ESD Pin injection detection device

Abstract

The utility model provides an ESD (Electro-Static Discharge) Pin injection detection device which comprises an ESD Pin test fixture, an impedance measurement module, a control switch and a display module, the ESD Pin test fixture is used for being connected with tested equipment through an IO (Input / Output) interface, and the impedance measurement module is connected with the ESD Pin test fixture under the control of the control switch and is used for measuring the impedance of a PIN of the tested equipment. The control switch is used for controlling connection or disconnection of the ESD Pin test fixture and the impedance measurement module, the display module is connected with the impedance measurement module and is used for displaying a numerical value of impedance, and the ESD Pin test fixture can be connected with an electrostatic emission device so that static electricity can be injected into the ESD Pin test fixture.

Description

Technical Field

[0001] The present application relates to the field of computer technology, and in particular to an ESD Pin injection detection device. Background Art

[0002] Existing laptops have I / O ports that are plugged in and out multiple times, which accumulates charges and then generates static electricity to damage the inside of the PCB. In order to solve this problem, an ESD Pin injection test solution is usually used. An electrostatic emission device is used to directly inject a kilovolt voltage into the external Pin pin to determine the tolerance strength of the parts and chips on the laptop PCB. However, after the static injection of the Pin pin is completed in this test solution, it is necessary to use an external I / O port device to determine whether it is damaged and it is impossible to accurately locate which pin has a problem.

[0003] One of the existing technologies is the original ESD Pin test solution, which manually solders the wire of the port to be measured to the corresponding port pin of the PCB board to make an ESD pin test fixture. Before the test, it is necessary to connect to an external device to detect whether the port function is normal. During the test, the electrostatic emitter is used to perform a kilovolt-level voltage electrostatic injection operation on the ESD pin test fixture. After the test is completed, the I / O port function needs to be verified. This technical solution requires functional verification before and after the test, and when a problem occurs with the device under test, it is impossible to determine which specific Pin has a problem.

[0004] The second prior art is an integrated ESD Pin test solution, which integrates most of the ports into the device and connects the device ports to the ports of the device under test through wires. Compared with the original ESD Pin measurement solution, this solution integrates all ports and is only convenient for testing multiple modules, but there is no substantial improvement in the functional verification before and after the test. During the test, if there is a problem with the device under test, it is still impossible to determine the specific Pin problem. Utility Model Content

[0005] The purpose of the embodiments of the present application is to provide an ESD Pin injection detection device.

[0006] The ESD Pin injection detection device provided according to the first aspect of the present application includes:

[0007] An ESD Pin test fixture, wherein the ESD Pin test fixture is used to connect to a device under test via an IO interface;

[0008] The impedance measurement module is connected to the ESD Pin test fixture under the control of the control switch to measure the PIN pin impedance of the device under test;

[0009] A control switch, used for controlling the connection between the ESD Pin test fixture and the impedance measurement module;

[0010] A display module, connected to the impedance measurement module, and used to display the value of the impedance;

[0011] The ESD Pin test fixture can be connected to an electrostatic emission device to be injected with static electricity.

[0012] According to an ESD Pin injection detection device of one embodiment of the present application, before testing, the control switch of the ESD Pin injection detection device is in an on state, and the display module indicates the impedance value of each Pin pin, and the impedance value reflects the first working state of each Pin pin.

[0013] According to an embodiment of the present application, the ESD Pin injection detection device further includes a power supply module, and after the control switch is turned on, the power supply module supplies power to the impedance measurement module and the reference resistor.

[0014] According to an ESD Pin injection detection device in one embodiment of the present application, the port of the device under test is connected in series between the power supply module and the COM interface through an ESDPin test fixture and a reference resistor. The power supply module provides a test current to the reference resistor and the device under test. The voltage drop on the reference resistor is used as a reference voltage, the voltage drop at the port of the device under test is used as an input voltage, and the product of the ratio of the reference voltage to the input voltage and the reference resistor is used as the port impedance value of the device under test.

[0015] According to an ESD Pin injection detection device in one embodiment of the present application, when the ESD Pin injection detection device is used in a test, the control switch is in an off state, and kilovolt-level static electricity is injected into the ESD Pin tool pin portion through the electrostatic emission device.

[0016] According to an ESD Pin injection detection device of one embodiment of the present application, after the ESD Pin injection detection device is used for testing, the electrostatic emission device does not inject static electricity into the ESD Pin test fixture, the control switch is in the on state, and the display module indicates the impedance value of each Pin pin, and the impedance value reflects the second working state of each Pin pin.

[0017] According to an ESD Pin injection detection device of one embodiment of the present application, an I / O pin of an electronic device is connected to a test fixture via a cable, and resistors are respectively provided at positions 1 to 17 of the test fixture.

[0018] According to an ESD Pin injection detection device in one embodiment of the present application, the distance between each adjacent position from the 1st position to the 17th position of the ESD Pin test fixture is greater than or equal to 15 mm.

[0019] According to an ESD Pin injection detection device of one embodiment of the present application, the distance between each position point from the 1st position to the 17th position of the ESD Pin test fixture and the edge copper wire of the ESD Pin test fixture is greater than or equal to 30 mm.

[0020] According to an ESD Pin injection detection device in one embodiment of the present application, the edge copper wire of the ESD Pin test fixture is greater than or equal to 7 mm.

[0021] The ESD Pin injection detection device provided in the present application, on the one hand, does not need to replace external equipment and can directly perform functional verification, thereby speeding up the test progress; on the other hand, the impedance measurement function is integrated into the ESD Pin test fixture. By measuring the Pin impedance before and after the test and observing the change in impedance before the test, the problem can be located without disassembling the machine for measurement. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the structure of an ESD Pin injection detection device according to an embodiment of the present application;

[0023] Figure 2 This is a schematic diagram of the structure of the ESD Pin injection detection circuit according to an embodiment of the present application;

[0024] Figure 3 Schematic diagram of the ESD Pin test fixture structure according to an embodiment of the present application. DETAILED DESCRIPTION

[0025] Various aspects and features of the present application are described herein with reference to the accompanying drawings.

[0026] It should be understood that various modifications may be made to the embodiments of the present application. Therefore, the above description should not be considered as limiting, but only as an example of an embodiment. Other modifications within the scope and spirit of the present application will occur to those skilled in the art.

[0027] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the present application and, together with the general description of the present application given above and the detailed description of the embodiments given below, serve to explain the principles of the present application.

[0028] These and other characteristics of the present application will become apparent from the following description of a preferred form of embodiment given as a non-limiting example with reference to the accompanying drawings.

[0029] It should also be understood that although the present application has been described with reference to some specific examples, those skilled in the art will be able to readily implement many other equivalent forms of the present application.

[0030] According to an ESD Pin injection detection device provided in one embodiment of the present application, Figure 1 As shown, the ESD Pin injection detection device includes:

[0031] ESD Pin test fixture, the ESD Pin test fixture is used to connect the device under test through the IO interface;

[0032] The impedance measurement module is connected to the ESD Pin test fixture under the control of the control switch to measure the PIN pin impedance of the device under test;

[0033] A control switch is used to control the connection between the ESD Pin test fixture and the impedance measurement module;

[0034] A display module, connected to the impedance measurement module, for displaying the impedance value;

[0035] The ESD Pin test fixture may be connected to an electrostatic emission device to be injected with static electricity.

[0036] According to an ESD Pin injection detection device of one embodiment of the present application, before testing, the control switch of the ESD Pin injection detection device is in an on state, and the display module indicates the impedance value of each Pin pin, and the impedance value reflects the first working state of each Pin pin.

[0037] According to an embodiment of the present application, the ESD Pin injection detection device further includes a power supply module, which supplies power to the impedance measurement module and the reference resistor after the control switch is turned on. Specifically, the impedance measurement module can be powered through the IN+ and IN- input pins of the impedance measurement module.

[0038] According to an ESD Pin injection detection device in one embodiment of the present application, the port of the device under test is connected in series between the power supply module and the COM interface through the ESD Pin test fixture and the reference resistor. The power supply module provides a test current to the reference resistor and the device under test. The voltage drop on the reference resistor is used as the reference voltage, the voltage drop at the port of the device under test is used as the input voltage, and the product of the ratio of the reference voltage to the input voltage and the reference resistor is used as the port impedance value of the device under test.

[0039] According to an ESD Pin injection detection device of one embodiment of the present application, when the ESD Pin injection detection device is used in a test, a control switch is in an off state, and kilovolt-level static electricity is injected into the ESD Pin tool pin portion through an electrostatic emission device.

[0040] According to an ESD Pin injection detection device of one embodiment of the present application, after the ESD Pin injection detection device is used for testing, the electrostatic emission device does not inject static electricity into the ESD Pin test fixture, the control switch is in the on state, and the display module indicates the impedance value of each Pin pin, and the impedance value reflects the second working state of each Pin pin.

[0041] According to an ESD Pin injection detection device of one embodiment of the present application, an I / O pin of an electronic device is connected to a test fixture via a cable, and resistors are respectively provided at positions 1 to 17 of the test fixture.

[0042] According to an ESD Pin injection detection device of one embodiment of the present application, the distance between each adjacent position from the 1st position to the 17th position of the ESD Pin test fixture is greater than or equal to 15 mm.

[0043] According to an ESD Pin injection detection device of one embodiment of the present application, the distance between each position point from the 1st position to the 17th position of the ESD Pin test fixture and the edge copper wire of the ESD Pin test fixture is greater than or equal to 30 mm.

[0044] According to an ESD Pin injection detection device in one embodiment of the present application, the edge copper wire of the ESD Pin test fixture is greater than or equal to 7 mm.

[0045] The ESD Pin injection detection device provided in the present application, on the one hand, does not need to replace external equipment and can directly perform functional verification, thereby speeding up the test progress; on the other hand, the impedance measurement function is integrated into the ESD Pin test fixture. By measuring the Pin impedance before and after the test and observing the change in impedance before the test, the problem can be located without disassembling the machine for measurement.

[0046] like Figure 2 The schematic diagram of the ESD Pin injection detection circuit structure of the present application is shown as follows: Figure 2 As shown, the impedance measurement module can use the TSC7106 chip. As a measurement chip for A / D digital-to-analog conversion and automatic range switching, the TSC7106 can achieve low-cost, high-precision and low-power impedance measurement. When measuring impedance, the TSC7106 converts impedance into a voltage signal through internal input resistance and conversion gain. In this process, the TSC7106 can achieve automatic range switching through automatic gain control (AGC) to ensure the accuracy and speed of AD conversion. After the conversion is completed, the specific impedance value is displayed through the connected display module.

[0047] After the control switch is turned off, the power supply module supplies power to the TSC7106 chip and the reference resistor. Specifically, power can be supplied through the IN+ and IN- input pins of the TSC7106 chip.

[0048] The port of the device under test is connected in series between the power supply module and the COM interface through the ESD Pin test fixture and the reference resistor. The power supply module provides test current to the reference resistor and the device under test. The voltage drop on the reference resistor is used as the reference voltage VREF, and the voltage drop at the port of the device under test is used as the input voltage VIN. VREF and VIN are compared, and the final impedance value of the device under test port is the product of the ratio of VREF and VIN and the reference resistor.

[0049] The control switch is used to control the input of analog signals and prevent the electrostatic gun from interfering with the entire ESD PIN injection detection scheme circuit. Specifically, before the test, the control switch is closed, the signal is input, and the display module displays the pin impedance of the device under test before the test; during the test, the control switch is disconnected, and the electrostatic gun voltage can only enter the device under test through the ESD Pin test fixture and cannot interfere with the ESD Pin detection circuit; after the test, the control switch is closed, the signal is input, and the pin impedance of the device under test after the test is displayed.

[0050] By observing the impedance changes of the Pin pins before and after the test, we can know whether the Pin pins are damaged. If the changes are small, it proves that the port tolerance is compliant. If the Pin pin impedance changes significantly or is not conductive, it means that the chip or anti-static component connected to the Pin pin is damaged or even completely destroyed, which makes it easier for engineers to further locate the problem of the specific chip or anti-static component.

[0051] The existing ESD Pin test device takes at least two hours to test and determine the port Pin. The ESD Pin injection detection device provided in this application can solve the problem of locating the specific Pin and can shorten the test time of the existing solution by at least half.

[0052] In order to address the disadvantage that static electricity damages the internal PCB board due to repeated plugging and unplugging of the I / O port of a laptop computer, the ESD Pin injection detection device provided in the present application is used to test the tolerance of the laptop computer port and improve the reliability of the laptop computer.

[0053] like Figure 3 The schematic diagram of the structure of the test fixture of the present application is shown in FIG. Figure 3As shown, the cable (as shown in the figure, the cable can also include a wire) is used as a connection line between the ESD Pin test fixture and the notebook I / O port. The 1st position to the 17th position, that is, the S1-S17 position, corresponds to the notebook I / O port pin through the cable. The electrostatic gun can be placed at S1-S17 to inject static electricity into the notebook I / O port. R1-R17 is the resistor that needs to be connected according to the ESD Pin test requirements to maintain the stability of the electrostatic waveform injected by the electrostatic gun. In order to reduce the energy loss injected by the electrostatic gun and the spatial coupling phenomenon caused during the transmission process, the distance between adjacent positions of S1-S17 is greater than or equal to 15mm, and the distance between S1-S17 and the edge copper wire of the ESD Pin test fixture (that is, the bare copper area shown in the figure) is greater than or equal to 30mm. The edge copper wire of the ESD Pin test fixture (that is, the width of the bare copper area shown in the figure) needs to be greater than or equal to 7mm.

[0054] It should be understood that the various parts of the present application can be implemented by hardware, software or a combination thereof. In the above-mentioned embodiments, multiple steps or methods can be implemented by software stored in a memory and executed by a suitable instruction execution system. For example, if implemented by hardware, as in another embodiment, it can be implemented by any one of the following technologies known in the art or their combination: a discrete logic circuit having a logic gate circuit for implementing a logic function for a data signal, a dedicated integrated circuit having a suitable combination of logic gate circuits, a programmable gate array (PGA), a field programmable gate array (FPGA), etc.

[0055] A person skilled in the art may understand that all or part of the steps of implementing the above-mentioned implementation method may be completed by instructing related hardware through a program, and the program may be stored in a readable storage medium, which, when executed, includes one or a combination of the steps of the implementation method.

[0056] In addition, each functional unit in each embodiment of the present application may be integrated into a processing module, or each unit may exist physically separately, or two or more units may be integrated into one module. The above-mentioned integrated module may be implemented in the form of hardware or in the form of a software functional module. If the integrated module is implemented in the form of a software functional module and sold or used as an independent product, it may also be stored in a readable storage medium. The storage medium may be a read-only memory, a disk or an optical disk, etc.

[0057] In the description of this specification, the description with reference to the terms "one embodiment / method", "some embodiments / methods", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment / method or example are included in at least one embodiment / method or example of the present application. In this specification, the schematic representations of the above terms are not necessarily the same embodiment / method or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments / methods or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments / methods or examples described in this specification and the features of the different embodiments / methods or examples, unless they are contradictory.

[0058] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0059] Those skilled in the art should understand that the above embodiments are only for the purpose of clearly illustrating the present application, and are not intended to limit the scope of the present application. For those skilled in the art, other changes or modifications may be made based on the above disclosure, and these changes or modifications are still within the scope of the present application.

Claims

1. An ESD Pin injection detection device, characterized in that: include: An ESD Pin test fixture, wherein the ESD Pin test fixture is used to connect to a device under test via an IO interface; The impedance measurement module is connected to the ESD Pin test fixture under the control of the control switch to measure the PIN pin impedance of the device under test; A control switch, used for controlling the connection between the ESD Pin test fixture and the impedance measurement module; A display module, connected to the impedance measurement module, and used to display the value of the impedance; The ESD Pin test fixture can be connected to an electrostatic emission device to be injected with static electricity.

2. The ESD Pin injection detection device according to claim 1, characterized in that: Before testing, the ESD Pin injection detection device controls the switch to be in an on state, and the display module indicates the impedance value of each Pin pin, and the impedance value reflects the first working state of each Pin pin.

3. The ESD Pin injection detection device according to claim 2, characterized in that: It also includes a power supply module, which supplies power to the impedance measurement module and the reference resistor after the control switch is turned on.

4. The ESD Pin injection detection device according to claim 3, characterized in that: The port of the device under test is connected in series between the power supply module and the COM interface through the ESD Pin test fixture and the reference resistor. The power supply module provides a test current to the reference resistor and the device under test. The voltage drop on the reference resistor is used as the reference voltage, the voltage drop at the port of the device under test is used as the input voltage, and the product of the ratio of the reference voltage to the input voltage and the reference resistor is used as the port impedance value of the device under test.

5. The ESD Pin injection detection device according to claim 1, characterized in that: When the ESD Pin injection detection device is used in a test, the control switch is in an off state, and kilovolt-level static electricity is injected into the ESD Pin tool pin portion through the static electricity emission device.

6. The ESD Pin injection detection device according to claim 1, characterized in that: After the ESD Pin injection detection device is used to complete the test, the electrostatic emission device does not inject static electricity into the ESD Pin test fixture, the control switch is in the on state, and the display module indicates the impedance value of each Pin pin, and the impedance value reflects the second working state of each Pin pin.

7. The ESD Pin injection detection device according to claim 1, characterized in that: The I / O pins of the electronic device are connected to the test fixture through cables, and resistors are respectively set at the first to the seventeenth positions of the test fixture.

8. The ESD Pin injection detection device according to claim 3, characterized in that: The distance between each adjacent position from the 1st position to the 17th position of the ESD Pin test fixture is greater than or equal to 15 mm.

9. The ESD Pin injection detection device according to claim 5, characterized in that: The distance between each position point from the 1st position to the 17th position of the ESD Pin test fixture and the edge copper wire of the ESD Pin test fixture is greater than or equal to 30 mm.

10. The ESD Pin injection detection device according to claim 1, characterized in that: The edge copper wire of the ESD Pin test fixture is greater than or equal to 7mm.

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