Anti-drop carrier for semiconductor device
By designing an anti-detachment vehicle for semiconductor devices using fixing seats, plungers, springs and sealing screws, negative pressure adsorption and fixing are achieved using adsorption holes and air extraction pipe joints, and through the design of pressure rods and ring grooves, the problem of difficult to fix semiconductor devices is solved, and a more stable loading and unloading operation is achieved.
Patent Information
- Application Number
- CN202421544167.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-02
- Publication Date
- 2025-04-25
- Estimated Expiration
- 2034-07-02
AI Technical Summary
During the processing or detection of semiconductor devices, it is difficult for the carrier to fix the semiconductor devices, resulting in easy falling off during handling and loading and unloading, increasing operational difficulty and system control complexity.
An anti-detachment vehicle for semiconductor devices is designed, and a structure of a fixing seat, plunger, spring and sealing screw is used to achieve negative pressure adsorption and fixation through the adsorption hole and the air pump joint, and the adsorption is lifted through the design of the pressure rod and the ring groove.
It effectively improves the stability of semiconductor devices in the carrier, simplifies the loading and unloading operations of semiconductor devices by the robot, and reduces the difficulty of operation and the complexity of system control.
Smart Images
Figure CN222801765U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of semiconductor device tooling, in particular to an anti-dropping carrier for semiconductor devices. Background Art
[0002] In the production process of semiconductor devices, carriers are needed to position the semiconductor devices for easy processing or testing.
[0003] In order to improve the level of automation in the processing or testing of semiconductor devices, a robot can be used to carry semiconductor devices, automatically place them in a carrier, and remove them from the carrier after processing or testing. The carrier can usually only position the semiconductor device, but cannot fix it, and it is easy to fall off during processing or testing. In order to improve the stability of the semiconductor device in the carrier, a negative pressure suction cup can be added for fixation, but this affects the loading and unloading of semiconductor devices by the robot, and also increases the difficulty of system control, which needs to be improved. Utility Model Content
[0004] The utility model aims to provide an anti-dropping carrier for semiconductor devices, so as to position and fix the semiconductor devices and improve the convenience of loading and unloading.
[0005] To achieve this purpose, the utility model adopts the following technical solutions:
[0006] A semiconductor device anti-slip carrier comprises: a fixing seat, a plunger, a spring and a plugging screw, wherein the top of the fixing seat is concavely provided with a semiconductor positioning groove, the bottom of the semiconductor positioning groove is concavely provided with an adsorption hole, the bottom of the fixing seat is concavely provided with a first guide hole extending upward, the plunger is arranged in the first guide hole, the spring is arranged below the plunger to elastically support the plunger, the plugging screw is arranged at the bottom of the first guide hole, the top of the first guide hole is provided with a second guide hole extending to the top surface of the fixing seat, the top of the plunger is provided with a pressure rod extending to the top of the fixing seat through the second guide hole, the side wall of the adsorption hole is provided with an air inlet hole extending through the first guide hole and extending to the outside of the fixing seat, the outer circle of the plunger is concavely provided with a circle of annular grooves located above the air inlet holes, when the plunger moves downward, the annular groove moves downward accordingly and is connected with the air inlet hole.
[0007] Wherein, an air extraction pipe joint connected to the adsorption hole is arranged on one side of the fixing seat.
[0008] Wherein, the outer diameter of the plunger corresponds to the diameter of the first guide hole.
[0009] Wherein, a section of internal thread corresponding to the blocking screw is arranged at the bottom of the first guide hole.
[0010] Wherein, the first guide hole array is distributed around the semiconductor positioning groove.
[0011] Wherein, a fixing plate is arranged at the bottom of the side surface of the fixing seat, and a mounting hole is arranged on the fixing plate.
[0012] Wherein, it also includes a pressure ring, and the pressure ring is arranged above the pressure rod.
[0013] Wherein, the pressure ring is provided with a through hole located above the semiconductor positioning groove.
[0014] The beneficial effects of the utility model include: an anti-slip carrier for semiconductor devices, in which the semiconductor devices can be carried to the semiconductor positioning groove on the top of the fixing seat by a manipulator to achieve positioning, and the semiconductor devices can be adsorbed and fixed by using the adsorption holes, thereby improving the stability during processing or testing. When unloading, the manipulator first descends to press the pressure rod, so that the plunger moves downward, and the annular groove moves downward accordingly and is connected to the air inlet hole, thereby releasing the adsorption of the semiconductor devices by the adsorption holes, and then the manipulator is used to unload the semiconductor devices. The operation is simple and the difficulty of operation is reduced. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a structural schematic diagram of the utility model;
[0016] Figure 2 yes Figure 1 Schematic diagram of the structure after the middle plunger moves downward. DETAILED DESCRIPTION
[0017] Combine the following Figure 1 to Figure 2 The technical solution of the utility model is further illustrated by specific embodiments.
[0018] like Figure 1 The anti-slip carrier for semiconductor devices shown includes: a fixing seat 1, a plunger 10, a spring 3 and a blocking screw 4. A fixing plate 7 is provided at the bottom of the side of the fixing seat 1, and a mounting hole 6 is provided on the fixing plate 7, which is convenient for fixing by screws to install the fixing seat 1 on the processing or testing equipment of the semiconductor device.
[0019] A semiconductor positioning groove 13 is provided in the top of the fixing seat 1. During use, the semiconductor device can be moved to the semiconductor positioning groove on the top of the fixing seat 1 by a robot arm to achieve precise positioning. An adsorption hole 12 is provided in the bottom of the semiconductor positioning groove 13. In this embodiment, an exhaust pipe joint 2 connected to the adsorption hole 12 is provided on one side of the fixing seat 1. The exhaust pipe joint 2 is externally connected to an exhaust fan, which can extract the air in the adsorption hole 12 to form a negative pressure, thereby achieving adsorption and fixation of the semiconductor device in the semiconductor positioning groove 13, and improving the stability during processing or detection.
[0020] A first guide hole 5 extending upward is concavely arranged at the bottom of the fixing seat 1, and the plunger 10 is arranged in the first guide hole 5. In this embodiment, the outer diameter of the plunger 10 corresponds to the diameter of the first guide hole 5, and the fit is tight, and the guiding effect is good.
[0021] The spring 3 is arranged below the plunger 10 to elastically support the plunger 10, and the plugging screw 4 is arranged at the bottom of the first guide hole 5 to limit the compression of the spring 3. In this embodiment, the bottom of the first guide hole 5 is provided with an internal thread corresponding to the plugging screw 4, which is convenient for disassembly, assembly and adjustment.
[0022] A second guide hole 15 extending to the top surface of the fixing seat 1 is arranged at the top of the first guide hole 5, and a pressure rod 11 extending through the second guide hole 15 to above the fixing seat 1 is arranged at the top of the plunger 10. The diameter of the second guide hole 15 is smaller than the diameter of the first guide hole 5, so as to limit the upward movement of the plunger 10.
[0023] An air inlet hole 8 is provided on the side wall of the adsorption hole 12, passing through the first guide hole 5 and extending to the outside of the fixing seat. A ring groove 9 is provided on the outer circle of the plunger 10, which is located above the air inlet hole 8. Figure 2 As shown, when the plunger 10 moves downward, the annular groove 9 moves downward accordingly and communicates with the air inlet 8, and the external air enters the adsorption hole 12 to release the adsorption of the semiconductor device.
[0024] In this embodiment, the first guide holes 5 are arrayed around the semiconductor positioning groove 13. In order to facilitate the robot to press the pressing rod 11 downward, a pressing ring 14 can also be installed. The pressing ring 14 is arranged above the pressing rod 11. Figure 1 As shown, the pressure ring 14 is provided with a through hole located above the semiconductor positioning groove 13 , which does not affect the positioning and loading and unloading of the semiconductor device in the semiconductor positioning groove 13 .
[0025] When unloading, the manipulator first descends to press the pressure ring 14, so that the plunger 10 moves downward, and the ring groove 9 moves downward and communicates with the air inlet 8, releasing the adsorption of the semiconductor device by the adsorption hole 12, and then the manipulator is used to unload the semiconductor device, which is easy to operate.
[0026] The above contents are only preferred embodiments of the present invention. For ordinary technicians in this field, according to the concept of the present invention, there will be changes in the specific implementation methods and application scopes. The contents of this specification should not be understood as limiting the present invention.
Claims
1. A semiconductor device anti-dropping carrier, characterized in that: include: A fixing seat, a plunger, a spring and a sealing screw, wherein the top of the fixing seat is concavely provided with a semiconductor positioning groove, the bottom of the semiconductor positioning groove is concavely provided with an adsorption hole, the bottom of the fixing seat is concavely provided with a first guide hole extending upward, the plunger is arranged in the first guide hole, the spring is arranged below the plunger to elastically support the plunger, the sealing screw is arranged at the bottom of the first guide hole, the top of the first guide hole is provided with a second guide hole extending to the top surface of the fixing seat, the top of the plunger is provided with a pressure rod extending to the top of the fixing seat through the second guide hole, the side wall of the adsorption hole is provided with an air inlet hole passing through the first guide hole and extending to the outside of the fixing seat, the outer circle of the plunger is concavely provided with a circle of annular grooves located above the air inlet hole, and when the plunger moves downward, the annular groove moves downward accordingly and is connected with the air inlet hole.
2. The semiconductor device anti-dropping carrier according to claim 1, characterized in that: An air extraction pipe joint connected to the adsorption hole is arranged on one side of the fixing seat.
3. The semiconductor device anti-dropping carrier according to claim 1, characterized in that: The outer diameter of the plunger corresponds to the diameter of the first guide hole.
4. The semiconductor device anti-dropping carrier according to claim 1, characterized in that: The bottom of the first guide hole is provided with an internal thread corresponding to the blocking screw.
5. The semiconductor device anti-dropping carrier according to claim 1, characterized in that: The first guide hole array is distributed around the semiconductor positioning groove.
6. The semiconductor device anti-dropping carrier according to claim 1, characterized in that: A fixing plate is arranged at the bottom of the side surface of the fixing seat, and a mounting hole is arranged on the fixing plate.
7. The semiconductor device anti-dropping carrier according to claim 1, characterized in that: It also includes a pressing ring, which is arranged above the pressing rod.
8. The semiconductor device anti-dropping carrier according to claim 7, characterized in that: The pressure ring is provided with a through hole located above the semiconductor positioning groove.