Wafer pushing mechanism for photoetching equipment

Abstract

The utility model provides a wafer pushing mechanism for photoetching equipment, which comprises a bearing assembly component, a pushing guide component, a guide bracket component, a pushing operation component, a box body limiting component and a wafer pushing component, and the box body limiting component of the wafer pushing mechanism consists of an edge limiting block, a bottom limiting block and a height adjusting block, according to the wafer pushing device, the discharging wafer box body and the feeding wafer box body can be ensured to be fixed and accurately positioned on the supporting seat plate, so that the wafer pushing precision and efficiency are improved, the wafer pushing device can adapt to the wafer box bodies with different heights or abraded through the height adjusting block, the wafer pushing precision is further improved, the wafer pushing device is suitable for the wafer box bodies with different sizes and types, and the wafer pushing efficiency is improved. Compared with the prior art, the device has the advantages that the adaptability is high, the influence on the production efficiency caused by the size change of the wafer box body is reduced, the wafers can be arranged in order, a mechanical arm can conveniently grab the wafers, the production error caused by the fact that the wafers are not arranged in order is reduced, and the production efficiency and the quality of integrated circuit finished products are improved.

Description

Technical Field

[0001] The utility model relates to integrated circuit production equipment, in particular to a wafer pushing mechanism for photolithography equipment. Background Art

[0002] During the photolithography process of the wafer, due to the slight difference in the size of the wafer boxes produced by different standards, the wafer boxes are not universal on some models, and the wafers in the wafer box need to be completely transferred to another wafer box, and the wafers are frequently taken and placed during the processing, which will cause their arrangement to be disrupted. Patent document CN216389303U discloses a wafer pusher, which includes a placement part, a push part and two baffles, the placement part is provided with a placement groove, the placement groove is used to place the plug, the push part is connected to the placement part, located at one end of the placement groove, and is used to push the wafer out of the plug, and the two baffles are connected to the placement part, respectively located on both sides of the other end of the placement groove, when the wafer is pushed out of the plug, the movement of the wafer is limited by the baffles on both sides of the wafer, so as to avoid the wafer from tilting and causing the wafer to slip. However, this pusher mechanism has poor operating flexibility, low operating efficiency, and is easy to cause the wafer to be contaminated and scrapped. Therefore, it is necessary to optimize the structure of this wafer pusher mechanism to overcome the above defects. Utility Model Content

[0003] The utility model aims to provide a wafer pushing mechanism for photolithography equipment, so as to enhance the flexibility of use and improve the quality of wafers.

[0004] The technical solution adopted by the utility model to solve its technical problems is:

[0005] A wafer pushing mechanism for a photolithography device, comprising:

[0006] A support assembly component having an assembly space therein;

[0007] A push guide assembly, the push guide assembly being installed in the support assembly;

[0008] A guide support assembly, which is mounted on the push guide assembly and can move on the push guide assembly, and the push guide assembly guides the movement of the guide support assembly;

[0009] A push operation component, which is installed on the guide support component and can drive the guide support component to move on the push guide component through the push operation component;

[0010] The box body limiting component is installed on the supporting assembly component, and is adapted to the shape of the discharge wafer box body and the feed wafer box body, and can position the discharge wafer box body and the feed wafer box body;

[0011] The wafer pushing assembly is installed on the guide support assembly and can move with the guide support assembly. Its position corresponds to the box body limit assembly. When the wafer pushing assembly moves, it can drive the wafer in the discharge wafer box body to move into the feed wafer box body.

[0012] Specifically, the support assembly includes:

[0013] A support base plate is arranged in the transverse direction, and has a space on the top for placing an outgoing wafer box and an incoming wafer box, and one end of the support base plate is provided with a avoiding notch that matches the shape of the guide support assembly;

[0014] The support cover shell is formed by enclosing plates and is located below the support base plate. Its edge is connected to the support base plate by connecting bolts, and an activity space adapted to the push guide assembly is formed between the support cover shell and the support base plate.

[0015] In one embodiment of the utility model, the support base plate and the support cover shell are rectangular structures, and the avoidance notch extends along the length direction of the support base plate;

[0016] In one embodiment of the utility model, a group of supporting columns are provided at the bottom of the supporting cover, and each supporting column is arranged in sequence along the edge of the supporting cover and extends below the supporting cover, and the supporting column supports the supporting cover and the supporting seat plate;

[0017] In one embodiment of the utility model, a supporting gasket is respectively provided at the bottom of each supporting column. The supporting gasket is made of soft material and can buffer the supporting process of the supporting column.

[0018] The push guide assembly includes:

[0019] The guide slide rail is located between the support base plate and the support cover shell and is fixed to the bottom of the support base plate by connecting bolts. The avoidance notch corresponds to the position of the guide slide rail and is parallel to each other.

[0020] The guide bracket assembly includes:

[0021] A guide seat block, which is mounted on the guide rail and can move along the guide rail;

[0022] The supporting horizontal plate is in the shape of a long strip and extends along the length direction of the guide rail, the inner end of which is connected to the guide seat block through a connecting bolt, and the outer end of which extends to the bottom of the avoidance notch;

[0023] The supporting vertical plate is installed on the outer end of the supporting horizontal plate through connecting bolts and extends above the supporting horizontal plate, and the top of the supporting vertical plate is exposed from the avoidance notch.

[0024] The push operation components include:

[0025] A push beam, which is located above the support base plate and is installed on the top of the supporting plate through connecting bolts;

[0026] The operating handle is formed by bending a rod and is installed on the push beam through connecting bolts. The operating handle can apply thrust to the push beam.

[0027] The box limit assembly includes:

[0028] The edge limit blocks are provided with two groups, each group of edge limit blocks is respectively installed on the top edge of the support base plate, and are arranged in sequence along the length direction of the avoidance notch, and are adapted to the edge shapes of the discharge wafer box and the feed wafer box, and the edges of the discharge wafer box and the feed wafer box are positioned by the positioning horizontal block;

[0029] The bottom stopper is provided with two groups, each group of bottom stopper is respectively installed on the top of the support base plate and is located between the side stopper blocks, which are arranged in sequence along the length direction of the avoidance notch and are adapted to the bottom shape of the discharge wafer box and the feed wafer box. The bottom stopper is used to position the bottom of the wafer assembly so that the discharge wafer box and the feed wafer box are kept fixed on the support base plate;

[0030] Height adjustment blocks, which are provided with two groups, each group of height adjustment blocks is installed in the support base plate through adjusting bolts, and the height can be adjusted in the support base plate. The height adjustment blocks correspond to the position of the edge limit blocks and the bottom limit blocks, and abut against the bottom of the discharge wafer box and the feed wafer box, and the height of the discharge wafer box and the feed wafer box can be adjusted. When the discharge wafer box and the feed wafer box are worn and the height changes, the height adjustment blocks can be adjusted to make the discharge wafer box and the feed wafer box have the same height.

[0031] The wafer push assembly includes:

[0032] A push plate, which is located above the support base plate, has its inner end connected to the top of the support plate by connecting bolts, and its outer end extends toward the side limit block and the bottom limit block, and can move with the support plate;

[0033] The sliding vertical plate is installed on the outer end of the sliding horizontal plate through connecting bolts and extends above the sliding horizontal plate. It can move together with the sliding horizontal plate. Its width is smaller than the width of the openings of the unloading wafer box and the feeding wafer box. When it moves, it can drive the wafers in the unloading wafer box to move as a whole into the feeding wafer box.

[0034] In one embodiment of the utility model, a reinforcing angle plate is provided between the push vertical plate and the push horizontal plate, and the reinforcing angle plate is used to structurally strengthen the joint portion between the push vertical plate and the push horizontal plate;

[0035] In one embodiment of the utility model, a buffer pad is provided on the outer wall of the push plate. The buffer pad is made of a silicone sheet and is bonded to the outer wall of the push plate. The buffer pad can buffer the movement of the wafer to avoid damage to the wafer.

[0036] The advantages of the utility model are:

[0037] The box limit assembly of the wafer pushing mechanism is composed of an edge limit block, a bottom limit block and a height adjustment block, which can ensure that the discharge wafer box and the feed wafer box remain fixed and accurately positioned on the support base plate, thereby improving the accuracy and efficiency of wafer pushing. Through the height adjustment block, it can adapt to wafer boxes of different heights or wear and tear, ensure the height consistency of the wafer box, and further improve the accuracy of wafer pushing. It is suitable for wafer boxes of different sizes and types, has strong adaptability and flexibility, reduces the impact on production efficiency caused by changes in the size of the wafer box, can arrange the wafers neatly, and is convenient for the robot arm to grab, reducing production errors caused by uneven wafer placement, which is beneficial to improving production efficiency and the quality of integrated circuit products. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 It is a schematic diagram of the external structure of a wafer pushing mechanism for a photolithography device proposed by the utility model;

[0039] Figure 2 It is a schematic diagram of the internal structure of the wafer pushing mechanism. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical scheme and advantages of the embodiment of the utility model clearer, the technical scheme in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. The components of the embodiment of the utility model generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiment of the utility model provided in the drawings is not intended to limit the scope of the utility model claimed for protection, but merely represents the selected embodiment of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the utility model.

[0041] like Figure 1 , Figure 2As shown, the wafer pushing mechanism for lithography equipment proposed by the utility model comprises a supporting assembly component, a pushing guide component, a guide support component, a pushing operation component, a box body limiting component and a wafer pushing component. The supporting assembly component has an assembly space. The pushing guide component is installed in the supporting assembly component. The guide support component is installed on the pushing guide component and can move on the pushing guide component. The moving process of the guide support component is guided by the pushing guide component. The pushing operation component is installed on the guide support component, and the guide support component can be driven to move on the pushing guide component by the pushing operation component. The box body limiting component is installed on the supporting assembly component, which is adapted to the shape of the discharge wafer box body and the feed wafer box body, and can position the discharge wafer box body and the feed wafer box body. The wafer pushing component is installed on the guide support component and can move with the guide support component. It corresponds to the position of the box body limiting component. When the wafer pushing component moves, it can drive the wafer in the discharge wafer box body to move into the feed wafer box body.

[0042] In this embodiment, the support assembly component includes a support seat plate 110 and a support cover shell 120. The support seat plate is arranged horizontally, and its top has space for placing the discharge wafer box and the feed wafer box. One end of the support seat plate is provided with a avoidance notch 111 that is adapted to the shape of the guide support assembly, and the box body limit assembly is located at the other end. The support cover shell is formed by enclosing plates and is located below the support seat plate. Its edge is connected to the support seat plate by connecting bolts, and a movable space adapted to the push guide assembly is formed between the support cover shell and the support seat plate.

[0043] In this embodiment, the support base plate and the support cover shell are rectangular structures, and the avoidance notch extends along the length direction of the support base plate;

[0044] In this embodiment, a group of supporting columns 130 are provided at the bottom of the supporting housing, and each supporting column is arranged in sequence along the edge of the supporting housing and extends downwardly from the supporting housing, and the supporting columns support the supporting housing and the supporting base plate;

[0045] In this embodiment, a supporting gasket 131 is respectively provided at the bottom of each supporting column. The supporting gasket is made of soft material and can buffer the supporting process of the supporting column.

[0046] The push guide assembly includes a guide rail 200, which is located between the support base plate and the support cover shell and is fixed to the bottom of the support base plate by connecting bolts. The avoidance notch corresponds to the position of the guide rail and is parallel to each other.

[0047] The guide support assembly includes a guide seat block 310, a support cross plate 320 and a support vertical plate 330. The guide seat block is installed on the guide slide rail and can move along the guide slide rail. The support cross plate is long and extends along the length direction of the guide slide rail. Its inner end is connected to the guide seat block through connecting bolts, and its outer end extends to the bottom of the avoidance notch. The support vertical plate is installed on the outer end of the support cross plate through connecting bolts and extends above the support cross plate, and its top is exposed from the avoidance notch.

[0048] The pushing operation assembly includes a pushing beam 410 and an operating handle 420. The pushing beam is located above the supporting seat plate and is installed on the top of the supporting plate through connecting bolts. The operating handle is formed by bending a rod and is installed on the pushing beam through connecting bolts. The operating handle can apply thrust to the pushing beam.

[0049] The box body limit assembly includes an edge limit block 510, a bottom limit block 520 and a height adjustment block 530. The edge limit blocks are provided with two groups, and each group of edge limit blocks is respectively installed on the top edge of the support seat plate, and is arranged in sequence along the length direction of the avoidance notch, and is adapted to the edge shape of the discharge wafer box body and the feed wafer box body. The edge of the discharge wafer box body and the feed wafer box body is positioned by the positioning cross block. The bottom limit blocks are provided with two groups, and each group of bottom limit blocks is respectively installed on the top of the support seat plate and is located between the edge limit blocks. The directions are arranged sequentially and adapted to the bottom shapes of the discharge wafer box and the feed wafer box. The bottom limit block is used to position the bottom of the wafer assembly so that the discharge wafer box and the feed wafer box remain fixed on the support seat plate. Two groups of height adjustment blocks are provided. Each group of height adjustment blocks is installed in the support seat plate through adjusting bolts. The height can be adjusted in the support seat plate. It corresponds to the position of the edge limit block and the bottom limit block, and abuts against the bottom of the discharge wafer box and the feed wafer box, so the height of the discharge wafer box and the feed wafer box can be adjusted. When the discharge wafer box and the feed wafer box are worn and the height changes, the height adjustment block can be adjusted to make the discharge wafer box and the feed wafer box have the same height.

[0050] The wafer pushing assembly includes a pushing transverse plate 610 and a pushing vertical plate 620. The pushing transverse plate is located above the supporting seat plate, and its inner end is connected to the top of the supporting vertical plate through connecting bolts, and its outer end extends toward the side limit block and the bottom limit block, and can move with the supporting vertical plate. The pushing vertical plate is installed on the outer end of the pushing transverse plate through connecting bolts and extends above the pushing transverse plate, and can move with the pushing transverse plate. Its width is smaller than the width of the openings of the discharge wafer box and the feed wafer box. When it moves, it can drive the wafer in the discharge wafer box to move as a whole into the feed wafer box.

[0051] In this embodiment, a reinforcing angle plate 630 is provided between the push vertical plate and the push horizontal plate, and the reinforcing angle plate is used to structurally strengthen the joint between the push vertical plate and the push horizontal plate.

[0052] In this embodiment, a buffer pad 640 is provided on the outer wall of the push plate. The buffer pad is made of a silicone sheet and is bonded to the outer wall of the push plate. The buffer pad can buffer the movement of the wafer to avoid damage to the wafer.

[0053] In the description of the present utility model, it should be noted that when terms such as "upper", "lower", "inner", "outer", "left", "right" and the like indicating orientation or positional relationship appear, it should be understood that the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the utility model product is usually placed when in use, or the orientation or positional relationship commonly understood by those skilled in the art, is only for the convenience of describing the present utility model and simplifying the description, and does not indicate or imply that the equipment or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, when terms such as "first" and "second" appear, they are only used to distinguish the description, and cannot be understood as indicating or implying relative importance. In the description of the present utility model, it should also be noted that, unless otherwise clearly specified and limited, terms such as "installation", "setting", and "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal connection of two elements. For those skilled in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

Claims

1. A wafer pushing mechanism for a photolithography device, characterized in that: include: A support assembly component having an assembly space therein; A push guide assembly, the push guide assembly being installed in the support assembly; A guide support assembly, which is mounted on the push guide assembly and can move on the push guide assembly, and the push guide assembly guides the movement of the guide support assembly; A push operation component, which is installed on the guide support component and can drive the guide support component to move on the push guide component through the push operation component; The box body limiting component is installed on the supporting assembly component, and is adapted to the shape of the discharge wafer box body and the feed wafer box body, and can position the discharge wafer box body and the feed wafer box body; The wafer pushing assembly is installed on the guide support assembly and can move with the guide support assembly. Its position corresponds to the box body limit assembly. When the wafer pushing assembly moves, it can drive the wafer in the discharge wafer box body to move into the feed wafer box body.

2. The wafer pushing mechanism for photolithography equipment according to claim 1, characterized in that: The support assembly includes: A support base plate is arranged in the transverse direction, and has a space on the top for placing an outgoing wafer box and an incoming wafer box, and one end of the support base plate is provided with a avoiding notch that matches the shape of the guide support assembly; The support cover shell is formed by enclosing plates and is located below the support base plate. Its edge is connected to the support base plate by connecting bolts, and an activity space adapted to the push guide assembly is formed between the support cover shell and the support base plate.

3. The wafer pushing mechanism for photolithography equipment according to claim 2, characterized in that: The push guide assembly includes: The guide slide rail is located between the support base plate and the support cover shell and is fixed to the bottom of the support base plate by connecting bolts. The avoidance notch corresponds to the position of the guide slide rail and is parallel to each other.

4. The wafer pushing mechanism for photolithography equipment according to claim 3, characterized in that: The guide bracket assembly includes: A guide seat block, which is mounted on the guide rail and can move along the guide rail; The supporting horizontal plate is in the shape of a long strip and extends along the length direction of the guide rail, the inner end of which is connected to the guide seat block through a connecting bolt, and the outer end of which extends to the bottom of the avoidance notch; The supporting vertical plate is installed on the outer end of the supporting horizontal plate through connecting bolts and extends above the supporting horizontal plate, and the top of the supporting vertical plate is exposed from the avoidance notch.

5. The wafer pushing mechanism for photolithography equipment according to claim 4, characterized in that: The push operation components include: A push beam, which is located above the support base plate and is installed on the top of the supporting plate through connecting bolts; The operating handle is formed by bending a rod and is installed on the push beam through connecting bolts. The operating handle can apply thrust to the push beam.

6. The wafer pushing mechanism for photolithography equipment according to claim 2, characterized in that: The box limit assembly includes: The edge limit blocks are provided with two groups, each group of edge limit blocks is respectively installed on the top edge of the support base plate, and are arranged in sequence along the length direction of the avoidance notch, and are adapted to the edge shapes of the discharge wafer box and the feed wafer box, and the edges of the discharge wafer box and the feed wafer box are positioned by the positioning horizontal block; The bottom stopper is provided with two groups, each group of bottom stopper is respectively installed on the top of the support base plate and is located between the side stopper blocks, which are arranged in sequence along the length direction of the avoidance notch and are adapted to the bottom shape of the discharge wafer box and the feed wafer box. The bottom stopper is used to position the bottom of the wafer assembly so that the discharge wafer box and the feed wafer box are kept fixed on the support base plate; The height adjustment block is provided with two groups, and each group of height adjustment blocks is installed in the supporting seat plate through adjusting bolts, and the height can be adjusted in the supporting seat plate. It corresponds to the position of the side limit block and the bottom limit block, and abuts against the bottom of the discharge wafer box and the feed wafer box, so the height of the discharge wafer box and the feed wafer box can be adjusted.

7. A wafer pushing mechanism for a photolithography device according to claim 4 or 6, characterized in that: The wafer push assembly includes: A push plate, which is located above the support base plate, has its inner end connected to the top of the support plate by connecting bolts, and its outer end extends toward the side limit block and the bottom limit block, and can move with the support plate; The sliding vertical plate is installed on the outer end of the sliding horizontal plate through connecting bolts and extends above the sliding horizontal plate. It can move together with the sliding horizontal plate. Its width is smaller than the width of the openings of the unloading wafer box and the feeding wafer box. When it moves, it can drive the wafers in the unloading wafer box to move as a whole into the feeding wafer box.

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