Turnover grinding device for multilayer board processing
By designing a multi-layer plate processing and flip-floping grinding device including electric telescopic rods, vertical plates, rotating shafts, clamping devices and springs, the possible shaking problems of multi-layer plates during grinding are solved, and the grinding effect and efficiency are improved.
Patent Information
- Application Number
- CN202421061800.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-16
- Publication Date
- 2025-04-29
- Estimated Expiration
- 2034-05-16
AI Technical Summary
When the existing multi-layer board processing flip-flop grinding device grinding the surface of multi-layer boards of different thicknesses, the downforce may cause the multi-layer board to shake, affect the grinding effect and reduce efficiency.
A multi-layer board processing and flip-flop grinding device is designed. Through structures such as electric telescopic rods, vertical plates, rotating shafts, clamping devices and springs, the multi-layer boards are stably clamped and fixed to prevent shaking.
It effectively prevents the multi-layer board from shaking during the grinding process, improves the grinding effect of the surface of multi-layer boards of different thicknesses, and improves the grinding efficiency of multi-layer boards.
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Figure CN222806668U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of multilayer board processing, and more specifically to a multilayer board processing flip-over grinding device. Background Art
[0002] Multilayer board is also called plywood. It is made by selecting high-quality regular wood as the panel, applying resin glue, and then making it under high temperature and high pressure in a hot press. Now the application of multilayer board is more and more extensive. The design and installation of various cabinets all use multilayer board as the base material. After the processing of multilayer board is completed, the surface of the multilayer board needs to be polished. A polishing device is required for polishing the surface of the multilayer board.
[0003] Chinese patent application number CN202320199339.3 discloses a multi-layer board processing flip-over grinding device, including a workbench and a clamping plate, the left and right ends of the workbench are fixedly connected with electric push rods, the left end of the left electric push rod is provided with a torsion bar, the right end of the torsion bar is fixedly connected with a rotating rod, the driving ends of the electric push rods are rotatably connected to the outer diameter of the rotating rod, the inner end of the rotating rod is fixedly connected to a first fixed plate, the inner wall of the first fixed plate is provided with a sliding groove, the inner wall of the sliding groove is slidably connected to two sliding blocks, and the inner ends of the two sliding blocks are respectively fixedly connected to the left and right ends of the clamping plate;
[0004] In the above technical solution, the purpose of clamping multilayer boards of different widths is achieved through structures such as torsion bars, clamping plates and tension springs. However, the existing multilayer boards have diversified specifications. Due to different market demands, the production thickness of multilayer boards is also different. Although the above clamping device can clamp multilayer boards of different widths, when grinding the surfaces of multilayer boards of different thicknesses, the grinding device has a downward pressure, so that the grinding device and the surface of the multilayer board are tightly fitted. During the operation of the grinding device, the downward pressure may cause the multilayer board to shake, affecting the grinding effect of the surfaces of the multilayer boards of different thicknesses and reducing the grinding efficiency of the multilayer boards. Utility Model Content
[0005] The purpose of the utility model is to provide a multi-layer board processing and flipping grinding device to solve the problems raised in the above background technology:
[0006] Although the existing clamping device can clamp multilayer boards of different widths, when grinding the surfaces of multilayer boards of different thicknesses, the grinding device has a downward pressure, which makes the grinding device fit tightly against the surface of the multilayer board. During the operation of the grinding device, the downward pressure may cause the multilayer board to shake, affecting the grinding effect of the surfaces of the multilayer boards of different thicknesses and reducing the grinding efficiency of the multilayer boards.
[0007] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0008] 7. The swiftly and minutely adjusting device for a wood-planer working table as claimed in claim 1, wherein the first and second sliding blocks are respectively provided with a pendulum, a pendulum being connected to the bottom of the pendulum and a pendulum being connected to the bottom of the pendulum.
[0009] Preferably, the second spring is sleeved on the surface of the guide column, and two ends of the second spring are fixedly connected to the surfaces of the clamping plate and the rotating rod respectively.
[0010] Preferably, a first spring is elastically connected between the movable column and the movable groove, and two ends of the first spring are fixedly connected to the bottom surface of the movable column and the inner wall of the movable groove respectively.
[0011] Preferably, a screw rod is rotatably connected inside the slide groove, the first slider and the second slider are slidably connected on the surface of the screw rod, a motor is fixedly mounted on the side surface of the base, and the output end of the motor is fixedly connected to one end of the screw rod.
[0012] Preferably, a multi-directional movable frame is provided on the surface of the base, a bracket is provided above the base, the bracket is movably connected to the base through the multi-directional movable frame, and the grinding device body is fixedly connected to the bracket.
[0013] Preferably, a motor is fixedly mounted on the surface of one of the vertical plates, one end of the motor is fixedly connected to one of the rotating shafts, and a placing table is fixedly mounted on the middle surface of the base.
[0014] Preferably, a rubber pad is fixedly connected to the surface of the clamping plate.
[0015] Compared with the prior art, the beneficial effects of the utility model are:
[0016] 1) When the multi-layer board processing flip-over grinding device is in use, the electric telescopic rod is adjusted to extend and retract so that the vertical board moves with the clamping device. When the movable column is adjusted to be flush with the end of the multi-layer board, the screw rod rotates to make the first slider and the second slider move toward each other and move with the electric telescopic rod. At this time, the two clamping devices move toward each other to clamp the multi-layer board. In the process of clamping the multi-layer board, the movable column is squeezed by the end of the multi-layer board and moves toward the inside of the movable groove. At this time, the slide bar moves in the groove. Since the rotating rod is rotatably connected with the rotating groove, the rotating rod rotates and moves the clamping plates. The two pairs of clamping plates move to clamp and fix the upper and lower surfaces of the two ends of the multi-layer board. In the grinding process, the multi-layer board is prevented from shaking, which improves the grinding effect of the surfaces of multi-layer boards with different thicknesses and improves the grinding efficiency of the multi-layer boards.
[0017] 2) When the multi-layer board processing flip-over grinding device is in use, the surface of the clamping plate is fixedly connected with a rubber pad, and the two clamping devices move towards each other to clamp the multi-layer board. During the clamping process of the multi-layer board, the rotating rod rotates to move the clamping plate, and the two pairs of clamping plates move to clamp and fix the upper and lower surfaces of both ends of the multi-layer board. Since the surface of the clamping plate is fixedly connected with the rubber pad, during the clamping process of the multi-layer board, indentations on the surface of the multi-layer board can be prevented, thereby ensuring the beauty of the multi-layer board. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0019] Figure 2 This is a schematic diagram of the structure of the grinding device of the utility model;
[0020] Figure 3 This is a schematic diagram of the structure of the clamping device of the utility model;
[0021] Figure 4 It is a schematic diagram of the movable column structure of the utility model.
[0022] Explanation of the numbers in the figure: 1. base; 2. slide groove; 3. first slider; 4. second slider; 5. electric telescopic rod; 6. vertical plate; 7. rotating shaft; 8. clamping device; 9. rotating groove; 10. movable groove; 11. movable column; 12. first spring; 13. slide rod; 14. rotating rod; 15. notch; 16. clamping plate; 17. guide column; 18. second spring; 19. screw rod; 20. motor; 21. bracket; 22. grinding device body; 23. placing table; 24. motor; 25. rubber pad. DETAILED DESCRIPTION
[0023] Example 1: Although the existing clamping device can clamp multilayer boards of different widths, when grinding the surfaces of multilayer boards of different thicknesses, the grinding device has a downward pressure, which makes the grinding device fit tightly against the surface of the multilayer board. During the operation of the grinding device, the downward pressure may cause the multilayer board to shake, affecting the grinding effect of the surfaces of the multilayer boards of different thicknesses and reducing the grinding efficiency of the multilayer boards. This problem is solved by the following solution.
[0024] See also Figures 1 to 4 A multi-layer board processing and flip-over grinding device comprises a base 1, a slide groove 2 is provided on the surface of the base 1, a first slider 3 and a second slider 4 are slidably connected inside the slide groove 2, an electric telescopic rod 5 is fixedly installed on the end surfaces of the first slider 3 and the second slider 4, the electric telescopic rod 5 is a conventional electric control push rod in the prior art, the telescopic ends of the two electric telescopic rods 5 are fixedly connected to a vertical plate 6, the surfaces of the two vertical plates 6 are rotatably connected to a rotating shaft 7, the surfaces of the two rotating shafts 7 are fixedly connected to a clamping device 8, and the clamping device 8 For clamping the multilayer board, the surface of the clamping device 8 is respectively provided with a rotating groove 9 and a movable groove 10, the inside of the movable groove 10 is slidably connected with a movable column 11 matching therewith, the inside of the rotating groove 9 is correspondingly slidably connected with a rotating rod 14, the inner side of the rotating rod 14 is provided with a notch 15, the surface of the movable column 11 is fixedly connected with a sliding rod 13, one end of the sliding rod 13 extends to the inside of the notch 15, and the sliding rod 13 fits with the notch 15, a clamping plate 16 is provided on the inner side of the rotating rod 14, and the surface of the rotating rod 14 is correspondingly slidably connected with two guide columns 17, the bottom surface of the guide column 17 is fixedly connected to the end surface of the clamping plate 16, and the second spring 18 is elastically connected between the clamping plate 16 and the rotating rod 14. A grinding device body 22 is arranged above the base 1. The grinding device body 22 is a conventional grinding device in the prior art. By adjusting the extension of the electric telescopic rod 5, the vertical plate 6 moves with the clamping device 8. When the movable column 11 is adjusted to be flush with the end of the multilayer board, the screw 19 rotates to make the first slider 3 and the second slider 4 move toward each other and move with the electric telescopic rod 5. At this time, the two clamps The holding devices 8 move towards each other to clamp the multilayer board. During the clamping process, the movable column 11 is squeezed by the end of the multilayer board and moves toward the inside of the movable groove 10. At this time, the slide bar 13 moves in the groove 15. Since the rotating rod 14 is rotatably connected to the rotating groove 9, the rotating rod 14 rotates with the clamping plate 16 to move. The two pairs of clamping plates 16 move to clamp and fix the upper and lower surfaces of the two ends of the multilayer board. During the grinding process, the multilayer board is prevented from shaking, the grinding effect of the surfaces of the multilayer boards with different thicknesses is improved, and the grinding efficiency of the multilayer boards is improved.
[0025] The second spring 18 is sleeved on the surface of the guide pillar 17 , and the two ends of the second spring 18 are fixedly connected to the surfaces of the clamping plate 16 and the rotating rod 14 respectively. The second spring 18 makes the clamping plate 16 fit the multilayer board.
[0026] A first spring 12 is elastically connected between the movable column 11 and the movable groove 10 . Two ends of the first spring 12 are fixedly connected to the bottom surface of the movable column 11 and the inner wall of the movable groove 10 , respectively. The first spring 12 is used for resetting the movable column 11 .
[0027] The inside of the slide groove 2 is rotatably connected with a screw rod 19, the first slider 3 and the second slider 4 are slidably connected on the surface of the screw rod 19, the screw rod 19 is a conventional bidirectional screw rod 19 in the prior art, and a motor 20 is fixedly installed on the side surface of the base 1. The motor 20 is a conventional forward and reverse motor 20 in the prior art. The output end of the motor 20 is fixedly connected to one end of the screw rod 19, and the first slider 3 and the second slider 4 move in opposite directions on the surface of the screw rod 19.
[0028] The surface of the base 1 is provided with a multi-directional movable frame, and a bracket 21 is provided above the base 1. The bracket 21 is movably connected to the base 1 through the multi-directional movable frame. The grinding device body 22 is fixedly connected to the bracket 21, and the grinding device body 22 grinds the surface of the multilayer board.
[0029] A motor 24 is fixedly installed on the surface of one of the vertical plates 6. The motor 24 is a conventional motor 24 in the prior art. One end of the motor 24 is fixedly connected to one of the rotating shafts 7. A placement table 23 is fixedly installed on the middle surface of the base 1. The placement table 23 is used for placing the multilayer board. The rotation of the motor 24 causes the clamping device 8 to rotate to realize the flipping of the multilayer board.
[0030] The use steps of the utility model are as follows: when the multi-layer board processing flip-over grinding device is used, when grinding the surface of multi-layer boards of different thicknesses, firstly, the multi-layer boards of different thicknesses are placed on the surface of the placing table 23, and the electric telescopic rod 5 is adjusted to extend and retract, so that the vertical plate 6 moves with the clamping device 8 to adjust the position, and when the movable column 11 is adjusted to be flush with the end of the multi-layer board, the motor 20 works and drives the screw rod 19 to rotate, so that the first slider 3 and the second slider 4 move toward each other and drive the electric telescopic rod 5 to move, and at this time, the two clamping devices 8 move toward each other to clamp the multi-layer board, and in the process of clamping the multi-layer board, the movable column 11 is squeezed by the end of the multi-layer board and moves toward the inside of the movable groove 10 to compress the first spring 12, and at this time, the slide bar 13 moves in the notch 15, and because the rotating rod 14 is rotatably connected to the rotating groove 9, the rotating rod 14 rotates and drives the clamping plate 16 to move, and the two pairs of clamping plates 16 move to clamp and fix the upper and lower surfaces of the two ends of the multi-layer board, At this time, the second spring 18 is compressed, and the grinding device body 22 works to grind the surfaces of multilayer boards of different thicknesses. This scheme adjusts the extension and retraction of the electric telescopic rod 5 so that the vertical plate 6 moves with the clamping device 8. When the movable column 11 is adjusted to be flush with the end of the multilayer board, the screw rod 19 rotates to make the first slider 3 and the second slider 4 move toward each other and move with the electric telescopic rod 5. At this time, the two clamping devices 8 move toward each other to clamp the multilayer board. In the process of clamping the multilayer board, the movable column 11 is squeezed by the end of the multilayer board and moves toward the inside of the movable groove 10. At this time, the slide bar 13 moves in the groove 15. Since the rotating rod 14 is rotatably connected to the rotating groove 9, the rotating rod 14 rotates and moves the splint 16. The two pairs of splints 16 move to clamp and fix the upper and lower surfaces of the two ends of the multilayer board. During the grinding process, the multilayer board is prevented from shaking, which improves the grinding effect of the surfaces of multilayer boards of different thicknesses and the grinding efficiency of the multilayer boards.
[0031] Embodiment 2: When the clamping device 8 clamps the multilayer board, in order to prevent indentations from appearing on the surface of the multilayer board, the problem is solved by the following solution.
[0032] See also Figure 3 and Figure 4 The difference in the basis of the combined implementation is that a rubber pad 25 is fixedly connected to the surface of the clamping plate 16, and the two clamping devices 8 move toward each other to clamp the multilayer board. During the clamping of the multilayer board, the rotating rod 14 rotates to move the clamping plate 16, and the two pairs of clamping plates 16 move to clamp and fix the upper and lower surfaces of the two ends of the multilayer board. Since the surface of the clamping plate 16 is fixedly connected to the rubber pad 25, during the clamping of the multilayer board, indentations on the surface of the multilayer board can be prevented, thereby ensuring the beauty of the multilayer board.
[0033] The use steps of the utility model are as follows: when the multi-layer board processing flip-over grinding device is in use, the two clamping devices 8 move toward each other to clamp the multi-layer board. During the clamping process of the multi-layer board, the rotating rod 14 rotates to move the clamping plate 16. The two pairs of clamping plates 16 move to clamp and fix the upper and lower surfaces of the two ends of the multi-layer board. Since the surface of the clamping plate 16 is fixedly connected with the rubber pad 25, the surface of the multi-layer board can be prevented from being indented during the clamping process of the multi-layer board, thereby ensuring the beauty of the multi-layer board.
[0034] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.
Claims
1. A multi-layer board processing and flip-over grinding device, comprising a base (1), characterized in that: The surface of the base (1) is provided with a slide groove (2), the interior of the slide groove (2) is correspondingly slidably connected with a first slider (3) and a second slider (4), the end surfaces of the first slider (3) and the second slider (4) are both fixedly mounted with electric telescopic rods (5), the telescopic ends of the two electric telescopic rods (5) are both fixedly connected with vertical plates (6), the surfaces of the two vertical plates (6) are both rotatably connected with rotating shafts (7), the surfaces of the two rotating shafts (7) are both fixedly connected with clamping devices (8), the surfaces of the clamping devices (8) are respectively provided with rotating grooves (9) and movable grooves (10), the interior of the movable grooves (10) is slidably connected with movable columns (11) matching therewith, the rotating grooves (9) ) is slidably connected to a rotating rod (14) in its interior, a notch (15) is provided on the inner side of the rotating rod (14), a sliding rod (13) is fixedly connected to the surface of the movable column (11), one end of the sliding rod (13) extends into the notch (15), and the sliding rod (13) fits the notch (15), a clamping plate (16) is provided on the inner side of the rotating rod (14), two guide columns (17) are slidably connected to the surface of the rotating rod (14), the bottom surface of the guide column (17) is fixedly connected to the end surface of the clamping plate (16), a second spring (18) is elastically connected between the clamping plate (16) and the rotating rod (14), and a grinding device body (22) is provided above the base (1).
2. The device for turning over and grinding a multi-layer board according to claim 1, characterized in that: The second spring (18) is sleeved on the surface of the guide column (17), and the two ends of the second spring (18) are respectively fixedly connected to the surfaces of the clamping plate (16) and the rotating rod (14).
3. The device for turning over and grinding a multi-layer board according to claim 1, characterized in that: A first spring (12) is elastically connected between the movable column (11) and the movable groove (10), and two ends of the first spring (12) are respectively fixedly connected to the bottom surface of the movable column (11) and the inner wall of the movable groove (10).
4. The device for turning over and grinding a multi-layer board according to claim 1, characterized in that: A screw rod (19) is rotatably connected inside the slide groove (2), the first slider (3) and the second slider (4) are slidably connected on the surface of the screw rod (19), and a motor (20) is fixedly mounted on the side surface of the base (1), and the output end of the motor (20) is fixedly connected to one end of the screw rod (19).
5. The device for turning over and grinding a multi-layer board according to claim 1, characterized in that: A multi-directional movable frame is provided on the surface of the base (1), a bracket (21) is provided above the base (1), the bracket (21) is movably connected to the base (1) via the multi-directional movable frame, and the grinding device body (22) is fixedly connected to the bracket (21).
6. The device for turning over and grinding a multi-layer board according to claim 1, characterized in that: A motor (24) is fixedly mounted on the surface of one of the vertical plates (6), one end of the motor (24) is fixedly connected to one of the rotating shafts (7), and a placement table (23) is fixedly mounted on the middle surface of the base (1).
7. The device for turning over and grinding a multi-layer board according to claim 1, characterized in that: A rubber pad (25) is fixedly connected to the surface of the clamping plate (16).
Citation Information
Patent Citations
Turnover grinding device for multilayer board processing
CN219275366U