Packaging structure capable of effectively improving heat dissipation function
By using multi-layered metal substrate frames and conductive material layers in the packaging structure, multi-layered heat transfer channels are established, and heat dissipation holes are opened on the plastic sealing layer to fill the conductive or thermally conductive medium, the existing packaging structure has solved the problems of high cost, complex process and insufficient heat dissipation channels in terms of heat dissipation functions, achieving more efficient heat dissipation effects and lower costs.
Patent Information
- Application Number
- CN202420843080.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-23
- Publication Date
- 2025-04-25
- Estimated Expiration
- 2034-04-23
AI Technical Summary
The existing packaging structures have high costs, complex processes and insufficient heat dissipation channels in improving heat dissipation functions, making it difficult to meet the high power consumption requirements of high-performance computers for heat dissipation design.
Using a packaging structure including N metal substrate frames, multi-layer heat transfer channels are established by printing a layer of conductive material and mounting a chip, and a heat dissipation hole is opened on the plastic sealing layer to fill the conductive or thermally conductive medium to enhance the heat dissipation ability.
It effectively reduces product costs, simplifies the packaging process, enhances the heat dissipation effect, improves the temperature transfer capability of the chip, and avoids performance problems caused by excessive temperature.
Smart Images
Figure CN222801741U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of integrated circuit manufacturing, in particular to a packaging structure that effectively improves the heat dissipation function. Background Art
[0002] With the continuous development of Moore's Law, chip processing technology has been continuously breaking through, and the manufacturing process node has entered the angstrom era. Due to the more advanced manufacturing process, more transistors are integrated inside the chip with higher density and overall quantity, which has more functions and higher performance, but the increase in transistors brings higher power consumption requirements for heat dissipation design. If the accumulated heat cannot be dissipated in time to ensure that the chip temperature is below the safe temperature, the chip's operating performance will be affected at best, and it will be directly burned and paralyzed at worst, which seriously restricts the development of high-performance computers.
[0003] The current mainstream packaging and heat dissipation solutions in the industry are:
[0004] An additional metal heat dissipation component carrier is added to the top of the chip and thinned after plastic packaging to ensure the leakage of the metal heat dissipation component. At the same time, a heat dissipation channel of the top heat dissipation component is established through the bonding interface at the bottom of the top heat dissipation component.
[0005] The above structure has the following deficiencies:
[0006] A metal heat dissipation component carrier is added to the chip surface, and the non-functional area on the chip surface is limited, which cannot enhance the utilization of the functional area, and the chip heat dissipation interface cannot be maximized;
[0007] It is necessary to first plastic seal and then thin it to ensure that the metal heat dissipation component carrier is exposed, which increases the plastic seal grinding process and makes the packaging process more complicated;
[0008] Adding the combination and welding of the heat dissipation component on the top of the metal heat dissipation component carrier increases the packaging structure cost and the complexity of the packaging process. Utility Model Content
[0009] The current packaging process is complex, the overall cost is high, the heat dissipation channel is poor, and the temperature transfer of the chip itself cannot be improved. In view of the problem of heat dissipation, it is impossible to achieve higher current and higher voltage product application fields. The purpose of this utility model is to provide a preparation process for a packaging structure that effectively improves the heat dissipation function, which can comprehensively save and improve product costs and heat dissipation effects.
[0010] A packaging structure that effectively improves heat dissipation function, characterized in that:
[0011] It includes N metal substrate frames, N≥2;
[0012] The first conductive material layer is printed on the upper surfaces of the N metal substrate frames;
[0013] The upper surface of the first conductive material layer is mounted with a first chip;
[0014] Among the N metal substrate frames, the first chips on the A metal substrate frames are all printed with a second conductive material layer, and the upper surface of the second conductive material layer is mounted with a first conductive medium component, wherein 1≤A<N;
[0015] A third conductive material layer is printed on the upper surfaces of A first conductive medium components and the upper surfaces of the remaining first chips that are not printed with the second conductive material layer;
[0016] The same second conductive medium component is mounted on the N third conductive material layers;
[0017] The entire internal component is covered with a plastic packaging layer, and the lower surfaces of the N metal substrate frames and one end of the second conductive medium component are exposed outside the plastic packaging layer.
[0018] Preferably, a plurality of heat dissipation holes are evenly opened on the top of the plastic sealing layer directly above the first conductive medium component.
[0019] Furthermore, the heat dissipation holes are filled with a conductive or thermal conductive medium.
[0020] Specifically, a fourth conductive material layer is printed on the area of the second conductive medium component directly above the metal substrate frame where the first conductive medium component is not mounted, and a second chip is mounted on the fourth conductive material layer. The second chip is electrically connected to the second conductive medium component through a bonding wire.
[0021] Specifically, the first conductive medium component and the second conductive medium component are made of metal;
[0022] The first conductive material layer, the second conductive material layer, the third conductive material layer and the fourth conductive material layer are made of metal.
[0023] Compared with the prior art, the packaging structure of the utility model which effectively improves the heat dissipation function has the following advantages:
[0024] (1) Product cost: Using special-shaped conductive dielectric components to replace customized heat sinks improves costs and efficiency to a certain extent;
[0025] (2) Heat dissipation effect: Increase heat transfer and thermal channel establishment between heat dissipation chips, enhance the heat dissipation capacity of the bottom and top heat dissipation structures, enhance the chip's ability to transfer heat upward, and improve chip performance problems caused by excessive temperature;
[0026] (3) The current application of the packaging heat dissipation channels and process methods of this top heat dissipation structure is somewhat different from the existing solutions in the semiconductor packaging field. The overall heat dissipation industry still mainly achieves multi-functional heat dissipation by adding heat sinks or adding heat sinks on the top. The number of packaging heat dissipation channels can be increased to effectively transfer the temperature generated by the chip to the top heat dissipation channel, thereby reducing the impact of the chip junction temperature on the product itself. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] Figure 1 A schematic diagram of a packaging structure for effectively improving heat dissipation function provided in Example 1;
[0028] Figure 2 This is a schematic diagram of the product after completing step B1 in Example 2;
[0029] Figure 3 This is a schematic diagram of the product after step B2 in Example 2 is completed;
[0030] Figure 4 This is a schematic diagram of the product after step B3 in Example 2 is completed;
[0031] Figure 5 This is a schematic diagram of the product after step B4 in Example 2 is completed;
[0032] Figure 6 This is a schematic diagram of the product after step B5 in Example 2 is completed;
[0033] Figure 7 The product after step B6 in Example 2 is completed Figure 1 ;
[0034] Figure 8 The product after step B6 in Example 2 is completed Figure 2 ;
[0035] Fig. 9 This is a schematic diagram of the product after step B7 in Example 2 is completed;
[0036] Fig.10 This is a schematic diagram of the product after step B8 in Example 2 is completed. DETAILED DESCRIPTION
[0037] The specific implementation of the utility model is further described in detail below with reference to the accompanying drawings.
[0038] Example 1
[0039] In this embodiment, two metal substrate frames are taken as an example.
[0040] like Figure 1As shown, a packaging structure of the utility model that effectively improves the heat dissipation function includes N metal substrate frames 1; the upper surfaces of the N metal substrate frames 1 are all printed with a first conductive material layer 2; the upper surfaces of the first conductive material layer 2 are all mounted with a first chip 3; among the N metal substrate frames, the first chips on A metal substrate frames are all printed with a second conductive material layer 4, and the upper surfaces of the second conductive material layer 4 are all mounted with a first conductive medium component 5; the upper surfaces of the A first conductive medium components 5 and the upper surfaces of the remaining first chips that are not printed with the second conductive material layer 4 are all printed with a third conductive material layer 6; the same second conductive medium component 7 is mounted on the N third conductive material layers 6; the entire internal component is covered with a plastic sealing layer 11, and the lower surfaces of the N metal substrate frames 1 and one end of the second conductive medium component 7 are exposed outside the plastic sealing layer 11.
[0041] In this embodiment, a plurality of heat dissipation holes 12 are evenly opened on the top of the plastic sealing layer 11 located directly above the first conductive medium component 5. Furthermore, the heat dissipation holes 12 are filled with conductive or thermal conductive medium.
[0042] In this embodiment, a fourth conductive material layer 8 is printed on a region of the second conductive medium component 7 directly above the metal substrate frame where the first conductive medium component 5 is not mounted, and a second chip 9 is mounted on the fourth conductive material layer 8. The second chip 9 is electrically connected to the second conductive medium component 7 through a bonding wire 10.
[0043] In this embodiment, the first conductive medium component 5 and the second conductive medium component 7 are made of metal; the first conductive material layer 2, the second conductive material layer 4, the third conductive material layer 6 and the fourth conductive material layer 8 are made of metal.
[0044] Example 2
[0045] A preparation process of a packaging structure that effectively improves heat dissipation function comprises the following steps:
[0046] B1. Take N metal substrate frames 1 and print the first conductive material layer 2 on the upper surface thereof, wherein N ≥ 2. Figure 2 ;
[0047] B2. Mounting the first chip 3 on the first conductive material layer 2, such as Figure 3 As shown;
[0048] B3. Among N metal substrate frames, the first chips on A metal substrate frames are all printed with a second conductive material layer 4, and the upper surface of the second conductive material layer 4 is mounted with a first conductive medium component 5, where 1≤A<N, such as Figure 4 As shown;
[0049] B4, printing the third conductive material layer 6 on the upper surfaces of A first conductive medium components 5 and the upper surfaces of the remaining first chips that are not printed with the second conductive material layer 4, such as Figure 5 As shown;
[0050] B5. Mounting the same second conductive medium component 7 on the N third conductive material layers 6, such as Figure 6 As shown;
[0051] B6, printing a fourth conductive material layer 8 on the area of the second conductive medium component 7 directly above the metal substrate frame where the first conductive medium component 5 is not mounted, and mounting a second chip 9 on the fourth conductive material layer 8, as shown in FIG. Figure 7 and Figure 8 As shown;
[0052] B7, realize electrical connection between the second chip 9 and the second conductive medium component 7 through the bonding wire 10, such as Fig. 9 As shown;
[0053] B8, on the internal component formed after step B7, plastic sealing is performed to form a plastic sealing layer 11 on the periphery of the internal component, and the lower surfaces of the N metal substrate frames 1 and one end of the second conductive medium component 7 are exposed outside the plastic sealing layer 11, such as Fig.10 As shown;
[0054] B9, evenly open a plurality of heat dissipation holes 12 on the top of the plastic sealing layer 11 located directly above the first conductive medium component 5, and fill the heat dissipation holes 12 opened in the step with conductive or thermal conductive medium, such as Figure 1 shown.
[0055] In this embodiment, a laser drilling or mechanical drilling process is adopted to evenly open a plurality of heat dissipation holes 12 on the top of the plastic packaging layer located directly above the first conductive medium component 5, and a brushing process is adopted to fill the conductive or thermal conductive medium in the openings.
[0056] In this embodiment, N is 2.
[0057] In this embodiment, high-precision printing equipment and printing steel mesh are used to print a high-thermal conductivity first conductive material layer 2 of uniform thickness on the metal substrate frame 1 to ensure that the thickness and size of the conductive material are controllable; high-precision chip mounting equipment is used to mount the ultra-thin first chip 3 through the solder paste dispensing process, and ensure that the solder paste voids are controllable to meet the control requirements of the heat dissipation thermal resistance and the conductive Rdson at the bottom of the chip; high-precision copper sheet mounting equipment is used to mount the first conductive medium component 5 on the first chip 3 through the solder paste brushing process, and the heating temperature of the first chip 3 is transferred to the first conductive medium component 5; high-precision printing equipment and step-type printing steel mesh are used above the first conductive medium component 5 and the first chip 3 to increase the printing of a high-thermal conductivity third conductive material layer 6 of uniform thickness to ensure the thickness and size of the conductive material The size is controllable; high-precision chip mounting equipment is used to install the second conductive medium component 7 on the third conductive material layer 6 through the solder paste process to ensure that the temperature of the first conductive medium component 5 and the first chip 3 is effectively transferred upward; the fourth conductive material layer 8 with high thermal conductivity is used to effectively mount the third chip 9 on the second conductive medium component 7, and through the connection of the welding wire 10, the electrical connection between the third chip 9 and each functional component is ensured to achieve product function output; the plastic sealing layer 11 of high heat dissipation plastic sealing material is used to protect the internal product components and effectively isolate the influence of external water vapor and electrical interference; the laser opening process is used to design the opening of the plastic sealing layer 11 of the high heat dissipation plastic sealing material above the first conductive medium component 5, and the high thermal conductivity material is filled in the opening by the glue brushing process to ensure the effective realization of the top heat dissipation channel.
[0058] The preferred embodiments of the present invention have been specifically described above, but the present invention is not limited to the described embodiments. Those skilled in the art may make various equivalent modifications or substitutions without violating the spirit of the present invention, and these equivalent modifications or substitutions are all within the scope defined by the claims of this application.
Claims
1. A packaging structure that effectively improves heat dissipation function, characterized in that: It includes N metal substrate frames, N≥2; The first conductive material layer is printed on the upper surfaces of the N metal substrate frames; The upper surface of the first conductive material layer is mounted with a first chip; Among the N metal substrate frames, the first chips on the A metal substrate frames are all printed with a second conductive material layer, and the upper surface of the second conductive material layer is mounted with a first conductive medium component, wherein 1≤A<N; A third conductive material layer is printed on the upper surfaces of A of the first conductive medium components and the upper surfaces of the remaining first chips that are not printed with the second conductive material layer; The same second conductive medium component is mounted on the N third conductive material layers; The entire internal component is covered with a plastic packaging layer, and the lower surfaces of the N metal substrate frames and one end of the second conductive medium component are exposed outside the plastic packaging layer.
2. A packaging structure for effectively improving heat dissipation function as claimed in claim 1, characterized in that: A plurality of heat dissipation holes are evenly provided on the top of the plastic sealing layer located directly above the first conductive medium component.
3. A packaging structure for effectively improving heat dissipation function as claimed in claim 2, characterized in that: The heat dissipation holes are filled with conductive or thermal conductive media.
4. A packaging structure for effectively improving heat dissipation function as claimed in any one of claims 1 to 3, characterized in that: A fourth conductive material layer is printed on the area of the second conductive medium component directly above the metal substrate frame where the first conductive medium component is not mounted. A second chip is mounted on the fourth conductive material layer. The second chip is electrically connected to the second conductive medium component through a bonding wire.
5. A packaging structure for effectively improving heat dissipation function as claimed in claim 4, characterized in that: The first conductive medium component and the second conductive medium component are made of metal; The first conductive material layer, the second conductive material layer, the third conductive material layer and the fourth conductive material layer are made of metal.