Edge polishing device for single wafer

Abstract

The utility model discloses an edge polishing device for a single wafer, and relates to the technical field of wafer polishing, the edge polishing device comprises a base and a wafer body, the top end of the base is provided with an L-shaped rod I and an L-shaped rod II, the bottom end of the L-shaped rod I is fixedly connected with a connecting rod, and the bottom end of the L-shaped rod II is fixedly connected with the wafer body. The top of the end, away from the grinding dresser, of the connecting rod is fixedly connected with the grinding dresser, a grinding wheel is arranged at the top end of the grinding dresser, and the grinding dresser is used for grinding the grinding wheel. The grinding wheel dresser has the main advantages that the grinding wheel can be dressed continuously through the grinding wheel and the grinding dresser, so that the sharpness of the surface of the grinding wheel is maintained, and the continuous efficient cutting capacity is ensured. The accuracy of the geometrical shape of the grinding wheel can be kept through continuous dressing, and the size and shape precision of a workpiece is ensured. And the surface roughness of the workpiece is reduced, and machining defects are reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of round wafer grinding, in particular to an edge grinding device for a single wafer. Background Art

[0002] Wafer edge grinding is an important step in the semiconductor manufacturing process. Its purpose is to remove defects on the wafer edge and improve the strength and stability of the wafer. It can remove micro cracks and defects caused by cutting. It can improve the strength of the wafer and reduce the risk of breakage in subsequent processing. It can also improve the shape of the wafer edge for subsequent processing.

[0003] In the existing process of wafer polishing, it is generally done through mechanized uniform cutting and polishing. However, after the polishing is completed, due to the process-based production, some wafers may not be fully polished, resulting in wafer waste.

[0004] The above solution may cause the problem of incomplete polishing of individual wafers. By installing a grinding wheel at a fitting position on the side of the device, and then allowing the grinding wheel to rotate on itself and around the wafer, the problem of unpolished single wafers can be solved.

[0005] However, in the process of grinding a single wafer, since the grinding wheel is always in a fixed state, it is extremely inconvenient to replace it, so the grinding wheel cannot always maintain effective cutting performance and shape accuracy, resulting in the inability to effectively remove excess material on the side of the wafer, resulting in a rough machined surface and inaccurate dimensions, affecting the quality and accuracy of the workpiece. Moreover, a grinding wheel that has lost its cutting performance may cause the workpiece to overheat, causing thermal damage, thereby reducing the mechanical properties and life of the workpiece. Utility Model Content

[0006] The utility model aims to solve the shortcomings in the prior art and proposes an edge grinding device for a single wafer, which solves the technical problem that the existing grinding wheel cannot always maintain effective cutting performance and shape accuracy.

[0007] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0008] A single wafer edge grinding device comprises a base and a wafer body, wherein the top of the base is provided with an L-shaped rod 1 and an L-shaped rod 2, the bottom end of the L-shaped rod 1 is fixedly connected with a connecting rod, the top of the connecting rod away from the grinding dresser is fixedly connected with the grinding dresser, the top of the grinding dresser is provided with a grinding wheel, and the grinding dresser is used to grind the grinding wheel, so as to maintain the cutting performance and shape accuracy of the grinding wheel.

[0009] As a further improvement of the present invention, the grinding wheel is rotatably connected to a rotating rod at one side close to the L-shaped rod, the rotating rod is fixedly connected to the surface of the L-shaped rod at one end away from the grinding wheel, and the grinding wheel is fixedly connected to a meshing fixing tube at one side away from the rotating rod. Thus, the wafer body can be ground and the grinding mechanism and the wafer body can be prevented from being offset.

[0010] As a further improvement of the utility model, an engagement rod is engaged inside the engagement fixing tube at the side away from the grinding wheel, a second motor is arranged at the side of the engagement rod away from the engagement fixing tube, and a side of the second motor away from the engagement rod is fixedly connected to the side of the second L-shaped rod. Thus, the grinding mechanism can be started after the wafer body is fixed.

[0011] As a further improvement of the present invention, the top of the base is fixedly connected to a motor 1, the output end of the motor 1 is fixedly connected to a connecting column, the L-shaped rod 1 is fixedly connected to the side of the connecting column, and the side of the connecting column away from the motor 1 is rotatably connected to an extrusion piece 1. Thus, the wafer body can be driven to rotate around the central axis of the motor 1.

[0012] As a further improvement of the present invention, the side of the L-shaped rod 2 close to the extrusion piece 1 is rotatably connected to the extrusion piece 2, the section of the L-shaped rod 2 away from the extrusion piece 2 is fixedly connected to the plug-in sliding rod, the top of the plug-in sliding rod is fixedly connected to the inside of the spring 1, and the top of the spring 1 is fixedly connected to the triangular block. Thus, the extrusion piece 1 and the extrusion piece 2 can be clamped after being close to the wafer body.

[0013] As a further improvement of the present invention, a manual pressing rod is inserted into the interior of the L-shaped rod 1, and springs 2 are fixedly connected to the four corners of the top surface of the bottom end of the manual pressing rod, and the top ends of the four springs 2 are fixedly connected to the inner wall of the L-shaped rod 1. Thus, the extrusion piece 1 and the extrusion piece 2 can be separated after the grinding is completed.

[0014] As a further improvement of the present invention, the extrusion piece 1 and the extrusion piece 2 are both designed as soft pads on the side close to each other, thereby preventing damage to the wafer body.

[0015] As a further improvement of the present invention, the material used for the grinding and dressing device is diamond material, so that the grinding wheel can have better grinding performance.

[0016] Compared with the prior art, the utility model has the following beneficial effects:

[0017] 1. The grinding wheel and the grinding dresser are used to drive the grinding wheel to rotate through the motor 2. Since the grinding dresser is always at the bottom of the grinding wheel, the grinding wheel can be continuously dressed to maintain the sharpness of the grinding wheel surface and ensure continuous and efficient cutting ability. Through continuous dressing, the geometric shape accuracy of the grinding wheel can be maintained to ensure the size and shape accuracy of the workpiece. It also reduces the surface roughness of the workpiece and reduces the occurrence of processing defects. It also prevents excessive wear of the grinding wheel, thereby reducing the replacement frequency, reducing costs, and reducing the downtime caused by the need to replace the grinding wheel due to the decline in performance, thereby maintaining stable processing efficiency. It also improves the processing accuracy, reduces the rate of defective products, and improves the overall production quality.

[0018] 2. Through motor 1, L-shaped rod 1, L-shaped rod 2 and motor 2, motor 1 drives L-shaped rod 1 and L-shaped rod 2 to rotate, and motor 2 drives the grinding wheel to rotate, so that when grinding the wafer body, the grinding wheel can rotate and grind while revolving around the wafer body. The combined movement of the grinding wheel rotating and revolving around the wafer body can make the grinding process more uniform, ensuring that the entire side of the wafer body can be fully ground to avoid local excessive wear or insufficient grinding. Moreover, simultaneous rotation and revolving grinding can increase the grinding area, improve grinding efficiency, shorten processing time, and improve production efficiency. This combined movement can reduce the unevenness of the grinding surface, reduce surface roughness, improve processing quality, and make the surface of the wafer body smoother and more uniform. Moreover, uniform grinding is conducive to reducing the wear of the grinding wheel, extending the service life of the tool, and reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of the utility model.

[0020] Figure 2 It is a schematic diagram of the structure of motor 1, extrusion piece 1 and extrusion piece 2 in the utility model.

[0021] Figure 3 For this utility model Figure 2 Schematic diagram of the structure in the separated state.

[0022] Figure 4 It is a schematic diagram of the front cross-sectional structure of the L-shaped rod and the plug-in sliding rod in the utility model.

[0023] In the figure: 101, base; 102, motor 1; 103, connecting column; 104, L-shaped rod 1; 105, extrusion piece 1; 106, extrusion piece 2; 107, L-shaped rod 2; 108, plug-in sliding rod; 109, spring 1; 110, triangular block; 111, manual pressing rod; 112, spring 2; 201, rotating rod; 202, grinding wheel; 203, connecting rod; 204, grinding dresser; 205, meshing fixing tube; 206, meshing rod; 207, motor 2; 300, wafer body. DETAILED DESCRIPTION

[0024] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation of the utility model is described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific implementation disclosed below.

[0025] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0026] As shown in the figure, a single wafer edge grinding device includes an L-shaped rod 104, a grinding wheel 202, a connecting rod 203, a grinding dresser 204, an engaging fixing tube 205, an engaging rod 206 and a motor 207.

[0027] When the extrusion piece 105 and the extrusion piece 2 106 are close to each other to fix the wafer body 300, the L-shaped rod 104 and the L-shaped rod 2 107 are close to each other, so that the meshing rod 206 fixed on the side of the motor 207 is meshed with the inside of the meshing fixing tube 205. Since the meshing rod 206 is fixedly connected to the output shaft of the motor 207, when the motor 207 is started, the meshing rod 206 is driven to rotate, thereby driving the meshing fixing tube 205 to rotate. The end of the connecting rod 203 is fixedly connected to the side of the grinding wheel 202, and the rotating rod 201 that is rotatably connected to the other end of the grinding wheel 202 is fixedly connected to the side of the L-shaped rod 104. Since the connecting rod 203 that is fixedly connected to the bottom end of the L-shaped rod 104 and the grinding dresser 204 that is fixedly connected to the other end fits the bottom end of the grinding wheel 202, when the grinding wheel 202 rotates, the grinding dresser 204 can achieve the effect of continuously dressing the grinding wheel 202, thereby maintaining the sharpness of the surface of the grinding wheel 202 and ensuring continuous and efficient cutting capabilities. Through continuous dressing, the geometric shape accuracy of the grinding wheel 202 can also be maintained to ensure the size and shape accuracy of the workpiece.

[0028] When the extrusion piece 105 and the extrusion piece 2 106 are manually controlled to approach each other to fix the wafer body 300, the plug-in sliding rod 108 fixedly connected to the side of the L-shaped rod 2 107 will be inserted into the L-shaped rod 104. When the plug-in sliding rod 108 moves along the inside of the grinding wheel 202, the spring 109 and the triangular block 110 fixed on the top of the plug-in sliding rod 108 will be in a normalized state. When the extrusion piece 105 and the extrusion piece 2 106 are completely fitted together, the triangular block 110 will be pressed downwards under the internal notch design of the L-shaped rod 104, so that the spring 109 will be elastically deformed. When the triangular block 110 moves to the bottom of the manual pressing rod 111, the spring 109 will be deformed. At this time, the triangular block 110 will be fixed into the inner groove of the L-shaped rod 104 under the rebound of the spring 109, so as to achieve the effect of fixing the extrusion piece 105 and the extrusion piece 2 106. When the polished wafer body 300 needs to be taken out, the manual pressing rod 111 is manually pressed to make the spring 2 112 elastically deform. At this time, under the pressure of the manual pressing rod 111, the triangular block 110 squeezes the spring 109 to move into the L-shaped rod 104. When the triangular block 110 completely enters the L-shaped rod 104, the L-shaped rod 104 and the L-shaped rod 2 107 are pulled to separate the extrusion piece 105 and the extrusion piece 2 106, so as to achieve the removal of the wafer body 300.

[0029] As a result, the wafer body 300 will be fixed. During the grinding process, the wafer body 300 needs to remain stable to ensure processing accuracy. Completely fixing the wafer body 300 can avoid processing errors caused by movement or shaking of the wafer body 300, ensuring the precision and accuracy of processing. In addition, the wafer body 300 is a very expensive and fragile item. If it is not fixed during grinding, the wafer body 300 is prone to shifting or breaking, which will cause processing failure or even damage to the equipment. Fixing the wafer body 300 can effectively avoid this situation.

[0030] Furthermore, when the motor 102 and the motor 207 are started, the output shaft of the motor 102 is fixedly connected to the connecting column 103, thereby driving the L-shaped rod 104 to rotate through the connecting column 103. At this time, the L-shaped rod 104 and the L-shaped rod 2 107 are fixed by the spring 109, and the connecting column 103 and the L-shaped rod 2 107 are respectively connected to the extrusion piece 105 and the extrusion piece 2 106, so that the grinding wheel 202 that is driven to rotate is circularly moved along the outside of the wafer body 300. Through the combined movement of the grinding wheel 202 rotating and revolving around the wafer body 300, the grinding process can be made more uniform, ensuring that the entire side of the wafer body 300 can be fully ground, avoiding the situation of local excessive wear or insufficient grinding. Moreover, the simultaneous rotation and revolving grinding can increase the grinding area, improve the grinding efficiency, shorten the processing time, and improve the production efficiency.

[0031] The advantages of the utility model are: 1) The grinding dresser 204 can achieve the effect of continuous dressing of the grinding wheel 202, thereby maintaining the sharpness of the surface of the grinding wheel 202 and ensuring continuous efficient cutting ability. 2) The wafer body 300 can be fixed. During the grinding process, the wafer body 300 needs to remain stable to ensure processing accuracy. Completely fixing the wafer body 300 can avoid processing errors caused by movement or shaking of the wafer body 300, ensuring the precision and accuracy of processing. 3) Through the combined movement of the grinding wheel 202 rotating on its own and revolving around the wafer body 300, the grinding process can be made more uniform, ensuring that the entire side of the wafer body 300 can be fully ground, avoiding local excessive wear or insufficient grinding.

[0032] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A single wafer edge grinding device, comprising a base (101) and a wafer body (300), characterized in that: The top of the base (101) is provided with an L-shaped rod 1 (104) and an L-shaped rod 2 (107); the bottom end of the L-shaped rod 1 (104) is fixedly connected to a connecting rod (203); the top of one end of the connecting rod (203) away from the grinding dresser (204) is fixedly connected to the grinding dresser (204); a grinding wheel (202) is provided at the top of the grinding dresser (204); and the grinding dresser (204) is used to grind the grinding wheel (202).

2. The edge grinding device for a single wafer according to claim 1, characterized in that: The grinding wheel (202) is rotatably connected to a rotating rod (201) at one side close to the L-shaped rod (104); one end of the rotating rod (201) away from the grinding wheel (202) is fixedly connected to the surface of the L-shaped rod (104); and the side of the grinding wheel (202) away from the rotating rod (201) is fixedly connected to an engaging fixing tube (205).

3. The edge grinding device for a single wafer according to claim 2, characterized in that: An engaging rod (206) is engaged with the inside of the engaging fixing tube (205) at a side away from the grinding wheel (202), a second motor (207) is arranged at a side of the engaging rod (206) away from the engaging fixing tube (205), and a side of the second motor (207) away from the engaging rod (206) is fixedly connected to a side surface of the second L-shaped rod (107).

4. The edge grinding device for a single wafer according to claim 1, characterized in that: The top end of the base (101) is fixedly connected to a motor 1 (102), the output end of the motor 1 (102) is fixedly connected to a connecting column (103), the L-shaped rod 1 (104) is fixedly connected to a side of the connecting column (103), and the side of the connecting column (103) away from the motor 1 (102) is rotatably connected to an extrusion piece 1 (105).

5. The edge grinding device for a single wafer according to claim 4, characterized in that: The side of the L-shaped rod 2 (107) close to the extrusion piece 1 (105) is rotatably connected to the extrusion piece 2 (106), and a section of the L-shaped rod 2 (107) away from the extrusion piece 2 (106) is fixedly connected to the plug-in sliding rod (108), and the top of the plug-in sliding rod (108) is fixedly connected to the inside of the spring 1 (109), and the top of the spring 1 (109) is fixedly connected to the triangular block (110).

6. The edge grinding device for a single wafer according to claim 5, characterized in that: A manual pressing rod (111) is inserted into the interior of the L-shaped rod (104), and springs (112) are fixedly connected to the four corners of the top surface of the bottom end of the manual pressing rod (111), and the top ends of the four springs (112) are fixedly connected to the inner wall of the L-shaped rod (104).

7. The edge grinding device for a single wafer according to claim 5, characterized in that: The extrusion piece 1 (105) and the extrusion piece 2 (106) are both designed as soft cushions on the side close to each other.

8. The edge grinding device for a single wafer according to claim 1, characterized in that: The material used by the grinding and trimming device (204) is diamond material.

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