High-temperature-resistant circuit board

Abstract

The utility model discloses a high temperature resistant circuit board, comprising a main board on which a plurality of circuit elements and a plurality of interface elements are installed; the upper heat dissipation aluminum alloy plate is arranged on the mainboard and is positioned on one side of the circuit element; the heat conduction module is arranged on the side, facing the mainboard, of the upper heat dissipation aluminum alloy plate, and the heat conduction module makes contact with the corresponding circuit element and conducts heat generated by the circuit element to the upper heat dissipation aluminum alloy plate for heat dissipation; and the lower heat dissipation aluminum alloy plate is arranged on one side, far away from the circuit element, of the mainboard and is used for absorbing heat generated by the mainboard and conducting the heat to an external space. The structure is simple, the mainboard, the circuit element and the interface element are cooled by arranging the upper heat dissipation aluminum alloy plate and the lower heat dissipation aluminum alloy plate, the upper heat dissipation aluminum alloy plate and the circuit element are directly communicated by arranging the heat conduction module, heat generated by the circuit element is conveniently and directly conducted to the upper heat dissipation aluminum alloy plate for heat dissipation, and the heat dissipation efficiency is improved. And the heat dissipation effect is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a high temperature resistant circuit board. Background Art

[0002] A circuit board usually has multiple different circuit components installed on it to meet its performance requirements, such as a computer motherboard. Most of the existing motherboard heat dissipation designs use cooling fans for heat dissipation. However, existing cooling fans are large in size, easy to damage, and prone to waste heat accumulation, which is very inconvenient. Summary of the invention

[0003] In order to overcome the deficiencies of the prior art, the utility model provides a high temperature resistant circuit board.

[0004] The technical solution adopted by the utility model to solve its technical problems is:

[0005] A high temperature resistant circuit board, comprising:

[0006] a main board on which a plurality of circuit elements and a plurality of interface elements are mounted;

[0007] An upper heat dissipation aluminum alloy plate is installed on the main board and located on one side of the circuit element;

[0008] A heat conduction module is provided on the side of the upper heat dissipation aluminum alloy plate facing the main board, the heat conduction module contacts the corresponding circuit element and conducts the heat generated by the circuit element to the upper heat dissipation aluminum alloy plate for heat dissipation;

[0009] The lower heat dissipation aluminum alloy plate is installed on the mainboard at a side away from the circuit elements, and is used to absorb the heat generated by the mainboard and conduct it to the external space.

[0010] In the high temperature resistant circuit board as described above, the heat conduction module comprises a plurality of heat conduction protrusions and a plurality of heat conduction grooves arranged on the upper heat dissipation aluminum alloy plate, and the heat conduction protrusions and the heat conduction grooves can be respectively attached to or inserted into corresponding circuit elements.

[0011] In the high temperature resistant circuit board as described above, the heat conductive protrusion is an aluminum alloy block protruding on the upper heat dissipation aluminum alloy plate.

[0012] In the high temperature resistant circuit board as described above, the upper heat dissipation aluminum alloy plate and the heat conduction module are integrally arranged.

[0013] In the high temperature resistant circuit board as described above, the peripheral sides of the upper heat dissipation aluminum alloy plate and the lower heat dissipation aluminum alloy plate are respectively provided with mounting screw holes for connecting with the mainboard.

[0014] In the high temperature resistant circuit board as described above, the main board is further provided with connection holes which can be matched with the mounting screw holes.

[0015] In the high temperature resistant circuit board as described above, the upper heat dissipation aluminum alloy plate is also provided with a plurality of notches capable of correspondingly exposing the interface components.

[0016] In the high temperature resistant circuit board as described above, both sides of the upper heat dissipation aluminum alloy plate are detachably provided with protective columns capable of shielding the two side walls of the main board.

[0017] In the high temperature resistant circuit board as described above, the material of the upper heat dissipation aluminum alloy plate and the lower heat dissipation aluminum alloy plate are both one of aluminum oxide, copper aluminum alloy and magnesium aluminum alloy.

[0018] In the high temperature resistant circuit board as described above, the material of the protection column is one of aluminum oxide, copper-aluminum alloy and magnesium-aluminum alloy.

[0019] The beneficial effects of the utility model are as follows: the utility model has a simple structure, and by arranging an upper heat dissipation aluminum alloy plate and a lower heat dissipation aluminum alloy plate, heat is dissipated for the mainboard, circuit components and interface components at the same time. The upper heat dissipation aluminum alloy plate and the circuit components are directly connected by arranging a heat conduction module, so that the heat generated by the circuit components can be directly conducted to the upper heat dissipation aluminum alloy plate for heat dissipation. The overall volume is greatly reduced and the heat dissipation effect is greatly improved, which is practical and convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 It is a structural schematic diagram of a high temperature resistant circuit board according to an embodiment of the utility model.

[0022] Figure 2 This is a structural exploded view of a high temperature resistant circuit board according to an embodiment of the utility model.

[0023] Figure 3 It is a structural schematic diagram of the upper heat dissipation aluminum alloy plate described in an embodiment of the utility model. DETAILED DESCRIPTION

[0024] The technical solution of the utility model is described in detail below in conjunction with the accompanying drawings and embodiments.

[0025] See also Figures 1 to 3 As shown, the embodiment of the present application provides a high temperature resistant circuit board, including:

[0026] A main board 1 on which a plurality of circuit elements 100 and a plurality of interface elements 101 are mounted;

[0027] An upper heat dissipation aluminum alloy plate 2 is installed on the main board 1 and located on one side of the circuit element 100;

[0028] A heat conduction module 3 is provided on the side of the upper heat dissipation aluminum alloy plate 2 facing the main board 1, and the heat conduction module 3 contacts the corresponding circuit element 100 and conducts the heat generated by the circuit element 100 to the upper heat dissipation aluminum alloy plate 2 for heat dissipation;

[0029] The lower heat dissipation aluminum alloy plate 4 is installed on the mainboard 1 at a side away from the circuit element 100, and is used to absorb the heat generated by the mainboard 1 and conduct it to the external space.

[0030] By providing an upper heat dissipation aluminum alloy plate 2 and a lower heat dissipation aluminum alloy plate 4, heat is dissipated for the mainboard 1, the circuit element 100, and the interface element 101 at the same time. By providing a heat conduction module 3 to directly connect the upper heat dissipation aluminum alloy plate 2 and the circuit element 100, the heat generated by the circuit element can be directly conducted to the upper heat dissipation aluminum alloy plate 2 for heat dissipation. The overall volume is greatly reduced and the heat dissipation effect is greatly improved, which is practical and convenient.

[0031] Furthermore, the heat conduction module 3 includes a plurality of heat conduction protrusions 31 and a plurality of heat conduction grooves 32 provided on the upper heat dissipation aluminum alloy plate 2, and the heat conduction protrusions 31 and the heat conduction grooves 32 can be respectively attached to or inserted into corresponding circuit elements 100. By directly contacting the circuit elements 100 with the provided heat conduction protrusions 31 and the heat conduction grooves 32, the generated heat can be directly conducted to the upper heat dissipation aluminum alloy plate 2, the heat dissipation efficiency is greatly improved, and it is practical and convenient.

[0032] Furthermore, the heat-conducting protrusion 31 is an aluminum alloy block protruding from the upper heat-dissipating aluminum alloy plate 2. The aluminum alloy material with good heat dissipation effect is used to increase the heat dissipation efficiency, which is practical and convenient.

[0033] Specifically, the upper heat dissipating aluminum alloy plate 2 and the heat conducting module 3 are integrated, which is convenient for production and overall heat transfer.

[0034] Furthermore, mounting screw holes 5 for connecting to the main board 1 are respectively provided on the circumference of the upper heat dissipation aluminum alloy plate 2 and the circumference of the lower heat dissipation aluminum alloy plate 4. The main board 1 is also provided with connection holes 10 that can be matched with the mounting screw holes 5. The matching connection between the mounting screw holes 5 and the connection holes 10 facilitates installation.

[0035] Furthermore, the upper heat dissipating aluminum alloy plate 2 is also provided with a plurality of notches 6 for correspondingly exposing the interface elements 101 .

[0036] Furthermore, the upper heat dissipation aluminum alloy plate 2 is also provided with detachable protective columns 7 on both sides that can shield the two side walls of the main board 1. By providing the protective columns 7, together with the upper heat dissipation aluminum alloy plate 2 and the lower heat dissipation aluminum alloy plate 4, a shell structure is formed, which can not only dissipate heat for the main board 1, but also protect the main board 1, which is practical and convenient.

[0037] Specifically, the upper heat dissipation aluminum alloy plate 2 and the lower heat dissipation aluminum alloy plate 4 are made of one of aluminum oxide, copper aluminum alloy and magnesium aluminum alloy.

[0038] The material of the protection column 7 is one of aluminum oxide, copper-aluminum alloy, and magnesium-aluminum alloy.

[0039] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure made using the contents of the specification and drawings of the present invention, or directly or indirectly used in other related technical fields, is also included in the patent protection scope of the present invention.

Claims

1. A high temperature resistant circuit board, characterized in that: Included are: A main board (1) on which a plurality of circuit elements (100) and a plurality of interface elements (101) are mounted; An upper heat dissipating aluminum alloy plate (2) is mounted on the main board (1) and is located on one side of the circuit element (100); A heat conduction module (3) is arranged on the side of the upper heat dissipation aluminum alloy plate (2) facing the main board (1), the heat conduction module (3) is in contact with the corresponding circuit element (100) and conducts the heat generated by the circuit element (100) to the upper heat dissipation aluminum alloy plate (2) for heat dissipation; The lower heat dissipation aluminum alloy plate (4) is installed on a side of the mainboard (1) away from the circuit element (100) and is used to absorb the heat generated by the mainboard (1) and conduct it to the external space.

2. A high temperature resistant circuit board according to claim 1, characterized in that: The heat-conducting module (3) comprises a plurality of heat-conducting protrusions (31) and a plurality of heat-conducting grooves (32) provided on the upper heat-dissipating aluminum alloy plate (2); the heat-conducting protrusions (31) and the heat-conducting grooves (32) can be respectively attached to or inserted into corresponding circuit elements (100).

3. A high temperature resistant circuit board according to claim 2, characterized in that: The heat-conducting protrusion (31) is an aluminum alloy block protruding from the upper heat-dissipating aluminum alloy plate (2).

4. A high temperature resistant circuit board according to any one of claims 1 to 3, characterized in that: The upper heat dissipating aluminum alloy plate (2) and the heat conducting module (3) are arranged in an integrated manner.

5. The high temperature resistant circuit board according to claim 1, characterized in that: The circumferential side of the upper heat dissipation aluminum alloy plate (2) and the circumferential side of the lower heat dissipation aluminum alloy plate (4) are respectively provided with mounting screw holes (5) for connection with the main board (1).

6. A high temperature resistant circuit board according to claim 5, characterized in that: The main board (1) is also provided with a connection hole (10) that can be matched and connected with the mounting screw hole (5).

7. The high temperature resistant circuit board according to claim 1, characterized in that: The upper heat dissipating aluminum alloy plate (2) is also provided with a plurality of notches (6) capable of correspondingly exposing the interface elements (101).

8. The high temperature resistant circuit board according to claim 1, characterized in that: Protection columns (7) capable of shielding the two side walls of the main board (1) can also be detachably provided on both sides of the upper heat dissipation aluminum alloy plate (2).

9. The high temperature resistant circuit board according to claim 1, characterized in that: The material of the upper heat dissipation aluminum alloy plate (2) and the lower heat dissipation aluminum alloy plate (4) is one of aluminum oxide, copper aluminum alloy and magnesium aluminum alloy.

10. The high temperature resistant circuit board according to claim 8, characterized in that: The material of the protection column (7) is one of aluminum oxide, copper-aluminum alloy and magnesium-aluminum alloy.

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