High-efficiency heating wafer heating disc structure

Abstract

The utility model relates to the technical field of semiconductor manufacturing equipment, in particular to a high-efficiency heating wafer heating disc structure, which comprises a cover plate, a base, a column and a metal heater, the metal heater is fixedly mounted at the bottom of the cover plate, the top of the base is fixedly connected to the bottom of the cover plate, and the column is fixedly connected to the bottom of the cover plate. A column is fixedly connected to the bottom of the base, and a thermal resistance structure is arranged between the base and the cover plate. According to the wafer heating disc structure capable of heating efficiently, the base is hollowed out, the thermal resistance structure is additionally arranged between the metal heater and the base, meanwhile, the heat exchange area between the metal heater and the base and between the metal heater and the column is reduced, the heating efficiency of the cover plate is improved, and meanwhile, electric energy consumed by heating is reduced under the same wafer temperature requirement; and the carbon emission is reduced while the energy is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing equipment, in particular to a wafer heating plate structure with high-efficiency heating. Background Art

[0002] Wafer heating plates are used in scenarios that require temperature control, such as wafer heating or cooling, during the semiconductor manufacturing process and are often used in vacuum and special gas environments.

[0003] The main structure of the existing wafer heating plate includes: a cover plate, a base and a shaft three modules are welded together, a metal electric heater is embedded in the cover plate, and the base and the cover plate are welded into a whole. There is a problem with this structure, that is, when the metal heater is powered on to generate heat, the heat is evenly transferred to the surroundings, and the three modules are heated at the same time. However, in fact, the wafer is only in contact with the cover plate, so only the cover plate needs to be heated, and the base and the shaft itself do not need to be heated, resulting in a large amount of heat energy (electrical energy) Waste, which in turn causes the cover plate heating efficiency to be low. Therefore, a high-efficiency heating wafer heating plate structure is proposed. Utility Model Content

[0004] In order to solve the above problems, the utility model provides a high-efficiency heating wafer heating plate structure, which hollows out the base, adds a thermal resistance structure between the metal heater and the base, and reduces the heat exchange area between the metal heater and the base and the column, thereby improving the heating efficiency of the cover plate and reducing the electric energy consumed for heating under the same wafer temperature requirement, thereby saving energy and reducing carbon emissions.

[0005] The technical solution of the utility model is as follows:

[0006] A high-efficiency heating wafer heating plate structure comprises a cover plate, a base, a column and a metal heater, wherein the metal heater is fixedly mounted on the bottom of the cover plate, the top of the base is fixedly connected to the bottom of the cover plate, a column is fixedly connected to the bottom of the base, and a thermal resistance structure is arranged between the base and the cover plate.

[0007] Optionally, the thermal resistance structure is an air thermal resistance structure.

[0008] The air thermal resistance structure comprises a cavity arranged at the top of the base and an air channel arranged at the center of the column, and the air channel is communicated with the cavity.

[0009] Optionally, the thermal resistance structure is a thermal resistance structure made of heat insulating material.

[0010] A cavity is arranged on the top of the base, and a heat insulating material is filled in the cavity.

[0011] Optionally, the thermal insulation material is a ceramic fiberboard.

[0012] Optionally, the thermal insulation material is aerogel.

[0013] The metal heater is embedded and installed on the cover plate.

[0014] The cover plate is fixedly connected to the base by welding.

[0015] The base is fixedly connected to the column by welding.

[0016] The beneficial effects of the utility model are:

[0017] 1. The utility model discloses a high-efficiency heating wafer heating plate structure, which hollows out the base, leaving only a small part of the contact surface in contact with the cover plate, and adds a large amount of air thermal resistance between the base and the cover plate, so that most of the heat generated by the metal heater is transferred to the wafer surface, and a small part of the heat is transferred to other directions, thereby reducing heat loss and improving the heating efficiency of the wafer;

[0018] 2. The utility model discloses a high-efficiency heating wafer heating plate structure. The high-efficiency heating wafer heating plate structure improves the heating efficiency of the wafer surface. Therefore, when the wafer surface is heated to the same temperature, the power consumption is reduced, which can achieve the effect of energy saving and emission reduction, reduce energy consumption, and reduce carbon emissions;

[0019] 3. The utility model discloses a high-efficiency heating wafer heating plate structure. The hollowing out of the middle of the base of the high-efficiency heating wafer heating plate structure can also achieve the effect of reducing weight, greatly reducing the cost of raw materials. At the same time, due to the reduction of the welding surface, electron beam welding and other methods can be used instead of vacuum brazing, which reduces the process cost and improves production efficiency.

[0020] 4. The utility model discloses a high-efficiency heating wafer heating plate structure. In order to prevent the internal air from being unable to be discharged after the middle of the heating plate is hollowed out, and the internal and external pressure difference is generated when it is used in a vacuum environment, the scheme simultaneously connects the column with the hollow cavity of the base, so that the hollow cavity of the base is connected with the atmospheric environment, which can avoid the problem of internal and external pressure difference;

[0021] 5. The utility model discloses a high-efficiency heating wafer heating plate structure. After the middle part of the base of the high-efficiency heating wafer heating plate structure is hollowed out, in addition to using air thermal resistance, other materials with good thermal insulation performance can also be used to fill the space, such as ceramic fiberboard, aerogel, etc.;

[0022] 6. The utility model discloses a high-efficiency heating wafer heating plate structure. The base of the high-efficiency heating wafer heating plate structure is hollowed out to reduce the heat transfer to the base and the column, which can reduce the temperature of the base and the column during the heating process, which is beneficial to the electrical components inside the column and increases the life of the electrical components. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] By reading the detailed description of the preferred embodiment below, the scheme and advantages of the present application will become clear to those skilled in the art. The accompanying drawings are only used to illustrate the preferred embodiment and are not considered to be limiting of the present invention.

[0024] In the attached picture:

[0025] Figure 1 It is a three-dimensional exploded structural schematic diagram of a wafer heating plate structure with high-efficiency heating according to an embodiment of the utility model;

[0026] Figure 2 It is a schematic cross-sectional structure diagram of a wafer heating plate structure with high heating efficiency according to an embodiment of the utility model;

[0027] The components represented by the reference numerals in the figure are:

[0028] The utility model comprises: 1. a cover plate; 2. a base; 2a. a cavity; 3. a column; 3a. an air passage; and 4. a metal heater. DETAILED DESCRIPTION

[0029] like Figure 1 and Figure 2 As shown, the high-efficiency heating wafer heating plate structure includes a cover plate 1, a base 2, a column 3 and a metal heater 4, wherein the metal heater 4 is fixedly mounted on the bottom of the cover plate 1, the top of the base 2 is fixedly connected to the bottom of the cover plate 1, and the column 3 is fixedly connected to the bottom of the base 2. The above is a prior art structure, and the core innovation of this patent is that a thermal resistance structure is arranged between the base 2 and the cover plate 1.

[0030] The thermal resistance structure is an air thermal resistance structure or a thermal insulation material thermal resistance structure.

[0031] Among them, the metal heater 4 is embedded in the cover plate 1, and the middle part of the base 2 is hollowed out as a cavity 2a to form an air layer. Only the edge contact surface is left between the base 2 and the cover plate 1, that is, the heat capacity of the base 2 and the column 3 itself is basically isolated from the cover plate 1. When the metal heater 4 is powered on and heated, most of the heat will be transferred upward to the cover plate 1, and a small part of the heat will be transferred to the base 2 and the column 3 through the contact surface between the base 2 and the edge of the cover plate 1, thereby improving the power utilization rate, improving the heating efficiency of the wafer, and at the same time reducing the temperature of the base 2 and the column 3, which is beneficial to the life of the internal electrical components.

[0032] In order to avoid the internal and external pressure difference caused by the air layer in the cavity 2a of the base 2 when working in a vacuum environment, the column 3 is connected to the air layer so that the gas in the air layer is connected to the atmosphere to release the pressure. The air thermal resistance structure includes a cavity 2a arranged at the top of the base 2 and an air channel 3a arranged at the center of the column 3, and the air channel 3a is connected to the cavity 2a.

[0033] In addition, the cavity 2a is filled with a heat insulating material; the heat insulating material is a ceramic fiber board or aerogel.

[0034] The high-efficiency heating wafer heating plate structure hollows out the base, leaving only a small part of the contact surface in contact with the cover plate, and increases a large amount of air thermal resistance between the base and the cover plate, so that most of the heat generated by the metal heater is transferred to the wafer surface, and a small part of the heat is transferred to other directions, reducing heat loss and improving the heating efficiency of the wafer; due to the improved heating efficiency of the wafer surface, when the wafer surface is heated to the same temperature, the power consumption is reduced, which can achieve the effect of energy saving and emission reduction, reduce energy consumption and carbon emissions; the hollowing out of the middle part of the base can also achieve the effect of weight reduction, greatly reducing the cost of raw materials, and at the same time, due to the reduction of the welding surface, electricity can be used. Sub-beam welding and other methods replace vacuum brazing, which reduces process costs and improves production efficiency. In order to prevent the internal air from being unable to be discharged after the middle of the heating plate is hollowed out, and to generate internal and external pressure differences when used in a vacuum environment, this solution simultaneously connects the column with the hollow cavity of the base, so that the hollow cavity of the base is connected to the atmospheric environment, which can avoid the problem of internal and external pressure differences. After the middle of the base is hollowed out, in addition to using air thermal resistance, other materials with good thermal insulation properties can also be used to fill the space, such as ceramic fiberboard, aerogel, etc. After the base is hollowed out to reduce the heat transfer to the base and the column, the temperature of the base and the column during the heating process can be reduced, which is beneficial to the electrical components inside the column and increases the life of the electrical components.

Claims

1. A wafer heating plate structure with high heating efficiency, characterized in that: It comprises a cover plate (1), a base (2), a column (3) and a metal heater (4), wherein the metal heater (4) is fixedly mounted on the bottom of the cover plate (1), the top of the base (2) is fixedly connected to the bottom of the cover plate (1), the column (3) is fixedly connected to the bottom of the base (2), and a thermal resistance structure is provided between the base (2) and the cover plate (1); The thermal resistance structure is an air thermal resistance structure or a thermal insulation material thermal resistance structure; The air thermal resistance structure comprises a cavity (2a) arranged at the top of the base (2) and an air channel (3a) arranged at the center of the column (3), wherein the air channel (3a) is in communication with the cavity (2a); The heat-insulating material thermal resistance structure comprises a cavity (2a) provided on the top of the base (2), and the cavity (2a) is filled with a heat-insulating material.

2. The wafer heating plate structure with high heating efficiency according to claim 1, characterized in that: The heat insulating material is a ceramic fiberboard.

3. The wafer heating plate structure with high heating efficiency according to claim 1, characterized in that: The thermal insulation material is aerogel.

4. The wafer heating plate structure with high heating efficiency according to claim 1, characterized in that: The metal heater (4) is embedded and mounted on the cover plate (1).

5. The wafer heating plate structure with high heating efficiency according to claim 1, characterized in that: The cover plate (1) is fixedly connected to the base (2) by welding.

6. The wafer heating plate structure with high heating efficiency according to claim 1, characterized in that: The base (2) and the column (3) are fixedly connected by welding.

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