Semiconductor chip capping device

Abstract

The utility model discloses a semiconductor chip capping device, which comprises a working table, a capping frame fixedly connected to the upper end face of the working table, a cylinder in power connection with a movable frame located between the capping frame and the working table, a plurality of springs located in spring grooves fixedly connected between a clamping plate and the movable frame, and a protective cover located in a groove and clamped by the clamping plate. The upper end face of each fixing plate is fixedly connected with a first electric push rod, the movable protection frame is driven to move through the positioning grooves, the chip base can be fixed and positioned in cooperation with the fixing positioning plates, then the protection cover is driven to move downwards through the air cylinder, and after the movable frame abuts against the upper end face of the chip base, the protection cover is pushed to move downwards in cooperation with the first electric push rods. The protective cover is clamped in the clamping groove, so that capping can be completed, the clamping plate clamps the protective cover through the spring, and the protective cover is convenient to move in and move out, so that capping can be automatically carried out, a chip protection effect is achieved, manpower is saved, and the chip is prevented from being damaged by manpower.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor chips, in particular to a semiconductor chip capping device. Background Art

[0002] When semiconductor chips are packaged, they need to be covered with a protective cover to protect them. Manual operation can easily damage the chips. First, the chip base is fixed by a positioning block so that the card slot on the chip base is aligned with the protective cover up and down. The protective cover is placed in the capping machine housing in advance through a V-shaped card block, and the protective cover is carded into the card slot of the base with the help of a cylinder and an electric push rod, thereby realizing automatic capping of semiconductor chips, saving labor, and avoiding chip damage. Utility Model Content

[0003] The purpose of the utility model is to provide a semiconductor chip capping device to solve the problems raised in the above background technology.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor chip capping device comprises a workbench, an upper end surface of the workbench is fixedly connected to a capping frame, an upper end surface of the capping frame is fixedly connected to a cylinder, the cylinder is dynamically connected to a movable frame located between the capping frame and the workbench, the movable frame is provided with a groove, spring grooves are provided on the left and right sides of the groove, a clamping plate is connected in a left and right sliding manner in the spring groove, a plurality of springs located in the spring grooves are fixedly connected between the clamping plate and the movable frame, a protective cover is located in the groove and is clamped by the clamping plate, two left-right symmetrical fixed plates are fixedly connected to the front and rear end surfaces of the movable frame, a first electric push rod is fixedly connected to the upper end surface of each fixed plate, and the first electric push rod is dynamically connected to a push rod passing through the fixed plate.

[0005] Advantageously, a fixed positioning plate is fixedly connected to the left front side of the upper end surface of the workbench, a positioning groove is provided on the right rear side of the workbench, a sliding frame is slidably connected in the positioning groove, a second electric push rod is fixedly connected between the sliding frame and the workbench, the second electric push rod is dynamically connected to the sliding frame, a mobile protective frame is fixedly connected to the sliding frame, and the mobile protective frame can move and cooperate with the fixed positioning plate to fix the chip base on the upper end surface of the workbench;

[0006] Advantageously, the upper end surface of the workbench is fixedly connected to a chip base, a semiconductor chip is fixedly connected inside the chip base, the chip base is provided with a plurality of pin slots, the semiconductor chip is fixedly connected to pins passing through the pin slots and through the chip base, and the chip base is provided with a snap-in slot;

[0007] Advantageously, a controller is fixedly connected to the upper end surface of the workbench, and the controller controls the second electric push rod, the cylinder and the first electric push rod, thereby achieving automatic capping and avoiding manual operation and chip damage.

[0008] Compared with the prior art, the beneficial effects of the utility model are:

[0009] The utility model is provided with a movable protective frame, a clamping plate and a movable frame. The movable protective frame is driven to move by the positioning groove, and the chip base can be fixed and positioned in cooperation with the fixed positioning plate. The protective cover is then driven downward by the cylinder so that after the movable frame abuts against the upper end surface of the chip base, the protective cover is pushed downward in cooperation with the first electric push rod, and the protective cover is clamped into the clamping groove to complete the capping. The clamping plate clamps the protective cover by a spring, and is convenient for moving the protective cover in and out, so that the capping can be automatically performed, thereby playing a protective role in the chip, while saving labor and avoiding manual damage to the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a three-dimensional schematic diagram of the utility model;

[0011] Figure 2 for Figure 1 A top view of

[0012] Figure 3 for Figure 2 AA cross-sectional diagram of ;

[0013] Figure 4 for Figure 3 A partial enlarged schematic diagram of

[0014] Figure 5 It is a three-dimensional schematic diagram of the positioning groove of the utility model;

[0015] Figure 6 It is a three-dimensional schematic diagram of the clamping plate of the utility model.

[0016] In the figure: 100, workbench; 101, capping frame; 102, cylinder; 103, controller; 104, fixed positioning plate; 105, positioning groove; 106, movable frame; 107, chip base; 108, protective cover; 109, movable protective frame; 110, first electric push rod; 111, semiconductor chip; 112, card slot; 113, push rod; 114, spring slot; 115, card plate; 116, spring; 117, second electric push rod; 118, sliding frame; 119, pin slot; 120, pin; 121, fixed plate; 122, groove. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail in combination with the embodiments below. It should be understood that the specific embodiments described here are only used to explain the utility model, and are not used to limit the utility model.

[0018] Embodiment 1:

[0019] See also Figure 1-6 The utility model provides a technical solution: a semiconductor chip capping device, comprising a workbench 100, a capping frame 101 is fixedly connected to the upper end surface of the workbench 100, a cylinder 102 is fixedly connected to the upper end surface of the capping frame 101, the cylinder 102 is dynamically connected to a moving frame 106 located between the capping frame 101 and the workbench 100, the moving frame 106 is provided with a groove 122, the left and right sides of the groove 122 are provided with spring grooves 114, the spring grooves 114 slide left and right A clamping plate 115 is connected, and a plurality of springs 116 located in the spring groove 114 are fixedly connected between the clamping plate 115 and the movable frame 106. The protective cover 108 is located in the groove 122 and is clamped by the clamping plate 115. The front and rear end faces of the movable frame 106 are fixedly connected with two left-right symmetrical fixed plates 121, and the upper end face of each of the fixed plates 121 is fixedly connected with a first electric push rod 110, and the first electric push rod 110 is dynamically connected with a push rod 113 passing through the fixed plate 121.

[0020] A fixed positioning plate 104 is fixedly connected to the left front side of the upper end surface of the workbench 100, and a positioning groove 105 is provided on the right rear side of the workbench 100. A sliding frame 118 is slidably connected in the positioning groove 105. A second electric push rod 117 is fixedly connected between the sliding frame 118 and the workbench 100. The second electric push rod 117 is dynamically connected to the sliding frame 118. The sliding frame 118 is fixedly connected to a mobile protective frame 109. The mobile protective frame 109 can move and cooperate with the fixed positioning plate 104 to fix the chip base 107 on the upper end surface of the workbench 100;

[0021] The upper end surface of the workbench 100 is fixedly connected to a chip base 107, a semiconductor chip 111 is fixedly connected to the chip base 107, the chip base 107 is provided with a plurality of pin slots 119, the semiconductor chip 111 is fixedly connected to pins 120 passing through the pin slots 119 and passing through the chip base 107, and the chip base 107 is provided with a clamping slot 112;

[0022] The upper end surface of the workbench 100 is fixedly connected with a controller 103, and the controller 103 controls the second electric push rod 117, the cylinder 102 and the first electric push rod 110, so as to realize automatic capping and avoid manual operation and damage to the chip.

[0023] Working principle:

[0024] First, the left front corner of the chip base 107 is pressed against the fixed positioning plate 104, and then the second electric push rod 117 is started by the controller 103, and the second electric push rod 117 drives the sliding frame 118 to move to the left front, and the sliding frame 118 drives the mobile protective frame 109 to press against the right rear corner of the chip base 107, thereby clamping the chip base 107 and positioning the chip base 107;

[0025] Then, the cylinder 102 is started by the controller 103, and the cylinder 102 drives the moving frame 106 to move downward, so that the lower end surface of the moving frame 106 abuts against the upper end surface of the chip base 107, and then each first electric push rod 110 is started, and the first electric push rod 110 drives the push rod 113 to move downward, and the push rod 113 pushes the protective cover 108 to move downward. When the protective cover 108 moves downward, it pushes the card plate 115 to move into the spring groove 114. When the protective cover 108 moves downward, it is pressed into the card slot 112 by the first electric push rod 110, and the spring 116 drives the card plate 115 to move to the initial position, completing the capping;

[0026] After the capping is completed, the cylinder 102 drives the movable frame 106 to move up to the initial position, and at the same time, the first electric push rod 110 drives the push rod 113 to move up to the initial position, and then the second electric push rod 117 is started to drive the movable protective frame 109 to move, and the chip base 107 is released, so that the chip base 107 can be removed, and the new semiconductor chip 111 is inserted into the groove 122 and clamped by the clamping plate 115 to perform a cyclic capping.

[0027] It is obvious to those skilled in the art that various modifications and variations may be made to the disclosed embodiments. Other embodiments will be readily apparent to those skilled in the art in view of the specification and practice of the disclosed system. It is intended that the specification and examples be considered exemplary only, with the true scope of protection being determined by the appended claims and their equivalents.

Claims

1. A semiconductor chip capping device, comprising a workbench (100), characterized in that: The upper end surface of the workbench (100) is fixedly connected to a capping frame (101), the upper end surface of the capping frame (101) is fixedly connected to a cylinder (102), the cylinder (102) is dynamically connected to a moving frame (106) located between the capping frame (101) and the workbench (100), the moving frame (106) is provided with a groove (122), the left and right sides of the groove (122) are both provided with spring grooves (114), the spring grooves (114) ) is slidably connected to the inside of the movable frame (106) to the left and right, a plurality of springs (116) located in the spring grooves (114) are fixedly connected between the clamping plate (115) and the movable frame (106), a protective cover (108) is located in the groove (122), and the front and rear end surfaces of the movable frame (106) are fixedly connected to two left-right symmetrical fixed plates (121), and the upper end surface of each fixed plate (121) is fixedly connected to a first electric push rod (110).

2. A semiconductor chip capping device according to claim 1, characterized in that: A fixed positioning plate (104) is fixedly connected to the left front side of the upper end surface of the workbench (100), a positioning groove (105) is provided on the right rear side of the workbench (100), a sliding frame (118) is slidably connected in the positioning groove (105), and a second electric push rod (117) is fixedly connected between the sliding frame (118) and the workbench (100).

3. A semiconductor chip capping device according to claim 2, characterized in that: The second electric push rod (117) is connected to the sliding frame (118) by power, and the second electric push rod (117) can push the moving frame (118) to move, and the sliding frame (118) is fixedly connected to a moving protective frame (109).

4. A semiconductor chip capping device according to claim 3, characterized in that: The upper end surface of the workbench (100) is fixedly connected to a chip base (107), a semiconductor chip (111) is fixedly connected inside the chip base (107), the chip base (107) is provided with a plurality of pin grooves (119), the semiconductor chip (111) is fixedly connected to pins (120) passing through the pin grooves (119) and penetrating the chip base (107), and the chip base (107) is provided with a clamping groove (112).

5. The semiconductor chip capping device according to claim 3, characterized in that: A controller (103) is fixedly connected to the upper end surface of the workbench (100), and the controller (103) controls the second electric push rod (117), the cylinder (102) and the first electric push rod (110).

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