Mixed-voltage high-frequency double-layer circuit board with heat insulation structure

Abstract

The utility model discloses a mixed-voltage high-frequency double-layer circuit board with a heat insulation structure, which comprises a first heat insulation plate and a second heat insulation plate which are fixedly connected through two elastic telescopic rods. An upper circuit board and a lower circuit board are fixedly mounted in the first heat insulation plate and the second heat insulation plate through four insulation rods respectively, and heat dissipation fins are fixedly connected to the opposite sides of the upper circuit board and the lower circuit board. According to the utility model, the design is relatively simple, the simple structure enables the manufacture, the assembly and the maintenance to be easier, and meanwhile, the cost is also reduced; when the heat insulation structure is disassembled and assembled, only the heat insulation plate needs to be pressed downwards and pulled out, and due to the design, the circuit board is very convenient to replace and maintain; the heat dissipation fins are designed on the outer side, heat can be effectively conducted out and dissipated to the external environment, meanwhile, the heat insulation effect is further enhanced through the design of the heat insulation clamping plates, and stable operation of the circuit board is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a mixed-pressure high-frequency double-layer circuit board with a heat insulation structure. Background Art

[0002] Double-layer circuit board refers to a circuit board with copper on both sides and metalized holes. In other words, it has copper on both sides. Because the area of ​​double-sided board is twice that of single-sided board, it is not only convenient and simple in wiring, but also has less labor intensity in wiring and shorter in wiring length. Double-sided board solves the difficulty of wiring interlacing in single-sided board, and it is more suitable for use in more complex circuits than single-sided board.

[0003] The Chinese patent application number 202222895312.6 discloses a hybrid high-frequency double-layer circuit board with a heat insulation structure, which solves the problem that the circuit board body works in a hot environment for a long time, which will cause the silicone on the surface of the circuit board body to debond and the heat to affect the circuit board. However, it has the following problems:

[0004] 1. Assembly and disassembly difficulty: As its design is more complex, the assembly and disassembly process may be more difficult;

[0005] 2. The cumbersomeness of adjustment: The heat insulation effect needs to be adjusted by adjusting the bolt 507. This requires additional operating steps and may require special tools. Utility Model Content

[0006] The purpose of the utility model is to provide a hybrid high-frequency double-layer circuit board with a heat insulation structure to solve the problems raised in the above background technology.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a hybrid high-frequency double-layer circuit board with a heat insulation structure, comprising a first heat insulation board and a second heat insulation board, the first heat insulation board and the second heat insulation board are fixedly connected by two elastic telescopic rods, and the first heat insulation board and the second heat insulation board are respectively fixedly installed with an upper circuit board and a lower circuit board by four insulating rods, the upper circuit board and the lower circuit board are fixedly connected to the opposite sides thereof with heat dissipation fins, and the opposite sides of the two heat dissipation fins respectively penetrate to the outside of the first heat insulation board and the second heat insulation board, the top of the upper circuit board and the bottom of the lower circuit board are respectively provided with an upper heat insulation clamping plate and a lower heat insulation clamping plate, the left end of the top of the lower heat insulation clamping plate is fixedly connected with a side plate, and the right ends of the upper heat insulation clamping plate and the lower heat insulation clamping plate are provided with clamping columns.

[0008] Compared with the prior art, the beneficial effects of the utility model are:

[0009] The utility model is relatively simple in design, and this concise structure makes manufacturing, assembly and maintenance easier, while also reducing costs;

[0010] The heat insulation structure of the utility model only needs to press down the heat insulation board and pull it out when disassembling and assembling. This design makes the replacement and maintenance of the circuit board very convenient.

[0011] The heat dissipation fins in the utility model are designed on the outside, which can effectively export the heat and dissipate it to the external environment. At the same time, the design of the heat insulation clamp further enhances the heat insulation effect and ensures the stable operation of the circuit board.

[0012] The utility model occupies little space and has a relatively compact structure, which is an important advantage in application scenarios with limited space. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the utility model;

[0014] Figure 2 It is a three-dimensional diagram of the lower heat-insulating splint, the upper heat-insulating splint and the side panels of the utility model;

[0015] Figure 3 It is a left side schematic diagram of the utility model;

[0016] Figure 4 It is a left view of the first heat insulation board, the second heat insulation board and the elastic telescopic rod of the utility model.

[0017] In the figure: 1. first heat insulation board; 2. second heat insulation board; 3. elastic telescopic rod; 4. upper circuit board; 5. lower circuit board; 6. heat dissipation fins; 7. lower heat insulation clamping plate; 8. upper heat insulation clamping plate; 9. side plate; 10. tightening bolts; 11. rectangular receiving block; 12. clamping column; 13. threaded hole; 14. clamping slot; 15. mounting hole. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] See also Figure 1-4The utility model provides a technical solution: a hybrid high-frequency double-layer circuit board with a heat insulation structure, comprising a first heat insulation board 1 and a second heat insulation board 2, the first heat insulation board 1 and the second heat insulation board 2 are fixedly connected by two elastic telescopic rods 3, and the first heat insulation board 1 and the second heat insulation board 2 are respectively fixedly installed with an upper circuit board 4 and a lower circuit board 5 by four insulating rods, the upper circuit board 4 and the lower circuit board 5 are fixedly connected to the opposite sides thereof with heat dissipation fins 6, and the opposite sides of the two heat dissipation fins 6 respectively penetrate to the outside of the first heat insulation board 1 and the second heat insulation board 2, the top of the upper circuit board 4 and the bottom of the lower circuit board 5 are respectively provided with an upper heat insulation clamping plate 8 and a lower heat insulation clamping plate 7, the left end of the top of the lower heat insulation clamping plate 7 is fixedly connected with a side plate 9, and the right ends of the upper heat insulation clamping plate 8 and the lower heat insulation clamping plate 7 are provided with a clamping column 12.

[0020] The top of the first heat insulation board 1 and the bottom of the second heat insulation board 2 are both provided with through grooves, and the area of ​​the through grooves is slightly larger than the area of ​​the upper circuit board 4. The through grooves are designed to facilitate the disassembly and assembly of the circuit boards.

[0021] The first heat insulation board 1 and the second heat insulation board 2 have opposite sides formed with slots matching the heat dissipation fins 6 . The heat dissipation fins 6 are located outside the partitions for better heat dissipation.

[0022] A rectangular receiving block 11 is fixedly connected to the middle position of the top right end of the first insulation board 1 and the middle position of the bottom right end of the second insulation board 2. The right end of the clamping column 12 is fixedly connected to the rectangular receiving block 11. The right ends of the upper insulation splint 8 and the lower insulation splint 7 are provided with a clamping groove 14 matching the clamping column 12. The clamping column 12 can limit and fix the upper insulation splint 8.

[0023] The upper heat-insulating clamping plate 8 is fixedly connected to the side plate 9 by tightening bolts 10 . The provision of the tightening bolts 10 can facilitate the disassembly and assembly of the upper heat-insulating clamping plate 8 .

[0024] The upper heat-insulating clamping plate 8 is provided with threaded holes 13 matching with the tightening bolts 10 .

[0025] Two mounting holes 15 are provided on the left side of the side plate 9, and the mounting holes 15 are provided to fix the entire device.

[0026] When in use, first press down the first heat insulation board 1 to make the elastic telescopic rod 3 in a compressed state. Figure 1 As described above, at this time, the first insulation board 1 is inserted between the upper insulation clamping board 8 and the lower insulation clamping board 7, and the clamping grooves 14 at the right ends of the upper insulation clamping board 8 and the lower insulation clamping board 7 are aligned with the clamping columns 12 and clamped.

[0027] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0028] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A hybrid high-frequency double-layer circuit board with a heat insulation structure, comprising a first heat insulation board (1) and a second heat insulation board (2), characterized in that: The first heat insulation board (1) and the second heat insulation board (2) are fixedly connected by two elastic telescopic rods (3), and an upper circuit board (4) and a lower circuit board (5) are respectively fixedly installed in the first heat insulation board (1) and the second heat insulation board (2) by four insulating rods, and the upper circuit board (4) and the lower circuit board (5) are fixedly connected to the opposite sides of the upper circuit board (4) and the lower circuit board (5) with heat dissipation fins (6), and the opposite sides of the two heat dissipation fins (6) respectively penetrate to the outside of the upper circuit board (4) and the lower circuit board (5), and the top of the upper circuit board (4) and the bottom of the lower circuit board (5) are respectively provided with an upper heat insulation clamping plate (8) and a lower heat insulation clamping plate (7), and the left end of the top of the lower heat insulation clamping plate (7) is fixedly connected with a side plate (9), and the right ends of the upper heat insulation clamping plate (8) and the lower heat insulation clamping plate (7) are provided with clamping columns (12).

2. A hybrid high-frequency double-layer circuit board with a heat insulation structure according to claim 1, characterized in that: The top of the first heat insulation board (1) and the bottom of the second heat insulation board (2) are both provided with through grooves, and the area of ​​the through grooves is slightly larger than the area of ​​the upper circuit board (4).

3. The hybrid high-frequency double-layer circuit board with a heat insulation structure according to claim 1, characterized in that: The first heat insulation board (1) and the second heat insulation board (2) are both provided with grooves matching the heat dissipation fins (6) on opposite sides.

4. The hybrid high-frequency double-layer circuit board with a heat insulation structure according to claim 1, characterized in that: A rectangular receiving block (11) is fixedly connected to the middle position of the top right end of the first thermal insulation board (1) and the middle position of the bottom right end of the second thermal insulation board (2); the right end of the clamping column (12) is fixedly connected to the rectangular receiving block (11); and the right ends of the upper thermal insulation clamping plate (8) and the lower thermal insulation clamping plate (7) are provided with a clamping groove (14) matching the clamping column (12).

5. The hybrid high-frequency double-layer circuit board with a heat insulation structure according to claim 1, characterized in that: The upper heat-insulating clamping plate (8) is fixedly connected to the side plate (9) by tightening bolts (10).

6. The hybrid high-frequency double-layer circuit board with a heat insulation structure according to claim 1, characterized in that: The upper heat-insulating clamping plate (8) is provided with a threaded hole (13) matching the tightening bolt (10).

7. The hybrid high-frequency double-layer circuit board with a heat insulation structure according to claim 1, characterized in that: Two mounting holes (15) are provided on the left side of the side plate (9).

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