COB (Chip On Board) lamp strip combining glue pulling and dispensing processes

Abstract

The utility model provides a COB lamp strip combining glue pulling and dispensing processes. The COB lamp strip comprises a substrate and an LED chip. The number of the LED chips is multiple groups, the LED chips are installed on the substrate, and a part of the LED chips are provided with dispensing layers; the adhesive dispensing layer is arranged on the outer side of the LED chip, the strip-shaped adhesive pulling packaging layer is used for packaging a plurality of groups of LED chips, and the adhesive pulling packaging layer is arranged on the outer side of the LED chip or the adhesive dispensing layer, and relates to the technical field of COB lamp strips, a part of chips are selected in the lamp strip, adhesive dispensing treatment is firstly carried out on the outer surface of the LED chip, and then adhesive pulling treatment is carried out, so that the light of the part of the LED chip is different from that of other LED chips, and the adhesive pulling packaging layer is arranged on the outer side of the LED chip or the adhesive dispensing layer. Therefore, the COB lamp strip can emit light with different brightness and different colors, the applicability of the COB lamp strip is improved, and the COB lamp strip has good use prospects.

Description

Technical Field

[0001] The utility model relates to the technical field of COB light strips, in particular to a COB light strip combined with a glue drawing and dispensing process. Background Art

[0002] A light strip refers to an LED light that is welded to a copper wire or a strip of flexible circuit boards using a special processing technique and then connected to a power source to emit light. It is named a light strip because its shape when it emits light is like a light strip.

[0003] Light strips have been widely used in buildings, bridges, roads, gardens, courtyards, floors, ceilings, furniture, cars, ponds, underwater, advertisements, signs, logos and other fields for decoration or lighting. There are many types of LED chips, such as blue LED, green LED, red LED, etc. Different LED chips will emit different colors of light.

[0004] The existing patent number is CN103681643B, and the patent name is an invention patent of an LED packaging method and an LED packaging device. The patent records that the LED packaging method includes combining two or more LED chips arranged on the same substrate into a group; along the arrangement trajectory of the LED chips combined into a group, the surface of the LED chips combined into a group is continuously injected with glue in a moving manner, and after curing, a connected packaging layer is formed. The present invention solves the problems that the traditional LED packaging method requires the use of a bracket, has low packaging efficiency and poor mixing light effect through the above technical solution.

[0005] When the COB light strip recorded in the above patent is used, it uses glue to directly package the chip on the COB light strip. After packaging in this way, the entire COB light strip presents one color, which cannot meet people's requirements for light strips of multiple colors, has low applicability, and does not meet people's usage requirements. Utility Model Content

[0006] In order to overcome the existing problems, the present application provides a COB light strip combined with a glue pulling and dispensing process. Some chips are selected inside the light strip, and glue is first applied to the outer surface of the LED chip, and then glue is applied. This makes the light of this part of the LED chip passing through the glue packaging layer and the glue dispensing layer different from that of other LED chips, so that the COB light strip can emit light of different brightness and colors, thereby improving the applicability of the COB light strip and having a good prospect for use.

[0007] The technical solution adopted by the embodiment of the present application to solve the technical problem is:

[0008] A COB light strip combining a glue drawing and a glue dispensing process, comprising a substrate and an LED chip;

[0009] substrate;

[0010] LED chip, wherein the LED chip is mounted on a substrate;

[0011] Glue dispensing layer: a glue dispensing layer is provided on the upper part of some LED chips;

[0012] The strip-shaped glue encapsulation layer covers the glue dispensing layer and the remaining part of the LED chip not provided with the glue dispensing layer on the upper part.

[0013] Some chips are selected inside the COB light strip, and the outer surface of the LED chip is first treated with glue, and then the glue is pulled, so that the light of this part of the LED chip is different from that of other LED chips, so that the COB light strip can emit light of different brightness, improve the applicability of the COB light strip, and have a good prospect of use.

[0014] Preferably, the LED chips provided with the glue layer are spaced apart from the LED chips not provided with the glue layer.

[0015] The glue layer can be set on the LED chips at odd positions or even positions, or it can be set in two groups at intervals, as long as there is a certain pattern between the LED chips with glue layers and the LED chips without glue layers after setting.

[0016] Preferably, the substrate is any one of a copper substrate body or an aluminum substrate body.

[0017] Preferably, the inside of the glue-dotting layer and the glue-pulling packaging layer is doped with fluorescent powders of different colors, so as to change the color of the light passing through the glue-dotting layer and the glue-pulling packaging layer.

[0018] Preferably, the outer surface of the adhesive packaging layer may be further provided with a sleeve, and the size of the sleeve is larger than the size of the LED chip.

[0019] The advantages of the embodiments of the present application are:

[0020] 1. The utility model records a COB light strip combined with a glue drawing and glue dispensing process. Part of the LED chips are selected inside the light strip, and glue dispensing is first performed on the outer surface of the LED chips, and then glue drawing is performed, so that the light of this part of the LED chips passing through the glue drawing packaging layer and the glue dispensing layer is different from that of other LED chips, so that the COB light strip can emit light of different brightness and different colors, thereby improving the applicability of the COB light strip and having a good prospect of use;

[0021] 2. The utility model records a COB light strip that combines the glue drawing and glue dispensing processes. The light strip substrate is made of aluminum and copper substrates, both of which have good heat dissipation performance and excellent mechanical strength. It can withstand greater pressure and vibration and is suitable for various harsh environments. In addition, the copper substrate also has good electromagnetic shielding performance and packaging capabilities, which can effectively reduce electromagnetic interference and provide good protection;

[0022] 3. The utility model records a COB light strip that combines the gluing and glue-dotting processes. After the gluing process, a semi-wrapped sleeve is provided on the outer surface of the glue to surround the LED chip. On the one hand, the LED chip is protected by the sleeve to improve the waterproof and protective effects. On the other hand, the glue-dotting and gluing processes on the outer surface of the LED chip can be protected to improve the service life of the light strip, which has a good prospect for use. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0024] Figure 1 This is a schematic diagram of the overall structure of the COB light strip combined with the glue drawing and dispensing process of the utility model;

[0025] Figure 2 It is a schematic cross-sectional structure diagram of the COB light strip without the glue dispensing layer in the utility model combined with the glue drawing and dispensing process;

[0026] Figure 3 It is a schematic cross-sectional structure diagram of the position of the glue dot layer in the COB light strip combined with the glue pulling and dot process of the utility model.

[0027] Description of main reference numerals:

[0028] 1. Substrate; 2. LED chip; 3. Glue dispensing layer; 4. Glue encapsulation layer; 5. Sleeve. DETAILED DESCRIPTION

[0029] The embodiments of the present application provide a COB light strip combined with a glue drawing and dispensing process to solve the problem that the chips on the COB light strip are directly packaged by glue drawing in the prior art. After packaging in this way, the entire COB light strip presents one color, which cannot meet people's requirements for light strips of multiple colors and has low applicability.

[0030] The technical solution in the embodiment of the present application is to solve the above problems, and the overall idea is as follows:

[0031] Embodiment 1:

[0032] This embodiment provides a specific structure of a COB light strip combined with a glue drawing and dispensing process, such as Figure 1-3 As shown, it includes a substrate 1 and an LED chip 2;

[0033] The number of LED chips 2 is several groups, and the LED chips 2 are mounted on the substrate 1. First, glue is applied to some LED chips, and a glue layer 3 is set above some LED chips; then glue is applied to the entire COB light strip, and a glue encapsulation layer 4 is set above the LED chips that have not been glued and the glue layer 3. The specific selection of the part of LED chips to be glued depends on the product requirements, for example: select odd or even numbers for glue application, or glue application at intervals of 1 / 3 of the total number of LED chips, and select glue application.

[0034] Some LED chips 2 are selected inside the COB light strip, and glue is first applied to the outer surface of the LED chips 2, and then glue is applied, so that the light of these LED chips 2 is different from that of other LED chips 2, so that the COB light strip can emit light of different brightness, thereby improving the applicability of the COB light strip and having a good prospect for use.

[0035] Embodiment 2:

[0036] On the basis of Example 1, Figure 1-3 As shown, this patent also records the following structure:

[0037] The inside of the glue dispensing layer 3 and the glue encapsulation layer 4 is doped with fluorescent powders of different colors, which are used to change the color of the light passing through the glue dispensing layer 3 and the glue encapsulation layer 4.

[0038] Phosphor is a substance that can convert light of a specific wavelength into light of another wavelength. In LED lighting, phosphor is mainly used to convert the blue light emitted by the LED chip into other colors. There are many types of phosphors, the most common ones are rare earth element phosphors, silicate phosphors, etc. The choice of phosphor will affect the color temperature and brightness of LED lighting.

[0039] The colors of the fluorescent powder in the glue dispensing layer 3 and the glue encapsulation layer 4 are different, so the light emitted by the LED chip 2 has different colors after passing through the glue dispensing layer 3 and the glue encapsulation layer 4. Therefore, the COB light strip can emit light of different brightness and different colors, thereby improving the applicability of the COB light strip and having good usage prospects.

[0040] Embodiment 3:

[0041] On the basis of Example 2, Figure 1-3 As shown, this patent also records the following structure:

[0042] The LED chips 2 with the glue layer 3 are arranged at intervals from the LED chips 2 without the glue layer 3.

[0043] The glue layer 3 can be set on the LED chips 2 at odd positions or even positions, or two groups can be set at intervals. After setting, there is a certain pattern between the LED chips 2 with the glue layer 3 and the LED chips 2 without the glue layer 3.

[0044] The main purpose of presenting a certain regularity is to make the light emitted by the LED chip 2 more coordinated.

[0045] Embodiment 4:

[0046] On the basis of Example 3, Figure 1-3 As shown, this patent also records the following structure:

[0047] The substrate 1 is either a copper substrate body or an aluminum substrate body.

[0048] The substrate 1 is made of aluminum and copper substrates, both of which have good heat dissipation performance and can effectively conduct away the heat generated when the light strip is working, thereby ensuring the normal operation of the light strip and extending its service life.

[0049] The substrate 1 is made of aluminum and copper substrate and has excellent mechanical strength, can withstand greater pressure and vibration, and is suitable for various harsh environments. In addition, the copper substrate also has good electromagnetic shielding performance and packaging capabilities, which can effectively reduce electromagnetic interference and provide good protection.

[0050] Embodiment 5:

[0051] On the basis of Example 4, Figure 1-3 As shown, this patent also records the following structure:

[0052] A sleeve 5 is disposed on the outer surface of the adhesive packaging layer 4 , and the size of the sleeve 5 is larger than the size of the LED chip 2 .

[0053] After the glue pulling process, a semi-wrapped sleeve 5 is provided on the outer surface of the glue to surround the LED chip 2. On the one hand, the sleeve 5 protects the LED chip 2 to improve the waterproof and protective effects. On the other hand, the glue point and glue pulling process on the outer surface of the LED chip 2 can be protected to improve the service life of the light strip, which has a good prospect of use.

[0054] The sleeve 5 is a flexible, opaque material that can gather the light emitted by the LED chip 2, thereby increasing the brightness of the COB light strip. The setting of the sleeve 5 further improves the sealing effect, thereby improving the waterproof performance of the entire COB light strip. At the same time, the sleeve 5 is arranged in a semi-wrapped manner, which can compress the rubber packaging layer 4 and effectively prevent the rubber packaging layer 4 from falling off, thereby extending the service life of the COB light strip.

[0055] Working principle: Select some LED chips 2 inside the COB light strip, first do a glue dispensing process on the outer surface of the LED chips 2, and then do a glue pulling process, so that the light of this part of the LED chips 2 is different from that of other LED chips 2, so that the COB light strip can emit light of different brightness and different colors.

[0056] After the glue drawing process, a semi-wrapped sleeve 5 is provided on the outer surface of the glue packaging layer 4 to surround the LED chip 2. On the one hand, the sleeve 5 protects the LED chip 2 to improve the waterproof and protective effects. On the other hand, the glue point and glue drawing process on the outer surface of the LED chip 2 can be protected to improve the service life of the light strip.

[0057] Finally, it should be noted that: Obviously, the above embodiments are only examples for clearly explaining the present invention, and are not intended to limit the implementation methods. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from this are still within the scope of protection of the present invention.

Claims

1. A COB light strip combined with glue drawing and glue dispensing process, characterized in that: include: substrate(1); An LED chip (2), wherein the LED chip (2) is mounted on the substrate (1); A glue dispensing layer (3), wherein the glue dispensing layer (3) is disposed on the upper part of a portion of the LED chip; A strip-shaped glue encapsulation layer (4), wherein the glue encapsulation layer (4) covers the glue dispensing layer (3) and the remaining portion of the LED chip on which the glue dispensing layer (3) is not provided; The outer surface of the adhesive packaging layer (4) is provided with a semi-wrapped sleeve (5), and the size of the sleeve (5) is larger than the size of the LED chip (2); The sleeve (5) is made of a flexible, light-proof material that can gather the light emitted by the LED chip (2).

2. A COB light strip combined with glue drawing and glue dispensing process as claimed in claim 1, characterized in that: The inside of the glue-dotting layer (3) and the glue-pulling encapsulation layer (4) is doped with fluorescent powders of different colors, which are used to change the color of the light passing through the glue-dotting layer (3) and the glue-pulling encapsulation layer (4).

3. A COB light strip combined with glue drawing and glue dispensing process as claimed in claim 1, characterized in that: The LED chips (2) provided with the glue layer (3) and the LED chips (2) not provided with the glue layer (3) are arranged at intervals.

4. The COB light strip combined with the glue drawing and glue dispensing process as claimed in claim 1, characterized in that: The substrate (1) is any one of a copper substrate body and an aluminum substrate body.

Images