Preparation device of low-concentration BOE etching solution for semiconductor

Abstract

The utility model discloses a low-concentration BOE etching solution preparation device for semiconductors, which comprises a preparation cylinder, a conveying mechanism arranged above the preparation cylinder, a preparation mechanism arranged above the preparation cylinder, an auxiliary mechanism arranged above the preparation cylinder, and an output mechanism connected below the preparation cylinder. Harmful gas such as hydrogen sulfide and hydrogen chloride generated during preparation of the low-concentration BOE etching liquid preparation device for the semiconductor can be conveniently filtered and discharged in an auxiliary mode, the surrounding environment or workers are harmed, meanwhile, the output mechanism is arranged in the preparation cylinder, the prepared low-concentration BOE etching liquid for the semiconductor can be conveyed in an auxiliary mode and cooled, and the production efficiency is improved. And the prepared low-concentration BOE etching solution for the semiconductor can be subjected to auxiliary detection treatment, so that the high-concentration etching solution can be found in time when the low-concentration BOE etching solution for the semiconductor is conveyed, and the influence of a subsequent preparation process is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of etching solution preparation, in particular to a device for preparing low-concentration BOE etching solution for semiconductors. Background Art

[0002] The low-concentration BOE etching solution preparation device for semiconductors is a device used to prepare the low-concentration BOE etching solution required in the semiconductor process. BOE etching solution is a chemical solution commonly used in semiconductor processes for etching silicon oxide and some other materials.

[0003] However, the low-concentration BOE etching solution preparation device for semiconductors will produce harmful gases such as hydrogen sulfide and hydrogen chloride during preparation, which may easily cause harm to the surrounding environment or workers. At the same time, the low-concentration BOE etching solution preparation device for semiconductors cannot detect it after the preparation is completed, so that the high-concentration etching solution in the delivered etching solution cannot be discovered in time, which may easily affect the subsequent preparation process.

[0004] Currently, no effective solution has been proposed for the problems in the related technologies. Utility Model Content

[0005] 1. Technical issues to be resolved

[0006] In view of the deficiencies in the prior art, the utility model provides a device for preparing low-concentration BOE etching solution for semiconductors, which has the advantages of the above-mentioned technical problems and thus solves the problems in the prior art.

[0007] (II) Technical solution

[0008] In order to achieve the advantages of the above technical problems, the specific technical solutions adopted by the utility model are as follows:

[0009] A semiconductor low-concentration BOE etching solution preparation device comprises a preparation tube, a conveying mechanism is arranged above the preparation tube, and a preparation mechanism is installed above the preparation tube;

[0010] An auxiliary mechanism is installed above the preparation cylinder, and an output mechanism is connected below the preparation cylinder.

[0011] Furthermore, the conveying mechanism includes a filter box fixedly arranged above the preparation cylinder, a conveying pipe 1 passes through one side of the filter box, a conveying pipe 2 passes through the other side of the filter box, a conveying pump is installed at one end of the conveying pipe 2, and one end of the conveying pump passes through the preparation cylinder through a connecting pipe.

[0012] Furthermore, the preparation mechanism includes a fixed frame fixedly installed above the preparation cylinder, a servo motor is provided on the fixed frame, a preparation rod is fixedly provided on the output shaft of the servo motor, one end of the preparation rod penetrates the preparation cylinder, a preparation plate is fixedly connected to the surface of the preparation rod, a scraper plate is fixed at one end of the preparation plate, and one side of the scraper plate is in contact with the inner wall of the preparation cylinder.

[0013] Furthermore, the auxiliary mechanism includes a discharge pipe passing through the top of the preparation cylinder, one end of the discharge pipe passes through an auxiliary box, the bottom of the auxiliary box is fixedly connected to the preparation cylinder, an activated carbon plate is installed on the inner wall of the auxiliary box, and equidistantly distributed air outlets are opened on the other side of the auxiliary box.

[0014] Furthermore, the output mechanism includes an output tube 1 passing through the bottom of the preparation cylinder, one end of the output tube 1 is connected to a detection box, a detection probe passes through the top of the detection box, an output pump 1 passes through one side of the detection box, the output end of the output pump 1 is connected to an output tube 2, one end of the output tube 2 passes through the preparation cylinder, one side of the detection box is connected to the output pump 2 through a connecting tube 2, a heat preservation cover 1 is installed on the surface of the output tube 1, and semiconductor refrigeration plates distributed equidistantly are passed through the heat preservation cover 1.

[0015] Furthermore, a mounting frame is fixedly installed on the inner wall of the filter box, a filter screen plate is provided on the inner wall of the mounting frame, a sealing cover is hinged on the top of the filter box, and a lock buckle is fixedly connected to the sealing cover and the side of the filter box.

[0016] Furthermore, the output end of the second output pump is connected to a liquid storage cylinder.

[0017] Furthermore, the surface of the preparation cylinder is fixedly installed with connection plates distributed at equal distances, a heating ring is provided on the connection plate, and a second heat preservation cover is fixed at one end of the connection plate.

[0018] (III) Beneficial effects

[0019] Compared with the prior art, the utility model has the following beneficial effects:

[0020] (1) The auxiliary mechanism provided in the preparation tube facilitates the auxiliary filtration and discharge of harmful gases such as hydrogen sulfide and hydrogen chloride generated by the semiconductor low-concentration BOE etching solution preparation device during preparation, which harms the surrounding environment or workers. At the same time, the output mechanism provided in the preparation tube not only assists in the transportation and cooling of the prepared semiconductor low-concentration BOE etching solution, but also assists in the detection and treatment of the prepared semiconductor low-concentration BOE etching solution, thereby reducing the high-concentration etching solution when the semiconductor low-concentration BOE etching solution is transported, thereby reducing the impact of subsequent preparation processes.

[0021] (2) The conveying mechanism provided in the preparation barrel can not only convey the raw material of the low-concentration BOE etching liquid for semiconductors, but also assist in filtering the impurities in the raw material. At the same time, the preparation mechanism provided in the preparation barrel facilitates the uniform mixing and stirring of the prepared low-concentration BOE etching liquid for semiconductors. At the same time, the connecting plate and the heating ring provided in the preparation barrel facilitate the auxiliary heating treatment of the raw materials during preparation. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 The structure of a device for preparing a low-concentration BOE etching solution for semiconductors according to an embodiment of the utility model is shown in FIG. Figure 1 ;

[0024] Figure 2 The structure of a device for preparing a low-concentration BOE etching solution for semiconductors according to an embodiment of the utility model is shown in FIG. Figure 2 ;

[0025] Figure 3 It is a schematic diagram of the structure of a conveying mechanism of a semiconductor low-concentration BOE etching solution preparation device according to an embodiment of the utility model;

[0026] Figure 4 This is a schematic diagram of the auxiliary mechanism structure of a device for preparing a low-concentration BOE etching solution for semiconductors according to an embodiment of the utility model;

[0027] Figure 5 It is a schematic diagram of the structure of a preparation mechanism of a semiconductor low-concentration BOE etching solution preparation device according to an embodiment of the utility model;

[0028] Figure 6 The present invention is a schematic diagram of the output mechanism structure of a device for preparing low-concentration BOE etching solution for semiconductors according to an embodiment of the present invention.

[0029] In the figure:

[0030] 1. Preparation cylinder; 2. Delivery mechanism; 201. Filter box; 202. Delivery pipe 1; 203. Delivery pipe 2; 204. Delivery pump; 3. Preparation mechanism; 301. Fixed frame; 302. Servo motor; 303. Preparation rod; 304. Preparation plate; 305. Scraper plate; 4. Auxiliary mechanism; 401. Discharge pipe; 402. Auxiliary box; 403. Activated carbon plate; 404. Air outlet; 5. Output mechanism; 501. Output pipe 1; 502. Detection box; 503. Detection probe; 504. Output pump 1; 505. Output pipe 2; 506. Output pump 2; 507. Insulation cover 1; 508. Semiconductor refrigeration sheet; 6. Installation frame; 7. Filter screen; 8. Sealing cover; 9. Lock; 10. Liquid storage cylinder; 11. Connecting plate; 12. Heating ring; 13. Insulation cover 2. DETAILED DESCRIPTION

[0031] To further illustrate the technical solution of the present application, the present invention provides drawings, which are part of the disclosure of the present invention and are mainly used to illustrate the implementation methods. They can be used in conjunction with the relevant descriptions in the specification to explain the operating principles of the implementation methods. With reference to these contents, ordinary technicians in this field should be able to understand other possible implementation methods and advantages of the present invention. The components in the figures are not drawn to scale, and similar component symbols are generally used to represent similar components.

[0032] like Figure 1 - Figure 6 As shown, the utility model provides the following technical solutions: a device for preparing low-concentration BOE etching liquid for semiconductors, comprising a preparation barrel 1, a preparation container for low-concentration BOE etching liquid for semiconductors, a connection plate 11 with equal distances is fixedly installed on the surface of the preparation barrel 1, a heating ring 12 is provided on the connection plate 11, a heat preservation cover 2 13 is fixed at one end of the connection plate 11, a conveying mechanism 2 is provided above the preparation barrel 1, the conveying mechanism 2 comprises a filter box 201 fixedly arranged above the preparation barrel 1, a mounting frame 6 is fixedly installed on the inner wall of the filter box 201, a filter screen plate 7 is provided on the inner wall of the mounting frame 6, a sealing cover 8 is hinged above the filter box 201, and a lock buckle 9 is fixedly connected to the sealing cover 8 and the side of the filter box 201, a delivery pipe 1 202 is passed through one side of the filter box 201, a delivery pipe 203 is passed through the other side of the filter box 201, a delivery pump 204 is installed at one end of the delivery pipe 203, and one end of the delivery pump 204 passes through the preparation barrel 1 through a connecting pipe;

[0033] A preparation mechanism 3 is installed above the preparation cylinder 1, and the preparation mechanism 3 includes a fixed frame 301 fixedly installed above the preparation cylinder 1, a servo motor 302 is provided on the fixed frame 301, and a preparation rod 303 is fixedly provided on the output shaft of the servo motor 302, one end of the preparation rod 303 penetrates the preparation cylinder 1, a preparation plate 304 is fixedly connected to the surface of the preparation rod 303, a scraper plate 305 is fixed at one end of the preparation plate 304, and one side of the scraper plate 305 is in contact with the inner wall of the preparation cylinder 1.

[0034] Specifically, through the conveying mechanism 2 set in the preparation barrel 1, not only can the low-concentration BOE etching liquid raw material for semiconductors be conveyed, but also the impurities in the raw material can be assisted in filtering treatment. At the same time, the preparation mechanism 3 set in the preparation barrel 1 is convenient for uniformly mixing and stirring the prepared low-concentration BOE etching liquid for semiconductors. At the same time, the connecting plate 11 and the heating ring 12 set in the preparation barrel 1 are convenient for auxiliary heating treatment of the raw materials during preparation. At the same time, the filter mesh plate 7 set in the filter box 201 is convenient for auxiliary filtering treatment of impurities in the prepared raw materials. At the same time, the sealing cover 8 and the lock buckle 9 set in the filter box 201 are convenient for subsequent staff to replace the filter mesh plate 7.

[0035] like Figure 1 - Figure 6 As shown, an auxiliary mechanism 4 is installed above the preparation cylinder 1, and the auxiliary mechanism 4 includes a discharge pipe 401 passing through the top of the preparation cylinder 1, an auxiliary box 402 is passed through one end of the discharge pipe 401, and the lower part of the auxiliary box 402 is fixedly connected to the preparation cylinder 1, an activated carbon plate 403 is installed on the inner wall of the auxiliary box 402, and the other side of the auxiliary box 402 is provided with equidistantly distributed air outlet holes 404;

[0036] An output mechanism 5 is connected below the preparation cylinder 1, and the output mechanism 5 includes an output tube 1 501 penetrating below the preparation cylinder 1, one end of the output tube 1 501 is connected to a detection box 502, and a detection probe 503 is penetrated above the detection box 502. The detection probe 503 is consistent with the principle of model MAY-1001, an output pump 1 504 is penetrated on one side of the detection box 502, and an output end of the output pump 1 504 is connected to an output tube 2 505, and one end of the output tube 2 505 penetrates the preparation cylinder 1, and an output pump 2 506 is connected to one side of the detection box 502 through a connecting tube 2, and the output end of the output pump 2 506 is connected to a liquid storage cylinder 10 for storing the prepared low-concentration BOE etching solution, and a heat preservation cover 1 507 is installed on the surface of the output tube 1 501, and the heat preservation cover 1 507 is penetrated by semiconductor refrigeration sheets 508 distributed at equal distances, and the cooling end of the semiconductor refrigeration sheet 508 is located inside the heat preservation cover 1 507, and the heating end of the semiconductor refrigeration sheet 508 is located outside the heat preservation cover 1 507;

[0037] The semiconductor cooling sheet 508, the output pump 2 506, the output pump 1 504, the servo motor 302, the delivery pump 204, and the heating ring 12 are electrically connected to a controller during actual use, and the controller, the semiconductor cooling sheet 508, the output pump 2 506, the output pump 1 504, the servo motor 302, the delivery pump 204, the heating ring 12, and the detection probe 503 are electrically connected to an external power supply.

[0038] Specifically, by providing the auxiliary mechanism 4 on the preparation barrel 1, it is convenient to assist in filtering and discharging harmful gases such as hydrogen sulfide and hydrogen chloride generated by the semiconductor low-concentration BOE etching solution preparation device during preparation, so that the surrounding environment or workers are harmed. At the same time, the output mechanism 5 provided on the preparation barrel 1 can not only assist in conveying and cooling the prepared semiconductor low-concentration BOE etching solution, but also assist in detecting and processing the prepared semiconductor low-concentration BOE etching solution, thereby timely discovering high-concentration etching solution when the semiconductor low-concentration BOE etching solution is conveyed.

[0039] In summary, with the aid of the above technical scheme of the utility model, through the conveying mechanism 2 set in the preparation cylinder 1, not only the raw material of low-concentration BOE etching liquid for semiconductors can be conveyed, but also the impurities in the raw material can be assisted in filtering and processing. The raw material is filtered and conveyed into the preparation cylinder 1, and then the preparation mechanism 3 set in the preparation cylinder 1 is convenient for uniformly mixing and stirring the prepared low-concentration BOE etching liquid for semiconductors. During preparation, the connecting plate 11 and the heating ring 12 set in the preparation cylinder 1 are convenient for auxiliary heating treatment of the raw materials during preparation. At the same time, the filter screen plate 7 set in the filter box 201 is convenient for auxiliary filtering treatment of impurities in the prepared raw materials. When discharged, the output mechanism 5 set in the preparation cylinder 1 is not only for auxiliary conveying and cooling treatment of the prepared low-concentration BOE etching liquid for semiconductors, but also for auxiliary detection treatment of the prepared low-concentration BOE etching liquid for semiconductors, which can timely detect high-concentration etching liquid when the low-concentration BOE etching liquid for semiconductors is reduced. At the same time, the sealing cover 8 and the lock buckle 9 set in the filter box 201 are convenient for subsequent staff to replace the filter screen plate 7.

[0040] In the present utility model, unless otherwise clearly stipulated and limited, the terms such as "installation", "setting", "connection", "fixation" and "screw-on" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, ordinary technicians in this field can understand the specific meanings of the above terms in the utility model according to the specific circumstances.

[0041] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A device for preparing low-concentration BOE etching solution for semiconductors, characterized in that: It comprises a preparation cylinder (1), a conveying mechanism (2) is arranged above the preparation cylinder (1), and a preparation mechanism (3) is installed above the preparation cylinder (1); An auxiliary mechanism (4) is installed above the preparation cylinder (1), and the auxiliary mechanism (4) comprises a discharge pipe (401) passing through the top of the preparation cylinder (1), an auxiliary box (402) passes through one end of the discharge pipe (401), and the bottom of the auxiliary box (402) is fixedly connected to the preparation cylinder (1), an activated carbon plate (403) is installed on the inner wall of the auxiliary box (402), and the other side of the auxiliary box (402) is provided with equidistantly distributed air outlet holes (404); An output mechanism (5) is connected to the bottom of the preparation cylinder (1), and the output mechanism (5) includes an output tube (501) passing through the bottom of the preparation cylinder (1), one end of the output tube (501) is connected to a detection box (502), a detection probe (503) passes through the top of the detection box (502), an output pump (504) passes through one side of the detection box (502), an output end of the output pump (504) is connected to an output tube (505), one end of the output tube (505) passes through the preparation cylinder (1), and one side of the detection box (502) is connected to an output pump (506) via a connecting tube (506), a heat preservation cover (507) is installed on the surface of the output tube (501), and semiconductor cooling plates (508) distributed at equal distances are passed through the heat preservation cover (507).

2. A semiconductor low-concentration BOE etching solution preparation device according to claim 1, characterized in that: The conveying mechanism (2) comprises a filter box (201) fixedly arranged above the preparation cylinder (1), a conveying pipe 1 (202) passing through one side of the filter box (201), a conveying pipe 2 (203) passing through the other side of the filter box (201), a conveying pump (204) being installed at one end of the conveying pipe 2 (203), and one end of the conveying pump (204) passing through the preparation cylinder (1) via a connecting pipe 1.

3. A semiconductor low-concentration BOE etching solution preparation device according to claim 1, characterized in that: The preparation mechanism (3) comprises a fixed frame (301) fixedly installed above the preparation cylinder (1), a servo motor (302) being provided on the fixed frame (301), a preparation rod (303) being fixedly provided on the output shaft of the servo motor (302), one end of the preparation rod (303) penetrating the preparation cylinder (1), a preparation plate (304) being fixedly connected to the surface of the preparation rod (303), a scraper plate (305) being fixedly provided at one end of the preparation plate (304), and one side of the scraper plate (305) being in contact with the inner wall of the preparation cylinder (1).

4. A semiconductor low-concentration BOE etching solution preparation device according to claim 2, characterized in that: A mounting frame (6) is fixedly mounted on the inner wall of the filter box (201), a filter screen plate (7) is provided on the inner wall of the mounting frame (6), a sealing cover (8) is hingedly mounted on the top of the filter box (201), and a lock buckle (9) is fixedly connected to the side of the filter box (201).

5. The device for preparing a low-concentration BOE etching solution for semiconductor according to claim 1, characterized in that: The output end of the second output pump (506) is connected to a liquid storage cylinder (10).

6. The device for preparing a low-concentration BOE etching solution for semiconductor according to claim 1, characterized in that: The surface of the preparation cylinder (1) is fixedly mounted with connection plates (11) distributed at equal distances, a heating ring (12) is provided on the connection plate (11), and a second heat preservation cover (13) is fixed to one end of the connection plate (11).

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