Die bonder with glue dipping function
By integrating the material collection mechanism, solid crystal platform mechanism, solid crystal head mechanism and dispensing mechanism in the solid crystal equipment, the problems of low integration and low automation of the existing solid crystal equipment are solved, and efficient and automated solid crystal operation is achieved.
Patent Information
- Application Number
- CN202421400714.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-19
- Publication Date
- 2025-04-25
- Estimated Expiration
- 2034-06-19
AI Technical Summary
In the crystal solid equipment with existing semiconductor packaging technology, the dispensing mechanism and the crystal solid mechanism are usually designed separately, resulting in low equipment integration, large site area, low degree of automation, and low working efficiency.
Design a crystal solid machine with glue dipping function, integrate the rack feeding mechanism, crystal platform mechanism, crystal head mechanism and dispensing mechanism, and realize the automatic operation of crystal solid and dispensing through the coordinated work of these mechanisms.
It improves the integration of crystal solidification equipment, saves the equipment's footprint, enhances the degree of automation, improves work efficiency, and realizes automated, efficient and accurate crystal solidification operations.
Smart Images
Figure CN222801751U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor packaging equipment, in particular to a crystal bonding machine with a glue dipping function. Background Art
[0002] In the die bonding equipment of some current semiconductor packaging technologies, the dispensing mechanism and the die bonding mechanism are usually designed separately. Such die bonding equipment has low integration, occupies a large area, relies on manual operation, has a low degree of automation, and has low work efficiency. Utility Model Content
[0003] The main purpose of the utility model is to provide a die bonding machine with a glue dipping function, aiming to solve the technical problems that the current die bonding equipment has a low degree of integration and occupies a large site area due to separate designs of glue dispensing and die bonding.
[0004] To achieve the above-mentioned purpose, the utility model proposes a die bonding machine with a glue dipping function, comprising: a frame and a material feeding and receiving mechanism, a die bonding platform mechanism, a die bonding head mechanism and a glue dispensing mechanism arranged on the frame, wherein:
[0005] The feeding and receiving mechanism is used to provide substrates that have not been bonded and to recover and place substrates that have been bonded;
[0006] The crystal bonding platform mechanism is used to transfer the substrate between the material feeding and receiving mechanism and the crystal bonding header mechanism;
[0007] The crystal bonding head mechanism includes a crystal bonding drive motor and a swing arm, wherein the crystal bonding drive motor is connected to the swing arm and drives the swing arm to rotate, so that the swing arm has a crystal taking position for sucking the chip and a crystal bonding position for placing the chip on the substrate;
[0008] The glue dispensing mechanism includes a glue dispensing column and a glue dispensing component arranged on the glue dispensing column, the glue dispensing column is arranged on the frame, the glue dispensing component includes a glue dispensing head, a glue dispensing drive motor and a glue dispensing voice coil motor, the glue dispensing column is provided with a glue cup for holding glue, the glue dispensing drive motor is arranged on the glue dispensing column, the output shaft of the glue dispensing drive motor is connected to a fixed frame and drives the fixed frame to rotate, the glue dispensing voice coil motor is arranged on the fixed frame and connected to the glue dispensing head, the fixed frame rotates so that the glue dispensing head rotates to the glue cup to dip in glue, and the glue dispensing voice coil motor drives the glue dispensing head to rise and fall to apply glue on the substrate.
[0009] In one embodiment, the dispensing mechanism also includes an adjustment component, which includes an adjustment base, a slide plate and a mounting plate. The dispensing drive motor is arranged on the mounting plate, and the adjustment base is arranged on the dispensing column. A transverse guide rail is provided between the adjustment base and the slide plate, and the slide plate is slidably connected to the adjustment base through the transverse guide rail. A longitudinal guide rail is provided between the mounting plate and the slide plate, and the mounting plate is slidably connected to the slide plate through the longitudinal guide rail.
[0010] In one embodiment, the material feeding and receiving mechanism includes a material box basket lifting and lowering material feeding and receiving component and a material pushing component, and the two are arranged correspondingly. The material box basket lifting and lowering material feeding and receiving component includes a component mounting seat, a material box driving motor and a material box tray. The component mounting seat is connected to the frame, and the material box driving motor drives the material box tray and drives the material box tray to rise and fall. The material box tray is used to place the substrate, and the material pushing assembly is used to push the substrate to the crystal bonding platform mechanism.
[0011] In one embodiment, two material boxes are provided on the material box tray, and the pushing assembly includes a pushing bracket, two pushing cylinders and two sensors. The pushing bracket is provided on the frame, and the pushing cylinder and the sensor are provided on the pushing bracket. The pushing cylinder and the sensor correspond to the material boxes one by one. The pushing cylinder is used to push the substrate, and the sensor is used to sense the substrate in the material box.
[0012] In one embodiment, the crystal bonding platform mechanism includes a moving component, a receiving seat component and a conveyor line body. The moving component is connected to the receiving seat component and drives the receiving seat component to move. The conveyor line body is arranged on the receiving seat component and is used to receive the substrate provided by the feeding and receiving mechanism. The receiving seat component is provided with a substrate lifting cylinder and a cover plate. The substrate lifting cylinder is used to lift the substrate. The cover plate is located above the conveyor line body to cooperate with the substrate lifting cylinder to clamp the substrate.
[0013] In one embodiment, the crystal bonding platform mechanism also includes a crystal bonding base, and the moving assembly includes an X-axis linear motor, a Y-axis linear motor and a Y-axis base, the X-axis linear motor is arranged on the crystal bonding base, and the crystal bonding base is also provided with an X-axis linear guide, the X-axis linear motor is connected to the Y-axis base and drives the Y-axis base to move along the X-axis linear guide, the Y-axis linear motor is arranged on the Y-axis base, and the Y-axis base is also provided with a Y-axis linear guide, the Y-axis linear motor is connected to the socket seat assembly and drives the socket seat assembly to move along the Y-axis linear guide.
[0014] In one embodiment, the receiving seat assembly includes a receiving base and a fixed side plate and a movable side plate spaced apart on the receiving base, the fixed side plate and the movable side plate are both provided with the conveying line body, the conveying line body includes a rolling motor, a transmission assembly and a belt, the rolling motor drives the belt to rotate through the transmission assembly, the belt is used to convey the substrate, the substrate lifting cylinder is provided on the receiving base and is located between the fixed side plate and the movable side plate, and the cover plate is provided on the movable side plate and the fixed side plate.
[0015] In one embodiment, the crystal bonding head mechanism also includes a crystal bonding column, a swing arm voice coil camera and a bottom vision camera, the crystal bonding column is arranged on the frame, the crystal bonding drive motor is arranged on the crystal bonding column, the swing arm voice coil camera is connected to the swing arm and drives the swing arm to rise and fall, the bottom vision camera is arranged on the frame, the swing arm rotates past the bottom vision camera so that the bottom vision camera obtains the angle information of the chip on the swing arm.
[0016] In one embodiment, the crystal bonding machine with glue dipping function also includes a crystal supply and crystal retrieval mechanism, which includes a crystal supply ring assembly, a crystal ring transport assembly and a chip positioning platform, the crystal supply ring assembly includes a crystal ring lifting basket, and a plurality of crystal rings are arranged in the crystal ring lifting basket, the chip positioning platform is used to fix the crystal ring, and the crystal ring transport assembly includes a moving module and a clamp, and the moving module drives the clamp to move to transfer the crystal ring between the crystal supply ring assembly and the chip positioning platform.
[0017] In one embodiment, the crystal supply and retrieval mechanism further includes a pin assembly, which is disposed on the frame. The pin assembly includes a pin, which is used to pierce the blue film of the crystal ring and lift the chip.
[0018] The technical solution of the utility model is to integrate the dispensing mechanism on the frame by arranging a feeding and receiving mechanism, a crystal bonding platform mechanism, a crystal bonding head mechanism and a dispensing mechanism on the frame, and cooperate with each other to complete the crystal bonding work. The crystal bonding equipment has a high degree of integration and can save the floor space of the equipment. Specifically, the feeding and receiving mechanism is used to provide substrates that have not been crystal bonded and to recycle and place substrates after crystal bonding is completed. The crystal bonding platform mechanism is used to transfer substrates between the feeding and receiving mechanism and the crystal bonding head mechanism. The dispensing assembly includes a dispensing head, a dispensing drive motor and a dispensing voice coil motor. The dispensing column is provided with a glue cup for holding glue. The dispensing drive motor drives the dispensing head to rotate, and the dispensing head rotates to the glue cup to dip the glue. After the dispensing head is reset, the dispensing voice coil motor drives the dispensing head to descend and apply glue on the substrate to complete the dispensing. Then, the driving motor of the crystal bonding head drives the swing arm to rotate, so that the swing arm absorbs the chip and rotates to fix the chip to the crystal bonding platform mechanism to complete the crystal bonding work. In this way, the dispensing and die bonding mechanisms are integrated on one device through the frame, so that the die bonding and dispensing work can be completed in coordination with each other on an integral device, which can improve the integration of the equipment, simplify the equipment installation procedure, reduce the floor space and save manpower, which is conducive to improving production efficiency and equipment automation, efficient and precise die bonding operations, and meet various application requirements. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.
[0020] Figure 1 A schematic structural diagram of an embodiment of a die bonding machine with a dipping function provided by the utility model;
[0021] Figure 2 A structural schematic diagram of a feeding and receiving mechanism of a die bonding machine with a dipping function provided by the utility model;
[0022] Figure 3 A structural schematic diagram of a die bonding platform mechanism of a die bonding machine with a dipping function provided by the utility model;
[0023] Figure 4 A structural schematic diagram of a die bonding head mechanism of a die bonding machine with a dipping function provided by the utility model;
[0024] Figure 5 A structural schematic diagram of a glue dispensing mechanism of a die bonding machine with a glue dipping function provided by the utility model;
[0025] Figure 6It is a structural schematic diagram of an embodiment of a crystal supply and crystal fetching mechanism of a crystal bonding machine with a glue dipping function provided by the utility model;
[0026] Figure 7 This is a schematic diagram of the working state of the swing arm and glue dispensing of the crystal bonding machine with glue dipping function provided by the utility model.
[0027] Description of Figure Numbers:
[0028] 1. Frame;
[0029] 2. Material feeding and receiving mechanism; 21. Lifting and feeding and receiving assembly for the right material box lifting basket; 211. Assembly mounting seat; 212. Material box driving motor; 213. Material box lifting screw rod; 214. Material box lifting guide rail; 215. Material box tray; 216. Fixed plate; 217. Width adjustment side plate; 218. Shrapnel; 219. Material box placement area; 22. Lifting and feeding and receiving assembly for the left material box lifting basket; 23. Material box; 24. Material pushing assembly; 241. Material pushing cylinder; 242. Sensor;
[0030] 3. Crystal bonding platform mechanism; 31. Crystal bonding base; 32. Rolling motor; 33. Transmission assembly; 34. Movable side plate; 35. Fixed side plate; 36. Belt; 37. Base plate lifting cylinder; 38. Cover plate; 39. X-axis linear guide; 310. X-axis linear motor; 311. Y-axis base; 312. Y-axis linear guide; 313. Y-axis linear motor;
[0031] 4. Crystal bonding head mechanism; 41. Crystal bonding column; 42. Crystal bonding drive motor; 43. Swing arm; 44. Crystal retrieval camera system; 45. Swing arm voice coil camera; 46. Crystal bonding camera system; 47. Bottom vision camera;
[0032] 5. Glue dispensing mechanism; 51. Glue dispensing column; 52. Glue dispensing head; 53. Adjustment base; 54. Horizontal guide rail; 55. Slide plate; 56. Longitudinal guide rail; 57. Mounting plate; 58. Hand wheel; 59. Glue dispensing drive motor; 510. Glue cup; 511. Glue dispensing voice coil motor;
[0033] 6. Crystal supply and retrieval mechanism; 61. Crystal supply ring assembly; 611. Crystal ring basket; 612. Crystal ring; 62. Crystal ring transport assembly; 63. Chip positioning platform; 64. Ejector pin assembly;
[0034] 7. Control unit;
[0035] 8. Substrate.
[0036] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0037] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0038] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.
[0039] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the utility model.
[0040] In the prior art, in the die bonding equipment of some semiconductor packaging technologies, the dispensing mechanism and the die bonding mechanism are usually designed separately. Such die bonding equipment has low integration, occupies a large area, relies on manual operation, has a low degree of automation, and has low work efficiency.
[0041] The utility model provides a crystal bonding machine with a glue dipping function.
[0042] See also Figure 1 and Figure 5In one embodiment of the utility model, the die bonding machine with glue dipping function comprises: a frame 1 and a feeding and receiving mechanism 2, a die bonding platform mechanism 3, a die bonding head mechanism 4 and a glue dispensing mechanism 5 arranged on the frame 1, wherein the feeding and receiving mechanism 2 is used to provide an unbonded substrate 8 and to recover and place the substrate 8 after die bonding; the die bonding platform mechanism 3 is used to transfer the substrate 8 between the feeding and receiving mechanism 2 and the die bonding head mechanism 4; the die bonding head mechanism 4 comprises a die bonding drive motor 42 and a swing arm 43, the die bonding drive motor 42 is connected to the swing arm 43 and drives the swing arm 43 to rotate, so that the swing arm 43 has a die taking position for sucking the chip and a die bonding position for placing the chip on the substrate 8; The glue dispensing mechanism 5 includes a glue dispensing column 51 and a glue dispensing component arranged on the glue dispensing column 51. The glue dispensing column 51 is arranged on the frame 1. The glue dispensing component includes a glue dispensing head 52, a glue dispensing drive motor 59 and a glue dispensing voice coil motor 511. The glue dispensing column 51 is provided with a glue cup 510 for holding glue. The glue dispensing drive motor 59 is arranged on the glue dispensing column 51. The output shaft of the glue dispensing drive motor 59 is connected to a fixed frame and drives the fixed frame to rotate. The glue dispensing voice coil motor 511 is arranged on the fixed frame and connected to the glue dispensing head 52. The fixed frame rotates so that the glue dispensing head 52 rotates to the glue cup 510 to dip in glue. The glue dispensing voice coil motor 511 drives the glue dispensing head 52 to rise and fall to apply glue on the substrate 8.
[0043] In the specific implementation process, the frame 1, as the main part of the solid crystal equipment, plays a supporting and stabilizing role. It is made of steel parts, has a solid structure and can have sufficient stability. The feeding and receiving mechanism 2, the solid crystal platform mechanism 3, the solid crystal head mechanism 4 and the dispensing mechanism 5 are all automated mechanisms. The solid crystal platform mechanism 3 can be adjusted according to the size of the substrate 8 to meet the production needs of substrates 8 of different sizes; the swing arm 43 in the solid crystal head mechanism 4 has an angle rotation function, which can drive the chip to rotate the angle, realize angle correction and multi-angle solid crystal, etc.; the dispensing mechanism 5 has the function of heating the dispensing head 52, and the solid crystal machine is also equipped with a control unit 7, using a corresponding control system to control and coordinate the movement of each mechanism to ensure that the solid crystal machine can perform accurate operations according to the preset program, improve production efficiency and quality, and at the same time have the function of automatically replacing the crystal ring 612, which can meet the needs of multiple chip solid crystals on a product, and have a bottom flying shot function to provide the necessary data for secondary correction to ensure the precision and yield of solid crystals. The equipment has a high degree of functional integration, which can save labor and space for customers. This die bonder is designed to achieve automated, efficient and precise die bonding operations. By using high-quality materials and components, equipped with automation devices and advanced control systems, it ensures that the die bonder can operate stably and reliably and meet various application requirements.
[0044] The technical solution of the utility model adopts the method of setting a feeding and receiving mechanism 2, a crystal bonding platform mechanism 3, a crystal bonding head mechanism 4 and a glue dispensing mechanism 5 on a frame 1, integrating the glue dispensing mechanism 5 on the frame 1, and cooperating with each other to complete the crystal bonding work. The crystal bonding equipment has a high degree of integration and can save the floor space of the equipment. Specifically, the feeding and receiving mechanism 2 is used to provide unbonded substrates 8 and to recover and place substrates 8 after crystal bonding, and the crystal bonding platform mechanism 3 is used to transfer substrates 8 between the feeding and receiving mechanism 2 and the crystal bonding head mechanism 4. The dispensing assembly includes a dispensing head 52, a dispensing driving motor 59 and a dispensing voice coil motor 511. The dispensing column 51 is provided with a glue cup 510 for holding glue. The dispensing driving motor 59 drives the dispensing head 52 to rotate, and the dispensing head 52 rotates to the glue cup 510 to dip the glue. After the dispensing head 52 is reset, the dispensing voice coil motor 511 drives the dispensing head 52 to descend and put the glue on the substrate 8 to complete the dispensing. Then, the driving motor of the crystal bonding head drives the swing arm 43 to rotate, so that the swing arm 43 absorbs the chip and rotates to fix the chip to the crystal bonding platform mechanism 3 to complete the crystal bonding work. In this way, the dispensing and crystal bonding mechanisms are integrated into one device through the frame 1, so that the crystal bonding and dispensing work are completed in cooperation with each other on an integral device, which can improve the integration of the equipment, simplify the equipment installation program, reduce the floor space and save manpower, which is conducive to improving production efficiency and equipment automation, efficient and precise crystal bonding operations, and meet various application requirements.
[0045] Furthermore, the dispensing mechanism 5 also includes an adjustment component, which includes an adjustment base 53, a slide plate 55 and a mounting plate 57. The dispensing drive motor 59 is arranged on the mounting plate 57, and the adjustment base 53 is arranged on the dispensing column 51. A transverse guide rail 54 is arranged between the adjustment base 53 and the slide plate 55, and the slide plate 55 is slidably connected to the adjustment base 53 through the transverse guide rail 54. A longitudinal guide rail 56 is arranged between the mounting plate 57 and the slide plate 55, and the mounting plate 57 is slidably connected to the slide plate 55 through the longitudinal guide rail 56.
[0046] In this embodiment, the dispensing column 51 is installed on the frame 1. There are two groups of dispensing components and adjustment components on the dispensing column 51, which are arranged one by one. One group of adjustment components connects to the corresponding group of dispensing components and drives the dispensing components to move, and cooperates with the corresponding solid crystal platform components to complete the dispensing work. The mounting plate 57 slides along the longitudinal guide rail 56, and the longitudinal guide rail 56 is installed on the slide plate 55. The slide plate 55 slides along the transverse guide rail 54. In this way, the mounting plate 57 can move in the transverse and longitudinal directions relative to the adjustment base 53 through the slide plate 55. Furthermore, a screw slider adjustment mechanism is formed between the adjustment base 53 and the slide plate 55 and between the mounting plate 57 and the slide plate 55. The screw is connected to a hand wheel 58. The transverse and longitudinal positions of the mounting plate 57 are adjusted by rotating the hand wheel 58 to achieve the dispensing work of substrates 8 of different sizes. For example, the screw rod is rotatably connected to the adjustment base plate, and the screw rod is threadedly connected to the slide plate 55. Turning the handwheel 58 causes the screw rod to rotate and drive the slide plate 55 to move, thereby adjusting the position of the slide plate 55 relative to the adjustment base 53. It can be understood that the above can be used as an adjustment reference structure between the slide plate 55 and the mounting plate 57.
[0047] In one embodiment, reference Figure 2 As shown, the material feeding and receiving mechanism 2 includes a material box 23 basket lifting and lowering material feeding and receiving component and a material pushing component 24, and the two are arranged correspondingly. The material box 23 basket lifting and lowering material feeding and receiving component includes a component mounting seat 211, a material box driving motor 212 and a material box tray 215. The component mounting seat 211 is connected to the frame 1, and the material box driving motor 212 drives the connected material box tray 215 and drives the material box tray 215 to rise and fall. The material box tray 215 is used to place the substrate 8, and the material pushing component 24 is used to push the substrate 8 to the solid crystal platform mechanism 3.
[0048] In this embodiment, the material feeding and receiving mechanism 2 includes two symmetrically arranged material box lifting basket lifting and feeding and receiving components, and the two material box lifting basket lifting and feeding and receiving components are respectively a left material box lifting basket lifting and feeding and receiving component 22 and a right material box lifting basket lifting and feeding and receiving component 21, and each corresponds to a material pushing component 24, and the left material box lifting basket lifting and feeding and receiving component 22 and the right material box lifting basket lifting and feeding and receiving component 21 are respectively equipped with a crystal bonding platform, and each crystal bonding platform corresponds to a glue dispensing component, which can improve the crystal bonding efficiency while ensuring that the integration of the crystal bonding equipment is improved.
[0049] In the specific implementation process, the material feeding and receiving mechanism 2 is used to provide unbonded substrates 8 to the crystal bonding platform and receive the substrates 8 after crystal bonding on the crystal bonding platform. The material box 23 is placed on the material box tray 215, and the material box 23 is used to hold the unbonded substrates 8 and the substrates 8 after crystal bonding. Specifically, the side wall of the material box 23 is provided with a plurality of support grooves spaced up and down, and the edges of the substrates 8 are located in the support grooves, so that the multiple substrates 8 in the material box 23 are arranged at intervals up and down. The material box drive motor 212 is fixed to the frame 1 through the component mounting seat 211, and the material box drive motor 212 is connected to the material box tray 215 and drives the material box tray 215 to rise and fall, and cooperates with the pushing component to push the substrate 8 to the crystal bonding platform.
[0050] The material box driving motor 212 is connected to the material box lifting screw 213, and drives the material box lifting screw 213 to rotate, and the material box tray 215 is screwed to the material box lifting screw 213, thereby realizing the lifting of the material box tray 215. Furthermore, material box lifting guide rails 214 are provided on both sides of the screw, and the material box tray 215 is slidably connected to the material box lifting guide rails 214, which play a guiding and limiting role in the lifting of the material box tray 215.
[0051] Furthermore, two material boxes 23 are provided on the material box tray 215, and the pushing assembly 24 includes a pushing bracket, two pushing cylinders 241 and two sensors 242. The pushing bracket is arranged on the frame 1, and the pushing cylinder 241 and the sensor 242 are arranged on the pushing bracket. The pushing cylinder 241 and the sensor 242 correspond to the material boxes 23 one by one. The pushing cylinder 241 is used to push the substrate 8, and the sensor 242 is used to sense the substrate 8.
[0052] The material box driving motor 212 drives the material box tray 215 to rise and fall, thereby causing the material box 23 to move up and down. The substrate 8 reaches the pushing position. After the sensor 242 senses the substrate 8, the pushing cylinder 241 pushes the substrate 8 out of the material box 23 and onto the die bonding platform, completing the loading of the substrate 8. The material box 23 moves up and down to the receiving position, and the die bonding platform pushes the substrate 8 into the material box 23, completing the receiving of the material box 23. Of the two material boxes 23, when one material box 23 is loading and receiving, the other material box 23 is in a waiting state, which can reduce the waiting time of the equipment.
[0053] In the specific implementation process, a fixed plate 216 is provided on the material box tray 215, which separates the material box tray 215 into two material box placement areas 219, and two material boxes 23 are placed accordingly. A material box sensor is provided on the fixed plate 216, which is used to sense whether a material box 23 is placed on the material box tray 215. A width-adjusting side plate 217 is provided near the edges of both sides of the material box tray 215, and the material box placement area 219 is between the two width-adjusting side plates 217. By adjusting the position of the width-adjusting side plate 217 on the material box tray 215, the distance between the two width-adjusting side plates 217 can be adjusted to adapt to material boxes 23 of different sizes. Shrapnel 218 is provided on the opposite sides of the two width-adjusting side plates 217, and the shrapnel 218 contacts and clamps the material box 23.
[0054] In one embodiment, reference Figure 3 As shown, the crystal fixing platform mechanism 3 includes a moving component, a receiving seat component and a conveying line body. The moving component is connected to the receiving seat component and drives the receiving seat component to move. The conveying line body is arranged on the receiving seat component and is used to receive the substrate 8 provided by the feeding and receiving mechanism 2. The receiving seat assembly is provided with a substrate lifting cylinder 37 and a cover plate 38. The substrate lifting cylinder 37 is used to lift the substrate 8. The cover plate 38 is located above the conveying line body to cooperate with the substrate lifting cylinder 37 to clamp the substrate 8.
[0055] In this embodiment, two groups of crystal bonding platforms are installed on the frame 1, corresponding to two groups of material feeding and receiving components respectively. The moving component drives the receiving seat to move in the horizontal and vertical directions. The conveying line body is used to receive and convey the substrate 8, and the vertical line body is installed on the receiving seat assembly, so as to cooperate with the crystal bonding head mechanism 4 to complete the crystal bonding work of the substrate 8. The substrate lifting cylinder 37 on the receiving seat is located between the two conveying line bodies. It can be understood that the substrate lifting cylinder 37 is connected to a lifting plate, which contacts the substrate 8 to protect the substrate 8 from being damaged. The cover plate 38 is located above the receiving seat assembly and above the substrate 8. In this way, the substrate lifting cylinder 37 drives the substrate 8 to rise, and the cover plate 38 limits the rise of the substrate 8, and cooperates to clamp the substrate 8.
[0056] Furthermore, the crystal bonding platform mechanism 3 also includes a crystal bonding base 31, and the moving component includes an X-axis linear motor 310, a Y-axis linear motor 313 and a Y-axis base 311. The X-axis linear motor 310 is arranged on the crystal bonding base 31, and the crystal bonding base 31 is also provided with an X-axis linear guide 39. The X-axis linear motor 310 is connected to the Y-axis base 311 and drives the Y-axis base 311 to move along the X-axis linear guide 39. The Y-axis linear motor 313 is arranged on the Y-axis base 311, and the Y-axis base 311 is also provided with a Y-axis linear guide 312. The Y-axis linear motor 313 is connected to the receiving seat assembly and drives the receiving seat assembly to move along the Y-axis linear guide 312.
[0057] The fixed base is arranged on the frame 1, and the movement of the substrate 8 in the X-axis direction is realized through the X-axis linear guide 39 on the fixed base and the X-axis linear motor 310 that controls the movement of the Y-axis base 311 in the X-axis direction. Furthermore, the movement of the substrate 8 in the Y-axis direction is realized through the Y-axis linear guide 312 on the Y-axis base 311 and the Y-axis linear motor 313 that controls the movement of the receiving seat assembly in the Y-axis direction, thereby adjusting the position of the chip to be fixed on the substrate 8 to be located below the swing arm 43 to absorb the chip, and the swing arm 43 descends to complete the solid crystal work. In this embodiment, the X-axis direction is the horizontal direction, and the Y-axis direction is the longitudinal direction.
[0058] After the substrate 8 is solidified, the substrate lifting cylinder 37 descends, so that the substrate 8 falls on the conveyor line body and is transported to the material box 23 through the conveyor line body. Specifically, the receiving seat assembly includes a receiving base and a fixed side plate 35 and a movable side plate 34 arranged on the receiving base at intervals. The fixed side plate 35 and the movable side plate 34 are both provided with a conveyor line body. The conveyor line body includes a rolling motor 32, a transmission assembly 33 and a belt 36. The rolling motor 32 drives the belt 36 to rotate through the transmission assembly 33. The belt 36 is used to transport the substrate 8. The substrate lifting cylinder 37 is arranged on the receiving base and is located between the fixed side plate 35 and the movable side plate 34. The movable side plate 34 and the fixed side plate 35 are both provided with a cover plate 38.
[0059] In the specific implementation process, the receiving base is connected to the Y-axis linear motor 313, the fixed side plate 35 and the movable side plate 34 are arranged at intervals, and the substrate 8 is located on the two conveyor line bodies between the two. By adjusting the position of the movable side plate 34 on the receiving base, it can adapt to substrates 8 of different sizes. In this embodiment, the two conveyor line bodies are respectively installed on the fixed side plate 35 and the movable side plate 34, and the roller motor 32 of the conveyor line body is fixed on the corresponding fixed side plate 35 or the movable side plate 34. The roller motor 32 drives the belt 36 to rotate. It can be understood that the belts 36 of the two conveyor line bodies rotate synchronously. The transmission assembly 33 is a transmission wheel fixed on the fixed side plate 35 and the movable side plate 34, which plays the function of switching or tensioning, and will not be described one by one here.
[0060] In one embodiment, reference Figure 4 As shown, the crystal bonding head mechanism 4 also includes a crystal bonding column 41, a swing arm voice coil camera 45 and a bottom vision camera 47. The crystal bonding column 41 is arranged on the frame 1, and the crystal bonding drive motor 42 is arranged on the crystal bonding column 41. The swing arm voice coil camera 45 is connected to the swing arm 43 and drives the swing arm 43 to rise and fall. The bottom vision camera 47 is arranged on the frame 1, and the swing arm 43 rotates past the bottom vision camera 47 so that the bottom vision camera 47 obtains the angle information of the chip on the swing arm 43.
[0061] Two sets of crystal bonding head mechanisms 4 are installed on the frame 1, which correspond to the two sets of fixed platform mechanisms. The crystal bonding drive motor 42 is fixed on the crystal bonding column 41, and the output shaft of the crystal bonding drive motor 42 is connected to the swing arm mounting frame, and the swing arm mounting frame is connected to the swing arm 43 and the swing arm voice coil camera 45. The column is also connected to a crystal retrieval camera system 44 and a crystal bonding camera system 46. The crystal retrieval camera system 44 is located above the crystal retrieval position and is used to obtain the chip on the crystal ring 612. The crystal bonding camera system 46 is located above the crystal bonding position and is used to obtain the position of the chip that needs to be fixed on the substrate 8. In the specific implementation process, the swing arm drive motor 42 drives the swing arm 43 to rotate to the crystal retrieval position, the swing arm voice coil camera 45 drives the swing arm 43 to descend, and the suction nozzle on the swing arm 43 sucks up the chip to complete the crystal suction work, and the swing arm voice coil camera 45 drives the swing arm 43 to rise. The swing arm driving motor 42 drives the swing arm 43 to rotate and pass above the bottom vision camera 47. The bottom vision camera 47 takes a picture to obtain the angle information of the chip. When the swing arm driving motor 42 drives the swing arm 43 to the crystal bonding position, the swing arm 43 corrects the angle of the chip after obtaining the angle information. The swing arm voice coil camera 45 drives the swing arm 43 to descend and the suction nozzle puts down the chip to complete the crystal bonding work. This back and forth process completes the crystal removal and crystal bonding work.
[0062] In one embodiment, reference Figure 1 and Figure 6 As shown, the crystal bonding machine with the glue dipping function also includes a crystal supply and crystal retrieval mechanism 6, which includes a crystal supply ring assembly 61, a crystal ring transport assembly 62 and a chip positioning platform 63. The crystal supply ring assembly 61 includes a crystal ring lifting basket 611, and a plurality of crystal rings 612 are arranged in the crystal ring lifting basket 611. The chip positioning platform 63 is used to fix the crystal ring 612. The crystal ring transport assembly 62 includes a moving module and a clamp, and the moving module drives the clamp to move to transfer the crystal ring 612 between the crystal supply ring assembly 61 and the chip positioning platform 63.
[0063] In this embodiment, the crystal supply and crystal retrieval mechanism 6 is provided with two groups, and corresponds to two groups of crystal fixing head mechanisms 4 respectively, that is, the crystal ring 612 is provided to the two groups of crystal fixing head mechanisms 4 respectively, and the crystal ring 612 after crystal retrieval is replaced. In the specific implementation process, the moving module of the transport component extends between the crystal supply ring component 61 and the chip positioning platform 63, and drives the clamping claw to move. The crystal ring basket 611 has a multi-layer placement plate, and the crystal ring 612 is placed on the placement plate. The moving module drives the clamping claw to move to the crystal ring basket 611, and clamps the crystal ring 612, and transfers the crystal ring 612 in the crystal supply ring component 61 to the chip positioning platform 63, and transfers the crystal ring 612 on the chip positioning platform 63 after the chip is sucked to the crystal supply ring component 61, thereby realizing the automatic replacement of the crystal ring 612. In addition, the crystal ring basket 611 is connected to a lifting component, which drives the crystal ring basket 611 to rise and fall, and cooperates with the clamping claw to facilitate the removal and storage of the crystal ring 612.
[0064] Furthermore, the crystal supply and crystal retrieval mechanism 6 also includes an ejector assembly 64, which is arranged on the frame 1. The ejector assembly 64 includes an ejector pin, which is used to pierce the blue film of the crystal ring 612 and lift the chip. In addition, the chip positioning platform 63 is connected to the horizontal linear motor of the crystal ring 612 and the vertical linear motor of the crystal ring 612, thereby driving the chip positioning platform 63 to move in the horizontal and vertical directions, adjusting the position of the chip on the blue film of the crystal ring 612, so that the chip is aligned with the swing arm 43 located at the crystal retrieval position, and cooperates with the ejector assembly 64 and the crystal bonding head mechanism 4 to complete the chip retrieval work. Specifically, when the swing arm 43 needs to absorb the chip, the ejector pin of the ejector assembly 64 is lifted to pierce the blue film and lift the chip, and the suction nozzle on the swing arm 43 sucks the chip, and rotates to the crystal bonding position under the drive of the swing arm 43 drive motor, and drives the swing arm 43 to descend through the swing arm 43 voice coil motor, and places the chip at the corresponding position of the substrate 8 after glue dispensing.
[0065] refer to Figure 7 As shown, it is a schematic diagram of the working status of the swing arm 43 and dispensing. After the crystal retrieval camera system 44 obtains the chip on the crystal ring 612, the chip positioning platform 63 moves the chip to the crystal retrieval position. The swing arm 43 rotates by an angle of θ after retrieval, and passes through the bottom visual camera 47. After detection, the suction nozzle of the swing arm 43 adjusts the chip angle. The crystal fixing camera system 46 searches for the position of the substrate 8 to fix the chip on the substrate 8. The crystal fixing platform mechanism 3 moves the substrate 8 to move the position of the fixed chip to the crystal fixing position. The swing arm 43 rotates by an angle of γ to place the chip in the crystal fixing position. After crystal fixing, the swing arm 43 rotates by γ to return to the crystal retrieval position.
[0066] Before the swing arm 43 places the chip into the crystal bonding position, the glue dispensing head 52 needs to first be dipped in solder paste or silver glue in the glue cup 510, then rotate to the crystal bonding position, and dispense solder paste or silver glue onto the substrate 8, and then return to the glue cup 510. After the glue dispensing is completed, the swing arm 43 can rotate into the crystal bonding position to perform the crystal bonding action, and this cycle is repeated to complete the crystal removal and crystal bonding work.
[0067] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.
Claims
1. A die bonding machine with a dipping function, characterized in that: include: A frame and a material feeding and receiving mechanism, a crystal bonding platform mechanism, a crystal bonding head mechanism and a glue dispensing mechanism arranged on the frame, wherein: The feeding and receiving mechanism is used to provide substrates that have not been bonded and to recover and place substrates that have been bonded; The crystal bonding platform mechanism is used to transfer the substrate between the material feeding and receiving mechanism and the crystal bonding header mechanism; The crystal bonding head mechanism includes a crystal bonding drive motor and a swing arm, wherein the crystal bonding drive motor is connected to the swing arm and drives the swing arm to rotate, so that the swing arm has a crystal taking position for sucking the chip and a crystal bonding position for placing the chip on the substrate; The glue dispensing mechanism includes a glue dispensing column and a glue dispensing component arranged on the glue dispensing column, the glue dispensing column is arranged on the frame, the glue dispensing component includes a glue dispensing head, a glue dispensing drive motor and a glue dispensing voice coil motor, the glue dispensing column is provided with a glue cup for holding glue, the glue dispensing drive motor is arranged on the glue dispensing column, the output shaft of the glue dispensing drive motor is connected to a fixed frame and drives the fixed frame to rotate, the glue dispensing voice coil motor is arranged on the fixed frame and connected to the glue dispensing head, the fixed frame rotates so that the glue dispensing head rotates to the glue cup to dip in glue, and the glue dispensing voice coil motor drives the glue dispensing head to rise and fall to apply glue on the substrate.
2. The die bonding machine with glue dipping function as claimed in claim 1, characterized in that: The dispensing mechanism also includes an adjustment component, which includes an adjustment base, a slide plate and a mounting plate. The dispensing drive motor is arranged on the mounting plate, and the adjustment base is arranged on the dispensing column. A transverse guide rail is provided between the adjustment base and the slide plate, and the slide plate is slidably connected to the adjustment base through the transverse guide rail. A longitudinal guide rail is provided between the mounting plate and the slide plate, and the mounting plate is slidably connected to the slide plate through the longitudinal guide rail.
3. The die bonding machine with glue dipping function as claimed in claim 1, characterized in that: The material feeding and receiving mechanism includes a material box basket lifting and lowering material feeding and receiving component and a material pushing component, and the two are arranged correspondingly. The material box basket lifting and lowering material feeding and receiving component includes a component mounting seat, a material box driving motor and a material box tray. The component mounting seat is connected to the frame, and the material box driving motor drives the material box tray and drives the material box tray to rise and fall. The material box tray is used to place the substrate, and the material pushing assembly is used to push the substrate to the crystal bonding platform mechanism.
4. The die bonding machine with glue dipping function as claimed in claim 3, characterized in that: Two material boxes are arranged on the material box tray, and the pushing assembly includes a pushing bracket, two pushing cylinders and two sensors. The pushing bracket is arranged on the frame, and the pushing cylinder and the sensor are arranged on the pushing bracket. The pushing cylinder and the sensor correspond to the material boxes one by one. The pushing cylinder is used to push the substrate, and the sensor is used to sense the substrate in the material box.
5. The die bonding machine with glue dipping function as claimed in claim 1, characterized in that: The crystal fixing platform mechanism includes a moving component, a receiving seat component and a conveying line body. The moving component is connected to the receiving seat component and drives the receiving seat component to move. The conveying line body is arranged on the receiving seat component and is used to receive the substrate provided by the feeding and receiving mechanism. The receiving seat component is provided with a substrate lifting cylinder and a cover plate. The substrate lifting cylinder is used to lift the substrate. The cover plate is located above the conveying line body to cooperate with the substrate lifting cylinder to clamp the substrate.
6. The die bonding machine with glue dipping function as claimed in claim 5, characterized in that: The crystal bonding platform mechanism also includes a crystal bonding base, and the moving assembly includes an X-axis linear motor, a Y-axis linear motor and a Y-axis base. The X-axis linear motor is arranged on the crystal bonding base, and the crystal bonding base is also provided with an X-axis linear guide. The X-axis linear motor is connected to the Y-axis base and drives the Y-axis base to move along the X-axis linear guide. The Y-axis linear motor is arranged on the Y-axis base, and the Y-axis base is also provided with a Y-axis linear guide. The Y-axis linear motor is connected to the socket assembly and drives the socket assembly to move along the Y-axis linear guide.
7. The die bonding machine with glue dipping function as claimed in claim 5, characterized in that: The receiving seat assembly includes a receiving base and a fixed side plate and a movable side plate spaced apart on the receiving base, the fixed side plate and the movable side plate are both provided with the conveying line body, the conveying line body includes a rolling motor, a transmission assembly and a belt, the rolling motor drives the belt to rotate through the transmission assembly, the belt is used to convey the substrate, the substrate lifting cylinder is provided on the receiving base and is located between the fixed side plate and the movable side plate, and the cover plate is provided on the movable side plate and the fixed side plate.
8. The die bonding machine with glue dipping function as claimed in claim 1, characterized in that: The crystal bonding head mechanism also includes a crystal bonding column, a swing arm voice coil camera and a bottom vision camera. The crystal bonding column is arranged on the frame, the crystal bonding drive motor is arranged on the crystal bonding column, the swing arm voice coil camera is connected to the swing arm and drives the swing arm to rise and fall, the bottom vision camera is arranged on the frame, and the swing arm rotates past the bottom vision camera so that the bottom vision camera obtains the angle information of the chip on the swing arm.
9. The die bonding machine with glue dipping function as claimed in claim 8, characterized in that: The crystal bonding machine with glue dipping function also includes a crystal supply and crystal retrieval mechanism, which includes a crystal supply ring assembly, a crystal ring transport assembly and a chip positioning platform. The crystal supply ring assembly includes a crystal ring lifting basket, and a plurality of crystal rings are arranged in the crystal ring lifting basket. The chip positioning platform is used to fix the crystal rings. The crystal ring transport assembly includes a moving module and a clamp, and the moving module drives the clamp to move to transfer the crystal ring between the crystal supply ring assembly and the chip positioning platform.
10. The die bonding machine with glue dipping function as claimed in claim 9, characterized in that: The crystal supply and extraction mechanism further comprises an ejector pin assembly, which is arranged on the frame and comprises an ejector pin, which is used to pierce the blue film of the crystal ring and lift up the chip.