Special LED die bonder for special substrate

Abstract

The utility model discloses a special LED die bonder for a special substrate, and relates to the die bonding equipment field, the special LED die bonder for the special substrate comprises a rack, a material supply material box module, a manipulator assembly and two sets of die bonding platforms arranged symmetrically, the material supply material box module is used for providing a substrate to be subjected to die bonding and placing the substrate after die bonding is completed; the manipulator assembly is used for transferring a substrate to be subjected to die bonding to the die bonding platform; the die bonding platform comprises a driving assembly and a clamp assembly, the driving assembly is arranged on the rack and drives the clamp assembly to move, the clamp assembly comprises a clamp bottom plate, a jig base plate and a clamp suction cup, the clamp bottom plate is connected with the driving assembly, the jig base plate is arranged on the clamp bottom plate, and the clamp suction cup is provided with a containing groove used for containing a substrate. A vacuum adsorption opening is formed in the bottom of the containing groove and used for adsorbing the substrate. The LED die bonder special for the special substrate provided by the technical scheme of the utility model can adapt to the special substrate, and can prevent the substrate from being clamped and broken.

Description

Technical Field

[0001] The utility model relates to the technical field of crystal bonding equipment, in particular to an LED crystal bonding machine dedicated to a special substrate. Background Art

[0002] A die bonder is a device that transfers the chip on the blue film to the substrate. Conventional die bonders usually use a belt conveyor to feed the substrate into the die bond platform, and then the top plate is lifted by a cylinder. The top plate and the cover plate are arranged up and down to clamp the substrate. However, some special substrates are not suitable for this feeding method, such as fragile thin glass substrates. Utility Model Content

[0003] The main purpose of the utility model is to provide a special substrate dedicated LED crystal bonding machine, aiming to provide a LED crystal bonding machine suitable for some special substrate feeding.

[0004] To achieve the above purpose, the utility model proposes a special substrate dedicated LED die bonding machine, comprising: a frame, a material feeding box module, a manipulator assembly and two sets of symmetrically arranged die bonding platforms, wherein:

[0005] The material supply box module is arranged on one side of the frame, and is used to provide substrates to be bonded and to place substrates after bonding.

[0006] The robot assembly is disposed on the frame and is used to transfer the substrate to be bonded to the bonding platform and to transfer the substrate after bonding out of the bonding platform;

[0007] The crystal bonding platform includes a driving component and a clamp component, the driving component is arranged on the frame and drives the clamp component to move, the clamp component includes a clamp base plate, a fixture pad and a clamp suction cup, the clamp base plate is connected to the driving component, the fixture pad is arranged on the clamp base plate, the clamp suction cup is arranged on the top of the fixture pad, the clamp suction cup is provided with a placement groove for accommodating the substrate, and a vacuum adsorption port is provided at the bottom of the placement groove for adsorbing the substrate.

[0008] In one embodiment, two jig pads are provided, the jig bottom plate is provided with a jig adjustment hole, and the two jig pads are connected to the jig adjustment hole.

[0009] In one embodiment, the clamp assembly further includes a positioning cylinder, two of which are provided and are respectively arranged at the bottom of the clamp suction cup, two adjacent inner walls of the placement groove form two reference surfaces, one of the positioning cylinders is arranged opposite to the other reference surface, and the positioning cylinder is used to push the substrate and make the edge of the substrate fit with the reference surface.

[0010] In one embodiment, the feeding box module includes a feeding bracket and two groups of feeding components symmetrically arranged on the feeding bracket, and the feeding components include a pushing cylinder, a linear module, a lifting platform and a substrate box, wherein the linear module is arranged on the frame and connected to the lifting platform to drive the lifting platform to move up and down, the substrate box is arranged on the lifting platform, and a plurality of substrate placement positions are arranged at intervals in the substrate box, and the substrate is placed in the substrate placement positions, and the pushing cylinder is used to push the substrate out of the substrate box.

[0011] In one embodiment, the feeding component also includes a photoelectric component and an adjustment component. The photoelectric component is used to detect whether the substrate is in place. The photoelectric component is communicated with the pushing cylinder and the linear module. The adjustment component includes a right fixed baffle and a movable baffle. The right fixed baffle is fixedly connected to the lifting platform. The lifting platform is provided with a feeding adjustment hole. The movable baffle is connected to the feeding adjustment hole. The substrate material box is arranged between the right fixed baffle and the movable baffle.

[0012] In one embodiment, the frame is further provided with two sets of symmetrically arranged substrate transfer platforms, the substrate transfer platforms include a transfer base assembly, a feed fixed side baffle, a feed adjustment side baffle and a push assembly, wherein:

[0013] The transfer base assembly includes a screw moving platform and a material box tray, a screw motor is provided at the bottom of the material box tray to drive the screw moving platform to move, the feed fixed side baffle is provided at one end of the material box tray, the feed adjustment side baffle is connected to the screw moving platform, and the push assembly is provided between the feed fixed side baffle and the feed adjustment side baffle;

[0014] The fixed side baffle and the feed adjustment side baffle are arranged opposite to each other and are respectively provided with a conveyor line body, the conveyor line body has a first conveying state for conveying unbonded substrates and a second conveying state for receiving bonded substrates, when the conveyor line body is in the first conveying state, the robot arm assembly clamps the substrate on the conveyor line body and conveys it to the bonding platform, when the conveyor line body is in the second conveying state, the pushing assembly pushes the substrate on the conveyor line body to the substrate material box.

[0015] In one embodiment, the manipulator assembly includes a transport welding column arranged on the frame and two sets of transport assemblies symmetrically arranged on the transport welding column, the transport welding column is arranged on the frame, the transport assembly includes a screw drive module, a transport slider mounting block and a transport clamp assembly, the screw drive module is connected to the transport slider mounting block and drives the transport slider mounting block to move, the transport clamp assembly is arranged on the transport slider mounting block, the clamp assembly includes a pneumatic clamp mounting seat, a clamp fixed end and a clamp movable end, the pneumatic clamp mounting seat is arranged on the transport slider mounting block, the clamp fixed end and the clamp movable end are connected to a clamp cylinder, the clamp cylinder telescopes to control the clamp fixed end and the clamp movable end to approach and move away from each other so as to clamp the substrate.

[0016] In one embodiment, the special substrate dedicated LED crystal bonding machine also includes a crystal bonding swing arm assembly, the crystal bonding swing arm assembly includes a crystal bonding column arranged on the frame and a swing arm driving motor installed on the crystal bonding column, the swing arm driving motor is connected to two swing arms and drives the swing arms to rotate, the swing arm has a crystal taking position for sucking chips and a crystal bonding position for placing chips on the substrate, the angle between the two swing arms is 180 degrees, so that when one of the two swing arms is in the crystal taking position, the other one is in the crystal bonding position, the swing arm is connected to a voice coil motor, and the voice coil motor drives the swing arm to move up and down.

[0017] In one embodiment, the special substrate dedicated LED crystal bonding machine also includes a crystal supply assembly arranged on the frame, and the crystal supply assembly includes a material box switching assembly, a crystal ring conveying assembly and a crystal ring assembly, wherein the crystal ring conveying assembly includes a clamp module and a clamp body arranged on the clamp module, the clamp module drives the clamp body to move and has a first position and a second position in the moving stroke, when the clamp body moves from the first position to the second position, the clamp body clamps the crystal ring with the chip removed from the crystal ring assembly and transfers it to the material box switching assembly, and when the clamp body moves from the second position to the first position, the clamp body clamps the crystal ring with no chip removed from the crystal ring assembly and transfers it to the crystal ring assembly.

[0018] In one embodiment, the special substrate dedicated LED die bonding machine also includes a detection component, which includes a detection base, an adjustment mechanism, a visual camera system and a brush assembly. The detection base is arranged on the frame, the adjustment mechanism is respectively connected to the detection base and the visual camera system, the visual camera system is connected to the brush assembly, the travel of the swing arm passes above the visual camera system, the visual camera system is used to detect the angle of the chip on the swing arm, and the brush assembly is used to collect chips with quality problems on the swing arm.

[0019] The technical solution of the utility model can effectively avoid damage to the substrate by using a feed box to provide the substrate to be bonded, and using a manipulator assembly to clamp the substrate and place it on a bonding platform with a vacuum adsorption port. Specifically, the fixture base plate is connected to the drive assembly, the jig pad is installed on the fixture base plate, the jig suction cup is installed on the jig pad, the substrate is placed in the placement groove on the jig suction cup, and is fixed and adsorbed through the vacuum adsorption port at the bottom of the placement groove, thereby fixing the substrate, and the drive assembly also drives the substrate to move through the fixture assembly. In this way, for special substrates such as fragile thin glass, the substrate can be prevented from being clamped and broken by adsorption fixation. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0021] Figure 1 A schematic diagram of the structure of an embodiment of a LED die-bonding machine dedicated to a special substrate provided by the utility model;

[0022] Figure 2 This is a structural schematic diagram of a feeding box module at an angle of an embodiment of a LED die-bonding machine for special substrates provided by the utility model;

[0023] Figure 3 This is a structural schematic diagram of another angle of the feeding box module of the LED die bonding machine for special substrates provided by the utility model;

[0024] Figure 4 This is a structural schematic diagram of an angle of a substrate transfer platform of an embodiment of a LED die-bonding machine for special substrates provided by the utility model;

[0025] Figure 5 This is a structural schematic diagram of another angle of the substrate transfer platform of the embodiment of the LED die-bonding machine for special substrates provided by the utility model;

[0026] Figure 6 A schematic diagram of the structure of a manipulator assembly of an embodiment of a LED die-bonding machine for special substrates provided by the utility model;

[0027] Figure 7 A schematic diagram of the structure of a die bonding platform of an embodiment of a LED die bonding machine for special substrates provided by the utility model;

[0028] Figure 8A structural schematic diagram of a die-bonding swing arm assembly of an LED die-bonding machine for special substrates provided by the utility model;

[0029] Fig. 9 A structural schematic diagram of a crystal supply assembly of an embodiment of a LED crystal bonding machine dedicated to a special substrate provided by the utility model;

[0030] Fig.10 This is a structural schematic diagram of a detection component of an embodiment of a LED die-bonding machine dedicated to a special substrate provided by the utility model.

[0031] Description of Figure Numbers:

[0032] 100, rack;

[0033] 200, feeding box module; 201, feeding bracket; 202, module mounting block; 203, linear module; 204, first detection photoelectric; 205, right fixed baffle; 206, substrate box; 207, push cylinder; 208, movable baffle; 209, box lifting platform; 210, second detection photoelectric; 211, substrate;

[0034] 300, substrate transfer platform; 301, docking platform bottom plate; 302, first docking platform vertical plate; 303, second docking platform vertical plate; 304, material box tray; 305, belt motor; 306, feed fixed side baffle; 307, push material assembly; 308, feed adjustment side baffle; 309, sensor; 310, blocking block; 311, push plate cylinder; 312, belt; 313, screw motor; 314, screw moving platform;

[0035] 400, robot assembly; 401, handling welding column; 402, handling motor; 403, handling slider mounting block; 404, up and down linear guide; 405, up and down photoelectric origin; 406, front and back photoelectric origin; 407, gripper movable end; 408, up and down photoelectric sheet; 409, front and back photoelectric sheet; 410, gripper cylinder; 411, pneumatic gripper mounting seat; 412, gripper fixed end; 413, ball screw motor; 414, handling screw; 415, front and back linear guide;

[0036] 500, crystal bonding platform; 501, crystal bonding base; 502, vertical linear motor stator; 503, vertical linear guide rail; 504, vertical linear motor mover; 505, vertical grating ruler; 506, vertical grating reading head; 507, horizontal linear motor mover; 508, horizontal linear motor stator; 509, horizontal bottom plate; 510, horizontal linear guide rail; 511, fixture bottom plate; 512, fixture suction cup; 513, positioning cylinder; 514, fixture pad; 515, horizontal grating reading head; 516, horizontal grating ruler;

[0037] 600, crystal fixing swing arm assembly; 601, crystal fixing column; 602, swing arm drive motor; 603, crystal fixing camera system; 604, crystal extraction camera system; 605, voice coil motor; 606, swing arm;

[0038] 700, crystal supply assembly; 710, material box switching assembly; 711, crystal ring material box lifting assembly; 712, crystal ring material box; 713, crystal ring; 720, crystal ring handling assembly; 721, clamp body; 722, clamp module; 730, crystal ring assembly; 731, crystal ring mounting plate; 732, top core assembly;

[0039] 800, detection component; 801, detection base; 802, Y-axis handwheel; 803, Y-axis base; 804, X-axis handwheel; 805, X-axis base; 806, visual camera system; 807, brush assembly.

[0040] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0041] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0042] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0043] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0044] In the prior art, conventional die bonders usually use a belt conveyor to feed the substrate into the die bond platform, and then the top plate is lifted by a cylinder, and the top plate and cover plate are arranged up and down to clamp the substrate. However, some special substrates are not suitable for such a feeding method, such as fragile thin glass substrates.

[0045] The utility model provides a LED crystal bonding machine dedicated to a special substrate.

[0046] See also Figure 1 and Figure 7 In one embodiment of the utility model, the LED die bonding machine dedicated to the special substrate 211 includes: a frame 100, a material feeding box module 200, a robot assembly 400 and two sets of symmetrically arranged die bonding platforms 500, wherein the material feeding box module 200 is arranged on one side of the frame 100, and is used to provide the substrate 211 to be bonded and to place the substrate 211 after the die bonding is completed; the robot assembly 400 is arranged on the frame 100, and is used to transfer the substrate 211 that is not bonded to the die bonding platform 500 and to transfer the substrate 211 that has been bonded to the die bonding platform 500. The crystal bonding platform 500 is provided. The crystal bonding platform 500 includes a driving component and a clamping component. The driving component is arranged on the frame 100 and drives the clamping component to move. The clamping component includes a clamping base plate 511, a fixture pad 514 and a clamping suction cup 512. The clamping base plate 511 is connected to the driving component. The fixture pad 514 is arranged on the clamping base plate 511. The clamping suction cup 512 is arranged on the top of the fixture pad 514. The clamping suction cup 512 is provided with a placement groove for accommodating the substrate 211. The bottom of the placement groove is provided with a vacuum adsorption port for adsorbing the substrate 211.

[0047] In this embodiment, the frame 100 is welded with carbon steel square tubes, the manipulator assembly 400 and the crystal bonding platform 500 are fixed to the frame 100 by bolts, the feeding box module 200 is located on one side of the frame 100, and is used to provide the crystal bonding platform 500 with an unbonded substrate 211 and to place the crystal bonding platform 500 with the substrate 211 after the crystal bonding is completed. In this embodiment, the substrate 211 is clamped and transferred by the manipulator assembly 400. The manipulator assembly 400 can transfer the substrate 211 by clamping and adsorption and by movement. This is not limited in this embodiment and can be selected according to actual needs.

[0048] In the crystal bonding platform 500, a placement groove is provided at the top of the fixture suction cup 512, and gaps are provided on both sides of the placement groove to facilitate the robot assembly 400 to smoothly clamp the substrate 211. The vacuum suction port at the bottom of the placement groove faces the substrate 211 and suctions it. It can be understood that the vacuum suction port is connected to a vacuum suction mechanism to fix the substrate 211 by means of vacuum negative pressure.

[0049] The crystal bonding platform 500 also includes a crystal bonding base 501 disposed on the frame 100, and the driving assembly includes a vertical linear motor, a vertical grating assembly, a transverse linear motor and a transverse grating assembly. The vertical linear motor is disposed on the crystal bonding base 501, the transverse linear motor is connected to the vertical linear motor, the vertical grating assembly is used to position the transverse linear motor in the vertical direction, the fixture assembly is disposed on the transverse linear motor, and the transverse grating assembly is used to position the fixture assembly in the transverse direction. The crystal bonding platform 500 uses a high-precision and high-acceleration linear motor as a power source, and uses a precision linear guide rail to make the mechanism more stable. Specifically, the vertical linear motor includes a vertically extending vertical linear motor stator 502 and a vertical linear motor mover 504 sliding along the vertical linear motor stator 502. A vertical linear guide rail 503 is also provided on the solid crystal platform 500. The vertical linear guide rail 503 is parallel to the vertical linear motor stator 502. The vertical linear motor mover 504 is also connected to a horizontal bottom plate 509. The horizontal bottom plate 509 slides along the vertical linear guide rail 503 through the vertical linear motor mover 504. The vertical linear guide rail 503 plays a supporting and guiding role. A vertical grating ruler 505 is parallel to the vertical linear guide rail 503. A vertical grating reading head 506 is provided on the horizontal bottom plate 509, and is used for the movement and positioning of the fixture bottom plate 511 in the vertical direction. The transverse linear motor is mounted on the transverse bottom plate 509. The transverse linear motor includes a transverse linear stator extending transversely and a transverse linear motor mover 507 sliding along the transverse linear motor stator 508. The transverse bottom plate 509 is also provided with a transverse linear guide rail 510. The transverse linear guide rail 510 is parallel to the transverse linear stator. The transverse linear motor mover 507 is connected to the fixture bottom plate 511. The fixture bottom plate 511 slides along the transverse linear guide rail 510 through the transverse linear motor mover 507. The transverse linear guide rail 510 plays a supporting and guiding role. The transverse grating ruler 516 is parallel to the transverse linear guide rail 510. The transverse grating reading head 515 is arranged on the fixture bottom plate 511, and is used for the movement and positioning of the fixture bottom plate 511 in the transverse direction.

[0050] The technical solution of the utility model can effectively avoid damage to the substrate 211 by using a feed box to provide the substrate 211 to be solidified, and by using a manipulator assembly 400 to clamp the substrate 211 and place it on a solidification platform 500 with a vacuum adsorption port. Specifically, the fixture base plate 511 is connected to the drive assembly, the fixture pad 514 is installed on the fixture base plate 511, the fixture suction cup 512 is installed on the fixture pad 514, the substrate 211 is placed in the placement groove on the fixture suction cup 512, and is fixed and adsorbed through the vacuum adsorption port at the bottom of the placement groove, thereby fixing the substrate 211, and the drive assembly also drives the substrate 211 to move through the fixture assembly. In this way, for special substrates 211 such as fragile thin glass, the substrate 211 can be prevented from being clamped and broken by adsorption fixation.

[0051] Furthermore, two jig pads 514 are provided, and the jig bottom plate 511 is provided with a jig adjustment hole, and the two jig pads 514 are connected to the jig adjustment hole.

[0052] In the specific implementation process, two fixture adjustment holes are provided on the fixture bottom plate 511, and the fixture adjustment holes are long holes, and the position of the fixture pad 514 on the fixture bottom plate 511 can be adjusted through the long holes, and the distance between the two fixture pads 514 can be adjusted, and different fixture suction cups 512 can be replaced, so that the placement slot can adapt to substrates 211 of different sizes. A certain accommodation space is formed between the two fixture pads 514 to accommodate the vacuum adsorption mechanism and the positioning cylinder 513, etc.

[0053] Furthermore, the fixture assembly also includes a positioning cylinder 513, two positioning cylinders 513 are provided, and are respectively arranged at the bottom of the fixture pad 514, and two adjacent inner walls of the placement groove form two reference surfaces. One positioning cylinder 513 is arranged opposite to a reference surface, and the positioning cylinder 513 is used to push the substrate 211 and make the edge of the substrate 211 fit with the reference surface.

[0054] In the specific implementation process, the substrate 211 is a square substrate 211, and the two adjacent inner walls of the placement groove are two reference planes, which serve as the reference positioning of the substrate 211 in the horizontal and vertical directions. The two positioning cylinders 513 are respectively located on the opposite side walls of the two reference planes. The positioning cylinders 513 are fixed on the fixture pad 514. One positioning cylinder 513 is actuated to push the substrate 211 to fit with one reference plane, and the other positioning cylinder 513 is actuated to push the substrate 211 to fit with the other reference plane, so that the substrate 211 is positioned for the second time. After positioning, the vacuum suction port on the fixture suction cup 512 adsorbs and fixes the substrate 211, and the swing arm 606 assembly performs a solid crystal operation on the substrate 211.

[0055] In one embodiment, reference Figure 2 and Figure 3 As shown, the feeding box module 200 includes a feeding bracket 201 and two groups of feeding components symmetrically arranged on the feeding bracket 201, and the feeding components include a pushing cylinder 207, a linear module 203, a lifting platform and a substrate box 206, wherein the linear module 203 is arranged on the frame 100 and connected to the lifting platform to drive the lifting platform to move up and down, the substrate box 206 is arranged on the lifting platform, and a plurality of substrate 211 placement positions are arranged at intervals in the substrate box 206, and the substrate 211 is placed in the substrate 211 placement position, and the pushing cylinder 207 is used to push the substrate 211 out of the substrate box 206.

[0056] In this embodiment, the feed bracket 201 is located on one side of the frame 100. The feed bracket 201 can be an integral structure or two sub-feed brackets 201 connected into an integral bracket, and the two sub-feed brackets 201 are arranged corresponding to two groups of feed components. In this way, one feed component can cooperate with a solid crystal platform 500 to feed materials alone.

[0057] The feeding bracket 201 is also provided with a pushing bracket, and a pushing cylinder 207 is fixed on the pushing bracket. A first detection photoelectric 204 is installed next to each pushing cylinder 207 to detect whether there is a substrate 211 at the current position. The linear module 203 is connected to the module mounting block 202, and the module mounting block 202 is also connected to the feeding bracket 201. The linear module 203 drives the material box lifting platform 209 to move up and down. Furthermore, the substrate material box 206 is also fixed on the material box lifting platform 209, thereby driving the substrate material box 206 to move up and down to smoothly complete the supply and recovery of the substrate 211. Specifically, a plurality of substrate 211 placement positions are arranged at intervals up and down in the substrate material box 206, and the substrate 211 is placed on the substrate 211 placement position. In this way, a plurality of substrates 211 spaced up and down can be placed in the substrate material box 206. The substrate material box 206 is moved up and down by the material box lifting platform 209 and the linear module 203, so that the bottom substrate 211 is opposite to the push cylinder 207. The push cylinder 207 pushes the current substrate 211 and pushes out the substrate material box 206 to enter the substrate transfer platform 300. At the same time, it should be noted that the substrate material box 206 is also used to hold the substrate 211 after the die bonding is completed. When the substrate 211 is bonded, the substrate 211 is also placed in the substrate 211 placement position in the substrate material box 206 by the robot assembly 400 or the substrate transfer platform 300.

[0058] Furthermore, the feeding component also includes a photoelectric component and an adjustment component. The photoelectric component is used to detect whether the substrate 211 is in place and the photoelectric component is communicated with the pushing cylinder 207 and the linear module 203. The adjustment component includes a right fixed baffle 205 and a movable baffle 208. The right fixed baffle 205 is fixedly connected to the lifting platform. The lifting platform is provided with a feeding adjustment hole. The movable baffle 208 is connected to the feeding adjustment hole. The substrate box 206 is arranged between the right fixed baffle 205 and the movable baffle 208.

[0059] Specifically, the photoelectric component includes a first detection photoelectric 204 and a second detection photoelectric 210. The first detection photoelectric 204 is arranged on the pusher bracket, and is used to detect the substrate 211 and whether the substrate 211 is in place. The second detection photoelectric 210 is arranged on the substrate material box 206, and is used to detect whether the substrate 211 enters the substrate material box 206. In this embodiment, the bottom substrate 211 of the substrate material box 206 is opposite to the pusher cylinder 207. After the first detection photoelectric 204 detects the substrate 211, the pusher cylinder 207 pushes out the substrate 211 of the current layer, and pushes the substrate material box 206 to the substrate transfer platform 300. After the die bonding is completed, the substrate 211 returns to the substrate material box 206 through the substrate transfer platform 300. In this process, after the second detection photoelectric 210 detects that the substrate 211 has completely entered the substrate material box 206, the first detection photoelectric 204 detects whether the substrate 211 is in place. After the detection substrate 211 is in place, the linear module 203 drives the material box lifting platform 209 to move and move to the position of the next substrate 211, repeating the above movement to successfully complete the substrate 211 and the feeding and recycling.

[0060] In addition, the fixed baffle is fixedly mounted on the material box lifting platform 209, and the feed adjustment hole is a long hole. The position of the movable baffle 208 on the material box lifting platform 209 is adjusted through the long hole to achieve compatibility with substrate material boxes 206 of different sizes.

[0061] In one embodiment, reference Figure 1 , Figure 4 and Figure 5 As shown, the frame 100 is also provided with two groups of symmetrically arranged substrate transfer platforms 300, the substrate transfer platform 300 includes a transfer base assembly, a feed fixed side baffle 306, a feed adjustment side baffle 308 and a push assembly 307, wherein the transfer base assembly includes a screw moving platform 314 and a material box tray 304, a screw motor 313 is provided at the bottom of the material box tray 304 and drives the screw moving platform 314 to move, the feed fixed side baffle 306 is provided at one end of the material box tray 304, the feed adjustment side baffle 308 is connected to the screw moving platform 314, and the push assembly 307 It is arranged between the fixed feed side baffle 306 and the feed adjustment side baffle 308; the fixed side baffle and the feed adjustment side baffle 308 are arranged relatively to each other and are respectively provided with a conveyor line body, the conveyor line body has a first conveying state for conveying the un-crystal-bonded substrate 211 and a second conveying state for receiving the crystal-bonded substrate 211. When the conveyor line body is in the first conveying state, the robot arm assembly 400 clamps the substrate 211 on the conveyor line body and conveys it to the crystal-bonding platform 500. When the conveyor line body is in the second conveying state, the pushing assembly 307 pushes the substrate 211 on the conveyor line body to the substrate material box 206.

[0062] In this embodiment, the substrate transfer platform 300 also includes a docking station bottom plate 301, which is fixedly mounted on the rack 100. The transfer base assembly also includes a first docking station upright plate 302 and a second docking station upright plate 303, both of which are provided with adjustment waist-shaped holes and are staggeredly connected by bolts passing through the adjustment waist-shaped holes. The first docking station upright plate 302 is fixed on the docking station bottom plate 301, and the second docking station upright plate 303 is connected to the material box tray 304. The height of the material box tray 304 can also be adjusted by adjusting the waist holes to meet different needs. The feed fixed side baffle 306 is fixed at one end of the material box tray 304, and the bottom of the material box tray 304 is connected to a screw motor 313, a baffle screw and a screw moving platform 314. The screw motor 313 drives the baffle screw to rotate so that the screw moving platform 314 moves along the baffle screw. The screw moving platform 314 is also connected to the feed adjustment side baffle 308, thereby adjusting the distance between the feed adjustment side baffle 308 and the feed fixed side baffle 306 to achieve compatibility with substrates 211 of different sizes.

[0063] The conveyor line includes a belt 312 and a belt motor 305, and the belt motor 305 drives the belt 312 to rotate so as to be suitable for conveying the substrate 211. A blocking block 310 and a sensor 309 are also provided on the side of the feed fixed side baffle 306 facing the feed adjustment side baffle 308, and the sensor 309 is respectively connected to the push assembly 307 and the belt motor 305. The push assembly 307 includes a push rod and a push plate cylinder 311, and the push plate cylinder 311 is connected to one end of the push rod and drives the push rod to rotate, so that the free end of the push rod is lifted to a certain angle and moves along the direction of the belt 312 under the driving action of the push plate cylinder 311. When the conveyor line is in the first conveying state, the substrate 211 that has not been bonded is pushed out from the feeding box module 200 onto the belt 312 of the conveyor line, and is transported to the position of the blocking block 310 by the belt 312. After the sensor 309 senses the substrate 211, the belt motor 305 stops, and the manipulator assembly 400 grabs the substrate 211 and places it on the bonding platform 500. After the bonding is completed, the conveyor line is converted from the first conveying state to the second conveying state. The manipulator also grabs the substrate 211 after the bonding is completed and places it on the belt 312. After the sensor 309 senses the substrate 211, the belt motor 305 rotates in the opposite direction and transports the substrate 211 toward the substrate box 206. After the second detection photoelectric 210 detects the substrate 211, the push plate cylinder 311 is activated and drives the push rod to push the substrate 211 into the substrate box 206.

[0064] In one embodiment, reference Figure 1 and Figure 6As shown, the manipulator assembly 400 includes a transport welding column 401 arranged on the frame 100 and two sets of transport components symmetrically arranged on the transport welding column 401, the transport welding column 401 is arranged on the frame 100, the transport assembly includes a screw drive module, a transport slider mounting block 403 and a transport clamping jaw assembly, the screw drive module is connected to the transport slider mounting block 403 and drives the transport slider mounting block 403 to move, the transport clamping jaw assembly is arranged on the transport slider mounting block 403, the clamping jaw assembly includes a pneumatic clamping jaw mounting seat 411, a clamping jaw fixed end 412 and a clamping jaw movable end 407, the pneumatic clamping jaw mounting seat 411 is arranged on the transport slider mounting block 403, the clamping jaw fixed end 412 and the clamping jaw movable end 407 are connected to the clamping jaw cylinder 410, the clamping jaw cylinder 410 telescopes to control the clamping jaw fixed end 412 and the clamping jaw movable end 407 to move closer and farther so as to clamp the substrate 211.

[0065] In the specific implementation process, the two sets of transport components cooperate with the corresponding die bonding platform 500 and substrate transfer platform 300 respectively. In this embodiment, the screw drive module includes a transport motor 402, a transport screw 414 and a forward and backward motion linear guide 415. Specifically, the transport motor 402 drives the transport screw 414 to rotate, thereby moving the transport slider mounting block 403, and the transport slider mounting block 403 also slides along the forward and backward motion linear guide 415. A forward and backward motion photoelectric origin 406 is also provided on one side of the forward and backward motion linear guide 415, and a forward and backward motion photoelectric sheet 409 is also provided on the transport slider mounting block 403, which cooperates with the sensing of the forward and backward motion photoelectric origin 406 to obtain the forward and backward motion origin position. The transport slider mounting block 403 is also provided with a ball screw motor 413, an up and down motion linear guide 404 and an up and down motion photoelectric origin 405. The ball screw motor 413 is driven and connected to the pneumatic clamping jaw mounting seat 411 of the clamping jaw assembly to drive the entire clamping jaw assembly to move up and down. The pneumatic clamping jaw mounting seat 411 is also provided with an up and down motion photoelectric sheet 408, and cooperates with the up and down motion photoelectric origin 405 to obtain the up and down motion origin position.

[0066] The clamp cylinder 410 is fixed on the pneumatic clamp mounting seat 411, and the clamp cylinder 410 is respectively connected to the clamp fixed end 412 and the clamp movable end 407, thereby realizing the clamp opening and closing to pick up and place the substrate 211. In this embodiment, the clamp fixed end 412 and the clamp movable end 407 are respectively connected to an adapter plate, and the adapter plate is connected to the clamp cylinder 410. Further, a waist-shaped hole is provided on the adapter plate, and the clamp fixed end 412 and the clamp movable end 407 are adjusted to be compatible with substrates 211 of different sizes by the installation position in the waist-shaped hole. In addition, a waist-shaped hole is provided on the transport slider mounting block 403, and the pneumatic clamp mounting seat 411 is installed on the transport slider mounting block 403 through the waist-shaped hole. By adjusting the installation position on the waist-shaped hole, the clamp can be aligned with the center of the substrate 211 to smoothly clamp the clamp.

[0067] In one embodiment, reference Figure 1 and Figure 8 As shown, the LED die bonding machine dedicated to the special substrate 211 also includes a die bonding swing arm assembly 600, which includes a die bonding column 601 arranged on the frame 100 and a swing arm driving motor 602 installed on the die bonding column 601, the swing arm driving motor 602 is connected to two swing arms 606 and drives the swing arms 606 to rotate, the swing arms 606 have a crystal taking position for sucking the chip and a crystal bonding position for placing the chip on the substrate 211, the angle between the two swing arms 606 is 180 degrees, so that when one of the two swing arms 606 is in the crystal taking position, the other one is in the crystal bonding position, the swing arm 606 is connected to a voice coil motor 605, and the voice coil motor 605 drives the swing arm 606 to move up and down.

[0068] In this embodiment, the crystal-fixing swing arm assembly 600 further includes a crystal-picking camera system 604 and a crystal-fixing camera system 603 installed on the crystal-fixing column 601, and are respectively located on both sides of the swing arm driving motor 602. Among them, the crystal-picking camera system 604 is located above the crystal-picking position, and is used to detect the chip position on the crystal ring 713. The crystal-fixing camera system 603 is located above the crystal-fixing position, and is used to detect the crystal-fixing position on the substrate 211, so that the swing arm 606 can smoothly pick up and fix the crystal. In the specific implementation process, a suction nozzle is provided on the swing arm 606, and the suction nozzle can rotate. The suction nozzle is used to suck the chip. The voice coil motor 605 is fixed on the fixed column and drives the swing arm 606 to descend. The swing arm 606 located at the crystal-picking position sucks the chip from the crystal ring 713, and the swing arm 606 located at the crystal-fixing position puts the chip onto the substrate 211. The swing arm driving motor 602 drives the swing arm 606 to rotate 180 degrees, so that the two swing arms 606 switch positions, and so on and so forth, to complete the crystal-picking and crystal-fixing work.

[0069] In one embodiment, reference Figure 1 and Fig. 9 As shown, the LED solid crystal machine dedicated to the special substrate 211 also includes a crystal supply component 700 arranged on the frame 100, and the crystal supply component 700 includes a material box switching component 710, a crystal ring conveying component 720 and a crystal ring component 730, wherein the crystal ring conveying component 720 includes a clamp module 722 and a clamp body 721 arranged on the clamp module 722, the clamp module 722 drives the clamp body 721 to move and has a first position and a second position in the moving stroke, when the clamp body 721 moves from the first position to the second position, the clamp body 721 clamps the crystal ring 713 with the chip removed from the crystal ring component 730 and transfers it to the material box switching component 710, and when the clamp body 721 moves from the second position to the first position, the clamp body 721 clamps the crystal ring 713 with no chip removed from the crystal ring component 730 and transfers it to the crystal ring component 730.

[0070] In this embodiment, the material box switching assembly 710 includes a crystal ring material box lifting assembly 711 and a crystal ring material box 712, and the crystal ring material box lifting assembly 711 drives the crystal ring material box 712 to rise and fall. The crystal ring material box 712 is provided with multiple storage bins spaced up and down for placing multiple crystal rings 713. The crystal ring material box lifting assembly 711 can be a cylinder drive mechanism or a motor screw mechanism, which is not limited here. It only needs to drive the crystal ring material box 712 to rise and fall. The crystal ring assembly 730 includes a crystal ring mounting plate 731 and a top core assembly 732. The crystal ring 713 is mounted on the crystal ring mounting plate 731. The top core assembly 732 is located below the crystal ring 713 and is used to pierce the blue film on the crystal ring 713 and eject the chip, so that the swing arm 606 can absorb the chip. The clamp module 722 adopts a screw slider mechanism to drive the clamp body 721 to move.

[0071] The clamp module 722 drives the clamp body 721 to move to the first position, and clamps the crystal ring 713 on the crystal ring mounting plate 731 after the crystal is taken out. The clamp module 722 drives the clamp body 721 to move to the second position, and places the crystal ring 713 in the crystal ring material box 712, completing the automatic placement of the crystal ring 713. The crystal ring material box lifting component 711 drives the crystal ring material box 712 to move up and down, moves to the first height for replacing the crystal ring 713, and the clamp module 722 drives the clamp body 721 to move to the second position, and clamps the crystal ring 713. The clamp module 722 drives the clamp body 721 to move to the first position, and places the crystal ring 713 on the crystal ring mounting plate 731, completing the automatic placement of the crystal ring 713. The crystal ring material box 712 can hold multiple purifications, and the crystal ring material box lifting component 711 drives the crystal ring material box 712 to move up and down to the corresponding height for replacing the crystal ring 713.

[0072] In the embodiments, reference Figure 1 and Fig.10 As shown, the LED die bonding machine dedicated to the special substrate 211 also includes a detection component 800, which includes a detection base 801, an adjustment mechanism, a visual camera system 806 and a brush assembly 807. The detection base 801 is arranged on the frame 100, and the adjustment mechanism is respectively connected to the detection base 801 and the visual camera system 806, the visual camera system 806 is connected to the brush assembly 807, and the travel of the swing arm 606 passes above the visual camera system 806. The visual camera system 806 is used to detect the angle of the chip on the swing arm 606, and the brush assembly 807 is used to collect chips with quality problems on the swing arm 606.

[0073] In this embodiment, the adjustment mechanism includes an X-axis handwheel 804, an X-axis base 805, a Y-axis handwheel 802 and a Y-axis base 803, wherein the Y-axis handwheel 802 is respectively connected to the detection base 801 and the Y-axis base 803, the X-axis handwheel 804 is respectively connected to the X-axis base 805 and the Y-axis base 803, and the X-axis base 805 is connected to the visual camera system 806, and then the position of the visual camera system 806 is adjusted so that its center is located within the running track of the suction nozzle on the swing arm 606. When the chip on the swing arm 606 passes through the visual camera system 806, the visual camera system 806 will detect the angle of the identification chip and feed the information back to the control system for comparison, and then the suction nozzle adjusts the chip angle to ensure the accuracy of the chip placement angle after the solid crystal. In addition, the visual camera system 806 also detects whether the chip is qualified. When it is detected that the chip has a quality problem, the brush assembly 807 will also recycle the chip on the swing arm 606.

[0074] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A special LED die bonding machine for special substrates, characterized in that: include: The machine frame, the feeding box module, the robot assembly and two sets of symmetrically arranged die bonding platforms, among which, The material supply box module is arranged on one side of the frame, and is used to provide substrates to be bonded and to place substrates after bonding. The robot assembly is disposed on the frame and is used to transfer the substrate to be bonded to the bonding platform and to transfer the substrate after bonding out of the bonding platform; The crystal bonding platform includes a driving component and a clamp component, the driving component is arranged on the frame and drives the clamp component to move, the clamp component includes a clamp base plate, a fixture pad and a clamp suction cup, the clamp base plate is connected to the driving component, the fixture pad is arranged on the clamp base plate, the clamp suction cup is arranged on the top of the fixture pad, the clamp suction cup is provided with a placement groove for accommodating the substrate, and a vacuum adsorption port is provided at the bottom of the placement groove for adsorbing the substrate.

2. The LED die bonding machine for special substrates as claimed in claim 1, characterized in that: The jig pads are provided with two, the jig bottom plate is provided with a jig adjustment hole, and the two jig pads are connected to the jig adjustment hole.

3. The LED die bonding machine for special substrates as claimed in claim 2, characterized in that: The clamp assembly also includes a positioning cylinder, two of which are provided and are respectively arranged at the bottom of the clamp suction cup, two adjacent inner walls of the placement groove form two reference surfaces, one positioning cylinder is arranged opposite to another reference surface, and the positioning cylinder is used to push the substrate and make the edge of the substrate fit with the reference surface.

4. The LED die bonding machine for special substrates as claimed in claim 1, characterized in that: The feeding box module includes a feeding bracket and two groups of feeding components symmetrically arranged on the feeding bracket, and the feeding components include a pushing cylinder, a linear module, a lifting platform and a substrate box, wherein the linear module is arranged on the frame and connected to the lifting platform to drive the lifting platform to move up and down, the substrate box is arranged on the lifting platform, and a plurality of substrate placement positions are arranged at intervals in the substrate box, and the substrate is placed in the substrate placement positions, and the pushing cylinder is used to push the substrate out of the substrate box.

5. The LED die bonding machine for special substrates as claimed in claim 4, characterized in that: The feeding component also includes a photoelectric component and an adjustment component. The photoelectric component is used to detect whether the substrate is in place. The photoelectric component is communicated with the pushing cylinder and the linear module. The adjustment component includes a right fixed baffle and a movable baffle. The right fixed baffle is fixedly connected to the lifting platform. The lifting platform is provided with a feeding adjustment hole. The movable baffle is connected to the feeding adjustment hole. The substrate material box is arranged between the right fixed baffle and the movable baffle.

6. The LED die bonding machine for special substrates as claimed in claim 4, characterized in that: The frame is also provided with two sets of symmetrically arranged substrate transfer platforms, which include a transfer base assembly, a feed fixed side baffle, a feed adjustment side baffle and a push assembly, wherein: The transfer base assembly includes a screw moving platform and a material box tray, a screw motor is provided at the bottom of the material box tray to drive the screw moving platform to move, the feed fixed side baffle is provided at one end of the material box tray, the feed adjustment side baffle is connected to the screw moving platform, and the push assembly is provided between the feed fixed side baffle and the feed adjustment side baffle; The fixed side baffle and the feed adjustment side baffle are arranged opposite to each other and are respectively provided with a conveyor line body, the conveyor line body has a first conveying state for conveying unbonded substrates and a second conveying state for receiving bonded substrates, when the conveyor line body is in the first conveying state, the robot arm assembly clamps the substrate on the conveyor line body and conveys it to the bonding platform, when the conveyor line body is in the second conveying state, the pushing assembly pushes the substrate on the conveyor line body to the substrate material box.

7. The LED die bonding machine for special substrates as claimed in claim 1, characterized in that: The manipulator assembly includes a transport welding column arranged on the frame and two sets of transport assemblies symmetrically arranged on the transport welding column, the transport welding column is arranged on the frame, the transport assembly includes a screw drive module, a transport slider mounting block and a transport clamp assembly, the screw drive module is connected to the transport slider mounting block and drives the transport slider mounting block to move, the transport clamp assembly is arranged on the transport slider mounting block, the clamp assembly includes a pneumatic clamp mounting seat, a clamp fixed end and a clamp movable end, the pneumatic clamp mounting seat is arranged on the transport slider mounting block, the clamp fixed end and the clamp movable end are connected to a clamp cylinder, the clamp cylinder telescopes to control the clamp fixed end and the clamp movable end to approach and move away from each other so as to clamp the substrate.

8. The LED die bonding machine for special substrates as claimed in claim 1, characterized in that: The special substrate dedicated LED crystal bonding machine also includes a crystal bonding swing arm assembly, and the crystal bonding swing arm assembly includes a crystal bonding column arranged on the frame and a swing arm driving motor installed on the crystal bonding column. The swing arm driving motor is connected to two swing arms and drives the swing arms to rotate. The swing arm has a crystal taking position for sucking chips and a crystal bonding position for placing chips on the substrate. The angle between the two swing arms is 180 degrees, so that when one of the two swing arms is in the crystal taking position, the other one is in the crystal bonding position. The swing arm is connected to a voice coil motor, and the voice coil motor drives the swing arm to move up and down.

9. The LED die bonding machine for special substrates as claimed in claim 1, characterized in that: The special substrate dedicated LED crystal bonding machine also includes a crystal supply assembly arranged on the frame, and the crystal supply assembly includes a material box switching assembly, a crystal ring conveying assembly and a crystal ring assembly, wherein the crystal ring conveying assembly includes a clamp module and a clamp body arranged on the clamp module, the clamp module drives the clamp body to move and has a first position and a second position in the moving stroke, when the clamp body moves from the first position to the second position, the clamp body clamps the crystal ring with the chip removed from the crystal ring assembly and transfers it to the material box switching assembly, and when the clamp body moves from the second position to the first position, the clamp body clamps the crystal ring with no chip removed from the crystal ring assembly and transfers it to the crystal ring assembly.

10. The LED die bonding machine for special substrates as claimed in claim 8, characterized in that: The special substrate dedicated LED die bonding machine also includes a detection component, which includes a detection base, an adjustment mechanism, a visual camera system and a brush assembly. The detection base is arranged on the frame, the adjustment mechanism is respectively connected to the detection base and the visual camera system, the visual camera system is connected to the brush assembly, the travel of the swing arm passes above the visual camera system, the visual camera system is used to detect the angle of the chip on the swing arm, and the brush assembly is used to collect chips with quality problems on the swing arm.

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