PCB (printed circuit board) of LED (light-emitting diode) controller

Abstract

The utility model relates to the technical field of PCB (printed circuit board) technology, in particular to an LED (light-emitting diode) controller PCB, a pin of a working heating component adopts a heat dissipation soldering tin structure, and the heat dissipation soldering tin structure is used for conducting heat of the working heating component to a heat absorption medium; the through hole bonding pad or the patch bonding pad adopts a strong adhesion soldering tin structure, and the strong adhesion soldering tin structure is used for enabling the bonding surface of soldering tin and a pin to be firm; the heat dissipation soldering tin structure and the strong adhesion soldering tin structure can be arranged at the same time; therefore, the heat dissipation efficiency is higher, and the welding of components is firmer.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB board technology, in particular to a LED controller PCB board. Background Art

[0002] LED controller is a device used to control the switch in the LED lamp circuit. It controls the LED array to emit light regularly through chip processing, thereby displaying text or graphics. As a core component, LED controller is widely used in various LED lighting, display screens and intelligent lighting control systems, playing a very important role.

[0003] According to different application fields, LED controllers can be divided into many types. For different types of LED controllers, the design requirements of their PCB boards are also different. For example, when the LED controller is required to be designed to be the smallest in size, the layout of components and circuits in the PCB board of the LED controller will become very compact, and its heat dissipation performance will be greatly reduced. In addition, the LED controller circuit integrates a switching power supply transformer, which generates more heat. This causes the PCB board of the LED controller to easily be overheated, affecting the normal operation of the circuit.

[0004] More importantly, in the process of mass production of PCB boards, components are usually inserted in batches, which will cause some pins to not align with the vias when passing through the pads of the PCB board, causing the pins to tilt or bend severely. At this time, the conventional spot welding method can easily cause the solder to fail to fully contact the pins, resulting in poor contact, affecting the normal operation of the circuit, and even requiring rework, which greatly affects production efficiency. Utility Model Content

[0005] In view of the above-mentioned defects, the purpose of the utility model is to provide an LED controller PCB board with higher heat dissipation efficiency and more secure component welding.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] An LED controller PCB board, the pins of the working heat generating components adopt a heat dissipation solder structure, and the heat dissipation solder structure is used to conduct the heat of the working heat generating components to a heat absorbing medium;

[0008] The perforated pad or the patch pad adopts a strong adhesion solder structure, and the strong adhesion solder structure is used to make the bonding surface between the solder and the pin firm;

[0009] The heat dissipation solder structure and the strong adhesion solder structure are provided at the same time.

[0010] Furthermore, the solder joints of the pins of the working heat generating components spread outward or in a direction to expand the solder surface to form the heat dissipation solder structure.

[0011] Furthermore, the strong adhesion solder structure is a multi-angle solder surface or an asymmetric solder surface.

[0012] Furthermore, the heat dissipation solder structure includes a solder point solder surface and a circuit solder surface; the solder point of the working heat generating component pin spreads and expands the solder surface in all directions to form the solder point solder surface, and the solder point solder surface directionally spreads and expands the solder surface along the circuit copper foil layer connected by the solder point of the working heat generating component pin to form the circuit solder surface.

[0013] Furthermore, the circuit solder surface includes at least one solder strip; the solder strip is connected to the solder surface of the solder point, and the solder strips are connected to each other.

[0014] Furthermore, the multi-angle solder surface covers the contact surface between the pin and the patch pad.

[0015] Furthermore, the solder point of the pin extends the solder surface toward the offset direction of the pin relative to the perforated pad to form the asymmetric solder surface.

[0016] Furthermore, the multi-angle soldering surface is a triangle, a square or a rectangle.

[0017] The technical solution provided by the utility model may include the following beneficial effects: in order to solve the heating problem of working heat-generating components, a heat-dissipating solder structure is adopted in the pin welding method thereof, and the heat of the working heat-generating components (generally chips, transformers, etc.) is transferred from the pins to the heat-dissipating solder structure by utilizing the rapid thermal conductivity characteristics of the heat-dissipating solder structure, and then the heat is dissipated through full contact between the heat-dissipating solder structure and the heat-absorbing medium (such as air, plastic sealing glue with good thermal conductivity, etc.), thereby solving the heating problem of the working heat-generating components, improving the heat dissipation efficiency of the entire PCB board, and supporting the PCB board to carry out compact circuit design (the core heat-generating components that generate heat in the circuit solve the heat dissipation problem, which is equivalent to solving the heating problem of the circuit).

[0018] In order to solve the problem of poor contact between solder and pin when the most commonly used perforated pads or surface mount pads are welded to the pins of components, a strong adhesion solder structure is adopted in the welding method. By utilizing the flow conduction characteristics of the strong adhesion solder structure, the solder is more likely to gather on the pad during welding, making the contact between the solder and the pin more complete, thereby making the joint surface of the solder and the pin more firm, solving the problem of poor contact between the solder and the pin.

[0019] More importantly, the heat dissipation solder structure and the strong adhesion solder structure can be set at the same time. The pins and pads are first welded using the strong adhesion solder structure, and then the solder is expanded into the heat dissipation solder structure based on the strong adhesion solder structure, thereby achieving the effect of firm welding and good heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of a LED controller PCB board in one embodiment of the utility model.

[0021] Among them: a heat dissipation solder structure 1, a strong adhesion solder structure 2, a multi-angle solder surface 21, an asymmetric solder surface 22, a solder point solder surface 11, a circuit solder surface 12, and a solder strip 121. DETAILED DESCRIPTION

[0022] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0023] In the description of the embodiments of the present invention, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0024] In the description of the embodiments of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0025] Combine the following Figure 1 , describing an LED controller PCB board of an embodiment of the utility model.

[0026] A PCB board of an LED controller, the pins of a working heat generating component adopt a heat dissipation solder structure 1, and the heat dissipation solder structure 1 is used to transfer the heat of the working heat generating component to a heat absorbing medium;

[0027] The perforated pad or the patch pad adopts a strong adhesion solder structure 2, and the strong adhesion solder structure 2 is used to make the bonding surface between the solder and the pin firm;

[0028] The heat dissipation solder structure 1 and the strong adhesion solder structure 2 are provided at the same time.

[0029] The utility model proposes a preferred embodiment of a LED controller PCB board, such as Figure 1 As shown, in order to solve the heating problem of the working heat-generating components, a heat-dissipating solder structure 1 is adopted in the pin welding method thereof, and the heat of the working heat-generating components (generally chips, transformers, etc.) is transferred from the pins to the heat-dissipating solder structure 1 by utilizing the rapid thermal conductivity of the heat-dissipating solder structure 1, and then the heat is dissipated through full contact between the heat-dissipating solder structure 1 and the heat-absorbing medium (such as air, plastic sealing adhesive with good thermal conductivity, etc.), thereby solving the heating problem of the working heat-generating components, improving the heat dissipation efficiency of the entire PCB board, and supporting the PCB board to carry out compact circuit design (the core heat-generating components that generate heat in the circuit solve the heat dissipation problem, which is equivalent to solving the heating problem of the circuit).

[0030] In order to solve the problem of poor contact between solder and pin when the most commonly used perforated pads or surface mount pads are welded to the pins of components, a strong adhesion solder structure 2 is adopted in the welding method. By utilizing the flow conduction characteristics of the strong adhesion solder structure 2 for solder, the solder is more likely to gather on the pad during welding, so that the contact between the solder and the pin is more complete, thereby making the joint surface of the solder and the pin more firm, solving the problem of poor contact between the solder and the pin.

[0031] More importantly, the heat dissipation solder structure 1 and the strong adhesion solder structure 2 are set selectively or simultaneously, and the pins and pads are first welded using the strong adhesion solder structure 2, and then the solder is expanded to form the heat dissipation solder structure 1 based on the strong adhesion solder structure 2, thereby achieving the effects of firm welding and good heat dissipation performance.

[0032] Furthermore, the solder joints of the pins of the working heat generating components spread outward or in a direction to expand the solder surface to form a heat dissipation solder structure 1.

[0033] In this embodiment, in order to form the rapid thermal conductivity characteristics of the heat dissipation solder structure 1, the solder surface is expanded from the solder points of the pins of the working heat-generating components to the surrounding or directional large areas, thereby expanding the contact area between the solder and the heat-absorbing medium, so that the heat absorbed by the solder from the working heat-generating components can be dissipated by expanding the contact area with the heat-absorbing medium, thereby making the heat dissipation solder structure 1 have rapid thermal conductivity characteristics.

[0034] Furthermore, the strong adhesion solder structure 2 is a multi-angle solder surface 21 or an asymmetric solder surface 22 .

[0035] In this embodiment, in order to make the strong adhesion solder structure 2 have the effect of accumulating solder, the strong adhesion solder structure 2 is set to a multi-angle solder surface 21 or an asymmetric solder surface 22, wherein the multi-angle solder surface 21 is aimed at the tin on the patch pad, and compared with the conventional circular solder surface, its edges are more likely to guide the solder, so that the solder can reflux in the pad to fully wrap the pin placed on the patch pad; and the asymmetric solder surface 22 is aimed at the perforated pad. Compared with the conventional circular solder surface, the asymmetric solder surface 22 formed in the offset direction of the corresponding pin after passing through the solder hole can increase the contact area between the offset pin and the solder, thereby avoiding poor contact due to tilting or bending of the pin.

[0036] Furthermore, the heat dissipation solder structure 1 includes a solder point solder surface 11 and a circuit solder surface 12; the solder points of the working heat generating component pins spread and expand the solder surface to form the solder point solder surface 11, and the solder point solder surface 11 directionally spreads and expands the solder surface along the circuit copper foil layer connected by the solder points of the working heat generating component pins to form the circuit solder surface 12.

[0037] In this embodiment, the solder surface expansion feature of the heat dissipation solder structure 1 is mainly composed of a solder point solder surface 11 and a circuit solder surface 12; the available space around the solder point of the working heat generating component pin is used to add a copper foil layer, and the solder surface is spread and expanded as much as possible to form the solder point solder surface 11, so that the heat conducted from the solder point can be dispersed to the surroundings by the shortest path; on this basis, it is also necessary to expand the solder surface as much as possible to contact the heat absorbing medium to achieve the purpose of heat dissipation, but at this time there is no available space around the solder point for adding a copper foil layer, so the solder point solder surface 11 can use the circuit copper foil layer connected to the solder point to directionally spread and expand the solder surface to form the circuit solder surface 12 for expanding the heat dissipation area and improving the heat dissipation efficiency.

[0038] Furthermore, the circuit solder surface 12 includes at least one solder strip 121 ; the solder strip 121 is connected to the solder point solder surface 11 , and the solder strips 121 are connected to each other.

[0039] In this embodiment, since the circuit solder surface 12 is arranged along the circuit copper foil layer, the field performance is composed of at least one solder strip 121. When the line width of the circuit copper foil layer is relatively large (such as the ground line), a heat dissipation network can be formed by multiple solder strips 121. Therefore, the solder strips 121 are connected to the solder surface 11 of the solder point, and the solder strips 121 can be connected to each other, that is, the connection method between the solder strips 121 is not limited, and ultimately they can be connected to the solder surface 11 of the solder point for heat conduction.

[0040] Furthermore, the multi-angle solder surface 21 covers the contact surface between the lead and the SMD pad.

[0041] In this embodiment, when the multi-angle solder surface 21 is designed into a multi-angle shape, although the solder accumulation effect is enhanced, it is still necessary to cover the contact surface of the lead and the patch pad to make the bonding surface more firm.

[0042] Furthermore, the solder point of the pin extends the solder surface in the offset direction of the pin relative to the through-hole pad to form an asymmetric solder surface 22 .

[0043] In this embodiment, because the asymmetric solder surface 22 is designed to increase the contact area of ​​the tilted or bent pins, it is necessary to extend the solder surface from the solder point of the pin to the offset direction of the pin relative to the perforated pad to form the asymmetric solder surface 22, so that tin can be applied along the offset direction of the pin to increase the contact area.

[0044] Furthermore, the multi-angle soldering surface 21 is in the shape of a triangle, a square or a rectangle.

[0045] In this embodiment, the multi-angle solder surface 21 is welded into a triangle, square or rectangle according to the pin distribution method and component shape of different SMD components. For example, when the SMD component is a chip, its pins are arranged on both sides, and the middle between the two rows of pins is covered by the chip. Therefore, the multi-angle solder surface 21 is preferably square or rectangular for easier operation and improved welding efficiency.

[0046] Other structures and operations of a LED controller PCB board according to an embodiment of the utility model are known to ordinary technicians in the field and will not be described in detail here.

[0047] In the description of this specification, the description with reference to the terms "embodiment", "example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0048] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A LED controller PCB board, characterized in that: The pins of the working heat generating components adopt a heat dissipation solder structure, and the heat dissipation solder structure is used to transfer the heat of the working heat generating components to the heat absorbing medium; The perforated pad or the patch pad adopts a strong adhesion solder structure, and the strong adhesion solder structure is used to make the bonding surface between the solder and the pin firm; The heat dissipation solder structure and the strong adhesion solder structure are provided at the same time; The solder points of the pins of the working heat generating components spread outward or in a directional manner to expand the solder surface to form the heat dissipation solder structure; The heat dissipation solder structure includes a solder point solder surface and a circuit solder surface; the solder point of the working heat generating component pin spreads and expands the solder surface in all directions to form the solder point solder surface, and the solder point solder surface directionally spreads and expands the solder surface along the circuit copper foil layer connected by the solder point of the working heat generating component pin to form the circuit solder surface.

2. The LED controller PCB board according to claim 1, characterized in that: The strong adhesion solder structure is a multi-angle solder surface or an asymmetric solder surface.

3. The LED controller PCB board according to claim 1, characterized in that: The circuit solder surface includes at least one solder strip; the solder strip is connected to the solder surface of the solder point, and the solder strips are connected to each other.

4. The LED controller PCB board according to claim 2, characterized in that: The multi-angle solder surface covers the contact surface between the pin and the patch pad.

5. The LED controller PCB board according to claim 2, characterized in that: The solder point of the pin extends the solder surface toward the biased direction of the pin relative to the through-hole pad to form the asymmetric solder surface.

6. The LED controller PCB board according to claim 4, characterized in that: The multi-angle soldering surface is triangular, square or rectangular.

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