Film pasting device

Abstract

The utility model provides a film pasting device, which comprises a working table, a film pasting device and a film pasting device, and is characterized in that a working area which has an adsorption function and is used for pasting a film on a wafer is formed on the working table; a pre-pressing unit, a winding and unwinding unit, a first winding and unwinding unit, a second winding and unwinding unit and a pressing unit are arranged on the workbench, wherein the pressing unit is located between the winding and unwinding unit and the first winding and unwinding unit and located above the operation area. The winding and unwinding unit, the first winding unit and the pressing unit can horizontally move on the workbench so as to enter or leave an operation area. A film stripping module and a film collecting module which can move to be close to or away from the working table top are arranged on the opposite sides of the winding and unwinding unit and the first winding and unwinding unit correspondingly. According to the film pasting device provided by the invention, the problems of bubbles and the like in the film pasting process can be effectively avoided, so that the film pasting yield is effectively improved.

Description

Technical Field

[0001] The present application belongs to the technical field of semiconductor equipment, and more specifically, to a film pasting device. Background Art

[0002] During the wafer production process, a protective film needs to be attached to the front of the product before grinding. During the film attaching process, due to the thinness and large diameter of the wafer, it is inevitable that the edge will be warped, which will affect the flatness of the film attaching surface, resulting in the protective film not being able to fit well on the wafer surface and bubbles appearing during the film attaching process. Utility Model Content

[0003] The purpose of the embodiments of the present application is to provide a film pasting device to solve the technical problem of wafer edge warping during the film pasting process in the prior art.

[0004] In order to achieve the above-mentioned purpose, the technical solution adopted in the embodiment of the present application is to provide a film sticking device, which includes:

[0005] A workbench, on which a working area with an adsorption function for attaching a film to the wafer is formed;

[0006] The workbench is provided with a pre-pressing unit, a reeling unit, a first reeling unit, a second reeling unit, and a pressing unit located between the reeling unit and the first reeling unit and above the working area;

[0007] The unwinding unit, the first rewinding unit and the pressing unit can all move horizontally on the workbench to enter or leave the working area; a film stripping module and a film taking-up module are respectively arranged on opposite sides of the unwinding unit and the first rewinding unit, each of which can move close to or away from the workbench;

[0008] The pre-pressing unit is used to press the wafer tightly against the working area, the unwinding unit is used to release the protective film, the stripping end of the stripping module is used to strip the adhesive layer and the protective layer on the protective film, the second winding unit is used to wind up the protective layer, the pressing unit is used to press the adhesive layer onto the wafer, and the first winding unit is used to wind up the excess adhesive layer after pressing.

[0009] Optionally, the pre-pressing unit includes a driving mechanism and a pressure plate with an adsorption function, and the shape of the pressure plate is adapted to the shape of the working area.

[0010] Optionally, a buffer is provided on a side of the pressure plate that adsorbs the wafer.

[0011] Optionally, the pre-pressing unit is arranged inside the workbench, the working area can be raised and lowered, and the driving mechanism can drive the pre-pressing unit to move above the working area.

[0012] Optionally, the driving mechanism comprises a multi-stage telescopic mechanism, in which a telescopic negative pressure pipeline is arranged, and the negative pressure pipeline is connected to the pressure plate.

[0013] Optionally, the multi-stage telescopic mechanism includes a slide rail assembly, a slide frame and a cylinder, and the slide rail assembly and the cylinder connect two adjacent slide frames.

[0014] Optionally, the unwinding unit, the first winding unit and the pressing unit can all move horizontally on the workbench to enter or leave the working area; a film stripping module and a film winding module are respectively arranged on opposite sides of the unwinding unit and the first winding unit, each of which can move close to or away from the workbench surface.

[0015] Optionally, the unwinding unit further comprises a unwinding bracket horizontally slidably disposed on the workbench and a unwinding roller module fixedly disposed on the unwinding bracket, and the film stripping module is vertically slidably disposed on the unwinding bracket.

[0016] Optionally, the first winding unit also includes a winding bracket horizontally slidably arranged on the workbench and a rotating frame rotatably arranged on the winding bracket, and a winding roller module and a film collecting module eccentrically arranged with the rotating shaft are arranged on the rotating frame; a lifting mechanism is connected between the winding bracket and the rotating frame and located on one side of the rotating shaft, and the lifting mechanism is used for pushing the rotating frame to rotate so that the film collecting module is close to or away from the work table surface.

[0017] Optionally, a braking mechanism is provided in either or both of the unwinding unit and the first winding unit, and the braking mechanism includes a braking roller and a braking plate capable of pressing against the braking roller, and the protective film and / or the adhesive layer is inserted between the braking roller and the braking plate.

[0018] Optionally, the pressing unit includes a pressing frame horizontally slidably disposed on the workbench and a pressing roller vertically movably disposed on the pressing frame.

[0019] The film sticking device provided in the embodiment of the present application has at least the following beneficial effects:

[0020] By setting a pre-pressing unit on the workbench, it is used to pre-level the wafer to be filmed to eliminate the warping of the edge of the wafer surface, thereby effectively avoiding problems such as bubbles in the filming process and effectively improving the filming yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0022] Figure 1 A three-dimensional diagram of a film sticking device in some embodiments of the present application;

[0023] Figure 2 A three-dimensional diagram of a film sticking device in some embodiments of the present application;

[0024] Figure 3 It is a front view of a partial structure of a film sticking device in some embodiments of the present application;

[0025] Figure 4 A three-dimensional diagram of a pre-pressing unit in some embodiments of the present application;

[0026] Figure 5 A three-dimensional diagram of a pre-pressing unit in some embodiments of the present application;

[0027] Figure 6 A schematic diagram of a film-mounting device in some embodiments of the present application;

[0028] Figure 7 A schematic diagram of a film laminating device in a laminating stage in some embodiments of the present application;

[0029] Figure 8 A schematic diagram of a film cutting stage of a film sticking device in some embodiments of the present application;

[0030] Fig. 9 This is a schematic diagram of the residual film recovery stage of the film sticking device in some embodiments of the present application;

[0031] Fig.10 This is a schematic diagram of the film-drawing stage of the film-sticking device in some embodiments of the present application. DETAILED DESCRIPTION

[0032] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0033] It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0034] It should be noted that when an element is referred to as being “fixed to” or “disposed on” another element, it may be directly on the other element or indirectly on the other element.

[0035] When an element is referred to as being “connected to” another element, it can be directly connected to the other element or indirectly connected to the other element.

[0036] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0037] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0038] In the description of the present application, “plurality” means two or more than two, unless otherwise clearly and specifically defined.

[0039] Please also read Figures 1 to 10 Now, the film sticking device provided in the embodiment of the present application is described.

[0040] It should be noted that the film pasting device described in the present application is used to adhere a film layer to a wafer; during the wafer pasting process, the protective film M and the adhesive layer M2 on the protective film M are first separated, the protective film M of the protective film M is wound up and recycled, and the adhesive layer M2 is cut after being bonded to the wafer, and the waste adhesive layer M2 remaining after cutting is also recycled.

[0041] refer to Figures 1 to 3 The film laminating device described in the present application includes a workbench and a pre-pressing unit 700, a unwinding unit 100, a first rewinding unit 200, a second rewinding unit 300 arranged on the workbench, and a pressing unit 400 located between the unwinding unit 100 and the first rewinding unit 200 and above the working area A.

[0042] Specifically, an operation area A for wafer filming is formed on the workbench. It can be understood that the operation area A can accommodate at least one wafer, or two, four, or even numbers of wafers. In a setting that can accommodate an even number of wafers, the even number of wafers are placed side by side in the width direction of the operation area A. In a further embodiment, the operation area A can be heated, so that during the wafer filming process, heating can soften the glue on the film layer covering the surface of the wafer so that the film layer can be better adhered to the surface of the wafer; the operation area A can be adsorbed to fix the wafer to prevent displacement during the filming process that causes filming failure.

[0043] The pre-pressing unit 700 is used to pre-level the wafer to be filmed. Specifically, it can be pressed so that all parts of the wafer (especially the edges) can be completely adsorbed by the adsorption device on the working area A to avoid the edge of the wafer from warping. In some embodiments where the working area A is fixed, the pre-pressing unit 700 is set on the table of the workbench and can be moved to the top of the working area A; it can also be hidden in the workbench and can be lifted and moved to the top of the working area A; in the embodiment where the working area A can be lifted and lowered, a carrier 800 is set in the workbench, and the working area A is formed on the top surface of the carrier 800. The carrier 800 can be lowered below the table of the workbench or raised until the surface of the working area A is flush with the table. The pre-pressing unit 700 is hidden in the workbench. When the working area A is lowered below the table of the workbench, the pre-pressing unit 700 can be moved to the top of the working area A to level the wafer thereon.

[0044] refer to Figures 4 to 5 In some embodiments, the pre-pressing unit 700 includes a driving mechanism 710 and a pressure plate 720 with an adsorption function. The shape of the pressure plate 720 matches the shape of the working area A. The bottom surface of the pressure plate 720 is provided with a plurality of adsorption holes distributed in a circular array corresponding to each wafer adsorption area. For example, when the working area A can accommodate multiple wafers, the pressure plate 720 is also configured to be able to adsorb and press multiple wafers at the same time.

[0045] Specifically, when the wafer is pressed, the wafer is first adsorbed and fixed by the working area A, and then the pressure plate 720 is moved to the top of the working area A and close to the working area A under the drive mechanism 710. During this process, the pressure plate 720 maintains adsorption on the wafer to further prevent the wafer from shifting. The upper and lower surfaces of the wafer are squeezed so that all parts of its surface can be leveled and fully adsorbed. After the leveling is completed, when the pressure plate 720 stops adsorbing and leaves the working area A, all parts of the wafer surface have been fully adsorbed by the working area A, thereby eliminating edge warping and the like.

[0046] refer to Figures 4 to 5In a further embodiment, a buffer 721 is provided on one side of the pressure plate 720 that adsorbs the wafer. In this embodiment, the buffer 721 is an annular rubber ring. Specifically, at least one annular mounting groove, for example, two or more, is provided on the adsorption surface of the pressure plate 720, and the mounting groove is used to clamp the rubber ring. When the working area A and the pressure plate 720 jointly squeeze the wafer, the upper surface of the wafer abuts against the rubber ring, thereby preventing the upper surface of the wafer from being damaged due to squeezing.

[0047] In the aforementioned embodiment in which the working area A can be raised and lowered, the driving mechanism 710 is a multi-stage telescopic mechanism. At the same time, a telescopic negative pressure pipe 713 is provided in the multi-stage telescopic mechanism. One end of the negative pressure pipe 713 is connected to an external generating device, which can be a vacuum generator. The other end of the negative pressure pipe 713 is used to provide negative pressure for the pressure plate 720. Specifically, the negative pressure pipe 713 is composed of a plurality of pipes that can be nested with each other, and a sealing component is connected between two mutually nested pipes. By arranging the negative pressure pipe 713 in this way, when the driving mechanism 710 is extended and retracted, compared with the arrangement of the negative pressure hose, the negative pressure flow of the negative pressure pipe 713 is larger and less prone to entanglement, which can effectively meet the needs of wafer leveling.

[0048] Specifically, the multi-stage telescopic mechanism includes a slide rail assembly, a slide 711 and a cylinder 712. The slide rail assembly and the cylinder 712 connect two adjacent slides 711. The two adjacent slides 711 can be slidably embedded to save space. The cylinder 712 is used to pull the two adjacent slides 711 to telescope. In this embodiment, the slide 711 is provided with three levels, and correspondingly, two sets of slide rail assemblies and two sets of cylinders 712 are provided. The negative pressure pipe 713 is provided between each slide 711.

[0049] In the specific operation process, the carrier 800 carrying the wafer descends below the table surface, the multi-stage telescopic mechanism drives the pressure plate 720 to the top of the wafer, the carrier 800 rises so that the upper surface of the wafer on it slowly approaches the pressure plate 720 and abuts against each other, and then the carrier 800 continues to rise, so that the upper surface of the wafer is fully squeezed and flattened by the pressure plate 720, so that the lower surface of the wafer can be fully adsorbed by the carrier 800 at all places, and at the same time, the negative pressure pipe 713 provides negative pressure to the pressure plate 720, so that the pressure plate 720 has suction to fix the wafer, thereby achieving wafer leveling; after the wafer is leveled, the carrier 800 descends slightly, so that the upper surface of the wafer leaves the pressure plate 720, and then the multi-stage telescopic mechanism moves back, and the carrier 800 rises until the wafer surface is flush with the table surface of the workbench, in preparation for subsequent film bonding operations.

[0050] Specifically, the aforementioned unwinding unit 100 is used to release the protective film M, the second winding unit 300 is used to recover the protective layer M1, the pressing unit 400 is used to press the adhesive layer M2 tightly onto the wafer, and the first winding unit 200 is used to recover the waste film adhesive layer M2 remaining after cutting.

[0051] refer to Figures 1 to 3 , Figures 6 to 10 Specifically, the unwinding unit 100, the first winding unit 200, the second winding unit 300 and the pressing unit 400 are described in detail below.

[0052] The unwinding unit 100 includes a unwinding bracket 120 and a unwinding roller module 130 arranged on the unwinding bracket 120, a film stripping module 110 and a plurality of first film guide rollers 141 arranged between the unwinding roller module 130 and the film stripping module 110, and a pressing roller 142, a film stripping power roller 143 and a second film guide roller 144 arranged after the film stripping module 110.

[0053] The protective film M roll is placed on the unwinding roller module 130, and the protective film M tape passes through the first film guide rollers 141 and the film stripping module 110 in sequence. At the film stripping module 110, the protective layer M1 tape and the adhesive layer M2 tape on the protective film M tape are torn off with a large angle between them. After being torn off, the protective layer M1 tape passes through the pressing roller 142, the film stripping power roller 143 and the second film guide roller 144 in sequence, and is finally wound and recovered by the second winding unit 300. During this process, the unwinding roller module 130 is used to release the protective film M tape, and each first film guide roller 141 plays a guiding and conveying role on the protective film M tape, so that the protective film M tape can be smoothly rolled up to the film stripping module 110 for peeling, the film stripping power roller 143 is used to roll up the protective layer M1 tape, and the pressing roller 142 is used to pull the protective layer M1 tape, so that the protective layer M1 tape can be smoothly rolled up by the film stripping power roller 143 to be smoothly separated from the adhesive layer M2 tape, and the second film guide roller 144 also plays a guiding role on the protective layer M1 tape.

[0054] The laminating unit 400 is slidably disposed on the workbench, and can slide in the working area A to press the adhesive layer M2 tape onto the wafer in the working area A. After the laminating of the adhesive layer M2 tape is completed, the wafer and the adhesive layer M2 tape are cut and separated by an external cutting unit. After the wafer and the adhesive layer M2 tape are cut, the wafer is transported away from the working area A by the transport unit, and the working area A leaves the remaining adhesive layer M2 tape.

[0055] The first winding unit 200 includes a winding bracket 220 and a film winding module 210, a film winding power roller 250, and a winding roller module 240 arranged on the winding bracket 220. The winding roller module 240 is used to wind up the remaining adhesive layer M2 tape after the film lamination and cutting are completed. The adhesive layer M2 tape passes through the film winding module 210 and the film winding power roller 250 in sequence and is wound on the winding roller module 240. It can be understood that the winding roller module 240 is a gravity roller arrangement. Specifically, a slide rail assembly is vertically arranged on the winding bracket 220. The winding roller module 240 is arranged on the slide rail assembly, and the winding roller thereon abuts against the film winding power roller 250, and is driven to rotate by the film winding power roller 250 to realize the winding and recycling of the remaining adhesive layer M2 tape.

[0056] The second winding unit 300 is used for winding and recovering the protective layer M1 tape.

[0057] Furthermore, the unwinding unit 100 and the first winding unit 200 can both be horizontally movably arranged on the workbench, and are driven by a linear drive mechanism 710, which includes but is not limited to a screw mechanism, a linear slide 600 mechanism, etc., and the unwinding unit 100 and the first winding unit 200 are each independently movable. In this way, the unwinding unit 100 and the first winding unit 200 can each independently move to enter or leave the working area A.

[0058] In some specific embodiments, linear slides 600 are provided on both sides of the workbench in the length direction.

[0059] For the unwinding unit 100, the unwinding unit 100 is slidably set on the linear slide 600, and a first driving source is set on the workbench. The first driving source can be a linear motor. The movable end of the first driving source is connected to the unwinding bracket 120. At the same time, the bottom of the unwinding bracket 120 is only slidably set on the linear slide 600.

[0060] For the first retracting unit 200 , two sides of its bottom are slidably disposed on two linear slides 600 , respectively, and the first retracting unit 200 is driven by one of the linear slides 600 to perform horizontal linear movement.

[0061] As for the pressing unit 400 , two sides of its bottom are also slidably disposed on two linear slides 600 , and the pressing unit 400 is driven by one of the linear slides 600 to perform horizontal linear movement.

[0062] By arranging linear slides 600 on both sides of the workbench and the first winding unit 200 and the pressing unit 400 are driven by different linear slides 600 respectively, the film laminating device of the present application has a compact structure and each unit occupies a small space.

[0063] In addition, the aforementioned film stripping module 110 and film collection module 210 can be movably arranged, and both can be moved to be close to or away from the table top of the workbench. The movable arrangement of the film stripping module 110 and the film collection module 210 can be moving along a vertical straight line, or swinging around a rotating shaft, but is not limited thereto. By movably arranging the film stripping module 110 and the film collection module 210, when the unwinding unit 100 and / or the first unwinding unit 200 moves, the vertical distance between the film stripping module 110 and the film collection module 210 and the work table can be increased, thereby avoiding motion interference between the film stripping module 110 and the film collection module 210 and the work table, and ultimately increasing the moving stroke of the unwinding unit 100 and the first unwinding unit 200 on the work table to improve work efficiency.

[0064] Specifically, refer to Figures 6 to 10 The operation process of the film pasting device according to the embodiment of the present application is described in detail below.

[0065] The protective film M installation stage. In this step, the protective film M roll is manually placed on the unwinding roller module 130, the protective film M tape is pulled out and sequentially passes through each first film guide roller 141 and the film stripping module 110, and the protective layer M1 tape and the adhesive layer M2 tape on the protective film M tape are torn off at the film stripping module 110; the torn adhesive layer M2 tape passes through the film winding module 210, and the gap between the film winding power roller 250 and the winding roller module 240 and is clamped by the film winding power roller 250 and the winding roller module 240 for subsequent winding and recycling; the torn protective layer M1 tape passes through the pressing roller 142, the film stripping power roller 143 and the second film guide roller 144 in sequence and is wound on the second winding unit 300.

[0066] Prepare for the film laminating stage. The first rewinding unit 200 and the laminating unit 400 are both moved to their initial positions away from the unwinding unit 100, and the laminating unit 400 is adjacent to the first rewinding unit 200. At the same time, the film rewinding module 210 presses against the adhesive layer M2 tape to make it close to the surface of the working area A. The unwinding unit 100 also moves horizontally to its initial position away from the laminating unit 400. At the same time, the film stripping module 110 also moves to its initial position away from the work surface, and the distance between the front end of the film stripping module 110 (i.e., the separation point of the protective layer M1 tape and the adhesive layer M2 tape) and the laminating unit 400 is greater than the maximum length of the laminating area, and the adhesive layer M2 tape forms a certain angle with the surface of the working area A.

[0067] Wafer leveling stage. The carrier 800 carrying the wafer descends below the table surface, and the multi-stage telescopic mechanism drives the pressure plate 720 to the top of the wafer. The carrier 800 rises so that the upper surface of the wafer on it slowly approaches the pressure plate 720 until they abut against each other and then continue to slowly lift up, so that the upper surface of the wafer is fully squeezed and leveled by the pressure plate 720, so that the lower surface of the wafer can be fully adsorbed by the carrier 800, thereby achieving wafer leveling; after the wafer is leveled, the carrier 800 descends slightly, so that the upper surface of the wafer leaves the pressure plate 720, and then the multi-stage telescopic mechanism moves back, and the carrier 800 rises until the surface of the wafer is flush with the table surface of the workbench.

[0068] Lamination stage. The lamination unit 400 moves toward the side close to the unwinding unit 100. During the movement, it presses the adhesive layer M2 tape to the surface of the wafer. During this process, the stripping module 110 also simultaneously descends close to the work surface, so that the protective film M tape on the unwinding unit 100 maintains a consistent tension during the pasting process, until the stripping module 110 descends to a position flush with the work surface. After the movement of the lamination unit 400 forms a complete coverage of the operating area A, the lamination operation is completed.

[0069] Film cutting stage: After the lamination operation is completed, the external cutting unit cuts the adhesive layer M2 tape adhered to the wafer surface to separate the adhesive layer M2 tape adhered to the wafer surface from the adhesive layer M2 tape located above the operation area A and not adhered to the wafer surface.

[0070] Residual film recovery stage: The position of the unwinding unit 100 remains unchanged, and the first rewinding unit 200 moves toward the side of the unwinding unit 100, thereby rewinding the remaining adhesive layer M2 on the working area A. When the first rewinding unit 200 moves to the edge of the working area A close to the rewinding unit, the residual film recovery operation is completed.

[0071] Film pulling stage. The film collection module 210 moves away from the work surface, and the winding roller module 240 and the film collection power roller 250 remain stationary to fix the adhesive layer M2. Then, the first winding unit 200 moves away from the unwinding unit 100 to reset. During this process, the unwinding roller module 130 releases the protective film M. At the same time, the film stripping module 110 also moves away from the work surface to avoid the adhesive layer M2 from contacting the work surface during the pulling process.

[0072] By configuring the film laminating device of the present application in this way, especially the unwinding unit 100 and the first winding unit 200 can be movably configured, and the stripping module 110 and the film collecting module 210 thereon can be movably configured, the first winding unit 200 can simultaneously pull out the adhesive layer M2 tape required for the next operation cycle while being reset and will not contact the work surface, thereby avoiding the waste of the adhesive layer M2 tape caused by the resetting of the first winding unit 200, thereby increasing the number of wafers laminated with a single roll of protective film M tape.

[0073] It is understandable that the aforementioned film stripping module 110 can be movably arranged, and the film stripping plate 111 can be movably arranged, or the entire film stripping module 110 can be movably arranged, and the movable arrangement can be swinging or linear movement, etc. For example, in the manner in which the entire film stripping module 110 is movably arranged, the film stripping module 110 includes a stripping bracket 113 and a linear driving device (such as a linear motor or a cylinder), the stripping bracket 113 is vertically slidably arranged on the winding bracket 120 and driven by the linear driving device, and the film stripping plate 111 and each first film guide roller 141 are both arranged on the stripping bracket 113.

[0074] refer to Figures 1 to 3 In some embodiments, the first winding unit 200 further includes a winding bracket 220 that is horizontally slidably disposed on the workbench and a rotating frame 230 that is rotatably disposed on the winding bracket 220, and a winding roller module 240 and a film collecting module 210 that are eccentrically disposed with respect to the rotating shaft are disposed on the rotating frame 230. By disposing the rotating frame 230, and disposing the winding roller module 240 and the film collecting module 210 on the rotating frame 230 together, when the first winding unit 200 needs to be reset after the previous wafer film bonding operation is completed and the residual film is recovered, the rotating frame 230 is rotated as a whole to move the film collecting module 210 toward the side away from the workbench, thereby avoiding the waste problem caused by the film collecting module 210 being too close to the workbench during the reset process of the first winding unit 200, so that the pulled out layer to be bonded M2 contacts the workbench too early.

[0075] It is understandable that the rotating frame 230 can be driven by a rotating motor or pushed by a cylinder to achieve swinging.

[0076] Specifically, refer to Figures 1 to 3 In some embodiments, a lifting mechanism 260 is connected between the winding bracket 220 and the rotating frame 230 and located on one side of the rotating shaft. The lifting mechanism 260 is used to push the rotating frame 230 to rotate so that the film collection module 210 is close to or away from the work surface. The lifting mechanism 260 can be a linear motor or a cylinder.

[0077] refer to Figures 1 to 3In some embodiments, a braking mechanism is provided at either or both of the unwinding unit 100 and the first winding unit 200, and the braking mechanism includes a braking roller 520 and a braking plate 510 that can be pressed against the braking roller 520, and a protective film M and / or an adhesive layer M2 is passed between the braking roller 520 and the braking plate 510.

[0078] In a specific embodiment, a braking mechanism is provided on both the unwinding unit 100 and the first rewinding unit 200 .

[0079] Specifically, in the unwinding unit 100, the brake mechanism is disposed on the stripping bracket 113 and is located before the stripping plate. The brake mechanism includes a brake cylinder and a brake plate 510, and the brake cylinder is used to push the brake plate 510 to abut against one of the first film guide rollers 141 to press the protective film M belt against the corresponding first film guide roller 141 and stop the protective film M belt.

[0080] In the first winding unit 200, the braking mechanism is arranged on the rotating frame 230 and is located in the film winding module 210, and the braking mechanism also includes a braking cylinder and a braking plate 510. Specifically, the film winding module 210 includes a guide roller 211, a tension cylinder, a tension roller 212, a braking roller 520, a braking cylinder and a braking plate 510. The tension roller 212 is arranged behind the guide roller 211, and the braking roller 520 is arranged behind the guide roller 211. The adhesive layer M2 belt passes through the gap between the guide roller 211 and the tension roller 212 after passing through the guide roller 211, and then passes through the braking roller 520 and then the film winding power roller 250 before being wound in the winding roller module 240.

[0081] The tension cylinder is connected to the tension roller 212, and is used to push the tension roller 212 closer to or away from the guide roller 211 to adjust the tension of the adhesive layer M2 tape in the first winding unit 200. The brake cylinder is connected to the brake plate 510 to push the brake plate 510 against the brake roller 520, thereby clamping and fixing the adhesive layer M2 tape.

[0082] The brake mechanism in the unwinding unit 100 is used to adjust the tension of the protective film M in the preparation stage of film lamination. Specifically, the brake cylinder pushes the brake plate 510 close to the first film guide roller 141 to increase the friction between the protective film M and the first guide roller 211 and the brake plate 510, so that the protective film M is in different tension states.

[0083] The brake mechanism in the first winding unit 200 is used to clamp the adhesive layer M2 tape and pull it toward the side away from the unwinding unit 100 during the film pulling stage. Specifically, when the unwinding roller module 130 releases the protective film M tape, the brake mechanism clamps the adhesive layer M2 tape, and at the same time, the first unwinding unit 100 moves on the working area A to clamp the adhesive layer M2 tape and pull it to the initial position.

[0084] By providing a braking mechanism on either or both of the unwinding unit 100 and the first rewinding unit 200 , the pulling or tension control of the protective film M tape or the adhesive layer M2 tape can be more precise, which is beneficial to improving the film sticking accuracy.

[0085] refer to Figures 1 to 3 In some embodiments, the laminating unit 400 includes a laminating frame 410 that is horizontally slidable on a workbench and a pressing roller 420 that is vertically movable on the laminating frame 410. For example, there may be a linear slide 600 on the workbench, and the laminating frame 410 is disposed on the linear slide 600, and the moving stroke of the linear slide 600 is greater than the length of the working area A. Furthermore, a laminating cylinder for pushing the pressing roller 420 toward or away from the workbench is also disposed on the laminating frame 410, and in the process of laminating and resetting the laminating unit 400 after laminating, the pressing roller 420 can leave the workbench to be smoothly reset.

[0086] Furthermore, a heating module is provided in the pressure roller 420, and correspondingly, a temperature sensor is also provided in the pressure roller 420. Thus, when the pressure roller 420 presses the adhesive layer M2 in the working area A onto the wafer, it can simultaneously heat the adhesive layer M2 to soften the adhesive layer thereon, thereby achieving a better pressing effect.

[0087] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A film pasting device, used for pasting a film layer on a piece of film to be pasted, characterized in that: include: A workbench, on which a working area with an adsorption function for attaching a film to a wafer is formed; The workbench is provided with a pre-pressing unit, a reeling unit, a first reeling unit, a second reeling unit, and a pressing unit located between the reeling unit and the first reeling unit and above the working area; The unwinding unit, the first rewinding unit and the pressing unit can all move horizontally on the workbench to enter or leave the working area; a film stripping module and a film taking-up module are respectively arranged on opposite sides of the unwinding unit and the first rewinding unit, each of which can move close to or away from the workbench; The pre-pressing unit is used to press the wafer tightly against the working area, the unwinding unit is used to release the protective film, the stripping end of the stripping module is used to strip the adhesive layer and the protective layer on the protective film, the second winding unit is used to wind up the protective layer, the pressing unit is used to press the adhesive layer onto the wafer, and the first winding unit is used to wind up the excess adhesive layer after pressing.

2. The film sticking device according to claim 1, characterized in that: The pre-pressing unit includes a driving mechanism and a pressure plate with an adsorption function, and the shape of the pressure plate is adapted to the shape of the working area.

3. The film sticking device according to claim 2, characterized in that: A buffer is arranged on one side of the pressure plate that absorbs the wafer.

4. The film sticking device according to claim 2 or 3, characterized in that: The pre-pressing unit is arranged inside the workbench, the working area can be raised and lowered, and the driving mechanism can drive the pre-pressing unit to move above the working area.

5. The film sticking device according to claim 4, characterized in that: The driving mechanism comprises a multi-stage telescopic mechanism, in which a telescopic negative pressure pipeline is arranged, and the negative pressure pipeline is connected to the pressure plate.

6. The film sticking device according to claim 5, characterized in that: The multi-stage telescopic mechanism comprises a slide rail assembly, a slide frame and a cylinder, wherein the slide rail assembly and the cylinder connect two adjacent slide frames.

7. The film sticking device according to any one of claims 1 to 3, characterized in that: The unwinding unit further comprises an unwinding support which is horizontally slidably arranged on the workbench and an unwinding roller module which is fixedly arranged on the unwinding support, and the film stripping module is vertically slidably arranged on the unwinding support.

8. The film sticking device according to any one of claims 1 to 3, characterized in that: The first winding unit also includes a winding bracket horizontally slidably arranged on the workbench and a rotating frame rotatably arranged on the winding bracket, on which a winding roller module and the film winding module eccentrically arranged with respect to the rotating shaft are arranged; a lifting mechanism is connected between the winding bracket and the rotating frame and located on one side of the rotating shaft, and the lifting mechanism is used to push the rotating frame to rotate so that the film winding module is close to or away from the worktable surface.

9. The film sticking device according to any one of claims 1 to 3, characterized in that: A braking mechanism is provided on either or both of the unwinding unit and the first winding unit. The braking mechanism includes a braking roller and a braking plate capable of pressing against the braking roller. The protective film and / or the adhesive layer is provided between the braking roller and the braking plate.

10. The film sticking device according to any one of claims 1 to 3, characterized in that: The pressing unit comprises a pressing frame which is horizontally slidably arranged on the workbench and a pressing roller which is vertically movably arranged on the pressing frame.

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