Orthogonal backboard structure and automatic test equipment

Abstract

An orthogonal backplane structure and automatic test equipment, comprising: a plurality of backplanes arranged in parallel, a plurality of first connectors arranged at the edge of one side of the backplane along a first direction; the edge of one side of the single board is provided with a plurality of second connectors along a second direction, and the plurality of second connectors are respectively connected with the first connectors on the plurality of backboards along a third direction; a plurality of second connectors formed by one second connector on each single board in the plurality of single boards are respectively connected with the plurality of first connectors on one back board along a third direction; wherein the third direction is parallel to the back plate and the single plate, and the first direction, the second direction and the third direction are perpendicular to one another. Therefore, the single board and the back board can be conveniently driven to be in plugging connection along the third direction, the projection area between the back board and the single board can be reduced, the arrangement space of components such as interfaces on the single board is increased, and the arrangement difficulty of the components such as the interfaces on the single board is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic circuits, in particular to an orthogonal backplane structure and automatic testing equipment. Background Art

[0002] In the field of ATE (Automatic Test Equipment), the backplane is a connection board installed inside the chassis. Each functional board is plugged into the backplane and connected, communicated and powered through the backplane to realize the operation of the entire machine head.

[0003] The boards in ATE need to additionally support the fan-out of resource pins (fan-out refers to the process of distributing an input signal to multiple output channels or devices) for chip testing of the user interface. Therefore, under the condition of structural support, a larger board area and more backplane slots mean more resource fan-out and more chips tested per unit time, i.e., the UPH (Units Per Hour) indicator. This directly leads to the ATE system having many slots, large size, complex functions, high power consumption, and greater difficulty in system design.

[0004] In common ATE, multiple boards are usually plugged into a backplane in a vertical direction, and each board is parallel to each other and is arranged on the same side surface of the backplane. The backplane covers a portion of the end surface of each board, and the portion of the end surface of each board not covered by the backplane is provided with an interface that supports the fan-out of resource pins. In addition to supporting the fan-out of resource pins, the above-mentioned ATE backplane setting method also needs to introduce a water-cooling joint to solve the problem of excessive heat generation of the board, but the introduction of the water-cooling joint will further compress the backplane width. When the backplane width is further compressed due to water cooling and resource fan-out units, system communication and related functions become more and more complex, which poses further challenges to the ATE backplane design. Therefore, there is an urgent need for an orthogonal backplane structure and automatic test equipment that can optimize the connection structure between the backplane and the board, reduce the backplane's occupation of the board edge space, increase the layout space of components such as interfaces on the board, and reduce the difficulty of setting components such as interfaces on the board. Utility Model Content

[0005] In view of the above problems in the prior art, the present application provides an orthogonal backplane structure and automatic testing equipment, which can optimize the connection structure between the backplane and the single board, reduce the occupancy of the backplane on the edge space of the single board, increase the layout space of components such as interfaces on the single board, and reduce the difficulty of setting components such as interfaces on the single board.

[0006] To achieve the above-mentioned objectives, the first aspect of the present application provides an orthogonal backplane structure, including: a backplane, on which a plurality of first connectors are arranged along a first direction at an edge position on one side of the backplane, and the backplane is provided with a plurality of connectors in parallel; a single board, on which a plurality of second connectors are arranged along a second direction at an edge position on one side of the single board, and the plurality of second connectors are respectively connected to one of the first connectors on the plurality of backplanes along a third direction; the single board is provided with a plurality of second connectors, and a plurality of second connectors formed by one of the second connectors on each of the plurality of single boards are respectively connected to a plurality of the first connectors on a backplane along a third direction; wherein the third direction is parallel to the backplane and the single board, and the first direction intersects with the second direction.

[0007] With the above structure, since the first connector and the second connector are respectively located at the edge position of one side of the backplane and the single board, by making the third direction parallel to the backplane and the single board, the second connector on the single board can be connected to the first connector on the backplane along the third direction, and can be connected along the parallel direction of the backplane, that is, the backplane and the single board are connected along the parallel direction (extension direction) of the backplane and the single board at the edge position. Thus, not only can the single board and the backplane be conveniently driven to be plugged and unplugged along the third direction, but also the projection area between the backplane and the single board can be reduced, that is, the occupation of the space on the single board by the backplane is reduced, the layout space of components such as interfaces on the single board is increased, and the difficulty of setting components such as interfaces on the single board is reduced. At the same time, by making the first direction intersect with the second direction, the backplane and the single board can be intersected when viewed along the third direction, so that the area of ​​the overlap of the projection between the backplane and the single board in the third direction can be reduced, the occupation of the space between the backplane and the single board at the edge position is reduced, the layout space of components such as interfaces on the single board is increased, and the difficulty of setting components such as interfaces on the single board is reduced.

[0008] As a possible implementation manner of the first aspect, the first direction, the second direction, and the third direction are perpendicular to each other.

[0009] By adopting the above structure, by making the first direction, the second direction and the third direction perpendicular to each other, the back panel and the single board can be made perpendicular when viewed along the third direction, thereby further reducing the overlapping area of ​​the projections of the back panel and the single board in the third direction, reducing the space occupied by the back panel and the single board at the edge position, increasing the layout space of components such as interfaces on the single board, and reducing the difficulty of setting components such as interfaces on the single board.

[0010] As a possible implementation of the first aspect, at least one of the backplanes is provided with a switching module, and at least one of the single boards is provided with a communication-connected optical module and a processing module, and the switching module realizes a communication connection with the processing module through the connection between the first connector and the second connector; after the first connector is connected to the second connector, the communication distances of the processing module, the switching module and the optical module are respectively adapted, so that the communication between the processing module and the switching module and the optical module, respectively, is normal.

[0011] With the above structure, by setting an optical module on the single board, the single board can be externally connected to the optical fiber, that is, the optical fiber is directly introduced on the single board to open up the communication connection between the single board and the PC end. In addition, since the signal driving capabilities between the processing module and the switching module and the optical module are different, by adapting the communication distance between the processing module and the switching module and the optical module respectively, the signal driving capabilities between the processing module and the switching module and the optical module are adapted, so that the communication between the processing module and the switching module and the optical module is normal.

[0012] As a possible implementation of the first aspect, a first part and a second part are provided on one side edge of the single board, and the first part is located at both ends of the one side edge of the single board; multiple first parts are provided, and each is provided with a second connector; viewed along the first direction, the first parts and the second parts corresponding to the multiple single boards overlap, that is, the first part and the second part on each of the single boards overlap with the corresponding first parts and the second parts on the other single boards along the first direction.

[0013] By adopting the above structure, the second connector is set in the first part, so that the second connector is located at both ends of the edge of one side of the single board, so that after the single board is connected to the first connector on the backplane through the second connector, the middle position of the single board is left vacant to facilitate the layout of components such as interfaces, so that the single board can be connected to other devices.

[0014] As a possible implementation of the first aspect, the first portion is in the shape of a rectangular notch. Specifically, the first portion can be a rectangular notch formed by cutting an edge of the board on which the second connector is provided in a direction perpendicular to the edge (the depth direction of the notch).

[0015] With the above structure, by making the first part in a notch shape, the communication distance between the processing module and the switching module can be reduced, and further the communication distance between the processing module and the optical module can be reduced. Thus, wiring can be more conveniently performed on the backplane and the single board.

[0016] As a possible implementation of the first aspect, the farther the first portions are from the second portion, the greater the depth of the gap in the first portion. Specifically, the first portions located on the same side of the second portion are arranged in a connected manner along the second direction, so that the first portions located on the same side of the second portion form a step shape due to different depths.

[0017] With the above structure, the notch depth of the first part that is farther from the second part is larger, so that one side edge of the single board can be stepped, thereby facilitating the processing of the single board.

[0018] As a possible implementation manner of the first aspect, a third connector and a water-cooling joint are provided on the second part, and the third connector is a spring pin module.

[0019] By adopting the above structure, the spring pin module and the water cooling connector are arranged on the second part, so that the spring pin module and the water cooling connector can be easily arranged, the spring pin module is conveniently connected with other devices, and the water cooling connector is conveniently connected with the water pump through the pipeline, so as to avoid obstruction after the single board is connected with the backplane.

[0020] As a possible implementation of the first aspect, the single board is formed by splicing at least one first PCB board and a second PCB board, the splicing position of the first PCB board and the second PCB board extends along the third direction, the optical module and the processing module are arranged on the second PCB board, and the optical module and at least one of the first parts are respectively located at two ends of the second PCB board.

[0021] With the above structure, the single board is formed by assembling multiple PCB boards along the plane where the single board is located, so that the single board can only be assembled and disassembled along the extension direction of the single board during assembly and disassembly, thereby reducing the difficulty of manufacturing and disassembling the single board. At the same time, by arranging the optical module and the processing module on the second PCB board, the layout of the optical module and the processing module can be facilitated.

[0022] As a possible implementation of the first aspect, the number of backplanes is less than or equal to 5, and the depth of the notch of the first part is set so that after the first connector is connected to the second connector, the other side edge of the backplane is in the notch of the first part or flush with the second part.

[0023] As a possible implementation manner of the first aspect, a size of the first portion in the second direction matches a size of a corresponding position of the first connector on the backplane in the second direction.

[0024] With the above structure, since the size of the single board is limited, by making the number of backplanes less than or equal to 5, it is possible to avoid the number of first parts on the backplane and the space they occupy being too large, which affects the setting of the spring pin module and the water-cooling connector on the second part. By making the size of the first part in the second direction match the size of the corresponding position of the first connector on the backplane in the second direction, it is possible to avoid the size of the first part being too large, which affects the size of the second part in the second direction, so that the second part has enough space to set the third connector and the water-cooling connector. By setting the depth of the notch of the first part so that after the first connector is connected to the second connector, the other side edge of the backplane is in the notch of the first part or flush with the second part, the space occupied by the single board and the backplane after being connected can be reduced, thereby facilitating the installation of the single board and the backplane.

[0025] As a possible implementation manner of the first aspect, the backplane is at least one of an active backplane, a passive backplane and a power backplane.

[0026] With the above structure, users can set different types of backplanes as needed, thereby increasing the adaptability of the device.

[0027] A second aspect of the present application provides an automatic testing device, comprising the orthogonal backplane structure described in any one of the first aspects of the present application.

[0028] With the above structure, since the first connector and the second connector are respectively located at the edge position of one side of the backplane and the single board, by making the third direction parallel to the backplane and the single board, the second connector on the single board can be connected to the first connector on the backplane along the third direction, and can be connected along the parallel direction of the backplane, that is, the backplane and the single board are connected along the parallel direction (extension direction) of the backplane and the single board at the edge position. Thus, not only can the single board and the backplane be conveniently driven to be plugged and unplugged along the third direction, but also the projection area between the backplane and the single board can be reduced, that is, the occupation of the space on the single board by the backplane is reduced, the layout space of components such as interfaces on the single board is increased, and the difficulty of setting components such as interfaces on the single board is reduced. At the same time, by making the first direction intersect with the second direction, the backplane and the single board can be intersected when viewed along the third direction, so that the projection area between the backplane and the single board in the third direction can be reduced, the occupation of the space between the backplane and the single board at the edge position is reduced, the layout space of components such as interfaces on the single board is increased, and the difficulty of setting components such as interfaces on the single board is reduced.

[0029] These and other aspects of the present invention will become more apparent from the following description of the embodiment(s). BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The following further illustrates the various features of the present invention and the relationship between the various features with reference to the accompanying drawings. The accompanying drawings are all exemplary, and some features are not shown in actual proportion. Some drawings may omit the features that are conventional in the field involved in the present application and are not necessary for the present application, or additionally show features that are not necessary for the present application. The combination of the various features shown in the accompanying drawings is not intended to limit the present application. In addition, throughout this specification, the same figure numerals refer to the same content. The specific description of the drawings is as follows:

[0031] Figure 1 It is a schematic diagram of the three-dimensional structure of the orthogonal backplane structure in this application;

[0032] Figure 2 for Figure 1 Schematic diagram of the orthographic projection structure of the orthogonal backplane structure.

[0033] Description of Reference Numerals

[0034] 10 orthogonal backplane structure; 100 backplane; 110 first connector; 120 switching module; 130 active backplane; 140 passive backplane; 150 power backplane; 200 single board; 210 second connector; 220 optical module; 230 processing module; 240 first part; 250 second part; 260 third connector; 270 water cooling joint; 280 first PCB board; 290 second PCB board. DETAILED DESCRIPTION

[0035] The words "first, second, third, etc." or module A, module B, module C and other similar terms in the specification and claims are only used to distinguish similar objects and do not represent a specific ordering of the objects. It is understandable that the specific order or sequence can be interchanged where permitted so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein.

[0036] The term "comprising" as used in the description and claims should not be interpreted as being limited to what is listed thereafter; it does not exclude other elements. It should therefore be interpreted as specifying the presence of the features, integers or components mentioned, but does not exclude the presence or addition of one or more other features, integers or components and groups thereof. Thus, the expression "a device comprising means A and B" should not be limited to a device consisting of components A and B only.

[0037] References to "one embodiment" or "an embodiment" in this specification mean that a particular feature, structure, or characteristic described in conjunction with the embodiment is included in at least one embodiment of the present invention. Therefore, the phrases "in one embodiment" or "in an embodiment" appearing in various places in this specification do not necessarily refer to the same embodiment, but may refer to the same embodiment. In addition, in one or more embodiments, the particular features, structures, or characteristics can be combined in any appropriate manner, as will be apparent to one of ordinary skill in the art from this disclosure.

[0038] The present application provides an orthogonal backplane structure 10. Below, in conjunction with the accompanying drawings, possible embodiments of the orthogonal backplane structure 10 in the present application are exemplarily described.

[0039] Figure 1 It is a schematic diagram of the three-dimensional structure of the orthogonal backplane structure 10 in this application; Figure 2 for Figure 1 FIG. 1 is a schematic diagram of the orthographic projection structure of the orthogonal backplane structure 10. Figure 1 , Figure 2 As shown, the orthogonal backplane structure 10 in the present application includes a backplane 100 and a single board 200. A plurality of first connectors 110 are arranged along a first direction X at an edge position of one side of the backplane 100, and a plurality of first connectors 110 are arranged in parallel at an edge position of one side of the single board 200 along a second direction Y (including but not limited to being arranged in a straight line along the second direction Y, preferably, as shown in FIG. Figure 2 The single board 200 is provided with a plurality of second connectors 210, and the plurality of second connectors 210 are respectively connected to a first connector 110 on a plurality of backplanes 100 along a third direction Z (i.e., the plurality of second connectors 210 on a single board 200 are respectively connected to a first connector 110 on a plurality of backplanes 100, and the connection direction is the third direction Z). The single board 200 is provided with a plurality of second connectors 210 on a plurality of single boards 200, and a second connector 210 on a plurality of single boards 200 is respectively connected to a plurality of first connectors 110 on a backplane 100 along the third direction Z. The third direction Z is respectively parallel to the backplane 100 and the single board 200, and the first direction X intersects with the second direction Y.

[0040] Since the first connector 110 and the second connector 210 are respectively located at the edge of one side of the backplane 100 and the single board 200, by making the third direction Z parallel to the backplane 100 and the single board 200, the second connector 210 on the single board 200 can be connected with the first connector 110 on the backplane 100 along the third direction Z, and can be connected along the parallel direction of the backplane 100, that is, the backplane 100 and the single board 200 are connected along the parallel direction (extension direction) of the backplane 100 and the single board 200 at the edge position. In this way, not only can the single board 200 and the backplane 100 be conveniently driven to be plugged and unplugged along the third direction Z, but the projection area between the backplane 100 and the single board 200 can also be reduced, that is, the space occupied by the backplane 100 on the single board 200 is reduced, the layout space of components such as interfaces on the single board 200 is increased, and the difficulty of setting components such as interfaces on the single board 200 is reduced. At the same time, by making the first direction X intersect with the second direction Y, the backplane 100 and the single board 200 can be intersected when viewed along the third direction Z, thereby reducing the overlapping area of ​​the projections of the backplane 100 and the single board 200 in the third direction Z, reducing the space occupied by the backplane 100 and the single board 200 at the edge position, increasing the layout space of components such as interfaces on the single board 200, and reducing the difficulty of setting components such as interfaces on the single board 200.

[0041] In some embodiments, the first direction X, the second direction Y and the third direction Z are perpendicular to each other. Therefore, by making the first direction X, the second direction Y and the third direction Z perpendicular to each other, the back plate 100 and the single board 200 can be made perpendicular when viewed along the third direction Z, thereby further reducing the overlapping area of ​​the projections of the back plate 100 and the single board 200 in the third direction Z, reducing the space occupied at the edge between the back plate 100 and the single board 200, increasing the layout space of components such as interfaces on the single board 200, and reducing the difficulty of setting components such as interfaces on the single board 200.

[0042] In some embodiments, at least one backplane 100 is provided with a switching module 120, and at least one single board 200 is provided with a communication-connected optical module 220 and a processing module 230, and the switching module 120 realizes a communication connection with the processing module 230 through the connection between the first connector 110 and the second connector 210; after the first connector 110 and the second connector 210 are connected, the processing module 230 is adapted to the communication distance of the switching module 120 and the optical module 220, respectively, so that the processing module 230 can communicate normally with the switching module 120 and the optical module 220, respectively. Therefore, by providing the optical module 220 on the single board 200, the single board 200 can be externally connected to the optical fiber, that is, the optical fiber is directly introduced on the single board 200 to open up the communication connection between the single board 200 and the PC end. In addition, since the signal driving capabilities between the processing module 230 and the switching module 120 and the optical module 220 are not the same, by adapting the communication distances between the processing module 230 and the switching module 120 and the optical module 220 respectively, the signal driving capabilities between the processing module 230 and the switching module 120 and the optical module 220 are adapted, so that the communication between the processing module 230 and the switching module 120 and the optical module 220 is normal.

[0043] In some embodiments, a first portion 240 and a second portion 250 are provided on one side edge of the single board 200, and the first portion 240 is located at both ends of one side edge of the single board 200; a plurality of first portions 240 are provided, each of which is provided with a second connector 210; and when viewed along the first direction X, the first portions 240 and the second portions 250 corresponding to the plurality of single boards 200 overlap. Figure 1 As shown, the first part 240 and the second part 250 on each single board 200 overlap with the corresponding first part 240 and the second part 250 on other single boards 200 along the first direction X. Therefore, by arranging the second connector 210 on the first part 240, the second connector 210 is located at both ends of one edge of the single board 200, so that after the single board 200 is connected to the first connector 110 on the backplane 100 through the second connector 210, the middle position of the single board 200 is vacated to facilitate the layout of components such as interfaces, so that the single board 200 can be connected to other devices.

[0044] In some embodiments, the first portion 240 is in the shape of a rectangular notch. Figure 2 As shown, a rectangular notch is cut in a direction perpendicular to the edge (depth direction of the notch) of one side edge of the second connector 210 provided on the single board 200. Thus, by making the first portion 240 notch-shaped, the communication distance between the processing module 230 and the switching module 120 can be reduced, and further the communication distance between the processing module 230 and the optical module 220 can be reduced. Thus, wiring can be more conveniently performed on the backplane 100 and the single board 200.

[0045] In some embodiments, the further away from the second portion 250 among the plurality of first portions 240 is, the greater the depth of the notch of the first portion 240 is. Figure 2 As shown, the plurality of first portions 240 located on the same side of the second portion 250 are arranged in a connected manner along the second direction Y, so that the plurality of first portions 240 located on the same side of the second portion 250 form a step shape due to different depths. Thus, by making the notch depth of the first portion 240 farther from the second portion 250 larger, one side edge of the single board 200 can be made into a step shape. Thus, the single board 200 can be processed conveniently.

[0046] In some embodiments, the second part 250 is provided with a third connector 260 and a water-cooling connector 270, and the third connector 260 is a spring pin module. Thus, by providing the spring pin module and the water-cooling connector 270 on the second part 250, the spring pin module and the water-cooling connector 270 can be conveniently arranged, so that the spring pin module is conveniently connected to other devices, and the water-cooling connector 270 is conveniently connected to the water pump through a pipeline, so as to avoid obstruction after the single board 200 is connected to the backplane 100.

[0047] In some embodiments, the single board 200 is formed by splicing at least one first PCB board 280 and a second PCB board 290, the splicing position of the first PCB board 280 and the second PCB board 290 extends along the third direction Z, the optical module 220 and the processing module 230 are arranged on the second PCB board 290, and the optical module 220 and the at least one first part 240 are respectively located at two ends of the second PCB board 290. Therefore, by making the single board 200 formed by splicing multiple PCB boards along the same plane, the single board 200 can only be assembled and disassembled along the extension direction of the single board 200 during assembly and disassembly, thereby reducing the difficulty of manufacturing and disassembly of the single board 200. At the same time, by arranging the optical module 220 and the processing module 230 on the second PCB board 290, the layout of the optical module 220 and the processing module 230 can be facilitated.

[0048] In some embodiments, the number of backplanes 100 is less than or equal to 5, and the depth of the notch of the first part 240 is set so that after the first connector 110 is connected to the second connector 210, the other side edge of the backplane 100 is in the notch of the first part or flush with the second part 250. The size of the first part 240 in the second direction Y is adapted to the size of the corresponding position of the first connector 110 on the backplane 100 in the second direction Y. Since the size of the single board 200 is limited, by making the number of backplanes 100 less than or equal to 5, it is possible to avoid the number of the first parts 240 on the backplane 100 and the space they occupy being too large, which affects the setting of the spring pin module and the water-cooling joint 270 on the second part 250. By making the size of the first part 240 in the second direction Y adapted to the size of the corresponding position of the first connector 110 on the backplane 100 in the second direction Y, it is possible to avoid the size of the first part 240 being too large, which affects the size of the second part 250 in the second direction, so that the second part 250 has enough space to set the third connector 260 and the water-cooling joint 270. By setting the depth of the notch of the first part 240 so that after the first connector 110 is connected to the second connector 210, the other side edge of the backplane 100 is in the notch of the first part or is flush with the second part 250, the space occupied by the single board 200 after the connection with the backplane 100 can be reduced, thereby facilitating the installation of the single board 200 and the backplane 100.

[0049] In some embodiments, the backplane 100 is at least one of an active backplane 130, a passive backplane 140, and a power backplane 150. Specifically, the backplane 100 may be, for example, Figure 1 , Figure 2 As shown, there are three backplanes 100, which are respectively an active backplane 130, a passive backplane 140 and a power backplane 150. Alternatively, there may be two backplanes, including an active backplane 130 and a passive backplane 140. Alternatively, the plurality of backplanes 100 may be set to other numbers, and at least one of the active backplane 130, the passive backplane 140 and the power backplane 150 may be set as needed, and there is no limitation on this. Thus, users can set different types of backplanes 100 as needed, thereby improving the adaptability range of the device.

[0050] The present application also provides an automatic testing device, including any possible implementation form of the above-mentioned orthogonal backplane structure 10, and the specific structure will not be repeated here.

[0051] The above content is an exemplary description of possible embodiments of the orthogonal backplane structure 10 and the automatic test equipment in the present application. In the following, in conjunction with the accompanying drawings, the orthogonal backplane structure 10 is described in detail in a specific embodiment.

[0052] like Figure 1 , Figure 2As shown, the orthogonal backplane structure 10 includes a single board 200, an active backplane 130, a passive backplane 140 and a power backplane 150. Among them, the active backplane 130 is provided with active components such as a switching module 120, and the passive backplane 140 is a relatively simple PCB board, and passive components such as resistors, capacitors, and inductors are provided on the passive backplane 140. After the power backplane 150 is connected to the single board 200, it is used to provide power to the single board 200.

[0053] like Figure 1 , Figure 2 As shown, the single board 200 is a rectangular PCB board, which is formed by splicing a first PCB board 280 and a second PCB board by connecting them in a connector manner. The splicing position of the first PCB board 280 and the second PCB board 290 extends along the third direction Z. The single board 200 has a first part 240 and a second part 250 on one side edge facing the third direction Z. Specifically, the first PCB board 280 is provided with a first part 240 and a second part 250, and the second PCB board 290 is provided with two first parts 240, so that the first part 240 is located at the two end positions of the side edge of the single board 200, and the second part 250 is located in the middle position of the side edge.

[0054] A second connector 210 disposed toward the third direction Z is disposed on each of the three first parts 240. Specifically, a first part 240 is disposed on the second part 250 at a position facing away from the second direction Y, and the second connector 210 on the first part 240 is used to connect with the first connector 110 described below on the power backplane 150. Two first parts 240 are disposed on the second part 250 at a position facing the second direction Y, wherein the second connector 210 on the first part 240 connected to the second part 250 is used to connect with the first connector 110 described below on the passive backplane 140, and the second connector 210 on the other first part 240 is used to connect with the first connector 110 described below on the active backplane 130.

[0055] Two third connectors 260 are arranged in the middle of the second part 250. The third connector 260 is a spring pin module to fan out the resource pins (fan-out refers to the process of an input signal being distributed to multiple output channels or devices) for chip testing of the user interface. A water cooling pipeline is also arranged on the single board 200. The water cooling pipeline is provided with two water cooling joints 270 (water inlet joint and water outlet joint) at both ends of the second part 250, which are used to communicate with the water pump so that the coolant circulates in the water cooling pipeline. By arranging the third connector 260 and the water cooling joint 270 on the second part 250, the third connector 260 and the water cooling joint 270 can be easily arranged, which is convenient for the third connector 260 to be connected with other devices, and for the water cooling joint 270 to be connected with the water pump through a pipeline, so as to avoid obstruction after the single board 200 is connected to the backplane 100.

[0056] like Figure 1 , Figure 2 As shown, the first part 240 is in the shape of a rectangular notch, and of the two first parts 240 located on one side of the second part 250 facing the second direction Y, the notch depth of the first part 240 connected to the second part 250 is less than the notch depth of the other first part 240. Thus, the edge of one side of the single board 200 facing the third direction Z can be in a step shape to facilitate the processing of the single board 200. The depth of the notch of the first part 240 is set so that after the first connector 110 is connected to the second connector 210, the other side edge of the back plate 100 is in the notch of the first part or is flush with the second part 250. Thus, the space occupied by the single board 200 after being connected to the back plate 100 can be reduced, so that the installation of the single board 200 and the back plate 100 can be facilitated.

[0057] like Figure 2 As shown, a processing module 230 and an optical module 220 are also provided on the single board 200 at a position corresponding to the active backplane 130. Among them, the optical module 220 is an optical fiber connector, which is located at the edge of the single board 200 facing away from the third direction Z, and is used to communicate with the PC end through an optical fiber. The processing module 230 is an FPGA (Field Programmable Gate Array), which is used to process data. After the single board 200 is connected to the first connector 110 of the active backplane 130 through the second connector 210, the processing module 230 on the single board 200 can be connected to the switching module 120 on the active backplane 130. In addition to the switching module 120, multiple modules such as a clock module need to be provided on the active backplane 130. When multiple modules such as the switching module 120 and the clock module are arranged on the active backplane 130, in addition to the layout requirements of the active backplane 130 itself, it is also necessary to coordinate the adaptation requirements for communication with the processing module 230 on the single board 200 and communication between the processing module 230 and the optical module 220. In this embodiment, by making the first part 240 in a notch shape, the communication distance between the processing module 230 and the switching module 120 can be reduced, and then the communication distance between the processing module 230 and the optical module 220 can be reduced. As a result, wiring can be more conveniently performed on the active backplane 130 and the single board 200.

[0058] like Figure 1 As shown, the single board 200 is provided with a plurality of first connectors 110 evenly arranged at the edge positions of the corresponding sides of the active backplane 130, the passive backplane 140 and the power backplane 150 along the first direction X. A first connector 110 on the active backplane 130, the passive backplane 140 and the power backplane 150 is connected to three second connectors 210 on a single board 200 along the third direction Z respectively.

[0059] like Figure 1 As shown, after the active backplane 130, the passive backplane 140 and the power backplane 150 are connected to the multiple single boards 200, the multiple single boards 200 are in a parallel state and are evenly arranged along the first direction X. The first connectors 110 on the active backplane 130, the passive backplane 140 and the power backplane 150 overlap one by one along the second direction Y, so that the active backplane 130, the passive backplane 140 and the power backplane 150 are connected to the multiple second connectors 210 on the multiple single boards 200 through the multiple first connectors 110. At the same time, the active backplane 130, the passive backplane 140 and the power backplane 150 can also be kept in a parallel state after being connected to the multiple single boards 200, so as to facilitate the electrical connection between the active backplane 130, the passive backplane 140 and the power backplane 150 through copper cables and / or connectors.

[0060] like Figure 1 , Figure 2 As shown, the third direction Z is parallel to the single board 200, the active backplane 130, the passive backplane 140 and the power backplane 150. Thus, it is convenient to plug and unplug the single board 200 and the active backplane 130, the passive backplane 140 and the power backplane 150. And when replacing chips with different test requirements, the backplane 100 with corresponding functions can be installed as needed to realize the combination of backplanes 100 with different functions, making the test more flexible and efficient.

[0061] like Figure 1 , Figure 2 As shown, the first direction X, the second direction Y and the third direction Z are perpendicular to each other. Therefore, when viewed along the third direction Z, the backplane 100 can be perpendicular to the single board 200, thereby further reducing the overlapping area of ​​the projections of the backplane 100 and the single board 200 in the third direction Z, reducing the space occupied at the edge between the backplane 100 and the single board 200, increasing the layout space of components such as the third connector 260 and the water cooling joint 270 on the single board 200, and reducing the difficulty of setting components such as interfaces on the single board 200. In addition, by making the first direction X, the second direction Y and the third direction Z perpendicular to each other, the width limitation of the traditional backplane 100 can also be avoided, and the number of backplanes 100 can be easily expanded to achieve the improvement of the overall ATE function.

[0062] like Figure 2 As shown by the dotted line in the figure, the single board 200 is formed by two PCB boards connected along the plane where the single board 200 is located through a connector or other detachable connection method, so that the single board 200 can only be assembled and disassembled along the extension direction of the single board 200 during assembly and disassembly, thereby reducing the difficulty of manufacturing and disassembly of the single board 200.

[0063] Note that the above are only preferred embodiments of the present application and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present application is described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, all of which belong to the scope of protection of the present invention.

Claims

1. An orthogonal backplane structure, characterized in that: include: A backplane, wherein a plurality of first connectors are arranged along a first direction at an edge position of one side of the backplane, and the backplane is provided with a plurality of first connectors in parallel; A single board, wherein a plurality of second connectors are arranged along a second direction at an edge position of one side of the single board, and the plurality of second connectors are respectively connected to one of the first connectors on the plurality of backplanes along a third direction; the single board is provided with a plurality of second connectors, wherein a plurality of second connectors formed by one of the second connectors on each of the plurality of single boards are respectively connected to a plurality of the first connectors on one of the backplanes along the third direction; The third direction is parallel to the back plate and the single plate, and the first direction, the second direction and the third direction are perpendicular to each other.

2. The orthogonal backplane structure according to claim 1, characterized in that: At least one of the backplanes is provided with a switching module, and at least one of the single boards is provided with a communication-connected optical module and a processing module, and the switching module realizes a communication connection with the processing module through the connection between the first connector and the second connector; after the first connector is connected to the second connector, the communication distances of the processing module, the switching module and the optical module are respectively adapted, so that the communication between the processing module, the switching module and the optical module, respectively, is normal.

3. The orthogonal backplane structure according to claim 2, characterized in that: A first part and a second part are provided on one side edge of the single board, and the first part is located at both ends of one side edge of the single board; multiple first parts are provided, each of which is provided with a second connector; viewed along the first direction, the first parts and the second parts corresponding to multiple single boards overlap.

4. The orthogonal backplane structure according to claim 3, characterized in that: The first portion is in a rectangular notch shape.

5. The orthogonal backplane structure according to claim 4, characterized in that: The farther the first parts are from the second part, the deeper the notch of the first part becomes.

6. The orthogonal backplane structure according to claim 5, characterized in that: The second part is provided with a third connector and a water cooling joint, and the third connector is a spring pin module.

7. The orthogonal backplane structure according to any one of claims 3 to 6, characterized in that: The single board is formed by splicing at least one first PCB board and a second PCB board, the splicing position of the first PCB board and the second PCB board extends along the third direction, the optical module and the processing module are arranged on the second PCB board, and the optical module and at least one of the first parts are respectively located at two ends of the second PCB board.

8. The orthogonal backplane structure according to any one of claims 4 to 6, characterized in that: The number of the backplanes is less than or equal to 5, and the depth of the first portion notch is set so that after the first connector is connected to the second connector, the other side edge of the backplane is in the notch of the first portion or flush with the second portion.

9. The orthogonal backplane structure according to any one of claims 1 to 6, characterized in that: The backplane is at least one of an active backplane, a passive backplane and a power backplane.

10. An automatic testing device, characterized in that: The invention comprises the orthogonal backplane structure as described in any one of claims 1 to 9.

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