PCB solder paste wiping mechanism

Abstract

The utility model discloses a PCB solder paste wiping mechanism, comprising a carrying platform, the middle position of which is in a through shape; the positioning mechanism is arranged in the middle of the carrying table; the discharging mechanism is arranged on one side of the positioning mechanism; the receiving mechanism is arranged on the other side of the positioning mechanism, the receiving mechanism and the discharging mechanism are arranged in a flat shape, non-woven fabric is arranged between the receiving mechanism and the discharging mechanism, and the non-woven fabric passes through the lower portion of the positioning mechanism and abuts against the positioning mechanism; the detection mechanisms are distributed on the upper edge and the lower edge of the carrying table, do not make contact with the positioning mechanism, the discharging mechanism and the collecting mechanism, are located below the carrying table and are adjacent to the positioning mechanism, the positioning mechanism comprises a frame body and an air cylinder penetrating through the middle position of the frame body, and a pressing head is installed at the output end of the air cylinder; according to the utility model, the mode of combining manpower and the workbench is adopted, so that the working efficiency is improved, various workpieces can be cleaned, and meanwhile, manual intervention is not needed during the work of butt joint with a production line, so that the operation risk can be reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of PCB solder paste wiping, and in particular relates to a PCB solder paste wiping mechanism. Background Art

[0002] Solder paste is a new type of welding material that came into being with SMT. It is a paste-like mixture formed by mixing solder powder, flux and other surfactants, thixotropic agents, etc. It is mainly used for welding electronic components such as resistors, capacitors, and ICs on the surface of PCBs in the SMT industry. In the processing of PCBs, in order to ensure the welding quality, the solder paste needs to be evenly applied to the PCB through a wiping mechanism.

[0003] In traditional PCB solder paste wiping work, it is mainly dependent on manual work and requires multiple people to complete, resulting in a large workload; the operation risk is high, the overall inspection quality is not high, the efficiency is low, and it cannot be connected to the production line, which increases the labor of workers. Utility Model Content

[0004] The utility model aims to provide a PCB solder paste wiping mechanism to solve the problems of high risk, large workload and low detection quality in the existing wiping of PCB solder paste proposed in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a PCB solder paste wiping mechanism, including a carrier, the middle position of which is in a through shape; a positioning mechanism, which is arranged in the middle position of the carrier; a feeding mechanism, which is arranged on one side of the positioning mechanism; a collecting mechanism, which is arranged on the other side of the positioning mechanism and is arranged in a flat shape with the feeding mechanism, and a non-woven fabric is arranged between the two, and the non-woven fabric passes under the positioning mechanism and is tightly pressed against it; a detection mechanism, which is distributed at the upper and lower edges of the carrier and does not contact the positioning mechanism, the feeding mechanism, and the feeding mechanism; an alcohol spraying mechanism, which is located under the carrier and is arranged adjacent to the positioning mechanism.

[0006] Preferably, the positioning mechanism includes a frame, a cylinder passing through the middle of the frame, and a pressure head is installed on the output end of the cylinder; a position sensor is also installed on the frame, and when the position sensor detects that the PCB is in place, the cylinder drives the pressure head to press the dust-free cloth down to the surface of the PCB to prepare for cleaning.

[0007] Preferably, a guide shaft with a bushing is installed between the frame and the pressure head to ensure that the pressure head can be lifted and lowered in a vertical direction to achieve a guiding effect.

[0008] Preferably, the alcohol spraying mechanism is arranged on one side of the pressure head, and the alcohol spraying mechanism is installed on the bottom end surface of the frame, wherein the alcohol spraying mechanism is a nozzle. After the cylinder rises, the solenoid valve controls the alcohol pot to squeeze the alcohol into the nozzle and then spray it onto the PCB surface, and then the cylinder presses the clean dust-free cloth down to the PCB surface.

[0009] Preferably, the material collecting mechanism includes a motor and a roller frame installed on the output end of the motor, wherein the motor as a power source can drive the roller frame to perform a dirty cloth collecting movement; when collecting dirty cloth, the motor starts to idle after reaching a specified torque, and the motor always keeps the dust-free cloth in a tensioning action.

[0010] Preferably, the structure of the discharging mechanism is the same as that of the receiving mechanism, that is, the servo motor can be used as a power source to drive the workpiece to perform the dust-free cloth discharging movement; every mm of wiping, the servo motor performs the dust-free cloth discharging action, and then the cylinder rises and collects the material, and the cleaning function is realized in a cycle. Sensor 2 detects the diameter of the roller frame on the discharging mechanism. When it is lower than the set value, it prompts the operator to prepare to replace the dust-free cloth roll.

[0011] Preferably, the detection mechanism includes sensor 1, sensor 2, air knife, sensor 3, and solenoid valve. Sensor 1 is arranged on both sides of the top of the platform, and sensor 2 is arranged at both ends of the top of the platform, for detecting the diameter of the roller frame. The air knife is arranged on both sides of the bottom of the platform and is arranged adjacent to sensor 3. After wiping the non-woven fabric, the solenoid valve controls the gas to dry the alcohol on the surface of the product, and sensor 3 detects the dirt on the surface of the product.

[0012] During use, the product is manually placed at the loading station in the tooling. After the external sensor detects the presence or absence, the motor and the servo motor on the discharge mechanism drive the solder paste wiping mechanism to move. First, alcohol is sprayed on the PCB surface, the discharge mechanism is activated, the positioning mechanism presses the dust-free cloth to fit the PCB surface and reciprocates, and the collecting mechanism recycles the dirty cloth, and the cycle is repeated to clean the solder paste on the product surface.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] In the utility model, a combination of manual labor and a workbench is adopted to improve work efficiency and complete the cleaning of various workpieces. At the same time, when docking with the production line, no manual intervention is required, which can reduce operational risks. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the structure of the utility model;

[0016] Figure 2 It is a bottom view of the utility model;

[0017] Figure 3 It is a structural schematic diagram of the positioning mechanism of the utility model;

[0018] Figure 4 It is a schematic diagram of the connection between the carrier and the wind knife of the utility model.

[0019] In the figure:

[0020] 100, positioning mechanism; 101, frame; 102, cylinder; 103, position sensor; 104, guide shaft with bushing; 105, pressure head;

[0021] 200. Discharging mechanism;

[0022] 300, material receiving mechanism; 301, roller frame; 302, motor;

[0023] 401, sensor one; 402, sensor two; 403, wind knife; 404, sensor three;

[0024] 500, nozzle;

[0025] 600. Carrier. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] See also Figures 1 to 4 The utility model provides a technical solution: a PCB solder paste wiping mechanism, comprising

[0028] The carrier 600 has a through-hole shape in the middle;

[0029] The positioning mechanism 100 is arranged at the middle position of the carrier 600;

[0030] The material discharge mechanism 200 is arranged on one side of the positioning mechanism 100;

[0031] The material receiving mechanism 300 is arranged at the other side of the positioning mechanism 100 and is arranged in a flat shape with the material discharging mechanism 200, and a non-woven fabric is arranged between the two. The non-woven fabric passes under the positioning mechanism 100 and is pressed against it;

[0032] The detection mechanism is distributed at the upper and lower edges of the carrier 600 and does not contact the positioning mechanism 100, the material discharging mechanism 200, and the material receiving mechanism 300.

[0033] The alcohol spraying mechanism is located below the carrier 600 and is arranged adjacent to the positioning mechanism.

[0034] In this embodiment, preferably, the positioning mechanism 100 includes a frame 101 and a cylinder 102 that passes through the middle of the frame 101, and a pressure head 105 is installed on the output end of the cylinder 102; a position sensor 103 is also installed on the frame 101, and when the position sensor 103 detects that the PCB is in place, the cylinder 102 drives the pressure head 105 to press the dust-free cloth down to the surface of the PCB to prepare for cleaning.

[0035] In this embodiment, preferably, a guide shaft 104 with a bushing is installed between the frame 101 and the pressure head 105 to ensure that the pressure head 105 can be lifted and lowered in the vertical direction to achieve a guiding effect.

[0036] In this embodiment, preferably, the alcohol spraying mechanism is arranged on one side of the pressure head 105, and the alcohol spraying mechanism is installed on the bottom end surface of the frame 101, wherein the alcohol spraying mechanism is the nozzle 500. After the cylinder 102 rises, the solenoid valve controls the alcohol pot to squeeze the alcohol to the nozzle 500 and then spray it onto the PCB surface, and then the cylinder 102 presses the clean dust-free cloth down to the PCB surface.

[0037] In this embodiment, preferably, the material collecting mechanism 300 includes a motor 302, and a roller frame 301 installed on the output end of the motor 302, wherein the motor 302 as a power source can drive the roller frame 301 to perform a dirty cloth collecting movement; when collecting dirty cloth, the motor 302 starts to idle after reaching a specified torque, and the motor 302 always keeps the dust-free cloth in a tensioned action.

[0038] In this embodiment, preferably, the structure of the discharge mechanism 200 is the same as that of the receiving mechanism 300, that is, the servo motor can be used as a power source to drive the workpiece to perform the dust-free cloth discharge movement; every time the servo motor wipes 5 mm, the dust-free cloth discharge action is performed, and then the cylinder 102 rises, 302 receives the material, and the cleaning function is realized in sequence. The sensor 2 402 detects the diameter of the roller frame on the discharge mechanism 200. When it is lower than the set value, it prompts the operator to prepare to replace the dust-free cloth roll.

[0039] In this embodiment, preferably, the detection mechanism includes sensor 1 401, sensor 2 402, wind knife 403, sensor 3 404, and solenoid valve. Sensor 1 401 is arranged on both sides of the top of the platform 600, and sensor 2 402 is arranged at both ends of the top of the platform 600, for detecting the diameter of the roller frame 301. Wind knife 403 is arranged on both sides of the bottom of the platform 600 and is arranged adjacent to sensor 3 404. After wiping the non-woven fabric, the solenoid valve controls the gas to dry the alcohol on the surface of the product, and sensor 3 404 detects the dirt on the surface of the product.

[0040] During use, the product is manually placed at the loading station in the tooling. After the external sensor detects the presence or absence, the motor 302 and the servo motor on the discharge mechanism 200 drive the solder paste wiping mechanism to move. First, alcohol is sprayed on the surface of the PCB, the discharge mechanism 200 is actuated, the positioning mechanism 100 presses the dust-free cloth to reciprocate against the surface of the PCB, and the collecting mechanism 300 recycles the dirty cloth, and the cyclic action is repeated to clean the solder paste on the surface of the product.

[0041] Although the embodiments of the present invention have been shown and described (see the above detailed description for details), it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A PCB solder paste wiping mechanism, characterized in that: include The carrier (600) has a through-hole shape in the middle; A positioning mechanism (100) is arranged at a middle position of the carrier (600); A material discharge mechanism (200) is arranged on one side of the positioning mechanism (100); The material receiving mechanism (300) is arranged on the other side of the positioning mechanism (100) and is arranged in a flat shape with the material discharging mechanism (200), and a non-woven fabric is arranged between the two. The non-woven fabric passes under the positioning mechanism (100) and is tightly pressed against it; The detection mechanism is distributed at the upper and lower edges of the carrier (600) and does not contact the positioning mechanism (100), the material discharging mechanism (200) and the material receiving mechanism (300). The alcohol spraying mechanism is located below the carrier (600) and is arranged adjacent to the positioning mechanism.

2. A PCB solder paste wiping mechanism according to claim 1, characterized in that: The positioning mechanism (100) comprises a frame (101), a cylinder (102) penetrating the middle of the frame (101), a pressure head (105) being installed on the output end of the cylinder (102); and a position sensor (103) is also installed on the frame (101).

3. A PCB solder paste wiping mechanism according to claim 2, characterized in that: A guide shaft (104) with a bushing is also installed between the frame (101) and the pressure head (105).

4. A PCB solder paste wiping mechanism according to claim 2, characterized in that: The alcohol spraying mechanism is arranged on one side of the pressure head (105), and the alcohol spraying mechanism is installed on the bottom end surface of the frame (101), wherein the alcohol spraying mechanism is a nozzle (500).

5. The PCB solder paste wiping mechanism according to claim 1, characterized in that: The material receiving mechanism (300) comprises a motor (302) and a roller frame (301) mounted on the output end of the motor (302).

6. A PCB solder paste wiping mechanism according to claim 5, characterized in that: The material discharging mechanism (200) and the material collecting mechanism (300) have the same structure.

7. A PCB solder paste wiping mechanism according to claim 1, characterized in that: The detection mechanism includes sensor one (401), sensor two (402), a wind knife (403), sensor three (404), and a solenoid valve. Sensor one (401) is arranged on both sides of the top of the carrier (600), while sensor two (402) is arranged at both ends of the top of the carrier (600). The wind knife (403) is arranged on both sides of the bottom of the carrier (600) and is arranged adjacent to sensor three (404).

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