Connecting device and connecting equipment

Abstract

The utility model relates to the technical field of connector production and manufacturing, in particular to a connecting device and connecting equipment. The grounding hole is formed in the radial direction of the first connecting hole, when the connector and the circuit board are welded, the welding part extends into the grounding hole in the radial direction, the grounding hole is a via hole, a pin is not inserted into the via hole, and the welding part has better tin penetration capability in the grounding hole, so that the welding part can permeate into a grounding layer closer to the main body, and the welding part is prevented from penetrating into the grounding layer. The connector pin is connected with the grounding layer, close to the main body, in the circuit board, so that the grounding effect is improved, the grounding impedance is reduced, and the EMC performance is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of production and manufacture of connectors, in particular to a connecting device and connecting equipment. Background Art

[0002] With the continuous development of communication technology, the data transmission rate is also increasing. As a bridge for high-speed signal transmission, high-speed connectors ensure the stable and reliable transmission of high-speed signals. In automotive electronics, consumer electronics and other products, high-speed connectors are used to connect screens, cameras, sensors and other devices.

[0003] In the prior art, the material of the grounding layer of the circuit board is copper. When the connector and the circuit board are soldered, the solder does not penetrate deeply enough into the circuit board due to the fast heat dissipation of the grounding layer in the circuit board. Generally, the solder can only penetrate into one or two layers of the circuit board, which results in the connector pins not being connected to the remaining grounding layers, thereby reducing the EMC performance of the high-speed connector. Utility Model Content

[0004] The purpose of the present application is to provide a connection device and a connection equipment.

[0005] The present application provides a connection device, including: a circuit board, the circuit board including a plurality of grounding layers spaced apart and stacked, the circuit board forming a first connection hole and a grounding hole penetrating the grounding layer, the grounding hole being arranged in a radial direction of the first connection hole; a connector, the connector including a main body, a first pin and a welding portion, the first pin being connected to the main body, the first pin passing through the first connection hole, a welding portion connected to the first pin being formed on a side surface of the circuit board, the welding portion extending into the grounding hole in a radial direction, and the welding portion being connected to the grounding layer close to the main body.

[0006] In an exemplary embodiment of the present application, the grounding holes are arranged at intervals in the axial direction around the first connecting hole.

[0007] In an exemplary embodiment of the present application, the grounding hole includes a first grounding hole and a second grounding hole, and the hole diameter of the first grounding hole is larger than the hole diameter of the second grounding hole.

[0008] In an exemplary embodiment of the present application, a circular trajectory is defined in the radial direction of the first connecting hole, the circular trajectory and the first connecting hole have the same axis, the number of the first grounding holes is 4, the interval angle of the first grounding holes is 90 degrees, the number of the second grounding holes is 4, the interval angle of the second grounding holes is 90 degrees, the centers of the first grounding holes and the second grounding holes are both located on the circular trajectory, and the first grounding holes and the second grounding holes are staggered.

[0009] In an exemplary embodiment of the present application, a semicircular trajectory is defined in the radial direction of the first connecting hole, the semicircular trajectory has the same axis as the first connecting hole, the number of the first grounding holes is 3, the interval angle of the first grounding holes is 90 degrees, the number of the second grounding holes is 2, the interval angle of the second grounding holes is 90 degrees, the centers of the first grounding holes and the second grounding holes are both located on the semicircular trajectory, and the first grounding holes and the second grounding holes are staggered.

[0010] In an exemplary embodiment of the present application, the circuit board includes a plurality of stacked layer structures, the layer structure includes a conductive layer, an insulating layer and the ground layer, and the conductive layer, the ground layer and the insulating layer are stacked in sequence.

[0011] In an exemplary embodiment of the present application, the main body includes a plug, the first pin is arranged on the plug, and the plug is located on a side of the circuit board away from the welding portion so that the first pin passes through the first connecting hole.

[0012] In an exemplary embodiment of the present application, the connector includes a second pin arranged on the plug; the circuit board forms a second connecting hole, the second pin is arranged on the plug and passes through the second connecting hole, and the welding portion is formed on one side surface of the second pin and the circuit board.

[0013] In an exemplary embodiment of the present application, the number of the second connecting holes is four, and the second connecting holes are arranged at intervals along the first direction and the second direction to form a combination hole, and the first direction and the second direction are perpendicular to each other; the number of the first connecting holes is four, and the first connecting holes are arranged at intervals in the radial direction of the combination hole, and the interval distances between adjacent first connecting holes are the same.

[0014] The present application provides a connection device, including the connection apparatus described above.

[0015] A connection device and a connection equipment of the present application scheme have the following beneficial effects: the circuit board includes a plurality of grounding layers that are spaced and stacked, the circuit board forms a first connection hole and a grounding hole that penetrate the grounding layer, and the grounding hole is arranged in the radial direction of the first connection hole; the connector includes a main body, a first pin and a welding part, the first pin is connected to the main body, the first pin passes through the first connection hole, a welding part connected to the first pin is formed on one side of the circuit board, the welding part extends into the grounding hole in the radial direction, and the welding part is connected to the grounding layer close to the main body. The grounding hole is arranged in the radial direction of the first connection hole, and when the connector and the circuit board are welded, the welding part extends into the grounding hole in the radial direction. Since the grounding hole is a through hole, the pin is not inserted into the hole, and the welding part has a better tin penetration ability in the grounding hole, so that the welding part can penetrate into the grounding layer closer to the main body, so as to realize the connection between the connector pin and the grounding layer close to the main body in the circuit board, thereby increasing the grounding effect, reducing the grounding impedance, and improving the EMC performance.

[0016] Other features and advantages of the present application will become apparent from the following detailed description, or may be learned in part by the practice of the present application.

[0017] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present application, and together with the specification are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 It is a cross-sectional schematic diagram of a connecting device in an embodiment of the utility model;

[0020] Figure 2 This is a first structural schematic diagram of a connecting device in an embodiment of the utility model;

[0021] Figure 3 It is a second structural schematic diagram of a connecting device in an embodiment of the utility model.

[0022] Description of reference numerals:

[0023] 10. Circuit board; 11. Layer structure; 111. Ground layer; 112. Conductive layer; 113. Insulating layer; 121. First connecting hole; 122. Second connecting hole; 13. Ground hole; 131. First ground hole; 132. Second ground hole; 20. Connector; 21. Main body; 211. Plug; 22. First pin; 23. Soldering part; 24. Second pin; S1. Circular track; S2. Semicircular track. DETAILED DESCRIPTION

[0024] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be more comprehensive and complete and fully convey the concept of the example embodiments to those skilled in the art.

[0025] In addition, described feature, structure or characteristic can be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present application. However, those skilled in the art will appreciate that the technical scheme of the present application can be put into practice without one or more of the specific details, or other methods, components, devices, steps, etc. can be adopted. In other cases, known methods, devices, realizations or operations are not shown or described in detail to avoid blurring the various aspects of the application.

[0026] The present application is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the technical features involved in the various embodiments of the present application described below can be combined with each other as long as they do not conflict with each other. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be understood as limiting the present application.

[0027] It should be noted that the "multiple" mentioned in this article refers to two or more. "And / or" describes the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the associated objects before and after are in an "or" relationship.

[0028] With the continuous development of communication technology, the data transmission rate is also increasing. As a bridge for high-speed signal transmission, high-speed connectors ensure the stable and reliable transmission of high-speed signals. In automotive electronics, consumer electronics and other products, high-speed connectors are used to connect screens, cameras, sensors and other devices.

[0029] In the prior art, the material of the grounding layer of the circuit board is copper. When the connector and the circuit board are soldered, the solder does not penetrate deeply enough into the circuit board due to the fast heat dissipation of the grounding layer in the circuit board. Generally, the solder can only penetrate into one or two layers of the circuit board, which results in the connector pins not being connected to the remaining grounding layers, thereby reducing the EMC performance of the high-speed connector.

[0030] In order to solve the above technical problems, refer to Figure 1 and Figure 2 As shown, the present application provides a connection device, including a circuit board 10 and a connector 20, the connector 20 connects the circuit board 10 to achieve signal transmission. The circuit board 10 includes a plurality of grounding layers 111 spaced and stacked, the circuit board 10 forms a first connection hole 121 and a grounding hole 13 penetrating the grounding layer 111, and the grounding hole 13 is arranged in the radial direction of the first connection hole 121; the connector 20 includes a main body 21, a first pin 22 and a welding portion 23, the first pin 22 is connected to the main body 21, the first pin 22 passes through the first connection hole 121, and a welding portion 23 connected to the first pin 22 is formed on one side of the circuit board 10, the welding portion 23 extends into the first connection hole 121 and is connected to the grounding layer 111, and the welding portion 23 extends into the grounding hole 13 in the radial direction and is connected to the grounding layer 111, and along the axial direction, the connection height of the welding portion 23 in the grounding hole 13 is greater than the connection height of the welding portion 23 in the first connection hole 121. A grounding hole 13 is provided in the radial direction of the first connecting hole 121. When the connector 20 and the circuit board 10 are welded, the welding portion 23 extends into the grounding hole 13 in the radial direction. Since the grounding hole 13 is a through hole and no pin is inserted into the hole, the welding portion 23 has a better tin penetration ability in the grounding hole 13, so that the welding portion 23 can penetrate into the grounding layer 111 closer to the main body 21, so as to realize the connection between the pin of the connector 20 and the grounding layer 111 close to the main body 21 in the circuit board 10, thereby increasing the grounding effect, reducing the grounding impedance, and improving the EMC performance.

[0031] In some embodiments, the circuit board 10 may include a printed circuit board (PCB), a flexible printed circuit board (FPC), or a soft and hard combination plate (FPC). The circuit board 10 is not specifically limited here and can be selected according to actual needs.

[0032] In some embodiments, the axial direction is the same direction as the extension direction of the axis of the connecting hole, and the radial direction is a direction that diverges perpendicularly to the axial direction of the connecting hole.

[0033] In some embodiments, reference Figure 1As shown, the circuit board 10 includes a plurality of layer structures 11 stacked in layers, and the layer structure 11 includes a conductive layer 112, an insulating layer 113 and a grounding layer 111, and the conductive layer 112, the grounding layer 111, and the insulating layer 113 are stacked in sequence. The grounding layer 111 and the conductive layer 112 refer to the functional attribute layers in the printed circuit board 10, which are used to design grounding or power supply. The grounding function is also called the grounding layer 111, and the power supply function is also called the conductive layer 112. The insulating layer 113 is used to isolate the electrical signals between the adjacent conductive layers 112 and the grounding layer 111 to avoid signal interference. The circuit board can be provided with 8, 10, 12, or even 18 or more layer structures 11. The number of layers of the layer structure 11 is not specifically limited here, and can be selected according to actual needs.

[0034] In some embodiments, the material of the ground layer 111 is metal, preferably copper.

[0035] In some embodiments, the soldering portion 23 is formed by welding a tin bar on the surface of the circuit board through a soldering device, wherein the soldering process is wave soldering, which is a mature process with high stability and reliability. Since the tin bar is melted to form liquid tin, the liquid tin has fluidity and will directly penetrate into the first connection hole 121, and flow in the radial direction and penetrate into the grounding hole 13. After the liquid tin solidifies, it is connected to the grounding layer 111 in the abutment hole and forms a soldering portion 23. Other soldering methods can also be used in this application, which can be selected according to actual needs.

[0036] In some embodiments, reference Figure 1 As shown, since there is a first pin 22 in the first connection hole 121, the gap between the first pin 22 and the hole wall of the first connection hole 121 is small, and the grounding layer 111 has a strong heat dissipation capacity, which increases the solidification speed of the liquid tin, resulting in insufficient penetration of the liquid tin, and generally can only penetrate to the second layer or the third layer. When the liquid tin flows in the radial direction and penetrates into the grounding hole 13, since the grounding hole 13 is a through hole with a larger flow space in the hole, the penetration capacity of the liquid tin can be increased, thereby penetrating to the grounding layer 111 closer to the side of the main body 21.

[0037] In some embodiments, reference Figure 1 As shown, the connection height refers to the distance between the soldering start point and the maximum penetration depth of the liquid tin. The connection height in the first connection hole 121 is between the height of the 1st layer structure 11 and the height of the 3rd layer structure 11, and the connection height in the grounding hole 13 is between the height of the 6th layer structure 11 and the height of the 9th layer structure 11.

[0038] In some embodiments, reference Figure 2As shown, the grounding holes 13 are arranged at intervals in the axial direction around the first connection hole 121 to increase the penetration path of the liquid tin. The grounding holes 13 include a first grounding hole 131 and a second grounding hole 132. The aperture of the first grounding hole 131 is larger than the aperture of the second grounding hole 132. The grounding holes 13 are arranged as the first grounding holes 131 and the second grounding holes 132 with different apertures to increase the penetration amount of the liquid tin, thereby further increasing the penetration capacity of the liquid tin.

[0039] In some embodiments, reference Figure 2 As shown, a circular track S1 is defined in the radial direction of the first connection hole 121, and the circular track S1 and the first connection hole 121 have the same axis. The number of the first grounding holes 131 is 4, and the interval angle of the first grounding holes 131 is 90 degrees. The number of the second grounding holes 132 is 4, and the interval angle of the second grounding holes 132 is 90 degrees. The centers of the first grounding holes 131 and the second grounding holes 132 are both located on the circular track S1, and the first grounding holes 131 and the second grounding holes 132 are staggered. The circular track S1 is a reference track, which serves as a reference when forming the grounding hole 13. The diameter of the circular track S1 can be selected according to actual conditions. The circular track S1 and the first connection hole 121 have the same axis, that is, the circular track S1 and the first connection hole 121 are coaxially arranged, and the first grounding holes 131 and the second grounding holes 132 are arranged in an array with the circular track S1 as a reference, so that the centers of the first grounding holes 131 and the second grounding holes 132 are both located on the circular track S1.

[0040] In some embodiments, as shown in reference 3, a semicircular track S2 is defined in the radial direction of the first connection hole 121, the semicircular track S2 and the first connection hole 121 have the same axis, the number of the first grounding holes 131 is 3, the interval angle of the first grounding holes 131 is 90 degrees, the number of the second grounding holes 132 is 2, the interval angle of the second grounding holes 132 is 90 degrees, the centers of the first grounding holes 131 and the second grounding holes 132 are both located on the semicircular track S2, and the first grounding holes 131 and the second grounding holes 132 are staggered. The semicircular track S2 is also a reference track, which serves as a reference when forming the grounding hole 13, and the diameter of the semicircular track S2 can be selected according to actual conditions. The semicircular track S2 and the first connection hole 121 have the same axis, that is, the semicircular track S2 and the first connection hole 121 are coaxially arranged, and the first grounding hole 131 and the second grounding hole 132 are arranged in an array based on the semicircular track S2, so that the centers of the first grounding hole 131 and the second grounding hole 132 are both located on the semicircular track S2.

[0041] In some embodiments, reference Figure 2 and Figure 3As shown, the main body 21 includes a plug 211, a first pin 22 is arranged on the plug 211, and the plug 211 is located on the side of the circuit board 10 away from the soldering portion 23, so that the first pin 22 passes through the first connection hole 121. The connector 20 includes a second pin 24 arranged on the plug 211, and the circuit board 10 forms a second connection hole 122. The second pin 24 is arranged on the plug 211 and passes through the second connection hole 122. A soldering portion 23 is formed on one side of the second pin 24 and the circuit board 10, wherein the first pin 22 and the second pin 24 can transmit different electrical signals to increase the functional diversity of the connector 20. Further, the number of the second connection holes 122 is four, and the second connection holes 122 are arranged at intervals in the first direction and the second direction to form a combination hole, and the first direction and the second direction are perpendicular to each other; the number of the first connection holes 121 is four, and the first connection holes 121 are arranged at intervals in the radial direction of the combination hole, and the interval distance between adjacent first connection holes 121 is the same.

[0042] The present application also provides a connection device, including the above-mentioned connection device, which can increase the grounding effect, reduce the grounding impedance, and improve the EMC performance.

[0043] In this application, unless otherwise clearly specified and limited, the terms "disposed (provided with)", "connected" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0044] In the description of this specification, the description of reference terms such as "some embodiments" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment are included in at least one embodiment of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction.

[0045] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application. Therefore, any changes or modifications made in accordance with the claims and description of the present application should fall within the scope of the patent of this application.

Claims

1. A connection device, characterized in that: include: A circuit board, the circuit board comprising a plurality of grounding layers spaced apart and stacked, the circuit board forming a first connection hole and a grounding hole penetrating the grounding layer, the grounding hole being arranged in a radial direction of the first connection hole; A connector, the connector comprising a main body, a first pin and a welding portion, the first pin being connected to the main body, the first pin passing through the first connecting hole, forming the welding portion connected to the first pin on one side of the circuit board, the welding portion extending into the first connecting hole and connected to the grounding layer, and the welding portion extending into the grounding hole in a radial direction and connected to the grounding layer, and along the axial direction, the connection height of the welding portion in the grounding hole is greater than the connection height of the welding portion in the first connecting hole.

2. The connection device according to claim 1, characterized in that: The grounding holes are arranged at intervals in the axial direction around the first connecting hole.

3. The connection device according to claim 2, characterized in that: The grounding hole includes a first grounding hole and a second grounding hole, and the aperture of the first grounding hole is larger than the aperture of the second grounding hole.

4. The connection device according to claim 3, characterized in that: A circular trajectory is defined in the radial direction of the first connecting hole, the circular trajectory and the first connecting hole have the same axis, the number of the first grounding holes is 4, the interval angle of the first grounding holes is 90 degrees, the number of the second grounding holes is 4, the interval angle of the second grounding holes is 90 degrees, the centers of the first grounding holes and the second grounding holes are both located on the circular trajectory, and the first grounding holes and the second grounding holes are arranged alternately.

5. The connection device according to claim 3, characterized in that: A semicircular track is defined in the radial direction of the first connecting hole, the semicircular track and the first connecting hole have the same axis, the number of the first grounding holes is 3, the interval angle of the first grounding holes is 90 degrees, the number of the second grounding holes is 2, the interval angle of the second grounding holes is 90 degrees, the centers of the first grounding holes and the second grounding holes are both located on the semicircular track, and the first grounding holes and the second grounding holes are staggered.

6. The connection device according to claim 1, characterized in that: The circuit board includes a plurality of stacked layer structures, wherein the layer structures include a conductive layer, an insulating layer and the ground layer, and the conductive layer, the ground layer and the insulating layer are stacked in sequence.

7. The connection device according to claim 1, characterized in that: The main body comprises a plug, the first pin is arranged on the plug, and the plug is located at a side of the circuit board away from the welding portion so that the first pin passes through the first connecting hole.

8. The connection device according to claim 7, characterized in that The connector includes a second pin disposed on the plug; The circuit board forms a second connection hole, the second pin is arranged on the plug and passes through the second connection hole, and the welding portion is formed between the second pin and one side surface of the circuit board.

9. The connection device according to claim 8, characterized in that: The number of the second connection holes is four, and the second connection holes are arranged in a first direction and a second direction to form a combination hole, and the first direction and the second direction are perpendicular to each other; The number of the first connection holes is four, and the first connection holes are arranged at intervals in the radial direction of the combination hole, and the interval distances between adjacent first connection holes are the same.

10. A connection device, characterized in that: Comprising the connecting device according to any one of claims 1 to 9.

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