Copper groove copper ion concentration adjusting device

Abstract

The utility model relates to a copper groove copper ion concentration adjusting device which comprises a copper ball box, a circulating pump, a connecting pipe, a copper groove, a copper ion concentration detector and a controller, a copper ball is placed in the copper ball box, one side face of the copper ball box is communicated with one side face of the copper groove, and the circulating pump is connected with the copper groove and the copper ball box through the connecting pipe. The copper ion concentration detector is installed on the connecting pipe, and the copper ion concentration detector and the circulating pump are both electrically connected with the controller. Compared with the prior art, the copper balls are placed in the copper ball box to supplement copper ions in electroplating liquid, the copper content is high, and the cost is low; the circulating pump is connected with the copper tank and the copper ball box, circulation of electroplating liquid is achieved, and the copper ion concentration detector can detect the concentration of copper ions in real time; and the circulating pump and the copper ion concentration detector are both connected with the controller, and the controller regulates and controls the circulating pump according to a copper ion concentration detection result, so that the concentration of the copper ions in the electroplating liquid is regulated, and the like.

Description

Technical Field

[0001] The utility model relates to electroplating, in particular to a copper ion concentration regulating device for a copper tank. Background Art

[0002] Electroplating is the process of plating a thin layer of other metals or alloys on certain metal surfaces using the principle of electrolysis. It is a process that uses electrolysis to attach a layer of metal film to the surface of metal or other material parts, thereby preventing metal oxidation (such as rust), improving wear resistance, conductivity, reflectivity, corrosion resistance and enhancing aesthetics. Copper plating is the most widely used pre-plating layer in the electroplating industry. During copper plating, it is difficult for operators to monitor the copper ion concentration of the electroplating solution in the copper tank, and it takes a long time to conduct chemical tests, resulting in unstable copper ion concentration in the electroplating solution, which affects the quality of copper plating.

[0003] After searching, the application publication number CN113832529A discloses an automatic control method and control system for the copper ion concentration in a copper plating tank, which specifically discloses that: the input end of the central controller is connected to the host body, the output end of the host body is connected to the sensor, the induction probe of the sensor extends to the inside of the management tank, the output end of the central controller is connected to the copper oxide adding device, and the feeding port of the copper oxide adding device is located at the feeding port position of the dissolution tank. However, this prior art adjusts the copper ion concentration by controlling the feeding of copper oxide powder, the production cost is high, and a specific copper oxide feeding device needs to be set, and the structure is relatively complicated.

[0004] Therefore, how to design a device with low production cost, simple structure and convenient for detecting and adjusting the copper ion concentration in the copper tank is a technical problem that needs to be solved. Utility Model Content

[0005] The purpose of the utility model is to provide a copper tank copper ion concentration regulating device in order to overcome the defects of the prior art such as high production cost and complex structure.

[0006] The purpose of the utility model can be achieved through the following technical solutions:

[0007] According to one aspect of the utility model, a copper ion concentration regulating device for a copper trough is provided, comprising a copper ball box, a circulation pump, a connecting pipe, a copper trough, a copper ion concentration detector and a controller, wherein copper balls are placed in the copper ball box, one side of the copper ball box is connected to one side of the copper trough, the circulation pump is connected to the copper trough and the copper ball box through a connecting pipe, the copper ion concentration detector is installed on the connecting pipe, and the copper ion concentration detector and the circulation pump are both electrically connected to the controller.

[0008] As a preferred technical solution, the copper ball box is divided into a first copper ball box area and a second copper ball box area by a filter net. The first area is far away from the ground, connected to the connecting pipe, and copper balls are placed inside. The second area is connected to the copper trough.

[0009] As a preferred technical solution, the copper ion concentration detector includes a detection pipeline, a copper ion concentration light source and a copper ion concentration probe. The detection pipeline is connected to a connecting pipe, and the copper ion concentration light source and the copper ion concentration probe are respectively installed at both ends of the detection pipeline.

[0010] As a preferred technical solution, the copper ion concentration light source and the copper ion concentration probe are electrically connected to the controller.

[0011] As a preferred technical solution, a first valve is installed on the connecting pipe between the copper ion concentration detector and the copper ball box.

[0012] As a preferred technical solution, the device further includes a display screen and an alarm, and both the display screen and the alarm are electrically connected to the controller.

[0013] As a preferred technical solution, a spare branch pipe is connected to the connecting pipes between the copper ion concentration detector and the copper ball box and the circulation pump, and a normally closed second valve is installed on the spare branch pipe.

[0014] As a preferred technical solution, the device also includes an upper liquid pump, the copper trough is divided into a first copper trough area and a second copper trough area, the first copper trough area is far away from the ground, the second copper trough area is connected to a circulation pump, the first copper trough area and the second copper trough area are connected through a circulation hole, and the upper liquid pump connects the second copper trough area and the first copper trough area.

[0015] As a preferred technical solution, a bracket is provided in the first area of ​​the copper tank, and the workpiece to be electroplated is mounted on the bracket and is always immersed in the electroplating solution during the electroplating process.

[0016] According to another aspect of the utility model, a method for adjusting the copper ion concentration of a copper tank using a copper ion concentration adjusting device is provided, which specifically comprises the following steps:

[0017] Step S1, a copper ion concentration detector detects the real-time concentration of copper ions in the copper tank;

[0018] Step S2, compare the real-time concentration of copper ions with the set concentration. If the real-time concentration is greater than the set concentration, execute step S3; if the real-time concentration is less than the set concentration, execute step S4; otherwise, execute step S5;

[0019] Step S3, the circulation pump accelerates the circulation speed of the electroplating solution;

[0020] Step S4, the circulation pump slows down the circulation speed of the electroplating solution;

[0021] Step S5, the circulation pump maintains the initial circulation speed of the electroplating solution.

[0022] Compared with the prior art, the utility model has the following beneficial effects:

[0023] 1) The utility model places copper balls in the copper ball box to supplement the copper ions in the electroplating solution, which has high copper content and low cost; the circulation pump connects the copper tank and the copper ball box to realize the circulation of the electroplating solution, and the copper ion concentration detector is installed on the connecting pipe to detect the concentration of copper ions in the electroplating solution in real time; the circulation pump and the copper ion concentration detector are both connected to the controller, and the controller regulates the circulation pump according to the copper ion concentration detection result to realize the regulation of the copper ion concentration in the electroplating solution;

[0024] 2) The copper ball box of the utility model is divided into two areas by a filter screen, which can reduce the entry of impurities into the electroplating solution; the copper tank is divided into two areas, and a bracket is installed in the first area of ​​the copper tank, which is convenient for the installation and removal of the copper-plated workpiece;

[0025] 3) The utility model is provided with a display screen and an alarm, which is convenient for operators to monitor the electroplating process; the utility model is also provided with a spare branch pipe, which is convenient for debugging and maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic diagram of the overall structure of a copper tank copper ion concentration regulating device from the first perspective of the utility model;

[0027] Figure 2 This is a schematic diagram of the overall structure of a copper tank copper ion concentration regulating device from a second viewing angle of the utility model;

[0028] The numbers in the figure show:

[0029] 1. Copper ball box, 2. Circulation pump, 3. Connecting pipe, 30. First valve, 31. Spare branch pipe, 32. Second valve, 4. Copper trough, 40. Circulation hole, 41. Bracket, 5. Copper ion concentration detector, 50. Detection pipeline, 51. Copper ion concentration light source, 52. Copper ion concentration probe, 6. Controller, 7. Upper liquid pump. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of them. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0031] like Figure 1 As shown, the utility model provides a copper trough copper ion concentration regulating device, comprising a copper ball box 1, a circulation pump 2, a connecting pipe 3, a copper trough 4, a copper ion concentration detector 5, a controller 6, a display screen, an alarm and a liquid supply pump 7.

[0032] Copper balls are placed in the copper ball box 1 to supplement copper ions for the electroplating solution. The inside of the copper ball box 1 is divided into the first area of ​​the copper ball box 1 located at the top and the second area of ​​the copper ball box 1 located at the bottom by a filter. The first area of ​​the copper ball box 1 is connected to the connecting pipe 3, and the copper balls are placed on the filter net in the first area of ​​the copper ball box 1. When the electroplating solution passes through the copper balls from the first area of ​​the copper ball box 1 to the second area of ​​the copper ball box 1, the filter net can prevent impurities from entering the second area of ​​the copper ball box 1. The second area of ​​the copper ball box 1 is connected to the copper tank 4.

[0033] One end of the circulation pump 2 is connected to the copper tank 4 through the connecting pipe 3, and the other end is connected to the copper ball box 1 through the connecting pipe 3, so as to pump out the electroplating solution in the copper tank 4, flow through the copper ball box 1 along the connecting pipe 3, and then return to the copper tank 4. The circulation pump 2 is electrically connected to the controller 6, and the controller 6 controls the operation speed of the circulation pump 2 according to the current concentration of copper ions.

[0034] The copper trough 4 is divided into a first area of ​​the copper trough 4 located at the top and a second area of ​​the copper trough 4 located at the bottom. The first area of ​​the copper trough 4 and the second area of ​​the copper trough 4 are connected through a circulation hole 40. A bracket 41 is provided in the first area of ​​the copper trough 4 for mounting a workpiece to be electroplated. For example, a plate roller can be mounted on the bracket 41 with arc-shaped ends; the second area of ​​the copper trough 4 is connected to the second area of ​​the copper ball box 1, and the upper liquid pump 7 draws the plating liquid in the second area of ​​the copper trough 4 into the first area of ​​the copper trough 4. During the electroplating process, the workpiece is always immersed in the plating liquid, so the upper liquid pump 7 The liquid filling speed must be greater than the liquid leakage speed in the circulation hole 40.

[0035] The copper ion concentration detector 5 is installed on the connecting pipe 3, and includes a detection pipeline 50, a copper ion concentration light source 51 and a copper ion concentration probe 52. The copper ion concentration light source 51 and the copper ion concentration probe 52 are respectively installed at both ends of the detection pipeline 50. The electroplating solution in the connecting pipe 3 flows into the detection pipeline 50, and the copper ion concentration probe 52 detects the copper ion concentration in the electroplating solution. Figure 2 As shown, by removing the circulation pump 2, it can be seen that the copper ion concentration light source 51 and the copper ion concentration probe 52 are both electrically connected to the controller 6. The copper ion concentration probe 52 detects the copper ion concentration and then feeds it back to the controller 6. The controller 6 compares the current real-time concentration of copper ions with the set value to determine the operating speed of the circulation pump 2.

[0036] A first valve 30 is installed on the connecting pipe 3 between the copper ion concentration detector 5 and the copper ball box 1. A spare branch pipe 31 is connected to the connecting pipe 3 between the copper ion concentration detector 5 and the copper ball box 1 and the circulating pump 2, and a normally closed second valve 32 is installed on the spare branch pipe 31. The first valve 30 and the second valve 32 are both used for debugging and maintenance of the equipment.

[0037] The display screen and the alarm are both electrically connected to the controller 6. The display screen displays the current real-time concentration of copper ions, the set concentration, the current speed and the set speed of the circulation pump 2, which is convenient for the operator to observe; when the concentration value is abnormal, the alarm sounds.

[0038] The controller 6 may be a programmable logic controller 6 (PLC).

[0039] The working process of this utility model is as follows:

[0040] During the electroplating process, the circulation pump 2 is turned on, and the liquid in the copper tank 4 flows into the copper ball tank through the copper ion concentration probe 52 and the copper ion concentration detection light source, and then flows back into the copper tank 4 through the filter. When the electroplating solution flows through the copper ion concentration probe 52, the copper ion concentration probe 52 transmits the detected data back to the controller 6, and the data is displayed on the touch screen through the controller 6; the operator can set the upper and lower limits of the copper ion concentration and the high, medium and low speeds of the circulation pump 2 on the touch screen. When the copper ion concentration is lower than the set lower limit, the circulation pump 2 runs at high speed and the touch screen alarms; when the copper ion concentration is between the set lower limit and upper limit, the circulation pump 2 runs at medium speed; when the copper ion concentration is higher than the set upper limit, the circulation pump 2 runs at low speed and the touch screen alarms; after the electroplating is completed, the circulation pump 2 is turned off.

[0041] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the utility model, and these modifications or replacements should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A copper tank copper ion concentration regulating device, characterized in that: The invention comprises a copper ball box (1), a circulation pump (2), a connecting pipe (3), a copper tank (4), a copper ion concentration detector (5) and a controller (6); copper balls are placed in the copper ball box (1); one side of the copper ball box (1) is connected to one side of the copper tank (4); the circulation pump (2) is connected to the copper tank (4) and the copper ball box (1) through the connecting pipe (3); the copper ion concentration detector (5) is installed on the connecting pipe (3); and the copper ion concentration detector (5) and the circulation pump (2) are both electrically connected to the controller (6).

2. A copper tank copper ion concentration regulating device according to claim 1, characterized in that: The copper ball box (1) is divided into a first area of ​​the copper ball box (1) and a second area of ​​the copper ball box (1) by a filter screen. The first area is far away from the ground and connected to the connecting pipe (3), and copper balls are placed inside. The second area is connected to the copper tank (4).

3. A copper tank copper ion concentration regulating device according to claim 1, characterized in that: The copper ion concentration detector (5) comprises a detection pipeline (50), a copper ion concentration light source (51) and a copper ion concentration probe (52); the detection pipeline (50) is connected to the connecting pipe (3); and the copper ion concentration light source (51) and the copper ion concentration probe (52) are respectively installed at two ends of the detection pipeline (50).

4. A copper tank copper ion concentration regulating device according to claim 3, characterized in that: The copper ion concentration light source (51) and the copper ion concentration probe (52) are electrically connected to the controller (6).

5. A copper tank copper ion concentration regulating device according to claim 3, characterized in that: A first valve (30) is installed on the connecting pipe (3) between the copper ion concentration detector (5) and the copper ball box (1).

6. A copper tank copper ion concentration regulating device according to claim 1, characterized in that: The device also includes a display screen and an alarm, and both the display screen and the alarm are electrically connected to the controller (6).

7. A copper tank copper ion concentration regulating device according to claim 1, characterized in that: The copper ion concentration detector (5) and the connecting pipe (3) between the copper ball box (1) and the circulation pump (2) are all connected with a spare branch pipe (31), and a normally closed second valve (32) is installed on the spare branch pipe (31).

8. A copper tank copper ion concentration regulating device according to claim 1, characterized in that: The device further comprises an upper liquid pump (7); the copper trough (4) is divided into a first area of ​​the copper trough (4) and a second area of ​​the copper trough (4); the first area of ​​the copper trough (4) is away from the ground; the second area of ​​the copper trough (4) is connected to a circulation pump (2); the first area of ​​the copper trough (4) and the second area of ​​the copper trough (4) are connected via a circulation hole (40); and the upper liquid pump (7) connects the second area of ​​the copper trough (4) and the first area of ​​the copper trough (4).

9. A copper tank copper ion concentration regulating device according to claim 8, characterized in that: A bracket (41) is provided in the first area of ​​the copper tank (4), and the workpiece to be electroplated is mounted on the bracket (41) and is always immersed in the electroplating solution during the electroplating process.

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