Automatic injection molding system for semiconductor

Abstract

The utility model discloses an automatic injection molding system for a semiconductor, and belongs to the technical field of semiconductor element packaging. The semiconductor automatic injection molding system comprises an injection molding press, feeding equipment and discharging equipment, wherein the feeding equipment and the discharging equipment are arranged on the same side of the injection molding press. By means of the layout mode that the feeding device and the discharging device are arranged on the same side of the injection molding press, the occupied area of the injection molding system is reduced, the walking distance of workers between the feeding device and the discharging device is reduced, the workers can take many devices into consideration, and the problems that in the prior art, an injection molding system is large in occupied area, low in cost and the like are solved. And the working personnel cannot consider more equipment at the same time.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor element packaging, in particular to a semiconductor automatic injection molding system. Background Art

[0002] In the Chinese invention patent publication number: CN113013074A, title: A semiconductor component automatic injection molding system, it is disclosed that "a semiconductor component automatic injection molding system, characterized in that it includes an injection molding press, and a loading device and a unloading device respectively arranged on both sides of the injection molding press along the X-axis direction."

[0003] This layout of the semiconductor automated injection molding system has the problem of occupying a large area and the staff being unable to take care of more equipment because the loading and unloading equipment are respectively arranged on both sides of the injection molding press. Summary of the invention

[0004] Purpose of the invention: To provide a semiconductor automated injection molding system, which reduces the footprint of the injection molding system by arranging the loading equipment and the unloading equipment on the same side of the injection molding press, so that the staff can take care of more equipment.

[0005] The technical solution of the present invention is: a semiconductor automated injection molding system comprises: an injection molding press, a loading device and a unloading device, wherein the loading device and the unloading device are arranged on the same side of the injection molding press.

[0006] In a further embodiment, the feeding equipment includes: a product feeding device, a resin feeding device, a preheating device and a feeding and transferring device.

[0007] The product feeding device is arranged below the resin feeding device, the preheating device is arranged at one end of the product feeding device close to the injection molding press, one end of the loading and transferring device is arranged above the preheating device, and the other end thereof extends into the injection molding press, and the loading and transferring device is used to simultaneously transport the product and the resin into the injection molding press.

[0008] In a further embodiment, the product feeding device includes: a material box loading mechanism.

[0009] The material box loading mechanism comprises: a material box, a full material box storage box, a material box lifting mechanism, a product pushing mechanism and an empty material box storage box.

[0010] The material box is arranged in a full material box storage box and / or a material box lifting mechanism, the empty material box storage box is arranged below the full material box storage box, the material box lifting mechanism is arranged at one end of the full material box storage box and the empty material box storage box, and the product pushing mechanism is arranged on one side of the material box lifting mechanism.

[0011] The material box lifting mechanism comprises: a material box power mechanism and a cantilever, and the cantilever is installed on the material box power mechanism.

[0012] The cantilever is matched with the concave and convex parts of the material box, so that the cantilever limits the width direction of the material box.

[0013] The cantilever length is smaller than the width of the material box.

[0014] The product feeding device also includes: a top material box clamping mechanism, which is installed on the material box power mechanism. The top material box clamping mechanism is used to apply a force to the material box in the direction of the cantilever, thereby reducing the space occupied by the product feeding device and further reducing the overall volume of the semiconductor automated injection molding system.

[0015] In a further embodiment, a material box loading and moving mechanism is provided at the bottom of the full material box storage box, and the material box loading and moving mechanism is used to drive the material box to move in the direction of the material box power mechanism.

[0016] The material box power mechanism comprises: a material box transverse moving mechanism and a material box vertical moving mechanism which are connected in sequence, and the cantilever is installed on the material box vertical moving mechanism.

[0017] A receiving portion is provided at the bottom of the empty material box storage box. The width and length of the receiving portion are greater than the cantilever. The receiving portion is used to receive the cantilever.

[0018] In a further embodiment, the resin feeding device includes: a resin feeding mechanism.

[0019] The resin feeding mechanism comprises: a resin power component, a bottom plate, a push plate and a fixing plate.

[0020] The resin power assembly and the fixing plate are installed in the resin silo, the push plate is connected to the bottom plate, the push plate and / or the bottom plate are connected to the resin power assembly, and the push plate and the fixing plate are obliquely arranged in the resin silo.

[0021] The push plates and the fixed plates are staggered and matched, and the top height positions of a plurality of the fixed plates and the push plates are arranged in a stepped structure.

[0022] The resin power component is used to drive the push plate to perform reciprocating linear motion.

[0023] When the resin power assembly drives the push plate to move to the lowest position, the height position of the top end of the push plate is less than or equal to the height position of the top end of the adjacent fixed plate.

[0024] When the resin power assembly drives the push plate to move to the highest position, the top height of the push plate is greater than or equal to the top height of the adjacent fixed plate, which solves the problem of the large overall volume of the existing resin feeding mechanism and further reduces the footprint of the semiconductor automated injection molding system.

[0025] In a further embodiment, the resin feeding device further includes: a resin silo, a resin discharge mechanism and a buffer return channel.

[0026] The resin feeding mechanism is arranged in the resin silo, the resin discharging mechanism is arranged at the end of the resin silo, one end of the buffer return channel is arranged at one side of the resin discharging mechanism, and the other end thereof is communicated with the resin silo.

[0027] One end of the resin feeding mechanism extends to one side of the resin discharging mechanism, and is used to transport the resin in the resin silo to the resin discharging mechanism.

[0028] The resin discharging mechanism is used to arrange the resin at a certain angle.

[0029] The buffer return channel includes a plurality of baffles, which are arranged in a stepped structure to reduce the deformation rate of the resin.

[0030] In a further embodiment, the material loading and transferring device comprises: a material loading and transferring driving mechanism, and a material loading and transferring grabbing and resin temporary storage mechanism connected to the material loading and transferring driving mechanism.

[0031] The material loading and transfer driving mechanism comprises: a material loading guide rail mechanism, a material loading gear rack mechanism and a material loading and transfer lifting mechanism, and the material loading guide rail mechanism is installed on the injection molding press.

[0032] The feeding gear rack mechanism and the feeding transfer lifting mechanism are installed on the feeding guide rail mechanism, the feeding transfer lifting mechanism is connected with the feeding gear rack mechanism, and the feeding transfer grabbing and resin temporary storage mechanism is installed on the feeding transfer lifting mechanism.

[0033] The feeding gear rack mechanism is arranged on the side of the feeding, transferring, grabbing and resin temporary storage mechanism close to the unloading device, which reduces the probability of workers accidentally touching the rack and improves the safety of the semiconductor automated injection molding system.

[0034] In a further embodiment, the material unloading equipment includes: a material unloading and transferring device, a flow channel removing device and a material receiving device which are arranged in sequence.

[0035] One end of the material unloading and transferring device extends into the injection molding press, and the other end thereof is arranged on the same side of the injection molding press as the material loading device.

[0036] The runner removal device and the material receiving device are arranged on the same side of the injection molding press as the material feeding equipment.

[0037] In a further embodiment, the material unloading and transferring device includes: a first product unloading mechanism and a second product unloading mechanism.

[0038] The first product unloading mechanism comprises: a first product displacement component, a first product lifting component and a first product clamping component which are connected in sequence, and one end of the first product displacement component extends into the injection molding press.

[0039] The second product unloading mechanism comprises: a second product displacement component and a lower fixture for removing the flow channel connected in sequence, and the lower fixture for removing the flow channel is provided with two groups of product positioning parts.

[0040] The deflow channel device comprises: a deflow channel lifting assembly and a deflow channel upper fixture connected in sequence, the deflow channel upper fixture is provided with two groups of deflow channel cutting parts, and the two groups of deflow channel cutting parts cooperate with two groups of product positioning parts.

[0041] The first product unloading mechanism is used to place two products on the lower de-runner fixture, the second product unloading mechanism is used to move the two products to the bottom of the upper de-runner fixture, and the de-runner lifting assembly is used to drive the upper de-runner fixture to perform de-runner work on the two products, which greatly reduces the volume of the second unloading mechanism and the de-runner mechanism, and further solves the problem of the large overall volume of existing semiconductor automated injection molding equipment.

[0042] In a further embodiment, the first product clamping assembly includes: a first product clamping plate, a first product clamping rail, a first product clamping jaw and a first product clamping cylinder.

[0043] The first product clamping plate is installed on the first product lifting assembly, the first product clamping guide rail and the first product clamping cylinder are installed on the first product clamping plate, the first product clamping claw is installed on the first product clamping guide rail, and the first product clamping claw is connected to the first product clamping cylinder.

[0044] The number of the first product clamping jaws is eight groups, the number of the first product clamping cylinders matches the number of the first product clamping jaws, and the first product clamping cylinders are used to drive the first product clamping jaws to clamp the eight products in the injection molding press.

[0045] The first product clamping assembly further includes: a product clamping connecting rod, which is used to connect two adjacent first product clamping jaws.

[0046] The number of the first product clamping cylinders is four, so that each first product clamping cylinder drives two groups of first product clamps to work at the same time, which enables the product unloading device to use the strategy of exchanging time for space without affecting the working efficiency of the entire semiconductor automated injection molding equipment.

[0047] The beneficial effects of the present invention are as follows: the present application reduces the floor space of the injection molding system by arranging the loading equipment and the unloading equipment on the same side of the injection molding press, reduces the walking distance of the staff between the loading equipment and the unloading equipment, enables the staff to take care of more equipment, and solves the problem that the injection molding system of the prior art has a large floor space and the staff cannot take care of more equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 It is an axonometric schematic diagram of the internal structure of the hidden protection plate and the frame of the semiconductor automated injection molding system of the present invention.

[0049] Figure 2 It is a structural schematic diagram of the material box feeding mechanism of the present invention used in a semiconductor automatic injection molding system.

[0050] Figure 3 It is an independent front view structural schematic diagram of the material box feeding mechanism of the present invention.

[0051] Figure 4 It is a partial structural schematic diagram of the material box feeding mechanism of the present invention.

[0052] Figure 5 It is an independent axonometric structural schematic diagram of the material box feeding mechanism of the present invention.

[0053] Figure 6 It is a structural schematic diagram of the resin feeding device of the present invention.

[0054] Figure 7 It is a structural schematic diagram of the resin discharge mechanism and the buffer return channel of the present invention.

[0055] Figure 8 It is a structural schematic diagram when the push plate of the resin feeding mechanism of the present invention is in the lowest position.

[0056] Fig. 9 It is a structural schematic diagram when the push plate of the resin feeding mechanism of the present invention is in the highest position.

[0057] Fig.10 It is a partial structural schematic diagram of the loading and transferring device of the present invention.

[0058] Fig.11 It is a schematic structural diagram of the loading and transferring device from another angle of the present invention.

[0059] Fig.12 It is a partial structural schematic diagram of the material unloading and transferring device of the present invention.

[0060] Fig.13 It is an axonometric schematic diagram of the internal structure of the semiconductor automated injection molding system of the present invention with hidden protective plates and a frame from another angle.

[0061] Fig.14 It is an independent structural schematic diagram of the material unloading and transferring device of the present invention.

[0062] Fig.15 It is a schematic structural diagram of the first product clamping assembly of the present invention.

[0063] The reference numerals shown in the figure are: injection molding press 100, product feeding device 200, full material box storage box 201, material box feeding moving mechanism 2011, material box lifting mechanism 202, material box horizontal moving mechanism 2021, material box vertical moving mechanism 2022, product pushing mechanism 203, empty material box storage box 204, receiving part 2041, cantilever 205, top material box clamping mechanism 206, resin feeding device 300, resin feeding mechanism 301, resin power assembly 3011, bottom plate 3 012, first fixed plate 3013, second fixed plate 3014, first push plate 3015, resin three-axis moving module 302, resin silo 303, resin discharge mechanism 304, discharge guide bracket 3041, discharge motor 3042, discharge synchronous belt mechanism 3043, discharge block 3044, discharge sensor 3045, buffer return channel 305, first baffle 3051, second baffle 3052, third baffle 3053, preheating device 400, loading and transferring device 50 0, feeding transfer driving mechanism 501, feeding guide rail mechanism 5011, feeding transfer lifting mechanism 5012, feeding gear rack mechanism 5013, feeding transfer grabbing and resin temporary storage mechanism 502, feeding grabbing mounting plate 5021, unloading transfer device 600, first product unloading mechanism 601, first product displacement assembly 6011, first product displacement screw mechanism 60111, first product displacement guide rail 60112, first product displacement motor 60113, first product lifting assembly 6012, the first product clamping assembly 6013, the second product unloading mechanism 602, the second product displacement assembly 6021, the second product displacement synchronous belt mechanism 60211, the second product displacement guide rail 60212, the second product displacement motor 60213, the deflow channel lower fixture 6022, the deflow channel device 700, the deflow channel lifting assembly 701, the deflow channel upper fixture 702, the material receiving device 800, the material receiving power mechanism 801, the material receiving clamping mechanism 802, and the material receiving box mechanism 803. DETAILED DESCRIPTION

[0064] In the following description, a large number of specific details are provided to provide a more thorough understanding of the present invention. However, it is apparent to those skilled in the art that the present invention can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present invention, some technical features well known in the art are not described.

[0065] The invention discloses a semiconductor automated injection molding system, which reduces the floor space of the injection molding system by arranging a loading device and a unloading device on the same side of an injection molding press, so that the staff can take care of more equipment.

[0066] like Figure 1 The semiconductor automated injection molding system shown includes: an injection molding press 100 , a loading device and an unloading device, wherein the loading device and the unloading device are arranged on the same side of the injection molding press 100 .

[0067] In this embodiment, the semiconductor automated injection molding system also includes a stand and control devices such as a PLC. The injection molding press 100, the loading device, and the unloading device are all installed on the stand, and the injection molding press 100, the loading device, and the unloading device and other action elements are all connected to control devices such as a PLC, and the PLC and other control devices control each action element to coordinate actions.

[0068] In a preferred embodiment, the loading end of the loading device and the unloading end of the unloading device are located on the same side, which can further reduce the walking distance of the staff between the loading device and the unloading device, allowing the staff to take care of more equipment.

[0069] Regarding feeding equipment, such as Figure 1 The feeding equipment shown includes: a product feeding device 200 , a resin feeding device 300 , a preheating device 400 and a feeding and transferring device 500 .

[0070] The product feeding device 200 is arranged below the resin feeding device 300, the preheating device 400 is arranged at one end of the product feeding device 200 close to the injection molding press 100, one end of the loading and transferring device 500 is arranged above the preheating device 400, and the other end thereof extends into the injection molding press 100, and the loading and transferring device 500 is used to simultaneously transport the product and the resin into the injection molding press 100.

[0071] In a preferred embodiment, the product feeding device 200, the preheating device 400 and the loading and transferring device 500 are arranged in a straight line, so that the loading and unloading paths are arranged in parallel, further reducing the space occupied by the loading and unloading equipment and reducing interference between the two, so that the loading and unloading equipment are arranged on the same side of the injection molding press 100.

[0072] By arranging the product feeding device 200 below the resin feeding device 300 , the space below the resin feeding device 300 can be utilized, further reducing the occupied space of the feeding equipment.

[0073] Regarding the product feeding device 200, as Figure 2-5 The product feeding device 200 shown includes: a material box loading mechanism.

[0074] The material box loading mechanism includes: a material box, a full material box storage box 201 , a material box lifting mechanism 202 , a product pushing mechanism 203 and an empty material box storage box 204 .

[0075] The material box is arranged in the full material box storage box 201 and / or the material box lifting mechanism 202, the empty material box storage box 204 is arranged below the full material box storage box 201, the material box lifting mechanism 202 is arranged at one end of the full material box storage box 201 and the empty material box storage box 204, and the product pushing mechanism 203 is arranged on one side of the material box lifting mechanism 202. Figure 2 The product pushing mechanism 203 shown is a combination of a cylinder and a push plate.

[0076] The material box lifting mechanism 202 includes: a material box power mechanism and a cantilever 205, and the cantilever 205 is installed on the material box power mechanism.

[0077] The cantilever 205 cooperates with the concave and convex parts of the material box, so that the cantilever 205 limits the width direction of the material box.

[0078] The length of the cantilever 205 is smaller than the width of the magazine.

[0079] The product feeding device 200 further includes: a top material box clamping mechanism 206 , which is installed on the material box power mechanism, and is used to apply a force on the material box in the direction of the cantilever 205 .

[0080] like Figure 2 The full material box storage box 201 is arranged below the resin material bin 303; the material box is used to contain the product; Figure 3 The material box power mechanism shown includes: a material box horizontal moving mechanism 2021 and a material box vertical moving mechanism 2022 connected in sequence, and the cantilever 205 is installed on the material box vertical moving mechanism 2022; protrusions are provided on both sides of the bottom of the material box, and the cantilever 205 is provided with a groove portion, so that the groove portion of the cantilever 205 and the protrusion portion of the material box are matched in a concave-convex manner, as shown in FIG. Figure 4 As shown, a groove portion of the cantilever 205 is matched with a protrusion portion of the material box in a concave-convex manner, and the end portion of the cantilever 205 is matched with another protrusion portion of the material box.

[0081] By means of the concave-convex fit between the cantilever 205 and the material box, the cantilever 205 and the material box are snap-fitted together, and the width direction of the material box can be limited at the bottom, thereby ensuring the stability of the material box during lifting and lowering while shortening the length of the cantilever 205, and preventing the end of the cantilever 205 from hitting the adjacent material box without setting a material box separation mechanism, thereby solving the problem of the complicated structure and large volume of the material box loading device that requires an additional material box separation mechanism in the prior art, reducing the space occupied by the product feeding device 200, and further reducing the overall volume of the semiconductor automated injection molding system.

[0082] The top material box clamping mechanism 206 applies a force to the material box in the direction of the cantilever 205, so that the material box power mechanism drives the top material box clamping mechanism 206, the material box and the cantilever 205 to rise and fall together, and can apply a clamping force to the material box in the material box lifting stage and the product pushing stage to ensure the stability of the material box. Compared with the prior art that only uses a lateral cylinder to apply a lateral clamping force to the material box in the product pushing stage without setting a cylinder, the stability of the material box throughout the process can be ensured, and the stability of the material box is further improved.

[0083] In this embodiment, a material box loading moving mechanism 2011 is provided at the bottom of the full material box storage box 201. The material box loading moving mechanism 2011 is used to drive the material box to move in the direction of the material box power mechanism. The material box power mechanism and the material box loading moving mechanism 2011 are a cylinder, or a hydraulic cylinder, or an electric cylinder, or a combination of a screw mechanism and a motor, or a combination of a rack and pinion mechanism and a motor.

[0084] The material box power mechanism includes: a material box transverse moving mechanism 2021 and a material box vertical moving mechanism 2022 which are connected in sequence, and the cantilever 205 is installed on the material box vertical moving mechanism 2022.

[0085] The bottom of the empty material box storage box 204 is provided with a receiving portion 2041, the width and length of the receiving portion 2041 are greater than the cantilever 205, and the receiving portion 2041 is used to receive the cantilever 205. Figure 5 The receiving portion 2041 shown is a groove. In other embodiments, a cushioning member may be provided in the empty material box storage box 204 so that a predetermined distance is spaced between the cushioning member and the bottom wall of the empty material box storage box 204 to form the receiving portion 2041 .

[0086] The above-mentioned product feeding device 200 also includes: a product conveying mechanism and a product three-axis moving module, the product conveying mechanism is arranged at one end of the material box loading mechanism, one end of the product three-axis moving module is arranged above the product conveying mechanism, and the other end thereof extends above the preheating device 400, wherein the product pushing mechanism 203 is used to push the product in the material box onto the product conveying mechanism, and the product three-axis moving module is used to place the product on the product conveying mechanism on the preheating device 400, and to make the arrangement of the product on the preheating device 400 cooperate with the clamping position of the loading and transferring device 500.

[0087] Regarding the resin feeding device 300, as shown in FIG. Figure 6-9 The resin feeding device 300 shown includes: a resin feeding mechanism 301 .

[0088] The resin feeding mechanism 301 includes: a resin power component 3011, a bottom plate 3012, a push plate and a fixing plate.

[0089] The resin power assembly 3011 and the fixing plate are installed in the resin silo 303 , the push plate is connected to the bottom plate 3012 , the push plate and / or the bottom plate 3012 are connected to the resin power assembly 3011 , and the push plate and the fixing plate are obliquely arranged in the resin silo 303 .

[0090] The push plates and the fixed plates are staggered and matched, and the top height positions of the plurality of fixed plates and the push plates are arranged in a stepped structure.

[0091] The resin power assembly 3011 is used to drive the push plate to perform reciprocating linear motion.

[0092] When the resin power component 3011 drives the push plate to move to the lowest position, the height position of the top end of the push plate is less than or equal to the height position of the top end of the adjacent fixed plate.

[0093] When the resin power component 3011 drives the push plate to move to the highest position, the height position of the top end of the push plate is greater than or equal to the height position of the top end of the adjacent fixed plate.

[0094] The bottom plate 3012 is a stepped structure, or the bottom plate 3012 is a flat plate arranged obliquely, such as Figure 8 At least one push plate is installed on each step of the bottom plate 3012, and the length of the push plate can be reduced by using the bottom plate 3012 with a stepped structure or the bottom plate 3012 arranged obliquely.

[0095] like Figure 8 and 9 The resin feeding mechanism 301 shown includes: a first fixed plate 3013, a second fixed plate 3014 and a first push plate 3015, the first push plate 3015 is arranged between the first fixed plate 3013 and the second fixed plate 3014, and the top end height position of the first fixed plate 3013 is smaller than the bottom end height position of the second fixed plate 3014.

[0096] When the power assembly drives the first push plate 3015 to move to the lowest position, the top height position of the first push plate 3015 is between the top height position of the first fixing plate 3013 and the bottom height position of the second fixing plate 3014 .

[0097] The top height of the first fixed plate 3013 is smaller than the bottom height of the second fixed plate 3014 , so that the push plate between the first fixed plate 3013 and the second fixed plate 3014 is always supported between the two fixed plates, further ensuring the working stability of the resin feeding mechanism 301 .

[0098] All push plates are fixed together by the base plate 3012. When the power component drives the base plate 3012 or one of the push plates to move, all push plates move together and cooperate with all fixed plates, which greatly simplifies the structure of the resin feeding mechanism 301, reduces the volume of the resin feeding mechanism 301, solves the problem of the large overall volume of the existing resin feeding mechanism 301, further reduces the footprint of the semiconductor automated injection molding system, and reduces the distance between the resin discharge mechanism 304 and the bottom of the resin silo 303, further reducing the deformation rate of the resin.

[0099] In this embodiment, the resin feeding device 300 further includes: a resin silo 303 , a resin discharge mechanism 304 and a buffer return channel 305 .

[0100] The resin feeding mechanism 301 is arranged in the resin silo 303 , the resin discharging mechanism 304 is arranged at the end of the resin silo 303 , one end of the buffer return channel 305 is arranged at one side of the resin discharging mechanism 304 , and the other end thereof is communicated with the resin silo 303 .

[0101] One end of the resin feeding mechanism 301 extends to one side of the resin discharging mechanism 304 , and is used to transport the resin in the resin silo 303 to the resin discharging mechanism 304 .

[0102] The resin discharge mechanism 304 is used to arrange the resin at a certain angle.

[0103] The buffer return channel 305 includes a plurality of baffles, which are arranged in a stepped structure.

[0104] like Figure 6 The discharging mechanism shown includes: a discharging guide bracket 3041, a discharging motor 3042, a discharging synchronous belt mechanism 3043, a discharging stopper 3044 and a discharging sensor 3045. The guide bracket is installed at the end of the resin silo 303, the discharging motor 3042, the discharging synchronous belt mechanism 3043, the discharging stopper 3044 and the discharging sensor 3045 are installed on the guide bracket, and the discharging motor 3042 and the discharging synchronous belt mechanism 3043 are installed above the resin silo 303 through the discharging guide bracket 3041. The discharging synchronous belt mechanism 3043 is connected to the discharging motor 3042, the discharging stopper 3044 and the discharging sensor 3045 are arranged above the discharging synchronous belt mechanism 3043, the buffer return channel 305 is arranged on one side of the discharging synchronous belt mechanism 3043, and the discharging buffer return channel 305 is located below the stopper and the sensor.

[0105] like Figure 7 The buffer return channel 305 shown includes: a first baffle 3051, a second baffle 3052 and a third baffle 3053 arranged in sequence from top to bottom, and the first baffle 3051, the second baffle 3052 and the third baffle 3053 are inclined plates that form a predetermined angle with the horizontal plane, such as Figure 7 As shown, the first baffle 3051 forms an angle of 60° with the horizontal plane, and the second baffle 3052 forms an angle of 45° with the horizontal plane. The inclined plates can reduce the retention of resin in the buffer return channel 305.

[0106] like Figure 1 The resin feeding device 300 shown also includes: a resin three-axis moving module 302, one end of the resin three-axis moving module 302 is arranged at the end of the resin discharge mechanism 304, and the other end thereof is arranged above the loading and transferring device 500, the resin loading mechanism 301 is used to transport the resin in the resin silo 303 to the resin discharge mechanism 304, the resin discharge mechanism 304 is used to transport the resin at a predetermined angle to the bottom of the resin three-axis moving module 302, and the resin three-axis moving module 302 is used to move the resin to the loading and transferring device 500.

[0107] The resin is transported to the resin discharge mechanism 304 through the resin feeding mechanism 301, and the resin discharge mechanism 304 transports the resin from one end close to the resin feeding mechanism 301 to the other end close to the buffer return channel 305. In this process, the resin is arranged at a certain angle, and the resin that does not meet the angle requirement is blocked by the block of the resin discharge mechanism 304 and returned to the buffer return channel 305, so that the resin falls into the resin silo 303 after being buffered by several baffles of the buffer return channel 305, thereby reducing the deformation rate of the resin and solving the problem that the resin in the prior art needs to fall from a higher place into the resin silo 303, which is prone to deformation. The frequency of adding resin by the staff is reduced, and the staff can further manage more semiconductor automated injection molding systems.

[0108] Regarding the loading and transferring driving mechanism 501, in the specification of the Chinese invention patent with publication number: CN116666286A, title: A loading system Figure 2 and attached Figure 3 Although it is disclosed that a loading gear rack mechanism 5013 is used to drive the loading, transferring, grabbing and resin temporary storage mechanism 502 to move along the extension direction of the loading guide mechanism 5011, its layout is that the loading equipment and the unloading equipment are arranged on both sides of the injection molding press 100, so the loading gear rack mechanism 5013 is always located on the outside of the loading equipment, and there is a high probability that the staff will accidentally touch the rack.

[0109] like Fig.10 and 11 The material loading and transferring device 500 shown includes: a material loading and transferring driving mechanism 501 , and a material loading and transferring grabbing and resin temporary storage mechanism 502 connected to the material loading and transferring driving mechanism 501 .

[0110] The material loading and transfer driving mechanism 501 includes: a material loading guide rail mechanism 5011 , a material loading gear rack mechanism 5013 , and a material loading and transfer lifting mechanism 5012 . The material loading guide rail mechanism 5011 is installed on the injection molding press 100 .

[0111] The feeding rack and pinion mechanism 5013 and the feeding transfer lifting mechanism 5012 are installed on the feeding guide rail mechanism 5011 , the feeding transfer lifting mechanism 5012 is connected to the feeding rack and pinion mechanism 5013 , and the feeding transfer grabbing and resin temporary storage mechanism 502 is installed on the feeding transfer lifting mechanism 5012 .

[0112] The feeding gear rack mechanism 5013 is arranged on the side of the feeding, transferring, grabbing and resin temporary storage mechanism 502 close to the unloading device.

[0113] like Fig.10 and 11 The shown loading, transferring and lifting mechanism 5012 includes a loading, transferring and lifting mounting plate installed on the loading gear rack mechanism 5013 and the loading guide rail mechanism 5011, and a loading, transferring and lifting cylinder installed on the loading, transferring and lifting mounting plate. The loading, transferring, grabbing and resin temporary storage mechanism 502 is installed on the loading, transferring and lifting cylinder through the loading, grabbing mounting plate 5021.

[0114] By arranging the loading device and the unloading device on the same side of the injection molding press 100, and the motor of the loading gear rack mechanism 5013 drives the rack to move along the loading guide mechanism 5011 through the gear, the loading gear rack mechanism 5013 is arranged on the side of the loading, transferring, grabbing and resin temporary storage mechanism 502 close to the unloading device, and the movable rack can be arranged in the middle of the injection molding system, thereby reducing the probability of the staff accidentally touching the rack and improving the safety of the semiconductor automated injection molding system.

[0115] About cutting equipment, such as Figure 1 , 12 -15 shows the unloading equipment, which includes: an unloading and transferring device 600, a flow channel removing device 700 and a material receiving device 800 which are arranged in sequence.

[0116] One end of the material unloading and transferring device 600 extends into the injection molding press 100 , and the other end thereof is arranged on the same side of the injection molding press 100 as the material loading device.

[0117] The runner removal device 700 and the material receiving device 800 are arranged on the same side of the injection molding press 100 as the material loading device.

[0118] Among them, the unloading and transferring device 600, the de-flowing device 700 and the receiving device 800 are arranged in a "one" shape, so that the unloading and transferring device 600 and the loading equipment are arranged on the same side of the injection molding press, and the arrangement direction of the de-flowing device 700 and the receiving device 800 is parallel to the arrangement direction of the product feeding device 200, the preheating device 400 and the loading and transferring device 500, so that the loading and unloading paths are arranged in parallel, further reducing the occupied space of the loading and unloading equipment, reducing the interference between the two, and making the loading and unloading equipment arranged on the same side of the injection molding press 100.

[0119] like Figure 12-14 The material unloading and transferring device 600 shown includes: a first product unloading mechanism 601 and a second product unloading mechanism 602 .

[0120] The first product unloading mechanism 601 includes: a first product displacement component 6011, a first product lifting component 6012 and a first product clamping component 6013 connected in sequence, one end of the first product displacement component 6011 extends into the injection molding press 100,

[0121] The second product unloading mechanism 602 comprises: a second product displacement assembly 6021 and a lower fixture 6022 for removing the flow channel connected in sequence, and the lower fixture 6022 for removing the flow channel is provided with two sets of product positioning parts.

[0122] The flow channel removal device 700 includes: a flow channel removal lifting assembly 701 and a flow channel removal upper fixture 702 connected in sequence, and the flow channel removal upper fixture 702 is provided with two groups of flow channel removal cutter parts, and the two groups of flow channel removal cutter parts cooperate with two groups of product positioning parts.

[0123] The first product unloading mechanism 601 is used to place two products on the deflowing lower fixture 6022, the second product unloading mechanism 602 is used to move the two products to the bottom of the deflowing upper fixture 702, and the deflowing lifting assembly 701 is used to drive the deflowing upper fixture 702 to perform deflowing work on the two products.

[0124] like Figure 1 The extension direction of the second product displacement assembly 6021 is arranged parallel to the arrangement direction of the product feeding device 200 , the preheating device 400 and the loading and transferring device 500 .

[0125] By arranging two groups of product positioning parts on the de-runner lower jig 6022 and two groups of de-runner cutting parts on the de-runner upper jig 702, the first product unloading mechanism 601 places two products on the de-runner lower jig 6022 each time, and then the second product unloading mechanism 602 moves the two products to the de-runner mechanism position each time to perform the de-runner work, which greatly reduces the volume of the second unloading mechanism and the de-runner mechanism, and further solves the problem of the large overall volume of the existing semiconductor automated injection molding equipment.

[0126] The first product displacement assembly 6011 includes: a first product displacement motor 60113, a first product displacement screw mechanism 60111 and a first product displacement guide rail 60112. The first product displacement motor 60113, the first product displacement screw mechanism 60111 and the first product displacement guide rail 60112 are installed on the injection molding machine. The first product displacement screw mechanism 60111 is connected to the first product displacement motor 60113. Two first product displacement guide rails 60112 are respectively arranged on both sides of the first product clamping assembly 6013. One of the first product displacement guide rails 60112 is arranged above the first product displacement screw mechanism 60111 and is connected to the first product displacement screw mechanism 60111. The other first product displacement guide rail 60112 is arranged above the second product displacement assembly 6021.

[0127] like Figure 12-14 The first product displacement motor 60113, the first product displacement screw mechanism 60111 and the first product displacement guide rail 60112 are installed on the injection molding machine through the mounting plate of the frame. The first product displacement guide rail 60112 is arranged above the second product displacement component 6021 through a pad. The two first product displacements are connected through the first product lifting component 6012 and the first product clamping component 6013.

[0128] By arranging the first product displacement guide rail 60112 above the second product displacement assembly 6021, the product on the first product clamping assembly 6013 can be placed on the lower fixture 6022 for deflowing the flow channel without arranging the cantilever 205. The space above the lower fixture 6022 for deflowing the flow channel is utilized to further reduce the horizontal plane area occupied by the product unloading device and improve the stability of the product unloading device.

[0129] The second product displacement component 6021 includes: a second product displacement motor 60213, a second product displacement synchronous belt mechanism 60211 and a second product displacement guide rail 60212. The second product displacement motor 60213, the second product displacement synchronous belt mechanism 60211 and the second product displacement guide rail 60212 are installed on the injection molding machine. The second product displacement synchronous belt mechanism 60211 is connected to the second product displacement motor 60213. The runner removal fixture 6022 is installed on the second product displacement synchronous belt mechanism 60211 and the second product displacement guide rail 60212.

[0130] The first product clamping assembly 6013 includes: a first product clamping plate, a first product clamping guide rail, a first product clamping claw and a first product clamping cylinder.

[0131] The first product clamping plate is installed on the first product lifting assembly 6012, the first product clamping rail and the first product clamping cylinder are installed on the first product clamping plate, the first product clamping claw is installed on the first product clamping rail, and the first product clamping claw and the first product clamping cylinder are connected.

[0132] The number of first product clamping jaws is eight groups, and the number of first product clamping cylinders matches the number of first product clamping jaws. The first product clamping cylinders are used to drive the first product clamping jaws to clamp the eight products in the injection molding press 100.

[0133] The first product clamping assembly 6013 also includes: a product clamping connecting rod, which is used to connect two adjacent first product clamping jaws.

[0134] The number of the first product clamping cylinders is four, so that each first product clamping cylinder drives two groups of first product clamping claws to work at the same time.

[0135] The eight groups of first product clamps can be used to take out the products in the injection molding press 100 at one time. When the first product clamping assembly 6013 places the products in groups of two on the runner lower fixture 6022, the injection molding press 100 performs the packaging work of the next group of products. This enables the product unloading device to use the strategy of exchanging time for space without affecting the working efficiency of the entire semiconductor automated injection molding equipment.

[0136] The first product clamping component 6013 puts down two products at a time at one position through the first product clamping cylinder, thereby improving the efficiency of product placement, reducing the number of first product clamping cylinders, reducing the cost of the unloading device, reducing the weight of the first product clamping component 6013, and enabling the first product lifting component 6012 to use a low-load and low-cost cylinder, further reducing the cost of the unloading device.

[0137] like Fig.13 The material receiving device 800 shown includes: a material receiving power mechanism 801, a material receiving lifting mechanism, a material receiving clamping mechanism 802 and a material receiving box mechanism 803; one end of the material receiving power mechanism 801 extends to above the second product unloading mechanism 602, and the other end extends to above the material receiving box mechanism 803; the material receiving box mechanism 803 includes: a box lifting mechanism, and a box arranged on the box lifting mechanism; the material receiving lifting mechanism is installed on the material receiving power mechanism 801, and the material receiving clamping mechanism 802 is installed on the material receiving lifting mechanism. The material receiving power mechanism 801 and the material receiving lifting mechanism are used to drive the material receiving clamping mechanism 802 to move the product on the deflow channel lower fixture 6022 of the second product unloading mechanism 602 to the material box of the material receiving box mechanism 803.

[0138] Working principle: The material receiving device 800 is arranged on one side of the product feeding device 200 and the resin feeding device 300, and one end of the unloading transfer device 600 and the deflow channel device 700 are arranged on one side of the preheating device 400 and the loading transfer device 500.

[0139] First, the product feeding device 200 of the loading equipment moves the product to the preheating device 400 , the loading and transferring device 500 clamps eight products on the preheating device 400 , and the resin feeding device 300 moves the resin to the loading and transferring device 500 .

[0140] Then, the loading and transferring device 500 simultaneously drives the eight products and the resin to move into the injection molding press 100 along the lateral direction.

[0141] Then the injection molding press 100 performs packaging work on the eight products. During this process, the product feeding device 200, the preheating device 400, the resin feeding device 300 and the loading and transferring device 500 cooperate to place the next group of products and resin on the loading and transferring device 500.

[0142] After the injection molding press 100 completes the packaging of a group of eight products, the first product unloading mechanism 601 of the unloading equipment takes out all eight products in the injection molding press 100 and moves them to the position of the second product unloading mechanism 602 along the longitudinal direction.

[0143] The first product unloading mechanism 601 places the products in groups of two on the de-flowing channel lower fixture 6022 of the second product unloading mechanism 602, and the second product unloading mechanism 602 moves in sequence along the lateral direction to the positions of the de-flowing channel device 700 and the receiving device 800.

[0144] The de-runner device 700 performs de-runner work on the two products on the de-runner lower fixture 6022, and then the material receiving device 800 puts the two products into the material box. After four rounds of cooperation between the first product unloading mechanism 601, the second product unloading mechanism 602, the de-runner device 700 and the material receiving device 800, all eight products on the first product unloading mechanism 601 are de-runnered and placed into the material box. During this process, the loading and transferring device 500 puts the next group of eight products into the injection molding press 100, and the injection molding press 100 performs packaging work on the next group of eight products.

[0145] As described above, although the present invention has been shown and described with reference to specific preferred embodiments, it should not be construed as limiting the present invention itself. Various changes may be made to it in form and detail without departing from the spirit and scope of the present invention as defined in the appended claims.

Claims

1. A semiconductor automated injection molding system, characterized in that: include: An injection molding press, a loading device and a unloading device, wherein the loading device and the unloading device are arranged on the same side of the injection molding press; The feeding equipment includes: a product feeding device, a preheating device and a feeding and transferring device; The material unloading equipment comprises: a flow channel removing device and a material receiving device; The arrangement directions of the product feeding device, the preheating device and the loading and transferring device and the arrangement directions of the flow channel removing device and the material receiving device are arranged in parallel.

2. A semiconductor automated injection molding system according to claim 1, characterized in that: The feeding equipment further comprises: a resin feeding device; The product feeding device is arranged below the resin feeding device, the preheating device is arranged at one end of the product feeding device close to the injection molding press, one end of the loading and transferring device is arranged above the preheating device, and the other end thereof extends into the injection molding press, and the loading and transferring device is used to simultaneously transport the product and the resin into the injection molding press.

3. A semiconductor automated injection molding system according to claim 2, characterized in that: The product feeding device comprises: a material box feeding mechanism; The material box loading mechanism includes: a material box, a full material box storage box, a material box lifting mechanism, a product pushing mechanism and an empty material box storage box; The material box is arranged in a full material box storage box and / or a material box lifting mechanism, the empty material box storage box is arranged below the full material box storage box, the material box lifting mechanism is arranged at one end of the full material box storage box and the empty material box storage box, and the product pushing mechanism is arranged at one side of the material box lifting mechanism; The material box lifting mechanism comprises: a material box power mechanism and a cantilever, wherein the cantilever is installed on the material box power mechanism; The cantilever cooperates with the concave and convex parts of the material box so that the cantilever limits the width direction of the material box; The cantilever length is smaller than the width of the material box; The product feeding device further comprises: a top material box clamping mechanism, wherein the top material box clamping mechanism is installed on the material box power mechanism, and the top material box clamping mechanism is used to apply a force to the material box in the direction of the cantilever.

4. A semiconductor automated injection molding system according to claim 3, characterized in that: A material box loading moving mechanism is provided at the bottom of the full material box storage box, and the material box loading moving mechanism is used to drive the material box to move in the direction of the material box power mechanism; The material box power mechanism comprises: a material box transverse moving mechanism and a material box vertical moving mechanism connected in sequence, and the cantilever is installed on the material box vertical moving mechanism; A receiving portion is provided at the bottom of the empty material box storage box. The width and length of the receiving portion are greater than the cantilever. The receiving portion is used to receive the cantilever.

5. A semiconductor automated injection molding system according to claim 2, characterized in that: The resin feeding device comprises: a resin feeding mechanism; The resin feeding mechanism comprises: a resin power assembly, a bottom plate, a push plate and a fixed plate; The resin power assembly and the fixing plate are installed in the resin silo, the push plate is connected to the bottom plate, the push plate and / or the bottom plate are connected to the resin power assembly, and the push plate and the fixing plate are obliquely arranged in the resin silo; The push plates and the fixed plates are staggered, and the top height positions of the fixed plates and the push plates are arranged in a stepped structure; The resin power component is used to drive the push plate to perform reciprocating linear motion; When the resin power assembly drives the push plate to move to the lowest position, the height position of the top end of the push plate is less than or equal to the height position of the top end of the adjacent fixed plate; When the resin power assembly drives the push plate to move to the highest position, the height position of the top end of the push plate is greater than or equal to the height position of the top end of the adjacent fixed plate.

6. A semiconductor automated injection molding system according to claim 5, characterized in that: The resin feeding device also includes: a resin silo, a resin discharge mechanism and a buffer return channel; The resin feeding mechanism is arranged in the resin silo, the resin discharging mechanism is arranged at the end of the resin silo, one end of the buffer return channel is arranged at one side of the resin discharging mechanism, and the other end thereof is communicated with the resin silo; One end of the resin feeding mechanism extends to one side of the resin discharging mechanism, and is used to transport the resin in the resin silo to the resin discharging mechanism; The resin discharging mechanism is used to arrange the resin at a certain angle; The buffer return channel includes a plurality of baffles, and the baffles are arranged in a stepped structure.

7. A semiconductor automated injection molding system according to claim 2, characterized in that: The material loading and transferring device comprises: a material loading and transferring driving mechanism, and a material loading and transferring grabbing and resin temporary storage mechanism connected to the material loading and transferring driving mechanism; The feeding and transferring driving mechanism comprises: a feeding guide rail mechanism, a feeding gear rack mechanism and a feeding and transferring lifting mechanism, and the feeding guide rail mechanism is installed on the injection molding press; The feeding gear rack mechanism and the feeding transfer lifting mechanism are installed on the feeding guide rail mechanism, the feeding transfer lifting mechanism is connected to the feeding gear rack mechanism, and the feeding transfer grabbing and resin temporary storage mechanism is installed on the feeding transfer lifting mechanism; The feeding gear rack mechanism is arranged on a side of the feeding, transferring, grabbing and resin temporary storage mechanism close to the unloading device.

8. The semiconductor automated injection molding system according to claim 1, characterized in that: The material unloading equipment also includes: a material unloading and transferring device; One end of the material unloading and transferring device extends into the injection molding press, and the other end thereof is arranged on the same side of the injection molding press as the material loading device; The runner removal device and the material receiving device are arranged on the same side of the injection molding press as the material feeding equipment.

9. A semiconductor automated injection molding system according to claim 8, characterized in that: The material unloading and transferring device comprises: a first product unloading mechanism and a second product unloading mechanism; The first product unloading mechanism comprises: a first product displacement component, a first product lifting component and a first product clamping component connected in sequence, and one end of the first product displacement component extends into the injection molding press; The second product unloading mechanism comprises: a second product displacement assembly and a runner lower fixture connected in sequence, wherein the runner lower fixture is provided with two sets of product positioning parts; The flow channel removal device comprises: a flow channel removal lifting assembly and a flow channel removal upper fixture connected in sequence, the flow channel removal upper fixture is provided with two groups of flow channel removal cutter parts, and the two groups of flow channel removal cutter parts cooperate with two groups of product positioning parts; The first product unloading mechanism is used to place two products on the lower fixture of the deflow channel, the second product unloading mechanism is used to move the two products to the bottom of the upper fixture of the deflow channel, and the deflow channel lifting assembly is used to drive the upper fixture of the deflow channel to perform deflow work on the two products.

10. A semiconductor automated injection molding system according to claim 9, characterized in that: The first product clamping assembly includes: a first product clamping plate, a first product clamping guide rail, a first product clamping claw and a first product clamping cylinder; The first product clamping plate is installed on the first product lifting assembly, the first product clamping guide rail and the first product clamping cylinder are installed on the first product clamping plate, the first product clamping claw is installed on the first product clamping guide rail, and the first product clamping claw is connected to the first product clamping cylinder; The number of the first product clamping jaws is eight groups, the number of the first product clamping cylinders matches the number of the first product clamping jaws, and the first product clamping cylinders are used to drive the first product clamping jaws to clamp eight products in the injection molding press; The first product clamping assembly further includes: a product clamping connecting rod, which is used to connect two adjacent first product clamping jaws; The number of the first product clamping cylinders is four, so that each first product clamping cylinder drives two groups of first product clamping jaws to work at the same time.

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