Wafer carrying finger
By using the design of Bernoulli suction cups and air jets in the wafer handling fingers, the Bernoulli effect suspends and adsorbs ultra-thin wafers, the problem of difficulty in effectively transporting ultra-thin wafers in the prior art is solved, and the contactless and damage-free wafer transport effect is achieved.
Patent Information
- Application Number
- CN202420893511.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-25
- Publication Date
- 2025-04-25
- Estimated Expiration
- 2034-04-25
AI Technical Summary
Existing vacuum fingers and clamped fingers are difficult to effectively transport ultra-thin wafers, which can easily damage the wafer microstructure or cause deformation and contamination.
The wafer conveying fingers are used including a finger body and a Bernoulli suction cup provided on the bottom surface of the finger body, and the air supply device is used to vent into the suction cup air chamber, so that the high-speed flowing gas is sprayed out from the jet hole, creating a Bernoulli effect, and suspending and adsorbing the wafer.
Non-contact adsorption is realized, which avoids the damage and contamination of the wafer, while avoids the deformation and debris of the wafer, ensuring the safe transfer of the wafer.
Smart Images
Figure CN222801769U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a wafer transporting finger. Background Art
[0002] At present, the wafer transport in commonly used semiconductor equipment is mostly a clamping structure or a vacuum adsorption structure. When the wafer thickness is thin, the above two types of structure fixtures cannot effectively transport the wafer. Specifically, there are the following defects:
[0003] 1. The vacuum fingers cannot transport ultra-thin wafers. They will adsorb pits on the surface of the wafers and destroy the microstructure of the wafers. On the other hand, the vacuum fingers have surface contact with the wafers, which will cause contamination to the wafers.
[0004] 2. The clamping fingers cannot handle ultra-thin wafers. The wafers will be greatly deformed under the clamping action, and if the clamping force is not well controlled, it will cause fragmentation problems.
[0005] In view of this, it is necessary to propose a wafer transfer finger to solve the above problems. Utility Model Content
[0006] The utility model aims to provide a wafer transport finger, which is used to improve the problem that the existing vacuum fingers or clamping fingers cannot handle ultra-thin wafers.
[0007] The utility model provides a wafer handling finger, comprising: a finger body and a Bernoulli suction cup arranged on the bottom surface of the finger body, a suction cup air chamber is formed between the finger body and the Bernoulli suction cup, a plurality of air jet holes connected to the suction cup air chamber are arranged at intervals on the Bernoulli suction cup, a line connecting the plurality of air jet holes is circular, the suction cup air chamber is connected to an air supply device, and the air supply device is used to ventilate the suction cup air chamber so that gas is ejected from the air jet holes.
[0008] In a possible embodiment, it further includes a gas channel disposed on the finger body, one end of the gas channel extends to the rear end of the finger body and is connected to the gas supply device, and the other end is communicated with the suction cup air chamber.
[0009] In a possible embodiment, it also includes an air-uniform ring disposed in the suction cup air chamber and supported between the finger body and the Bernoulli suction cup, the air-uniform ring is disposed corresponding to the other end of the gas channel, and a plurality of air guide grooves are provided on the air-uniform ring at intervals along the extension direction of the air-uniform ring.
[0010] In a possible embodiment, it further includes a front stopper disposed on the bottom surface of the finger body and located at the front end of the finger body, wherein the front stopper is in a barb shape and has a front abutting surface for abutting against an edge of a wafer.
[0011] In a possible embodiment, it further includes a rear supporting block disposed on the bottom surface of the finger body and located at the rear end of the finger body, wherein the rear supporting block is in a barb shape and has a rear abutting surface.
[0012] In a possible embodiment, the front abutting surface and the rear abutting surface are arranged opposite to each other, the front abutting surface and the rear abutting surface are inclined surfaces, and the angle range between the front abutting surface and the vertical direction and the angle range between the rear abutting surface and the vertical direction are both greater than 0° and less than or equal to 45°;
[0013] The distance between the front abutment surface and the center line of the Bernoulli suction cup gradually decreases from the direction close to the finger body to the direction away from the finger body, and / or the distance between the rear abutment surface and the center line of the Bernoulli suction cup gradually decreases from the direction close to the finger body to the direction away from the finger body.
[0014] In a possible embodiment, it also includes a mounting base arranged at the rear end of the finger body, and a driving member is provided on the bottom surface of the mounting base, and the driving member is drivingly connected to a push block, and the push block has a limiting surface for abutting against the edge of the wafer. The driving member can be telescopically adjusted to drive the push block to move toward the front stop block or away from the front stop block, thereby achieving locking or releasing of the wafer.
[0015] In a possible embodiment, the limiting surface and the front abutting surface are arranged opposite to each other, the limiting surface is an inclined surface, the distance between the limiting surface and the center line of the Bernoulli suction cup gradually decreases from the direction close to the finger body to the direction away from the finger body, and the angle between the limiting surface and the vertical direction ranges from 5° to 15°.
[0016] In a possible embodiment, a connecting plate is provided between the driving member and the pushing block, a positioning plate is provided on the connecting plate, and a first light-shielding sensor and a second light-shielding sensor are provided on the mounting seat at intervals corresponding to the positioning plate. When the positioning plate blocks the first light-shielding sensor, the pushing block is located at a starting position, and when the positioning plate blocks the second light-shielding sensor, the pushing block is located close to the wafer.
[0017] In a possible embodiment, the distance between the channel of the air jet hole and the center line of the Bernoulli suction cup gradually increases from the direction close to the finger body to the direction away from the finger body, and the angle between the upper edge line of the channel of the air jet hole and the horizontal direction ranges from 15° to 45°.
[0018] The beneficial effect of the wafer handling finger provided by the utility model is that: the air supply device is used to ventilate the air chamber of the suction cup, and the high-speed flowing gas ejected from the air jet hole produces a Bernoulli effect, so that the wafer can be suspended and adsorbed under the Bernoulli suction cup. The non-contact adsorption avoids damaging the microstructure of the wafer, and will not cause deformation and fragmentation of the wafer, thereby avoiding contamination of the wafer. In a further solution, the front stopper and the rear support block limit the wafer, and the push block locks the position of the wafer to prevent the wafer from falling. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is a three-dimensional diagram of the wafer handling finger of the present invention.
[0020] Figure 2 It is a bottom view of the wafer handling finger of the present invention in one embodiment.
[0021] Figure 3 It is a cross-sectional view of the wafer handling finger of the present invention.
[0022] Figure 4 for Figure 3 A partial enlarged schematic diagram of the middle area.
[0023] Figure 5 It is a schematic diagram of the front stopper in the wafer handling finger of the present invention.
[0024] Figure 6 It is a bottom view of the wafer handling finger of the utility model in another embodiment.
[0025] Explanation of the reference numerals in the accompanying drawings: finger body 110; gas channel 111; groove 112; front extension 113; rear extension 114; Bernoulli suction cup 120; suction cup air chamber 121; air jet hole 122; air uniforming ring 130; air guide groove 131; protrusion 132; front stopper 140; front abutment surface 141; front contact surface 142; rear support block 150; rear abutment surface 151; rear contact surface 152; push block 160; limiting surface 161; mounting seat 170; connecting plate 171; positioning plate 172; driving member 180; first light-shielding sensor 191; second light-shielding sensor 192. DETAILED DESCRIPTION
[0026] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the technical solution in the embodiments of the utility model will be described clearly and completely below. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0027] In view of the problems existing in the prior art, the embodiment of the utility model provides a wafer handling finger, see Figure 1 , Figure 2 and Figure 3 The wafer handling finger includes: a finger body 110 and a Bernoulli suction cup 120 disposed on the bottom surface of the finger body 110, a suction cup air chamber 121 is formed between the finger body 110 and the Bernoulli suction cup 120, a plurality of jet holes 122 connected to the suction cup air chamber 121 are arranged at intervals on the Bernoulli suction cup 120, and the connection line of the plurality of jet holes 122 is circular, and the suction cup air chamber 121 is connected to a gas supply device (not shown in the figure), and the gas supply device is used to ventilate the suction cup air chamber 121 so that the gas is ejected from the jet holes 122. Preferably, the gas can be an inert gas such as nitrogen. The Bernoulli suction cup 120 is detachably disposed on the bottom surface of the finger body 110 by a fastener. The suction cup air chamber 121 is disposed on the top surface of the Bernoulli suction cup 120.
[0028] According to the Bernoulli principle, in a fluid (such as a gas or a liquid), the pressure is low where the flow rate is high. In this embodiment, a plurality of jet holes 122 are provided on the Bernoulli suction cup 120, and high-speed flowing gas is ejected from the jet holes 122, forming a low-pressure area below the suction cup air chamber 121, that is, a low-pressure area less than the surrounding atmospheric pressure. Under the action of the pressure difference, the wafer can be suspended and adsorbed below the Bernoulli suction cup 120, and ultra-thin wafers can be more easily adsorbed because the wafer surface is not in direct contact with the Bernoulli suction cup 120, thereby avoiding contamination of the wafer surface, damage to the wafer microstructure, and deformation and fragmentation of the wafer.
[0029] In a specific embodiment, see Figure 3 and Figure 4 The wafer handling finger also includes a gas channel 111 disposed on the finger body 110, one end of the gas channel 111 extends to the rear end of the finger body 110 and is connected to the gas supply device, and the other end is connected to the suction cup air chamber 121. Preferably, a groove 112 is provided on the bottom surface of the finger body 110 corresponding to the other end of the gas channel 111, the groove 112 is connected to the gas channel 111 and the suction cup air chamber 121, and the groove 112 is arranged corresponding to the middle of the Bernoulli suction cup 120.
[0030] In a preferred embodiment, see Figure 3 and Figure 4The wafer handling finger also includes an air-leveling ring 130 disposed in the suction cup air chamber 121 and supported between the finger body 110 and the Bernoulli suction cup 120. The air-leveling ring 130 is disposed at the other end of the corresponding gas channel 111. The air-leveling ring 130 is provided with a plurality of air-guiding grooves 131 at intervals along the extension direction of the air-leveling ring 130. Preferably, the air-leveling ring 130 is located in the middle of the suction cup air chamber 121. The air-leveling ring 130 includes an annular ring member and a plurality of protrusions 132 formed at intervals along the extension direction of the ring member. The air-guiding groove 131 is formed between two adjacent protrusions 132. The groove 112 is located within the projection range of the air-leveling ring 130 on the finger body 110. A plurality of air-injection holes 122 are evenly spaced along the edge of the suction cup air chamber 121.
[0031] The gas supply device introduces gas into the gas channel 111, and the gas passes through the groove 112, enters the gas leveling ring 130, and passes through the gas guide groove 131 on the gas leveling ring 130 to ensure that the gas is evenly diffused from the gas leveling ring 130 located in the middle of the suction cup gas chamber 121 to the surroundings of the suction cup gas chamber 121, and is ejected from the gas injection hole 122 located at the edge of the suction cup gas chamber 121. The gas guide groove 131 on the gas leveling ring 130 plays a role in uniform flow distribution, avoiding the problem of uneven air flow caused by air flow concentrated in a certain area, thereby improving the stability and reliability of wafer adsorption.
[0032] In one embodiment, see Figure 3 and Figure 5 The wafer handling finger also includes a front stopper 140 disposed on the bottom surface of the finger body 110 and located at the front end of the finger body 110. The front stopper 140 is in the shape of a barb and has a front abutting surface 141 for abutting against the edge of the wafer. Specifically, the front end of the finger body 110 is formed with a front extension portion 113 protruding from the periphery of the Bernoulli suction cup 120. There are two front stoppers 140, which are spaced apart and disposed at one end of the front extension portion 113 away from the Bernoulli suction cup 120. The front stopper 140 plays a role in limiting the position of the wafer at the front side.
[0033] In yet another embodiment, see Figure 1 and Figure 3 The wafer handling finger also includes a rear support block 150 disposed on the bottom surface of the finger body 110 and located at the rear end of the finger body 110. The rear support block 150 is in the shape of a barb and has a rear abutment surface 151. Specifically, the rear end of the finger body 110 is formed with a rear extension portion 114 protruding from the periphery of the Bernoulli suction cup 120. There are two rear support blocks 150, which are spaced apart and disposed at one end of the rear extension portion 114 away from the Bernoulli suction cup 120. The rear support block 150 plays a role in limiting the wafer at the rear side.
[0034] In one specific embodiment, see Figure 3 and Figure 5The front abutment surface 141 and the rear abutment surface 151 are arranged opposite to each other, and the front abutment surface 141 and the rear abutment surface 151 are inclined surfaces. The angle range between the front abutment surface 141 and the vertical direction and the angle range between the rear abutment surface 151 and the vertical direction are both greater than 0° and less than or equal to 45°. The distance between the front abutment surface 141 and the center line of the Bernoulli suction cup 120 gradually decreases from the direction close to the finger body 110 to the direction away from the finger body 110, and / or, the distance between the rear abutment surface 151 and the center line of the Bernoulli suction cup 120 gradually decreases from the direction close to the finger body 110 to the direction away from the finger body 110. The barb design of the front stopper 140 and the rear support block 150 plays a role in limiting the wafer in the horizontal direction.
[0035] Better, see Figure 3 and Figure 5 The front stopper 140 also has a front contact surface 142 connected to the top of the front abutting surface 141. The front contact surface 142 and the front abutting surface 141 form a barb shape. The front contact surface 142 gradually tilts upward from the direction close to the front abutting surface 141 to the direction away from the front abutting surface 141. When clamping the wafer, because the front contact surface 142 is tilted upward, only the edge of the wafer abuts against the connection between the front contact surface 142 and the front abutting surface 141, which greatly reduces the clamping contact surface and reduces the pollution and damage to the wafer.
[0036] Better, see Figure 3 The rear support block 150 also has a rear contact surface 152 connected to the top of the rear abutment surface 151. The rear contact surface 152 and the rear abutment surface 151 form a barb shape. The rear contact surface 152 gradually tilts upward from the direction close to the rear abutment surface 151 to the direction away from the rear abutment surface 151. Because the rear contact surface 152 is tilted upward, only the edge of the wafer contacts the rear contact surface 152, which greatly reduces the contact surface and reduces the contamination of the wafer.
[0037] In another embodiment, see Figure 3 and Figure 6 The wafer handling finger also includes a mounting seat 170 disposed at the rear end of the finger body 110. The bottom surface of the mounting seat 170 is provided with a driving member 180. The driving member 180 is drivingly connected to a push block 160. The push block 160 has a limiting surface 161 for abutting against the edge of the wafer. The driving member 180 can be telescopically adjusted to drive the push block 160 to move toward or away from the front stopper 140, thereby locking or releasing the wafer. Preferably, the driving member 180 can be a cylinder, an electric telescopic rod, etc.
[0038] In a specific embodiment, see Figure 3The limiting surface 161 and the front abutting surface 141 are arranged opposite to each other, the limiting surface 161 is an inclined surface, and the distance between the limiting surface 161 and the center line of the Bernoulli suction cup 120 gradually decreases from the direction close to the finger body 110 to the direction away from the finger body 110. The angle between the limiting surface 161 and the vertical direction ranges from 5° to 15°.
[0039] Due to the Bernoulli effect, the wafer is suspended and adsorbed under the Bernoulli suction cup 120, between the area enclosed by the front stop block 140 and the rear support block 150. Under the driving action of the driving member 180, the push block 160 pushes the wafer so that the edge of the wafer rests on the front stop block 140, thereby clamping the wafer between the front stop block 140 and the push block 160 to facilitate high-speed transportation of the wafer. The push block 160 can flexibly clamp or release the wafer, and the inclined surface design of the front abutment surface 141 of the front stop block 140, the rear abutment surface 151 of the rear support block 150, and the limiting surface 161 of the push block 160 can support the wafer. When the edge of the wafer abuts against the front abutment surface 141 and the limiting surface 161, it is equivalent to placing the wafer on the front abutment surface 141 and the limiting surface 161, and the parts of the front abutment surface 141 and the limiting surface 161 located below the wafer can support the wafer.
[0040] In a preferred embodiment, see Figure 6 A connecting plate 171 is provided between the driving member 180 and the push block 160, and a positioning plate 172 is provided on the connecting plate 171. A first light-shielding sensor 191 and a second light-shielding sensor 192 are provided at intervals on the bottom surface of the mounting seat 170 corresponding to the positioning plate 172. When the positioning plate 172 blocks the first light-shielding sensor 191, the push block 160 is located at the starting position; when the positioning plate 172 blocks the second light-shielding sensor 192, the push block 160 is located at a position close to the wafer. Through the cooperation between the positioning plate 172, the first light-shielding sensor 191, and the second light-shielding sensor 192, it can be detected whether the wafer is effectively clamped.
[0041] In a specific embodiment, see Figure 3 The distance between the channel of the air jet hole 122 and the center line of the Bernoulli suction cup 120 gradually increases from the direction close to the finger body 110 to the direction away from the finger body 110, and the angle between the upper edge line of the channel of the air jet hole 122 and the horizontal direction ranges from 15° to 45°. Preferably, the angle between the upper edge line of the channel of the air jet hole 122 and the horizontal direction is 30°. The inclined design of the channel of the air jet hole 122 enhances the adsorption effect of the airflow on the wafer, thereby effectively and stably clamping the wafer.
[0042] The technical effects of the wafer handling fingers provided by the utility model are described in detail below.
[0043] 1. The air jet hole 122 on the Bernoulli suction cup 120 generates the Bernoulli effect to suspend and absorb the wafer, thereby avoiding contamination of the wafer surface, damage to the wafer microstructure, and deformation and fragmentation of the wafer.
[0044] 2. The front stopper 140 and the rear support block 150 are designed with barbs to limit the wafer, and the push block 160 is used to lock the position of the wafer to prevent the wafer from falling.
[0045] Although the embodiments of the utility model are described in detail above, it is obvious to those skilled in the art that various modifications and changes can be made to these embodiments. However, it should be understood that such modifications and changes are within the scope and spirit of the utility model in the claims. Moreover, the utility model described herein may have other embodiments and may be implemented or realized in a variety of ways. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with ordinary skills in the field to which the utility model belongs. "Including" and similar words used herein mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects.
Claims
1. A wafer handling finger, characterized in that: include: A finger body and a Bernoulli suction cup arranged on the bottom surface of the finger body, a suction cup air chamber is formed between the finger body and the Bernoulli suction cup, a plurality of air jet holes connected to the suction cup air chamber are arranged at intervals on the Bernoulli suction cup, a line connecting the plurality of air jet holes is circular, the suction cup air chamber is connected to an air supply device, and the air supply device is used to ventilate the suction cup air chamber so that gas is ejected from the air jet holes; Also included is a gas channel disposed on the finger body; It also includes an air-uniform ring disposed in the suction cup air chamber and supported between the finger body and the Bernoulli suction cup. The air-uniform ring is disposed corresponding to the other end of the gas channel. A plurality of air-guiding grooves are disposed on the air-uniform ring at intervals along the extension direction of the air-uniform ring.
2. The wafer handling finger according to claim 1, characterized in that: One end of the gas channel extends to the rear end of the finger body and is connected to the gas supply device, and the other end is communicated with the suction cup air chamber.
3. The wafer handling finger according to claim 1, characterized in that: It also includes a front stopper arranged on the bottom surface of the finger body and located at the front end of the finger body. The front stopper is in a barb shape and has a front abutting surface for abutting against the edge of the wafer.
4. The wafer handling finger according to claim 3, characterized in that: It also includes a rear supporting block which is arranged on the bottom surface of the finger body and located at the rear end of the finger body. The rear supporting block is in a barb shape and has a rear abutting surface.
5. The wafer handling finger according to claim 4, characterized in that: The front abutting surface and the rear abutting surface are arranged opposite to each other, the front abutting surface and the rear abutting surface are inclined surfaces, and the angle range between the front abutting surface and the vertical direction and the angle range between the rear abutting surface and the vertical direction are both greater than 0° and less than or equal to 45°; The distance between the front abutment surface and the center line of the Bernoulli suction cup gradually decreases from the direction close to the finger body to the direction away from the finger body, and / or the distance between the rear abutment surface and the center line of the Bernoulli suction cup gradually decreases from the direction close to the finger body to the direction away from the finger body.
6. The wafer handling finger according to claim 3, characterized in that: It also includes a mounting seat arranged at the rear end of the finger body, a driving member is provided on the bottom surface of the mounting seat, the driving member is drivingly connected to a push block, the push block has a limiting surface for abutting against the edge of the wafer, the driving member can be telescopically adjusted to drive the push block to move toward or away from the front stop block, thereby achieving locking or releasing of the wafer.
7. The wafer handling finger according to claim 6, characterized in that: The limiting surface and the front abutting surface are arranged opposite to each other, the limiting surface is an inclined surface, the distance between the limiting surface and the center line of the Bernoulli suction cup gradually decreases from the direction close to the finger body to the direction away from the finger body, and the angle between the limiting surface and the vertical direction ranges from 5° to 15°.
8. The wafer handling finger according to claim 6, characterized in that: A connecting plate is provided between the driving member and the pushing block, a positioning plate is provided on the connecting plate, and a first light-shielding sensor and a second light-shielding sensor are provided on the mounting seat at intervals corresponding to the positioning plate. When the positioning plate blocks the first light-shielding sensor, the pushing block is located at a starting position, and when the positioning plate blocks the second light-shielding sensor, the pushing block is located close to the wafer.
9. The wafer handling finger according to claim 1, characterized in that: The distance between the channel of the jet hole and the center line of the Bernoulli suction cup gradually increases from the direction close to the finger body to the direction away from the finger body, and the angle between the upper edge line of the channel of the jet hole and the horizontal direction ranges from 15° to 45°.