Processor equipment for depth data analysis

Abstract

The utility model relates to a processor device for depth data analysis, the processor device is arranged on a double-processor mainboard, the periphery of two processor slots of the double-processor mainboard is provided with shell slots, the processor device comprises a main shell and an upper shell, the main shell is inserted in the shell slots, and the upper shell is inserted in the shell slots. A cavity is formed between the main shell and the dual-processor mainboard, an opening is formed in the top of the cavity, and the upper shell covers the opening of the main shell; the heat dissipation frame is installed on the upper shell, and the heat dissipation frame comprises heat dissipation fins and a heat dissipation fan; the cooling fins are installed on the upper shell, and the cooling fan is installed on the cooling fins. The first end of the heat conduction rod is located in the cavity and makes contact with the dual-processor mainboard, and the second end of the heat conduction rod penetrates through the opening and makes contact with the cooling fins; the temperature sensor is mounted in the cavity and connected with the dual-processor mainboard; and the two processors are arranged in the cavity and are respectively inserted into the two processor slots of the dual-processor mainboard.

Description

Technical Field

[0001] The utility model belongs to the technical field of processor equipment, and in particular relates to a processor equipment for deep data analysis. Background Art

[0002] In modern computers and electronic devices, processors are core components whose performance and stability directly affect the operating efficiency of the entire machine. With the rapid development of science and technology, the computing power of processors has been continuously improved, and they can meet diverse needs from simple daily tasks to complex data analysis and high-performance computing. However, the performance improvement is also accompanied by a significant increase in power consumption and heat generation. Effective heat dissipation management has become an important factor in ensuring processor stability and long-term reliability of equipment.

[0003] Since high-computing processors have high performance, multi-core, high-concurrency processing capabilities, and support for large-scale data processing, they can be used in a variety of application scenarios, such as processing large-scale data sets, training complex deep neural networks (such as convolutional neural networks, recurrent neural networks, transformers, etc.), and learning and optimizing strategies in complex environments for game AI, autonomous driving, industrial control, etc. Or, large-scale training in a simulation environment to improve the performance and robustness of AI systems.

[0004] Therefore, in order to ensure the computing power of the processor, heat dissipation management is particularly important. The performance and stability of the processor directly affect the overall operating efficiency of the device. With the continuous improvement of the computing power of the processor, especially in the face of diverse needs such as complex data analysis and high-performance computing, the heat generated by the processor has also increased. However, high-computing processors usually have higher clock frequencies and more cores, which makes them generate a lot of heat during operation. If this heat cannot be effectively dissipated, it will cause the processor to overheat, which will affect its performance, shorten its service life, and even cause hardware damage.

[0005] Therefore, in order to ensure the efficient operation of processor devices under high computing power requirements, improve user experience and device life, it is particularly important to solve problems such as poor heat dissipation. A processor device for deep data analysis is needed. Utility Model Content

[0006] 1. Technical issues to be resolved

[0007] In order to solve the above problems in the prior art, the utility model provides a processor device for deep data analysis.

[0008] (II) Technical solution

[0009] In order to achieve the above-mentioned purpose, the main technical solutions adopted by the utility model include:

[0010] The utility model provides a processor device for deep data analysis, comprising: the processor device is arranged on a dual-processor motherboard, and housing slots are arranged around two processor slots of the dual-processor motherboard. The processor device comprises:

[0011] A main housing 1 and an upper housing 2, wherein the main housing 1 is inserted into the housing slot, a chamber is formed between the main housing 1 and the dual-processor motherboard, the top of the chamber has an opening, and the upper housing 2 covers the opening of the main housing 1;

[0012] A heat sink 3 is installed on the upper housing 2, and the heat sink 3 includes a heat sink 4 and a heat sink fan 5; the heat sink 4 is installed on the upper housing 2, and the heat sink fan 5 is installed on the heat sink 4;

[0013] A heat conducting rod 6, wherein a first end of the heat conducting rod 6 is located in the chamber and contacts the dual-processor motherboard, and a second end of the heat conducting rod 6 passes through the opening and contacts the heat sink 4;

[0014] A temperature sensor 7 is installed in the chamber and connected to the dual processor mainboard;

[0015] Two processors 8 are arranged in the cavity and are respectively inserted into two processor slots of the dual-processor motherboard.

[0016] Preferably,

[0017] The upper shell 2 has a circular opening;

[0018] The circular opening of the upper shell 2 is arranged corresponding to the opening at the top of the main shell 1;

[0019] The heat dissipation frame 3 is arranged corresponding to the circular opening of the upper housing 2;

[0020] The heat conducting rod 6 contacts the heat sink 4 via the opening and the circular opening.

[0021] Preferably, it also includes a damping bracket;

[0022] The damping bracket comprises: a first cylindrical connecting member 9, a first spring 10, a second spring 11, a first buffer pad, a second buffer pad and a bottom plate 12;

[0023] The dual-processor mainboard is arranged above the bottom plate 12 of the damping bracket;

[0024] The bottom surface of the bottom plate 12 is also provided with an elastic pad;

[0025] The first connecting member 9 is arranged through the dual-processor mainboard, and one end of the first connecting member 9 is fixedly connected to the bottom board 12, and the other end of the first connecting member 9 has a limit block;

[0026] The first spring 10 and the first buffer pad are both sleeved on the first connecting member 9, the first end of the first spring 10 abuts against the bottom plate 12 through the first buffer pad, and the second end of the first spring 10 abuts against the dual-processor mainboard;

[0027] The second spring 11 and the second buffer pad are both sleeved on the first connecting member 9. The first end of the second spring 11 abuts against the dual-processor mainboard through the second buffer pad, and the second end of the second spring 11 abuts against the limit block.

[0028] Preferably,

[0029] The first connecting members 9 are disposed at the four corners of the dual-processor mainboard.

[0030] Preferably,

[0031] The cooling fan 5 is connected to the dual-processor mainboard via a fan interface.

[0032] Preferably,

[0033] The heat dissipation fan 5 includes a fan body and a fan bracket. The fan body is mounted on the fan bracket, and the fan bracket is connected to the heat sink 4 .

[0034] Preferably,

[0035] The main housing 1 is also provided with a ventilating opening.

[0036] Preferably,

[0037] There are multiple heat-conducting rods 6, and the multiple heat-conducting rods 6 are arranged in parallel.

[0038] Preferably, the main housing 1 has a dustproof net, and the dustproof net is arranged at the ventilation port.

[0039] Preferably,

[0040] Wherein, the heat sink 4 is a copper heat sink or an aluminum heat sink;

[0041] The main housing 1 and the upper housing 2 are both made of aluminum alloy or magnesium alloy.

[0042] (III) Beneficial effects

[0043] The utility model provides a processor device for deep data analysis. Since a heat sink is installed on an upper shell and includes a heat sink and a heat sink fan, the heat dissipation area is effectively increased, and the overall heat dissipation efficiency is improved through forced convection heat dissipation of the fan.

[0044] In addition, since the heat-conducting rod runs through the upper shell and the main shell, one end is connected to the heat sink and the other end is connected to the main shell, the heat generated by the processor is effectively conducted to the external heat sink and dissipated through the shell, further enhancing the heat dissipation effect.

[0045] The utility model provides a processor device for deep data analysis in which a temperature sensor is installed in a main housing, and the temperature sensor is connected to a dual-processor mainboard, thereby providing a hardware basis for controlling a cooling fan according to a temperature value collected by the temperature sensor.

[0046] The utility model provides a processor device for deep data analysis, which uses a dual-processor motherboard to significantly improve the computing power and parallel processing performance of the processor device, and is suitable for complex deep data analysis tasks and high-performance computing needs. The heat sink includes a heat sink and a cooling fan, which can effectively dissipate the heat generated by the processor, thereby preventing the processor from overheating and maintaining its stability and reliability during high-performance operation, thereby ensuring long-term operation and efficient computing power. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 This is a structural schematic diagram provided by the utility model.

[0048] Description of reference numerals:

[0049] 1: Main shell;

[0050] 2: Upper shell;

[0051] 3: heat sink;

[0052] 4: heat sink;

[0053] 5: Cooling fan;

[0054] 6: Heat conducting rod;

[0055] 7: Temperature sensor;

[0056] 8: Processor;

[0057] 9: first connecting member;

[0058] 10: first spring;

[0059] 11: second spring;

[0060] 12: bottom plate;

[0061] A: Dual processor motherboard. DETAILED DESCRIPTION

[0062] In order to better understand the above technical solution, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to enable a clearer and more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

[0063] like Figure 1 As shown, this embodiment provides a processor device for deep data analysis, the processor device is arranged on a dual-processor motherboard A, and housing slots are arranged around two processor slots of the dual-processor motherboard A. The processor device includes:

[0064] A main housing 1 and an upper housing 2, wherein the main housing 1 is inserted into the housing slot, a chamber is formed between the main housing 1 and the dual-processor motherboard A, the top of the chamber has an opening, and the upper housing 2 covers the opening of the main housing 1;

[0065] In the first specific implementation of this embodiment, a sealing ring is used to seal between the main housing 1 and the upper housing 2 to prevent dust and moisture from entering the interior of the device, thereby improving the durability and reliability of the device. In addition, in this embodiment, the inner sides of the main housing 1 and the upper housing 2 are coated with an electromagnetic shielding layer to shield external electromagnetic interference and ensure the normal operation of the processor device.

[0066] A heat sink 3 is installed on the upper housing 2, and the heat sink 3 includes a heat sink 4 and a heat sink fan 5; the heat sink 4 is installed on the upper housing 2, and the heat sink fan 5 is installed on the heat sink 4;

[0067] In this embodiment, by installing a heat sink 3 on the upper housing 2, the heat sink 3 includes a heat sink 4 and a heat dissipation fan 5, so that the heat dissipation capacity of the processor device can be enhanced. The heat sink 4 increases the heat dissipation surface area, and the heat dissipation fan 5 provides forced convection, thereby improving the heat dissipation efficiency. In this embodiment, an efficient heat dissipation system is formed by combining the heat sink, the heat sink and the heat dissipation fan, which can quickly dissipate the heat generated by the processor.

[0068] A heat conducting rod 6, wherein a first end of the heat conducting rod 6 is located in the chamber and contacts the dual-processor motherboard A, and a second end of the heat conducting rod 6 passes through the opening and contacts the heat sink 4;

[0069] In this embodiment, the heat conducting rod 6 conducts the heat inside the chamber to the external heat sink, which not only improves the efficiency of heat conduction, but also dissipates the heat to the external environment in time, thus avoiding overheating inside the processor.

[0070] A temperature sensor 7 is installed in the chamber and connected to the dual-processor motherboard A;

[0071] In this embodiment, the temperature sensor 7 is installed in the main housing to monitor the internal temperature.

[0072] Two processors 8 are arranged in the cavity and are respectively inserted into two processor slots of the dual-processor motherboard A.

[0073] It should be noted that the two processors 8 in this embodiment have high performance, multi-core, high-concurrency processing capabilities, and support for large-scale data processing. In other words, the two processors 8 in this embodiment have strong computing power.

[0074] In this embodiment, the dual-processor motherboard A configured with two high-performance processors can be used in application scenarios of high-performance computing and deep data analysis to significantly improve the computing power of the system. Increase the number of computing cores and threads, because in this embodiment, the dual-processor motherboard A configured with two high-performance processors has more physical cores and threads. For example, if each processor has 24 cores and 48 threads, the dual-processor configuration will provide 48 cores and 96 threads. This greatly increases the parallel processing capability and can handle more tasks at the same time.

[0075] In addition, in this embodiment, each processor generally supports multiple memory channels. The dual-processor motherboard A is configured with two high-performance processors to double the number of memory channels, thereby increasing the memory bandwidth. This means that data can be transferred from the memory to the processor faster, reducing memory bottlenecks.

[0076] In this embodiment, the dual-processor motherboard A is configured with two high-performance processors. During use, the two processors share the computing load, which can reduce the heat generated by a single processor, contribute to more effective heat dissipation management, and maintain stability during high-performance operation.

[0077] The processor in this embodiment can be used in a variety of application scenarios, such as processing large-scale data sets, training complex deep neural networks (such as convolutional neural networks, recurrent neural networks, transformers, etc.), and performing strategy learning and optimization in complex environments for game AI, autonomous driving, industrial control, etc. Alternatively, large-scale training can be performed in a simulation environment to improve the performance and robustness of AI systems.

[0078] In the practical application of this embodiment, the upper shell 2 has a circular opening;

[0079] The circular opening of the upper shell 2 is arranged corresponding to the opening at the top of the main shell 1;

[0080] The heat dissipation frame 3 is disposed corresponding to the circular opening of the upper housing 2 .

[0081] The heat conducting rod 6 contacts the heat sink 4 via the opening and the circular opening.

[0082] In this embodiment, the circular opening of the upper shell 2 is arranged corresponding to the heat sink, which helps to discharge heat more directly from the inside of the device and improve the heat dissipation efficiency. Through this circular opening, the heat dissipation fan can more effectively inhale cold air and discharge hot air, further enhancing the heat dissipation effect. The heat sink is arranged corresponding to the circular opening, making the installation and disassembly of the heat dissipation component more convenient and simplifying the maintenance process. This design reduces the impact on other components during disassembly and assembly, and improves the maintainability of the equipment. The corresponding arrangement of the circular opening and the heat sink helps to maintain the stability of the overall structure and avoid stress concentration problems caused by irregular openings. The circular opening can help better control the airflow path, allowing cold air to enter more smoothly and hot air to be discharged more effectively, thereby improving the overall efficiency of the heat dissipation system. This design also helps to avoid the formation of local hot spots and ensure the uniform distribution of temperature inside the device.

[0083] In this embodiment, the processor device further includes a damping bracket;

[0084] The damping bracket comprises: a first cylindrical connecting member 9, a first spring 10, a second spring 11, a first buffer pad, a second buffer pad and a bottom plate 12;

[0085] The dual-processor motherboard A is arranged above the bottom plate 12 of the damping bracket;

[0086] The bottom surface of the bottom plate 12 is also provided with an elastic pad;

[0087] The first connecting member 9 is arranged through the dual-processor mainboard A, and one end of the first connecting member 9 is fixedly connected to the bottom board 12, and the other end of the first connecting member 9 has a limit block;

[0088] The first spring 10 and the first buffer pad are sleeved on the first connecting member 9, the first end of the first spring 10 abuts against the bottom plate 12 through the first buffer pad, and the second end of the first spring 10 abuts against the dual-processor mainboard A;

[0089] The second spring 11 and the second buffer pad are sleeved on the first connecting member 9. The first end of the second spring 11 abuts against the dual-processor mainboard A through the second buffer pad, and the second end of the second spring 11 abuts against the limit block.

[0090] In this embodiment, the first spring and the second spring effectively absorb and buffer vibration and impact from the outside by elastically supporting the support panel and the bottom plate, thereby protecting the processor device in the main housing from damage. The elastic pad further enhances the absorption capacity of low-frequency vibration and small impact, thereby reducing noise and vibration during the operation of the device.

[0091] In this embodiment, the first buffer pad and the second buffer pad can absorb the energy of deformation generated by the first spring and the second spring.

[0092] The structure of the damping bracket ensures that the main housing can remain stable when subjected to external interference, thereby extending the service life of the device. By reducing the impact of mechanical stress and vibration on the processor and other internal components, the failure rate and maintenance cost of the device are reduced. The design of the first connector and the limit block provides additional structural strength and stability, ensuring that the spring can work correctly when subjected to force, avoiding performance degradation caused by spring displacement or deformation. The cylindrical first connector runs through the support panel and the bottom plate, making the entire damping bracket structure more compact and sturdy.

[0093] The first connecting members 9 are disposed at the four corners of the dual-processor mainboard A.

[0094] In this embodiment, the heat dissipation fan 5 is connected to the dual-processor mainboard A through a fan interface.

[0095] In this embodiment, the fan interface on the dual-processor motherboard A (the fan interface in this embodiment is a 3-pin or 4-pin connector) provides both power and control signals for the cooling fan.

[0096] The heat dissipation fan 5 includes a fan body and a fan bracket. The fan body is mounted on the fan bracket. The fan bracket is used to connect with the heat sink 4.

[0097] In this embodiment, the connection between the fan bracket and the heat sink 3 can ensure that the heat dissipation fan 5 is firmly mounted on the device, which can effectively prevent the fan from vibrating or loosening during operation, thereby improving the stability and reliability of the device.

[0098] The connection between the fan bracket and the heat sink 3 can effectively conduct heat, so that the heat dissipation fan 5 can dissipate heat more effectively. This can improve the heat dissipation efficiency of the processor device and keep the device within the normal operating temperature range.

[0099] The fan body is mounted on the fan bracket, and the fan bracket is connected to the heat sink 3. This design simplifies the installation process of the heat sink fan 5. The installer only needs to connect the fan bracket to the heat sink 3, without having to install the fan body and the fan bracket separately, saving installation time and labor costs.

[0100] If it is necessary to maintain or replace the cooling fan 5, the cooling fan 5 can be conveniently removed for maintenance or replacement by simply untying the connection between the fan bracket and the cooling frame 3. This can reduce the complexity of the maintenance process and improve the maintenance efficiency.

[0101] The separation design between the fan body and the fan bracket makes the heat dissipation fan 5 modular, which is convenient for separate maintenance or replacement of components therein, thereby improving the maintainability and reliability of the equipment.

[0102] In summary, through the design of the cooling fan 5, including the fan body and the fan bracket, and connected to the heat sink 3, stable and reliable installation, effective heat dissipation, simplified installation process, and convenient maintenance can be achieved, thereby improving the performance and reliability of the processor device.

[0103] Preferably, a vent is provided on the main housing 1 .

[0104] In this embodiment, due to the natural convection phenomenon of hot air rising and cold air falling, the vents are arranged at the bottom to allow cold air to enter the interior of the device more easily, and the hot air is discharged through the vents at the top, thereby promoting the heat dissipation effect inside the device. In addition, the vents help to form a stable air flow path, allowing cold air to enter from the bottom and hot air to be discharged from the top, effectively improving the overall heat dissipation efficiency of the device and preventing the device from overheating. It also helps to reduce the entry of dust and other particulate matter into the interior of the device. Since the airflow moves from bottom to top, dust is more easily taken out of the device, reducing the risk of contamination and damage to internal components.

[0105] In a specific implementation, there are multiple heat-conducting rods 6, and the multiple heat-conducting rods 6 are arranged in parallel.

[0106] In this embodiment, multiple heat-conducting rods are arranged in parallel to increase the heat-conducting area, enhance the heat conduction effect inside the device, and quickly conduct the heat generated by the heat source to the heat dissipation area, thereby improving the overall heat dissipation efficiency. Multiple heat-conducting rods can disperse heat more evenly, avoid heat concentration at a certain point, reduce local overheating, help maintain the temperature balance inside the device, and protect the processor in the device. Multiple heat-conducting rods arranged in parallel form a stable heat-conducting structure, making heat conduction more stable and reliable, and reducing the risk of uneven heat dissipation or failure due to a single heat conduction path. If one heat-conducting rod fails, the other heat-conducting rods can continue to work, provide heat conduction function, and improve the reliability and durability of the processor device.

[0107] Specifically, the main housing 1 has a dustproof net, and the dustproof net is arranged at the ventilation port.

[0108] In this embodiment, the dustproof net effectively blocks dust, impurities and other particles in the air from entering the interior of the device, thereby protecting the processor inside the main housing and reducing the impact of dust accumulation on the performance of the device. By preventing dust and other particles from entering, the dustproof net can reduce the wear and damage caused by dust, thereby extending the service life of the device and improving the reliability of the device. In addition, since dust accumulation will affect the heat dissipation effect of the radiator and fan, the dustproof net can prevent dust from clogging the heat dissipation channel, maintain good heat dissipation performance of the device, and ensure that the processor device runs at the optimal temperature. The dustproof net can reduce the frequency of cleaning and maintenance inside the processor device, reduce maintenance costs and workload, and make the device run more stable and reliable.

[0109] Preferably, the heat sink 4 is a copper heat sink and an aluminum heat sink;

[0110] In this embodiment, the heat sink 4 has a plurality of air holes, thereby increasing the fluidity of the air, making it easier for hot air to be discharged from the heat sink and for fresh cold air to enter, thereby improving the overall heat dissipation effect. At the same time, the air holes can reduce the use of materials, thereby reducing the weight of the heat sink, and the edges of the air holes increase the surface area of ​​the heat sink, which helps to dissipate heat more effectively.

[0111] The main housing 1 and the upper housing 2 are both made of aluminum alloy or magnesium alloy.

[0112] In this embodiment, since copper has excellent thermal conductivity and its thermal conductivity is higher than that of aluminum alloy and magnesium alloy, using copper as the heat sink material can conduct heat away from the heat source more quickly and effectively, thereby improving the overall heat dissipation efficiency.

[0113] In addition, the main shell and upper shell are made of aluminum alloy or magnesium alloy. These two materials have low density and light weight, which can significantly reduce the total weight of the equipment, making the equipment more portable and easy to transport and install. Moreover, aluminum alloy and magnesium alloy materials are not only light in weight, but also have high mechanical strength and durability, can provide good structural strength and impact resistance, protect internal components, and extend the service life of the equipment. Aluminum alloy and magnesium alloy have good corrosion resistance, can maintain stable performance under various environmental conditions, and prevent the equipment from being damaged in humid or corrosive environments.

[0114] The processor device for deep data analysis in this embodiment can be used in the following application scenarios, for example:

[0115] In deep learning and AI training scenarios, the dual-processor motherboard A in this embodiment is configured with two high-performance processors to train large neural network models faster because the training process can be executed in parallel on multiple cores.

[0116] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "embodiment", "example", "specific example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a combined manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0117] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are illustrative and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A processor device for deep data analysis, characterized in that: The processor device is arranged on a dual-processor motherboard (A), and housing slots are arranged around two processor slots of the dual-processor motherboard (A). The processor device comprises: A main housing (1) and an upper housing (2), wherein the main housing (1) is inserted into the housing slot, a chamber is formed between the main housing (1) and the dual-processor motherboard (A), the top of the chamber has an opening, and the upper housing (2) covers the opening of the main housing (1); A heat sink (3) is mounted on the upper housing (2), and the heat sink (3) comprises a heat sink (4) and a heat sink fan (5); the heat sink (4) is mounted on the upper housing (2), and the heat sink fan (5) is mounted on the heat sink (4); A heat conducting rod (6), wherein a first end of the heat conducting rod (6) is located in the chamber and contacts the dual-processor motherboard (A), and a second end of the heat conducting rod (6) passes through the opening and contacts the heat sink (4); A temperature sensor (7), installed in the chamber and connected to the dual-processor motherboard (A); Two processors (8) are arranged in the cavity and are respectively inserted into two processor slots of the dual-processor motherboard (A).

2. The processor device for deep data analysis according to claim 1, characterized in that: The upper shell (2) has a circular opening; The circular opening of the upper shell (2) is arranged corresponding to the opening at the top of the main shell (1); The heat dissipation frame (3) is arranged corresponding to the circular opening of the upper shell (2); The heat conducting rod (6) contacts the heat sink (4) via the opening and the circular opening.

3. The processor device for deep data analysis according to claim 2, characterized in that: Also included are damping brackets; The damping bracket comprises: a first cylindrical connecting member (9), a first spring (10), a second spring (11), a first buffer pad, a second buffer pad and a bottom plate (12); The dual-processor mainboard (A) is arranged above the bottom plate (12) of the damping bracket; The bottom surface of the bottom plate (12) is also provided with an elastic pad; The first connecting member (9) is arranged to penetrate the dual-processor mainboard (A), and one end of the first connecting member (9) is fixedly connected to the bottom board (12), and the other end of the first connecting member (9) has a limit block; The first spring (10) and the first buffer pad are both sleeved on the first connecting member (9), the first end of the first spring (10) abuts against the bottom plate (12) through the first buffer pad, and the second end of the first spring (10) abuts against the dual-processor mainboard (A); The second spring (11) and the second buffer pad are both sleeved on the first connecting member (9); the first end of the second spring (11) abuts against the dual-processor motherboard (A) through the second buffer pad, and the second end of the second spring (11) abuts against the limit block.

4. The processor device for deep data analysis according to claim 3, characterized in that: The first connecting members (9) are provided at the four corners of the dual-processor mainboard (A).

5. The processor device for deep data analysis according to claim 4, characterized in that: The cooling fan (5) is connected to the dual-processor mainboard (A) via a fan interface.

6. The processor device for deep data analysis according to claim 5, characterized in that: The heat dissipation fan (5) comprises a fan body and a fan bracket, wherein the fan body is mounted on the fan bracket, and the fan bracket is connected to the heat dissipation fin (4).

7. The processor device for deep data analysis according to claim 6, characterized in that: The main shell (1) is also provided with a ventilation hole.

8. The processor device for deep data analysis according to claim 7, characterized in that: There are a plurality of heat-conducting rods (6), and the plurality of heat-conducting rods (6) are arranged in parallel.

9. The processor device for deep data analysis according to claim 8, characterized in that: The main housing (1) has a dustproof net, and the dustproof net is arranged at the ventilation port.

10. The processor device for deep data analysis according to claim 8, characterized in that: in, The heat sink (4) is a copper heat sink or an aluminum heat sink; The materials of the main shell (1) and the upper shell (2) are both aluminum alloy or magnesium alloy.

Images