt connection or a welding connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] Example

[0035] This embodiment provides an electronic component glue removal device, and its structure is shown in FIG. Figures 1 to 3As shown, it includes a heating part 100, a cleaning part 200, a top plate 300 and a bottom plate 400, wherein the heating part 100 is installed on the bottom plate 400 and has a heating groove 110 for accommodating electronic accessories and having a heat source at the bottom, the cleaning part 200 is movably arranged above the heating groove 110 in a vertical direction, the top plate 300 and the bottom plate 400 are respectively arranged at intervals on the upper and lower sides of the cleaning part 200, and the adhesive surface of the electronic accessory is arranged at intervals from the heat source and is contacted and adhered to and carried away by the cleaning part 200.

[0036] For details, see Figure 2 and Figure 3 The cleaning part 200 includes a flexible adhesive member 210, a movable plate 220, a flexible connector 230 and a mounting plate 240. The flexible adhesive member 210 is movably arranged above the heating tank 110 in a vertical direction and is arranged in an array. The flexible adhesive member 210 contacts the adhesive surface of the electronic accessory. In this embodiment, the flexible adhesive member 210 is a flexible sphere with viscosity. The movable plate 220 is movably arranged above the heating tank 110 in a vertical direction. The mounting plate 240 is fixedly connected to the movable plate 220. The flexible adhesive member 210 is installed on the mounting plate 240, the soft connecting member 230 is between the mounting plate 240 and the flexible adhesive member 210 and is arranged in an array. In the present embodiment, the soft connecting member 230 is a cleaning soft rod, the top plate 300 and the bottom plate 400 are respectively arranged at intervals on the upper and lower sides of the movable plate 220, a plurality of driving motors 410 are installed at the bottom of the bottom plate 400, and a screw rod 420 is installed above the bottom plate 400, passing through the movable plate 220 and connected to the driving motor 410, and the movable plate 220 moves along the screw rod 420.

[0037] For details, see Figure 1 , Figure 2 and Figure 3 The heating part 100 further includes a limit frame 120 mounted on the bottom plate 400, a heating groove 110 is formed inside the limit frame 120, a heating plate 130 is provided at the bottom of the limit frame 120, and U-shaped limit frames 140 are provided on both sides of the limit frame 120, and the height of the limit frame 140 is at least not less than the height of the limit frame 120. Four sliding rods 430 are also provided between the top plate 300 and the bottom plate 400, and the movable plate 220 moves up and down along the sliding rods 430, and four bottom frames 440 are also provided at the bottom of the bottom plate 400.

[0038] The working principle of this embodiment is as follows:

[0039] The electronic accessory is placed in the heating tank 110, wherein the adhesive surface of the electronic accessory does not contact the bottom of the heating tank 110, and the heating plate 130 at the bottom of the heating tank 110 works to heat the adhesive surface at intervals to soften the adhesive surface. Then, the driving motor 410 is started, and the driving motor 410 rotates to drive the screw 420 to rotate, so that the movable plate 220 moves up and down along the screw 420. The driving motor 410 drives the movable plate 220 downward, so that the flexible adhesive member 210 abuts against the adhesive surface of the electronic accessory, that is, the flexible ball abuts against the adhesive surface of the electronic accessory. The design of the flexible ball increases the contact area with the adhesive surface. The flexible connecting member 230 ensures stable operation, and the design of the limit frame 140 ensures that the movable plate 220 does not move too far downward. Then, the driving motor 410 reverses to drive the movable plate 220 upward, and the residual adhesive of the electronic accessory in contact with the flexible ball is taken away, so that the electronic accessory will not be damaged, and the adhesive can be removed quickly and automatically.

[0040] The above description of the embodiments is to facilitate the understanding and use of the utility model by those skilled in the art. It is obvious that those familiar with the art can easily make various modifications to these embodiments and apply the general principles described herein to other embodiments without creative work. Therefore, the utility model is not limited to the above embodiments, and improvements and modifications made by those skilled in the art based on the disclosure of the utility model without departing from the scope of the utility model should be within the scope of protection of the utility model.

Claims

1. An electronic parts glue removal device, characterized in that: include: A heating portion (100) having a heating tank (110) for accommodating the electronic component and having a heat source at the bottom; and a cleaning portion (200) which is movably arranged above the heating tank (110) in a vertical direction, wherein the adhesive surface of the electronic component is spaced apart from the heat source and is contacted, adhered and carried away by the cleaning portion (200).

2. The electronic component glue removal device according to claim 1, characterized in that: The cleaning portion (200) comprises flexible adhesive members (210) arranged above the heating slot (110) and arranged in an array and movable in a vertical direction, wherein the flexible adhesive members (210) are in contact with the adhesive surface of the electronic accessory.

3. The electronic component glue removal device according to claim 2, characterized in that: The flexible adhesive member (210) is a flexible spherical ball with adhesiveness.

4. The electronic component glue removal device according to claim 2, characterized in that: The cleaning section (200) further comprises a movable plate (220) arranged above the heating tank (110) and movable in a vertical direction, and a mounting plate (240) fixedly connected to the movable plate (220), and the flexible adhesive member (210) is mounted on the mounting plate (240).

5. The electronic component glue removal device according to claim 4, characterized in that: Soft connecting members (230) arranged in an array are provided between the mounting plate (240) and the flexible adhesive member (210).

6. The electronic component glue removal device according to claim 5, characterized in that: The device further comprises a top plate (300) and a bottom plate (400) which are arranged at intervals on the upper and lower sides of the movable plate (220), respectively, and the heating tank (110) is mounted on the bottom plate (400); A plurality of driving motors (410) are installed at the bottom of the base plate (400), and a screw rod (420) passing through the movable plate (220) and connected to the driving motor (410) is installed above the base plate (400), and the movable plate (220) moves along the screw rod (420).

7. The electronic component glue removal device according to claim 6, characterized in that: The heating part (100) further comprises a limiting frame (120) mounted on the bottom plate (400), the heating groove (110) being formed inside the limiting frame (120), and a heating plate (130) being provided at the bottom of the limiting frame (120).

8. The electronic component glue removal device according to claim 7, characterized in that: U-shaped limiting frames (140) are also provided on both sides of the limiting frame (120); the height of the limiting frame (140) is at least not lower than the height of the limiting frame (120).

9. The electronic component glue removal device according to claim 6, characterized in that: A plurality of sliding bars (430) are provided between the top plate (300) and the bottom plate (400), and the movable plate (220) moves up and down along the sliding bars (430).

10. The electronic component glue removal device according to claim 6, characterized in that: A plurality of bottom frames (440) are also provided at the bottom of the bottom plate (400).

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