Semiconductor chip vacuum welding equipment

Abstract

The utility model discloses a semiconductor chip vacuum welding device. Comprising a feeding module, a transplanting module, a vacuum welding module and a discharging module. The feeding module, the transplanting module, the vacuum welding module and the discharging module are all arranged on the table top of the rack. The feeding module is connected with the transplanting module and is used for die assembly of an upper carrier and a lower carrier and feeding of chips; the transplanting module is arranged below the vacuum welding module and is used for driving the upper carrier, the lower carrier and the chip to pass through the vacuum welding module; the vacuum welding module is used for heating the chip, welding the chip in a vacuum environment and cooling the welded chip; the discharging module is arranged at an outlet of the vacuum welding module, is connected with the feeding module and is used for separating and discharging the upper carrier, the lower carrier and the chip and recycling the upper carrier and the lower carrier; the feeding module, the transplanting module and the discharging module form a circulation channel. According to the utility model, the labor intensity is greatly reduced, and the production efficiency is improved.

Description

Technical field:

[0001] The utility model belongs to the technical field of semiconductor chip production, and particularly relates to semiconductor chip vacuum welding equipment. Background technology:

[0002] During the production process of semiconductor chips, the circuit needs to be welded to the chip surface. Welding usually uses vacuum welding technology. The chip is placed in a heating device and heated in a vacuum environment to complete the welding of the chip circuit, reducing the void rate of the chip welding surface.

[0003] In the current semiconductor chip welding process, the chip needs to be placed between the upper and lower tools, and then enter the heating device for heating and welding. After welding, the chip needs to be taken out from between the upper and lower tools. The placement and removal of the chip are generally done manually, which is labor-intensive and has low production efficiency. How to design a vacuum welding device that can automatically load and unload materials is a problem that needs to be solved.

[0004] The information disclosed in this background technology section is only intended to increase the understanding of the overall background of the present invention, and should not be regarded as acknowledging or suggesting in any form that the information constitutes the prior art already known to a person skilled in the art. Utility model content:

[0005] The purpose of the utility model is to provide a semiconductor chip vacuum welding device, so as to overcome the defects in the above-mentioned prior art.

[0006] To achieve the above-mentioned purpose, the utility model provides a semiconductor chip vacuum welding equipment, including a loading module, a transplanting module, a vacuum welding module, and a unloading module; the loading module, the transplanting module, the vacuum welding module, and the unloading module are all arranged on the frame table; the loading module is connected with the transplanting module, and is used for the mold closing of the upper and lower tools and the loading of the chip; the transplanting module is arranged below the vacuum welding module, and is used to drive the upper and lower tools and the chip through the vacuum welding module; the vacuum welding module is used to heat the chip, weld it in a vacuum environment, and cool the welded chip; the unloading module is arranged at the outlet of the vacuum welding module, and the unloading module is connected with the loading module, and is used to separate and unload the upper and lower tools and the chip, and reuse the upper and lower tools; the loading module, the transplanting module, and the unloading module form a circulation channel to realize the vacuum welding of semiconductor chips and the circulation of the upper and lower tools.

[0007] Preferably, in the technical solution, the loading module includes a down-loader transmission mechanism, an upper loading machine clamping mechanism, and a mold closing loading clamping mechanism, and the end of the down-loader transmission mechanism is respectively provided with an upper loading machine clamping mechanism and a mold closing loading clamping mechanism, wherein the upper loading machine clamping mechanism is arranged in parallel with the down-loader transmission mechanism, and the mold closing loading clamping mechanism is arranged vertically with the down-loader transmission mechanism; the down-loader transmission mechanism includes a first conveyor belt, and the end of the first conveyor belt serves as a mold closing station; the upper loading machine clamping mechanism includes a first bracket, a first servo motor, a first guide rail, a first slider, and a first cylinder clamp, the first bracket is arranged on one side of the down-loader transmission mechanism, and the first servo motor, the first guide rail, and the first guide are arranged on the first bracket. A first slider is arranged on the rail, the first servo motor is connected to the first slider through a transmission belt, a first cylinder clamp is arranged on the first slider in a liftable manner, and a moving track of the first cylinder clamp is located between the mold closing station and the unloading module; the mold closing and feeding clamping mechanism comprises a second bracket, a second servo motor, a second guide rail, a second slider, and a second cylinder clamp, the second bracket is arranged on one side of the inlet of the vacuum welding module, a second servo motor and a second guide rail are arranged on the second bracket, a second slider is arranged on the second guide rail, the second servo motor is connected to the second slider through a transmission belt, a second cylinder clamp is arranged on the second slider, and a moving track of the second cylinder clamp is located between the mold closing station and the inlet of the vacuum welding module.

[0008] Preferably, in the technical solution, the transplanting module includes a transplanting unit, which is symmetrically arranged below the vacuum welding module; the transplanting unit includes a lifting mechanism, a base plate, a third servo motor, a third guide rail, a movable plate, and a transplanting rod; the lifting mechanism is arranged below the vacuum welding module, the lifting mechanism is provided with a base plate, the base plate is provided with a third servo motor and a third guide rail, the movable plate is provided on the third guide rail, the third servo motor is connected to the movable plate through a ball screw, the movable plate is provided with a transplanting rod, and the transplanting rod extends to the inside of the vacuum welding module through the inlet of the vacuum welding module; a gap is left between the transplanting rods of the two transplanting units; the transplanting rod is driven to move in the vacuum welding module by the third servo motor, thereby driving the upper and lower tools and the chip to move; the height of the transplanting rod is adjusted by the lifting mechanism to ensure that the upper and lower tools and the chip are not driven to move when the transplanting rod is retracted.

[0009] Preferably, in the technical scheme, the vacuum welding module includes a preheating zone, a heat preservation zone, a vacuum welding zone, a cooling zone, an electric heater, an upper vacuum chamber, a lower vacuum chamber, and a water cooling mechanism. The preheating zone and the heat preservation zone are provided with electric heaters. The vacuum welding zone is provided with an upper vacuum chamber and a lower vacuum chamber. The upper vacuum chamber is connected to an external vacuum generator. The upper vacuum chamber can be raised and lowered on the frame table. A sealing ring is provided in the upper vacuum chamber. The upper vacuum chamber and the lower vacuum chamber are sealed by the sealing ring when they are closed. A water cooling mechanism is provided in the cooling zone. The preheating zone, the heat preservation zone, the vacuum welding zone, and the cooling zone are all filled with nitrogen for protection. The transplanting rods of the two transplanting units extend to the vacuum welding zone respectively, and a gap is left between the two transplanting rods.

[0010] Preferably, in the technical solution, the unloading module includes a mold closing unloading clamping mechanism, an upper carrier recycling transmission mechanism, a chip unloading mechanism, a lower tool recycling transmission mechanism, an unloading conveyor belt, and a fifth bracket. The mold closing unloading clamping mechanism is arranged at the outlet side of the vacuum welding module, and the mold closing unloading clamping mechanism is connected to the unloading conveyor belt. The upper carrier recycling transmission mechanism, the chip unloading mechanism, and the lower tool recycling transmission mechanism are respectively arranged on both sides of the unloading conveyor belt, wherein the upper carrier recycling transmission mechanism and the lower tool recycling transmission mechanism are located on the same side; the mold closing unloading clamping mechanism includes the fourth bracket, the first A fourth servo motor, a fourth guide rail, a fourth slider, and a fourth cylinder clamp. The fourth bracket is arranged on one side of the vacuum welding module outlet. The fourth bracket is provided with a fourth servo motor and a fourth guide rail. The fourth slider is provided on the fourth guide rail. The fourth servo motor and the fourth slider are connected by a transmission belt. The fourth slider is provided with a fourth cylinder clamp. The moving track of the fourth cylinder clamp is located between the vacuum welding module outlet and the initial end of the unloading conveyor belt. The upper carrier recycling transmission mechanism includes a fifth servo motor, a fifth guide rail, a fifth slider, a fifth cylinder clamp, and a second conveyor belt. The fifth servo motor and the fifth guide rail are arranged on the fifth bracket. The fifth slider is arranged on the fifth guide rail. The fifth servo motor and the fifth slider are connected by a transmission belt. The fifth slider is provided with a fifth cylinder clamp. The second conveyor belt is arranged vertically with the unloading conveyor belt. The moving track of the fifth cylinder clamp is located on the unloading conveyor belt and the second conveyor belt. The lower carrier recycling transmission mechanism includes a sixth servo motor, a sixth guide rail, a sixth slider, a sixth cylinder clamp, and a third conveyor belt. The sixth servo motor and the sixth guide rail are arranged on the fifth bracket. The sixth slider is arranged on the sixth guide rail. The sixth servo motor is connected to the sixth slider through a transmission belt, the sixth slider is provided with a sixth cylinder clamp, the third conveyor belt is vertically arranged with the unloading conveyor belt, the third conveyor belt is connected with the first conveyor belt, and the moving track of the sixth cylinder clamp is located on the unloading conveyor belt and the third conveyor belt; the chip unloading mechanism includes a seventh cylinder clamp, a fourth conveyor belt, and an unloading rack, the seventh cylinder clamp is arranged on the sixth slider, the fourth conveyor belt is parallelly arranged with the unloading conveyor belt, the fourth conveyor belt is connected with the unloading rack, and the moving track of the seventh cylinder clamp is located on the unloading conveyor belt and the fourth conveyor belt.

[0011] Compared with the prior art, the utility model has the following beneficial effects:

[0012] Through the coordination of the loading module, the transplanting module and the unloading module, the chips can be loaded and unloaded manually instead of manually, and the chips can be automatically loaded and unloaded, and the loading and unloading tools can be reused, which greatly reduces the labor intensity and improves the production efficiency. Description of the drawings:

[0013] Figure 1 This is a schematic diagram of the structure of the semiconductor chip vacuum welding equipment of the utility model;

[0014] Figure 2 This is a schematic diagram of the structure of the feeding module of the utility model;

[0015] Figure 3 This is a schematic diagram of the structure of the transplanting module of the utility model;

[0016] Figure 4 This is a schematic diagram of the structure of the vacuum welding module of the utility model;

[0017] Figure 5 This is a schematic diagram of the front structure of the blanking module of the utility model;

[0018] Figure 6 It is a schematic diagram of the back structure of the blanking module of the utility model. Specific implementation method:

[0019] The specific implementation modes of the present invention are described in detail below, but it should be understood that the protection scope of the present invention is not limited by the specific implementation modes.

[0020] Unless explicitly stated otherwise, throughout the specification and claims, the term “comprise” or variations such as “include” or “comprising”, etc., will be understood to include the stated elements or components but not to exclude other elements or components.

[0021] like Figure 1 As shown, a semiconductor chip vacuum welding device comprises a loading module 1, a transplanting module 2, a vacuum welding module 3, and a unloading module 4; the loading module 1, the transplanting module 2, the vacuum welding module 3, and the unloading module 4 are all arranged on a rack table 5;

[0022] like Figure 2As shown, the feeding module 1 includes a lower tool transmission mechanism 10, an upper carrier machine clamping mechanism 11, and a mold closing feeding clamping mechanism 12. The upper carrier machine clamping mechanism 11 and the mold closing feeding clamping mechanism 12 are respectively arranged at the end of the lower tool transmission mechanism 10, wherein the upper carrier machine clamping mechanism 11 is arranged in parallel with the lower tool transmission mechanism 10, and the mold closing feeding clamping mechanism 12 is arranged vertically with the lower tool transmission mechanism 10; the lower tool transmission mechanism 10 includes a first conveyor belt 101, and the end of the first conveyor belt 101 serves as a mold closing station; the upper carrier machine clamping mechanism 11 includes a first bracket 110, a first servo motor 111, a first guide rail 112, a first slider 113, and a first cylinder clamp 114, the first bracket 110 is arranged on one side of the lower tool transmission mechanism 10, the first bracket 110 is provided with a first servo motor 111 and a first guide rail 112, and the first guide rail 112 is provided with a first slider 113 and a first cylinder clamp 114. A slider 113, a first servo motor 111 and the first slider 113 are connected by a transmission belt, a first cylinder clamp 114 is arranged on the first slider 113 so as to be liftable, and a moving track of the first cylinder clamp 114 is located between the mold clamping station and the unloading module 4; the mold clamping and feeding clamping mechanism 12 comprises a second bracket 120, a second servo motor 121, a second guide rail 122, a second slider 123, and a second cylinder clamp 124, the second bracket 120 is arranged on the inlet side of the vacuum welding module 3, a second servo motor 121 and a second guide rail 122 are arranged on the second bracket 120, a second slider 123 is arranged on the second guide rail 122, the second servo motor 121 and the second slider 123 are connected by a transmission belt, a second cylinder clamp 124 is arranged on the second slider 123, and a moving track of the second cylinder clamp 124 is located between the mold clamping station and the inlet of the vacuum welding module 3.

[0023] like Figure 3As shown, the transplanting module 2 includes a transplanting unit, which is symmetrically arranged below the vacuum welding module 3; the transplanting unit includes a lifting mechanism 20, a bottom plate 21, a third servo motor 22, a third guide rail 23, a moving plate 24, and a transplanting rod 25. The lifting mechanism 20 is arranged below the vacuum welding module 3, and the lifting mechanism 20 includes a seventh servo motor 200, a connecting plate 201, a seventh guide rail 202, a seventh slide plate 203, a step plate 204, a pulley mechanism 205, a support plate 206, and a top rod 207. The seventh servo motor 200 and the seventh guide rail 202 are arranged on the rack table 5, the seventh servo motor 200 is connected to the connecting plate 201 through a ball screw, the connecting plate 201 is connected to the seventh slide plate 203, the seventh slide plate 203 is arranged on the seventh guide rail 202, the seventh slide plate 203 is provided with a step plate 204, and the step plate 204 is slidably provided with A pulley mechanism 205, a support plate 206 is arranged on the top of the pulley mechanism 205, and top rods 207 are evenly distributed on the support plate 206, a bottom plate 21 is arranged on the support plate 206, a third servo motor 22 and a third guide rail 23 are arranged on the bottom plate 21, a movable plate 24 is arranged on the third guide rail 23, the third servo motor 22 is connected to the movable plate 24 through a ball screw, a transplanting rod 25 is arranged on the movable plate 24, the transplanting rod 25 extends to the inside of the vacuum welding module 3 through the inlet of the vacuum welding module 3, and each transplanting rod 25 is located above the corresponding top plate 207; a gap is left between the transplanting rods 25 of the two transplanting units; the transplanting rod 25 is driven by the third servo motor 22 to move in the vacuum welding module 3, and then the upper and lower tools and chips are driven to move; the height of the transplanting rod 25 is adjusted by the lifting mechanism 20 to ensure that the transplanting rod 25 does not drive the upper and lower tools and chips to move when it retreats.

[0024] like Figure 4 As shown, the vacuum welding module 3 includes a preheating zone 30, a heat preservation zone 31, a vacuum welding zone 32, a cooling zone 33, an electric heater, an upper vacuum cavity 34, a lower vacuum cavity 35, and a water cooling mechanism. The preheating zone 30 and the heat preservation zone 31 are provided with an electric heater, and the vacuum welding zone 32 is provided with an upper vacuum cavity 34 and a lower vacuum cavity 35. The upper vacuum cavity 34 is connected to an external vacuum generator, and the upper vacuum cavity 34 can be raised and lowered on the frame table 5. A sealing ring is provided in the cavity 34, and the upper vacuum cavity 34 and the lower vacuum cavity 35 are sealed by the sealing ring when they are closed. A water cooling mechanism is provided in the cooling zone 33; the preheating zone 30, the insulation zone 31, the vacuum welding zone 32, and the cooling zone 33 are all filled with nitrogen for protection; the preheating zone 30, the insulation zone 31, and the cooling zone 33 are all provided with exhaust fans for discharging the flux; the transplanting rods 25 of the two transplanting units extend to the vacuum welding zone 32 respectively, and a gap is left between the two transplanting rods 25.

[0025] like Figure 5-6As shown, the unloading module 4 includes a mold-closing unloading clamping mechanism 40, an upper carrier recycling transmission mechanism 41, a chip unloading mechanism 42, a lower tool recycling transmission mechanism 43, an unloading conveyor belt 44, and a fifth bracket 45. The mold-closing unloading clamping mechanism 40 is arranged at the outlet side of the vacuum welding module 3, and the mold-closing unloading clamping mechanism 40 is connected to the unloading conveyor belt 44. The upper carrier recycling transmission mechanism 41, the chip unloading mechanism 42, and the lower tool recycling transmission mechanism 43 are respectively arranged on both sides of the unloading conveyor belt 44, wherein the upper carrier recycling transmission mechanism 41 and the lower tool recycling transmission mechanism 43 are located on the same side; the mold-closing unloading clamping mechanism 40 includes a fourth bracket 400, a fourth servo motor 401, a fourth guide rail 402, a fourth slider 403, a first Four cylinder clamps 404, the fourth bracket 400 is arranged at the outlet side of the vacuum welding module 3, the fourth bracket 400 is provided with a fourth servo motor 401 and a fourth guide rail 402, the fourth guide rail 402 is provided with a fourth slider 403, the fourth servo motor 401 and the fourth slider 403 are connected by a transmission belt, the fourth slider 403 is provided with a fourth cylinder clamp 404, and the moving track of the fourth cylinder clamp 404 is located between the outlet of the vacuum welding module 3 and the initial end of the unloading conveyor belt 44; the upper carrier recycling transmission mechanism 41 includes a fifth servo motor 410, a fifth guide rail 411, a fifth slider 412, a fifth cylinder clamp 413, and a second conveyor belt 414, the fifth servo motor 410 and the fifth guide rail 411 are arranged The fifth bracket 45, the fifth slider 412 is arranged on the fifth guide rail 411, the fifth servo motor 410 is connected to the fifth slider 412 through a transmission belt, the fifth slider 412 is provided with a fifth cylinder clamp 413, the second conveyor belt 414 is vertically arranged with the unloading conveyor belt 44, and the moving track of the fifth cylinder clamp 413 is located on the unloading conveyor belt 44 and the second conveyor belt 414; the unloading tool return transmission mechanism 43 includes a sixth servo motor 430, a sixth guide rail 431, a sixth slider 432, a sixth cylinder clamp 433, and a third conveyor belt 434, the sixth servo motor 430 and the sixth guide rail 431 are arranged on the fifth bracket 45, the sixth slider 432 is arranged on the sixth guide rail 431, and the sixth servo motor 430 It is connected to the sixth slider 432 through a transmission belt, and a sixth cylinder clamp 433 is arranged on the sixth slider 432. The third conveyor belt 434 is arranged perpendicular to the unloading conveyor belt 44, and the third conveyor belt 434 is connected to the first conveyor belt 101. The moving trajectory of the sixth cylinder clamp 433 is located on the unloading conveyor belt 44 and the third conveyor belt 434; the chip unloading mechanism 42 includes a seventh cylinder clamp 420, a fourth conveyor belt 421, and an unloading rack 422. The seventh cylinder clamp 420 is arranged on the sixth slider 432, the fourth conveyor belt 421 is arranged parallel to the unloading conveyor belt 44, the fourth conveyor belt 421 is connected to the unloading rack 422, and the moving trajectory of the seventh cylinder clamp 420 is located on the unloading conveyor belt 44 and the fourth conveyor belt 421.

[0026] During production, you can select multi-carrier mode, single-carrier mode, and bare die mode as needed; when multi-carrier mode is selected, the equipment loads and unloads upper and lower tools and chips; when single-carrier mode is selected, the equipment loads and unloads lower tools and chips; when bare die mode is selected, the equipment loads and unloads chips.

[0027] When the multi-carrier mode is selected for production, the lower tool and the upper tool are transported to the mold closing station through the first conveyor belt 101 and the second conveyor belt 414 respectively, the first cylinder clamp 114 clamps the upper tool 6 on the second conveyor belt 414 and moves it above the mold closing station, the first cylinder clamp 114 descends to a suitable position to release the upper tool 6, the upper tool 6 covers the chip 8 on the top of the lower tool 7, the upper tool 6 and the lower tool 7 complete the mold closing of the chip 8, the second cylinder clamp 124 moves to the mold closing station to clamp the molded workpiece, and the second cylinder clamp 124 moves the molded workpiece to the true At the entrance of the vacuum welding module 3, the second cylinder clamp 124 places the molded workpiece on the moving rod 25, and the moving rod 25 of the transfer unit on the entrance side of the vacuum welding module 3 transports the molded workpiece to the vacuum welding module 3. The molded workpiece passes through the preheating zone 30 and the insulation zone 31 in a nitrogen atmosphere in turn. The heating temperature is 0-450°C, and the solder paste on the chip 8 gradually melts. The molded workpiece enters the vacuum welding zone 32, and the upper vacuum chamber 34 descends and closes with the lower vacuum chamber 35. The closed chamber is evacuated to extract the bubbles in the welding area on the surface of the chip 8 to complete the welding of the molded workpiece. The upper vacuum chamber 34 rises and separates from the lower vacuum chamber 35, the seventh servo motor 200 drives the seventh slide 203 to move, the pulley mechanism 205 of the transfer unit on the inlet side of the vacuum welding module 3 moves on the step plate 204 to lower the height, the top rod 207 descends to drive the moving rod 25 to descend, and the moving rod 25 of the transfer unit on the inlet side of the vacuum welding module 3 will not affect the movement of the mold workpiece during the retreat process, and the moving rod 25 of the transfer unit on the outlet side of the vacuum welding module 3 transports the mold workpiece to the outlet of the vacuum welding module 3 in the vacuum welding area 32, and the mold workpiece is cooled and output through the cooling area 33. The fourth cylinder clamp 404 clamps the molded workpiece and places it on the unloading conveyor belt 44. When the molded workpiece moves to the second conveyor belt 414 on the unloading conveyor belt 44, the fifth cylinder clamp 413 clamps the upper carrier 6 and places it on the second conveyor belt 414. The upper carrier 6 is transported to the molded station for reuse. When the molded workpiece moves to the third conveyor belt 434 on the unloading conveyor belt 44, the seventh cylinder clamp 420 clamps the chip 8 and places it on the fourth conveyor belt 421. The chip 8 is transported to the unloading rack 422 through the fourth conveyor belt 421 for unloading. The sixth cylinder clamp 433 clamps the lowering tool 7 and places it on the third conveyor belt 434. The lowering tool 7 flows to the first conveyor belt 101 through the third conveyor belt 434 for reuse. The loading module 1, the transplanting module 2, and the unloading module 4 cooperate to replace manual loading and unloading of the chip, realize automatic loading and unloading of the chip, and reuse of the upper and lower tools, which greatly reduces the labor intensity and improves the production efficiency.

[0028] The foregoing description of specific exemplary embodiments of the utility model is for the purpose of illustration and illustration. These descriptions are not intended to limit the utility model to the precise form disclosed, and it is clear that many changes and variations can be made based on the above teachings. The purpose of selecting and describing the exemplary embodiments is to explain the specific principles of the utility model and its practical application, so that those skilled in the art can realize and utilize various different exemplary embodiments of the utility model and various different options and changes. The scope of the utility model is intended to be defined by the claims and their equivalents.

Claims

1. A semiconductor chip vacuum welding device, characterized in that: It includes a loading module, a transplanting module, a vacuum welding module and a unloading module; the loading module, the transplanting module, the vacuum welding module and the unloading module are all arranged on the frame table; the loading module is connected with the transplanting module, and is used for the mold closing of the upper and lower tools and the loading of chips; the transplanting module is arranged below the vacuum welding module, and is used for driving the upper and lower tools and the chips through the vacuum welding module; the vacuum welding module is used for heating the chips, welding them in a vacuum environment, and cooling the welded chips; the unloading module is arranged at the outlet of the vacuum welding module, and the unloading module is connected with the loading module, and is used for separating and unloading the upper and lower tools and the chips, and reusing the upper and lower tools; the loading module, the transplanting module and the unloading module form a circulation channel.

2. The semiconductor chip vacuum welding equipment according to claim 1, characterized in that: The loading module includes a down-loader transmission mechanism, an upper-loader clamping mechanism, and a mold-closing loading clamping mechanism. The end of the down-loader transmission mechanism is respectively provided with an upper-loader clamping mechanism and a mold-closing loading clamping mechanism, wherein the upper-loader clamping mechanism is arranged in parallel with the down-loader transmission mechanism, and the mold-closing loading clamping mechanism is arranged vertically with the down-loader transmission mechanism; the down-loader transmission mechanism includes a first conveyor belt, and the end of the first conveyor belt serves as a mold-closing station; the upper-loader clamping mechanism includes a first bracket, a first servo motor, a first guide rail, a first slider, and a first cylinder clamp; the first bracket is arranged on one side of the down-loader transmission mechanism, the first bracket is provided with a first servo motor and a first guide rail, and the first guide rail is provided with The first slider, the first servo motor is connected to the first slider through a transmission belt, the first slider is provided with a first cylinder clamp which can be raised and lowered, and the moving track of the first cylinder clamp is located between the mold closing station and the unloading module; the mold closing and feeding clamping mechanism includes a second bracket, a second servo motor, a second guide rail, a second slider, and a second cylinder clamp, the second bracket is arranged on the inlet side of the vacuum welding module, the second bracket is provided with a second servo motor and a second guide rail, the second guide rail is provided with a second slider, the second servo motor is connected to the second slider through a transmission belt, the second slider is provided with a second cylinder clamp, and the moving track of the second cylinder clamp is located between the mold closing station and the inlet of the vacuum welding module.

3. The semiconductor chip vacuum welding equipment according to claim 2, characterized in that: The transplanting module includes a transplanting unit, which is symmetrically arranged below the vacuum welding module; the transplanting unit includes a lifting mechanism, a base plate, a third servo motor, a third guide rail, a moving plate, and a transplanting rod. The lifting mechanism is arranged below the vacuum welding module, the lifting mechanism is provided with a base plate, the base plate is provided with a third servo motor and a third guide rail, the moving plate is provided on the third guide rail, the third servo motor is connected to the moving plate through a ball screw, the moving plate is provided with a transplanting rod, and the transplanting rod extends to the inside of the vacuum welding module through the inlet of the vacuum welding module; a gap is left between the transplanting rods of the two transplanting units; the transplanting rod is driven to move in the vacuum welding module by the third servo motor, thereby driving the upper and lower tools and the chip to move; the height of the transplanting rod is adjusted by the lifting mechanism to ensure that the upper and lower tools and the chip are not driven to move when the transplanting rod is retracted.

4. The semiconductor chip vacuum welding equipment according to claim 3, characterized in that: The vacuum welding module includes a preheating zone, a heat preservation zone, a vacuum welding zone, a cooling zone, an electric heater, an upper vacuum cavity, a lower vacuum cavity, and a water cooling mechanism. The preheating zone and the heat preservation zone are provided with electric heaters. The vacuum welding zone is provided with an upper vacuum cavity and a lower vacuum cavity. The upper vacuum cavity is connected to an external vacuum generator. The upper vacuum cavity can be raised and lowered on the frame table. A sealing ring is provided in the upper vacuum cavity. The upper vacuum cavity and the lower vacuum cavity are sealed by the sealing ring when they are closed. A water cooling mechanism is provided in the cooling zone. The preheating zone, the heat preservation zone, the vacuum welding zone, and the cooling zone are all filled with nitrogen for protection. The transplanting rods of the two transplanting units extend to the vacuum welding zone respectively, and a gap is left between the two transplanting rods.

5. The semiconductor chip vacuum welding equipment according to claim 4, characterized in that: The unloading module includes a mold closing unloading clamping mechanism, an upper carrier recycling transmission mechanism, a chip unloading mechanism, a lower tool recycling transmission mechanism, an unloading conveyor belt, and a fifth bracket. The mold closing unloading clamping mechanism is arranged at the outlet side of the vacuum welding module, and the mold closing unloading clamping mechanism is connected to the unloading conveyor belt. The upper carrier recycling transmission mechanism, the chip unloading mechanism, and the lower tool recycling transmission mechanism are respectively arranged on both sides of the unloading conveyor belt, wherein the upper carrier recycling transmission mechanism and the lower tool recycling transmission mechanism are located on the same side; the mold closing unloading clamping mechanism includes a fourth bracket, a fourth servo motor, and a first The fourth guide rail, the fourth slider, the fourth cylinder clamp, the fourth bracket is arranged on the outlet side of the vacuum welding module, the fourth bracket is provided with a fourth servo motor and a fourth guide rail, the fourth slider is provided on the fourth guide rail, the fourth servo motor and the fourth slider are connected by a transmission belt, the fourth slider is provided with a fourth cylinder clamp, and the moving track of the fourth cylinder clamp is located between the outlet of the vacuum welding module and the initial end of the unloading conveyor belt; the upper carrier recycling transmission mechanism includes a fifth servo motor, a fifth guide rail, a fifth slider, a fifth cylinder clamp, and a second conveyor belt, the fifth servo motor and the fifth guide rail are arranged on the fifth bracket, the fifth slider is arranged on the fifth guide rail, the fifth servo motor and the fifth slider are connected by a transmission belt, the fifth slider is provided with a fifth cylinder clamp, the second conveyor belt is arranged vertically with the unloading conveyor belt, and the moving track of the fifth cylinder clamp is located on the unloading conveyor belt and the second conveyor belt; the lower carrier recycling transmission mechanism includes a sixth servo motor, a sixth guide rail, a sixth slider, a sixth cylinder clamp, and a third conveyor belt, the sixth servo motor and the sixth guide rail are arranged on the fifth bracket, the sixth slider is arranged on the sixth guide rail, the sixth servo motor and the sixth slider are connected by a transmission belt, the sixth servo motor and the sixth slider are provided with ... The servo motor is connected to the sixth slider through a transmission belt, the sixth slider is provided with a sixth cylinder clamp, the third conveyor belt is vertically arranged with the unloading conveyor belt, the third conveyor belt is connected with the first conveyor belt, and the moving track of the sixth cylinder clamp is located on the unloading conveyor belt and the third conveyor belt; the chip unloading mechanism includes a seventh cylinder clamp, a fourth conveyor belt, and an unloading rack, the seventh cylinder clamp is arranged on the sixth slider, the fourth conveyor belt is parallelly arranged with the unloading conveyor belt, the fourth conveyor belt is connected with the unloading rack, and the moving track of the seventh cylinder clamp is located on the unloading conveyor belt and the fourth conveyor belt.

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