Interface test platform
By designing an interface test platform, the matrix switch unit is used to realize automatic switching of the interface to be tested, solving the problem of inefficiency caused by manual interface replacement, and realizing automated testing of software and hardware interfaces and hardware interfaces.
Patent Information
- Application Number
- CN202421696896.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-17
- Publication Date
- 2025-04-29
- Estimated Expiration
- 2034-07-17
AI Technical Summary
During the testing process of software and hardware interfaces or hardware interfaces, the interface to be tested needs to be replaced manually, resulting in inefficient testing, inability to implement program control, and it is difficult to apply or transplant the automated testing technology of software interfaces.
An interface test platform is designed, including an interface switching device and a measuring instrument. The interface switching device adopts a matrix switch unit and is connected to the interface to be tested through multiple channels to realize automatic switching of the interface to be tested.
The user does not need to manually replace the interface to be tested, which significantly improves the testing efficiency and realizes automated testing of software and hardware interfaces and hardware interfaces.
Smart Images

Figure CN222813138U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of testing technology, and in particular to an interface testing platform. Background Art
[0002] In the process of testing the software and hardware interface or the hardware interface, the tester needs to manually change the interface to be tested. This step cannot be controlled by the program. That is, the automated testing technology of the software interface cannot be directly applied or transplanted to the software and hardware interface or the hardware interface test scenario;
[0003] However, the above process of manually replacing the interface to be tested is slow, resulting in low test efficiency. Utility Model Content
[0004] The main purpose of this application is to provide an interface testing platform to solve the technical problem of low testing efficiency.
[0005] To achieve the above-mentioned object, the present application provides an interface test platform, the interface test platform comprising an interface switching device and a measuring instrument, the interface switching device comprising a matrix switch unit, the matrix switch unit comprising a plurality of channels, the matrix switch unit being connected to the measuring instrument and connected to at least one interface to be tested through the plurality of channels;
[0006] The matrix switch unit switches the interface to be tested by controlling the on and off of each channel.
[0007] Optionally, the plurality of channels include a plurality of X-axis channels, a first channel among the plurality of X-axis channels is communicatively connected to at least one of the interfaces to be tested, and a second channel among the plurality of X-axis channels is connected to a reference ground of at least one of the interfaces to be tested;
[0008] The first channel is used for signal transmission with at least one of the interfaces to be tested.
[0009] Optionally, the plurality of channels further include a plurality of Y-axis channels;
[0010] The plurality of Y-axis channels are used for signal transmission with the measuring instrument;
[0011] An input end of each of the X-axis channels is connected to a third channel among the plurality of Y-axis channels, and an output end of each of the X-axis channels is connected to a fourth channel among the plurality of Y-axis channels.
[0012] Optionally, the matrix switch unit further includes a control unit, a driver chip cascade circuit, a first driver unit and a second driver unit, the control unit is provided with a multiplexing pin, the first driver unit is communicatively connected to the control unit via the multiplexing pin, and the driver chip cascade circuit is communicatively connected to the second driver unit;
[0013] The control unit is used to control the on and off of the first channel through the multiplexing pin and the first driving unit;
[0014] The driving chip cascade circuit is used to control the on and off of each of the Y-axis channels through the second driving unit.
[0015] Optionally, the control unit further includes a multi-channel SPI communication interface, the driver chip cascade circuit includes a first driver chip cascade circuit and a second driver chip cascade circuit, one of the multi-channel SPI communication interfaces is communicatively connected to the first driver chip cascade circuit, and the other SPI communication interfaces in the multi-channel SPI communication interface are communicatively connected to the second driver chip cascade circuit;
[0016] The first driver chip cascade circuit is used to control the on and off of the third channel through one of the SPI communication interfaces, the first driver chip cascade circuit, and the second driver unit;
[0017] The second driver chip cascade circuit is used to control the on and off of the fourth channel through the other SPI communication interfaces, the second driver chip cascade circuit, and the second driver unit.
[0018] Optionally, the interface switching device further comprises a switching unit, which is respectively connected to the interface to be tested, multiple channels of the matrix switch unit, and the measuring instrument to achieve switching between the interface to be tested and the matrix switch unit, and between the interface to be tested and the measuring instrument.
[0019] Optionally, the adapter unit includes a plurality of adapter terminal interfaces, and the plurality of adapter terminal interfaces are used to connect to different interfaces to be tested.
[0020] Optionally, the matrix switch unit is connected to the interface to be tested via an interface connection harness and at least one adapter terminal interface.
[0021] Optionally, the interface test platform further comprises a hardware-in-the-loop simulation device, and the interface to be tested comprises a signal interface required in the loop;
[0022] The hardware-in-the-loop simulation device is used to interact with the required signal interface in the loop through the switching unit and the matrix switch unit;
[0023] The matrix switch unit is used to obtain the required in-loop signal interacting between the hardware-in-the-loop simulation device and the interface to be tested, and transmit the required in-loop signal to the measuring instrument.
[0024] The interface testing platform of the present application includes an interface switching device and a measuring instrument. The interface switching device includes a matrix switch unit. The matrix switch unit includes multiple channels. Since the matrix switch unit is connected to at least one interface to be tested through multiple channels, the matrix switch unit can realize the switching of the interface to be tested by controlling the on and off of each channel. Since the matrix switch unit is also connected to the measuring instrument, after switching the interface to be tested, the switched interface to be tested can be tested by the measuring instrument. There is no need for the user to manually change the interface to be tested, thereby improving the testing efficiency of the interface. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 This is the structural diagram of the interface test platform for this application;
[0026] Figure 2 This is a schematic diagram of the connection between the matrix switch unit and other components in the interface test platform of this application;
[0027] Figure 3 This is the hardware architecture design diagram of the matrix switch unit in the interface test platform of this application.
[0028] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0029] It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0030] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.
[0031] It should be noted that, in this article, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element. In addition, components, features, and elements with the same name in different embodiments of the present application may have the same meaning or different meanings, and their specific meanings need to be determined by their explanation in the specific embodiment or further combined with the context of the specific embodiment.
[0032] It should be understood that, although the terms first, second, third, etc. may be used to describe various information in this article, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of this article, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Furthermore, as used in this article, the singular forms "one", "one" and "the" are intended to also include plural forms, unless there is an opposite indication in the context. It should be further understood that the terms "comprising", "including" indicate the existence of features, steps, operations, elements, components, projects, kinds, and / or groups, but do not exclude the existence, occurrence or addition of one or more other features, steps, operations, elements, components, projects, kinds, and / or groups. The terms "or", "and / or", "including at least one of the following" etc. used in this application may be interpreted as inclusive, or mean any one or any combination. For example, “comprising at least one of the following: A, B, C” means “any of the following: A; B; C; A and B; A and C; B and C; A and B and C”, and for another example, “A, B or C” or “A, B and / or C” means “any of the following: A; B; C; A and B; A and C; B and C; A and B and C”. An exception to this definition will only occur when a combination of elements, functions, steps or operations are inherently mutually exclusive in some manner.
[0033] In the subsequent description, the suffixes such as "module", "component" or "unit" used to represent elements are only used to facilitate the description of the present application, and have no specific meanings. Therefore, "module", "component" or "unit" can be used in a mixed manner.
[0034] Reference Figure 1 , Figure 1 This is the structural block diagram of the interface test platform for this application.
[0035] In the first embodiment, the interface testing platform includes an interface switching device and a measuring instrument, the interface switching device includes a matrix switch unit, the matrix switch unit includes multiple channels, the matrix switch unit is connected to the measuring instrument, and is connected to at least one interface to be tested through the multiple channels, and the matrix switch unit is used to control the on and off of each channel to realize the switching of the interface to be tested.
[0036] It should be noted that in the field of automotive motor controllers, compared with software testing, the hardware and integrated system testing of automotive motor controller products has the following characteristics: it is necessary to test the software and hardware interfaces, circuits, and electronic device hardware interfaces within the integrated system.
[0037] Currently, interface testing at the hardware and integrated system levels is mainly divided into R&D stage testing and production stage testing; among them, in production stage testing, ATE (Automatic Test Equipment) equipment is usually used to test automotive software; R&D stage testing is mainly performed by testers with the help of measuring instruments. When testing different software and hardware interfaces or hardware interfaces, testers need to manually change the interface to be tested. Although the automated testing method for automotive software in the product development stage is already very complete, the step of testers manually changing the interface to be tested cannot be controlled by the program, that is, the automated testing technology of the software interface cannot be directly applied or transplanted to the software and hardware interface or hardware interface testing process.
[0038] The above-mentioned manual replacement of the interface to be tested is slow, resulting in low test efficiency. It also requires high capabilities and experience of testers. Whether it is material replacement, design optimization, demand change, cost reduction, etc., the number of product test rounds will continue to increase, thereby increasing the test cost.
[0039] The interface testing platform of this embodiment can be used to test the software and hardware interfaces and hardware interfaces of the object to be tested. Correspondingly, the interfaces to be tested include software and hardware interfaces and hardware interfaces, and the object to be tested includes hardware to be tested and a system to be tested.
[0040] Among them, the hardware-software interface is the agreement or rule for information exchange and control between software and hardware. The hardware-software interface can be at the physical level or the logical level, for example, a communication port or an API (application programming interface).
[0041] Specifically, Figure 1 As shown, the interface test platform includes an interface switching device and a measuring instrument, the interface switching device includes a matrix switch unit, and the matrix switch unit is respectively connected to at least one interface to be tested and the measuring instrument through an interface connection harness; the interface test platform also includes a measuring probe, which can be arranged inside the measuring instrument or outside the measuring instrument.
[0042] The measuring instrument is provided with a program-controlled oscilloscope and a signal generator, and the measuring probe is provided with connection terminals for different program-controlled oscilloscopes.
[0043] The measuring probe is connected to the matrix switch unit through the interface connection harness. When the interface test platform is used for testing, the measuring probe transmits the measured signal to the matrix switch unit and simultaneously transmits the measured signal to the program-controlled oscilloscope. The program-controlled oscilloscope receives the measured signal and analyzes the measured signal.
[0044] It should be noted that the matrix switch unit includes a plurality of channels, and the matrix switch unit is connected to at least one interface to be tested through the plurality of channels. Therefore, the matrix switch unit can switch the interface to be tested by controlling the on and off of each channel.
[0045] Specifically, the matrix switch unit is provided with an internal control chip and relays, and the on and off of multiple channels are realized by the relays. In addition, the matrix switch unit is connected to the computer through a device communication cable. The computer can control the internal control chip of the matrix switch unit to drive the corresponding relays to work, thereby realizing the on and off of the channels. The device communication cable includes a CAN (Controller Area Network, serial communication protocol) bus.
[0046] It should be noted that a power supply circuit is provided inside the matrix switch unit, and the power supply circuit can provide voltages such as 5V, 3.3V and 1.9V, among which the 5V power supply is used to supply power to the CAN chip.
[0047] Furthermore, the interface test platform further comprises a program-controlled DC power supply, which is used to supply power to the object to be tested.
[0048] It can be understood that in the process of testing using the above-mentioned interface testing platform, the matrix switch unit and the measuring instrument are respectively connected to the computer through the equipment communication cable, and at least one interface to be tested is connected to the matrix switch unit through the interface connection harness. The computer controls the programmable DC power supply to supply power to the object to be tested, controls the on and off of the control channel of the matrix switch unit, and controls the connection of the measuring probe with the interface after the matrix switch unit switches the channel.
[0049] The matrix switch unit switches the interface to be tested by controlling the on and off of each channel, thereby transmitting the measured signal to the measuring probe through the connected channel. The measuring probe sends the measured signal to the measuring instrument, and the measuring instrument tests the interface to be tested by analyzing and processing the measured signal.
[0050] It should be noted that since the interface to be tested of each product is fixed and the interface connection harness corresponding to the interface to be tested is fixed, when the matrix switch unit is connected to the interface to be tested through the interface connection harness, and the matrix switch unit is connected to at least one interface to be tested through multiple channels, the switching of the interface to be tested can be achieved by controlling the on and off of each channel.
[0051] Furthermore, in order to facilitate the testing of different products with different interfaces, the interface switching device also includes a switching unit, such as Figure 2 As shown, the switching unit is connected to the interface to be tested, multiple channels of the matrix switch unit, and the measuring probe through the interface connection harness, so that the switching between the interface to be tested and the matrix switch unit, and the switching between the interface to be tested and the measuring probe are realized through the switching unit.
[0052] Specifically, the adapter unit includes a plurality of adapter terminal interfaces, and the plurality of adapter terminal interfaces are used to connect with different interfaces to be tested, for example, an FPC terminal interface, a BTB terminal interface, a bull horn terminal interface, etc., wherein each adapter terminal interface is provided with at least one.
[0053] It should be noted that the matrix switch unit is connected to the interface to be tested through an interface connection harness and at least one adapter terminal interface.
[0054] It can be understood that since the interface to be tested of each product is fixed and the interface connection harness corresponding to the interface to be tested is fixed, when the adapter unit is connected to the interface to be tested through the interface connection harness, the connection relationship between multiple channels and at least one interface to be tested corresponds to the connection relationship between at least one adapter terminal interface and the interface connection harness.
[0055] In this embodiment, the interface test platform includes an interface switching device and a measuring instrument. The interface switching device includes a matrix switch unit. The matrix switch unit includes multiple channels. Since the matrix switch unit is connected to at least one interface to be tested through multiple channels, the matrix switch unit can switch the interface to be tested by controlling the on and off of each channel. Since the matrix switch unit is also connected to the measuring instrument, after switching the interface to be tested, the switched interface to be tested can be tested by the measuring instrument, without the need for the user to manually change the interface to be tested. Testing using the above interface test platform can improve test efficiency. In addition, the interface switching device in this embodiment also includes a switching unit, which can realize the testing of different products with different interfaces.
[0056] Therefore, this embodiment provides a test platform that is easy to use and can test software and hardware interfaces or hardware interfaces, which can improve the execution efficiency of software and hardware and hardware tests at the system level and improve the test quality.
[0057] Further, based on the first embodiment, a second embodiment is provided:
[0058] In a second embodiment, the multiple channels of the matrix switch unit include multiple X-axis channels, a first channel among the multiple X-axis channels is communicatively connected to at least one of the interfaces to be tested, and a second channel among the multiple X-axis channels is connected to a reference ground of at least one of the interfaces to be tested; and the first channel is used to transmit signals with at least one of the interfaces to be tested.
[0059] like Figure 2 As shown, a first channel among the multiple X-axis channels is communicatively connected with at least one of the interfaces to be measured, and the first channel is used to transmit signals with the interface to be measured; a second channel among the multiple X-axis channels is connected with a reference ground of at least one of the interfaces to be measured, that is, the second channel among the multiple X-axis channels is used to access the reference ground of the interface to be measured, and the reference ground (ground, GND) of the interface to be measured is a potential reference point, which is usually set to 0 volts, and the reference ground is a common end that constitutes a circuit signal loop; the connection with the reference ground of the interface to be measured can connect the ground of the measuring instrument to the ground potential defined by the interface to be measured of the device to be measured, thereby ensuring that the reference potential during measurement is consistent and avoiding errors or interference caused by potential differences.
[0060] Specifically, the total number of the first channel and the second channel can be designed to be 80 or 100, etc. When the total number of the first channel and the second channel is 80, the corresponding channel number can be designed to be Switch_X_01-Switch_X_80, and a relay switch is connected in series between the input and output ends of each channel.
[0061] Therefore, the matrix switch unit transmits the measured signal and the reference ground of the measured signal to the measuring instrument through the measuring probe, and the measuring instrument analyzes the measured signal and the reference ground to implement the test of the interface to be measured.
[0062] It should be noted that the interfaces to be tested corresponding to different measured signals may be the same or different, that is, the corresponding reference grounds may be the same or different; therefore, the matrix switch unit needs to transmit the measured signal and its reference ground to the measuring instrument, and the measuring instrument performs a comprehensive analysis of the measured signal and its reference ground.
[0063] Furthermore, the multiple channels also include multiple Y-axis channels; the multiple Y-axis channels are used to transmit signals with the measuring instrument; the input end of each X-axis channel is connected to the third channel among the multiple Y-axis channels, and the output end of each X-axis channel is connected to the fourth channel among the multiple Y-axis channels.
[0064] Specifically, the total number of the third channel and the fourth channel can be designed to be 12 or 16, etc. When the total number of the third channel and the fourth channel is 12, when the number of the third channel is 8, the channel numbers corresponding to the third channels can be designed to be Switch_Yleft_P1-Switch_Yleft_P4, Switch_Yleft_N1-Switch_Yleft_N4, and when the number of the fourth channels is 4, the channel numbers corresponding to the fourth channels can be designed to be Switch_Yright_P1-Switch_Yright_P2, Switch_Yright_N1-Switch_Yright_N2.
[0065] Among them, in order to facilitate the distinction between the input end and the output end and avoid confusion in signal transmission, the input ends of the first channels Switch_X_01-Switch_X_76 are connected to the third channels of the Y-axis Switch_Yleft_P1-Switch_Yleft_P4 through relays, and the output ends of the first channels are connected to the fourth channels of the Y-axis Switch_Yright_01-Switch_Yright_02 through relays.
[0066] Specifically, Figure 3 As shown, in order to realize the functions of the above-mentioned matrix switch unit, the matrix switch unit also includes a control unit (internal control chip), a drive chip cascade circuit, a first drive unit and a second drive unit, the control unit is provided with a multiplexing pin, the first drive unit is communicatively connected with the control unit through the multiplexing pin, and the drive chip cascade circuit is communicatively connected with the second drive unit; the control unit is used to control the on-off of the first channel through the multiplexing pin and the first drive unit; the drive chip cascade circuit is used to control the on-off of each Y-axis channel through the second drive unit.
[0067] The control unit may be a DSP (Digital Signal Processing Control Module) control unit, an MCU (Micro Control Unit), a FPGA (Field Programmable Gate Array), or the like.
[0068] The preferred control unit of this embodiment is a DSP control unit. The DSP control unit can support software communication and burning with the outside world through CAN, and the DSP control unit has a built-in flash memory to provide sufficient space for code storage.
[0069] The driver chip cascade circuit includes a 74HC595 cascade unit formed by connecting multiple 74HC595 chips, a 74LS595 cascade unit formed by connecting multiple 74LS595 chips, or a 74HC164 cascade unit formed by connecting multiple 74HC164 chips.
[0070] Since the 74HC595 chip has good expansion capability and low power consumption, the preferred driving chip cascade circuit in this embodiment is a 74HC595 cascade unit composed of a plurality of 74HC595 chips connected together.
[0071] Furthermore, since the relay cannot be driven directly through the pin of the control unit, a driving module is required to amplify the driving capability to drive the relay to work. The first driving unit includes a MOS (MOSFET Gate Driver) driving module, or a transistor driving unit. The driving unit corresponding to the DSP control unit is preferably a MOS driving module. The MOS driving module can reduce the power consumption of the DSP control unit.
[0072] Furthermore, the DSP control unit has multiplexed GPIO (General Purpose Input / Output) pins as peripherals, the multiplexed GPIO pins have input filtering functions and are individually programmable, and the DSP control unit also has multiple SPI (Serial Peripheral Interface) communication interfaces.
[0073] Therefore, each channel of Switch_X_01-Switch_X_76 on the first channel outputs high and low level signals from the GPIO pin of the DSP chip and transmits them directly to the MOS driver module to realize the on and off of the relay of the first channel (the open or closed state of the circuit).
[0074] Since the second channel Switch_X_77-Switch_X_80 is used to access the reference ground of the measured signal, the MOS driver module corresponding to the second channel is in a pull-down state, keeping the relay in a normally closed state.
[0075] In order to reduce the power consumption of the control unit, this embodiment also implements on-off control of each Y-axis channel through a driver chip cascade circuit; specifically, the driver chip cascade circuit can control the on-off of each Y-axis channel through the second driver unit.
[0076] The second driving unit corresponding to the 74HC595 cascade unit can be a transistor driving unit. The transistor driving unit has a lower cost than the MOS driving module, and the transistor driving unit is only connected to the 74HC595 cascade unit, which will not affect the power consumption of the DSP control unit.
[0077] It should be noted that the power supply circuit provided inside the above matrix switch unit also provides 5V power supply for the CAN chip and 74HC595 drive unit, and also provides 3.3V power supply and 1.9V power supply for the DSP control unit.
[0078] Furthermore, the control unit also includes a multi-channel SPI communication interface, and the driver chip cascade circuit includes a first driver chip cascade circuit and a second driver chip cascade circuit; specifically, the first driver chip cascade circuit can be composed of 40 or 50 74HC595 chips connected, and the second driver chip cascade circuit can be composed of 20 or 25 74HC595 chips connected.
[0079] Among them, due to the limitation of the storage depth of the data buffer of the DSP control unit, the driver chip cascade unit is divided into a first driver chip cascade circuit and a second driver chip cascade circuit. At the same time, the level matching circuit ensures that the electrical specifications of the input and output signals of the control unit and the driver chip cascade unit match. One of the SPI communication interfaces in the multi-channel SPI communication interface can be used to communicate with the first driver chip cascade circuit, and other SPI communication interfaces in the multi-channel SPI communication interface can be used to communicate with the second driver chip cascade circuit; thereby, the on-off of the third channel can be controlled through one of the SPI communication interfaces, the first driver chip cascade circuit, and the second driver unit; the on-off of the fourth channel can be controlled through other SPI communication interfaces, the second driver chip cascade circuit, and the second driver unit.
[0080] like Figure 3 As shown, the third channels Switch_Yleft_P1-Switch_Yleft_P4 and Switch_Yleft_N1-Switch_Yleft_N4 corresponding to the Y-axis input end control the first driver chip cascade circuit and the transistor driver unit through an SPI communication interface, thereby realizing channel control of 320 relays corresponding to the third channel.
[0081] like Figure 3 As shown, the fourth channels Switch_Yright_P1-Switch_Yright_P2 and Switch_Yright_N1-Switch_Yright_N2 corresponding to the Y-axis output end control the second drive chip cascade circuit and the transistor drive unit through other SPI communication interfaces, thereby realizing channel control of 160 relays corresponding to the fourth channel.
[0082] Furthermore, in order to facilitate the determination of the status of each relay during use of the matrix switch unit, each X-axis channel and Y-axis channel is provided with a switch signal light, which is used to indicate the on / off status of the relay.
[0083] Furthermore, the coil driving voltage of the relay can be supplied by an external power supply device to reduce the number of power supply circuits and load requirements of the driving switch unit.
[0084] It should be noted that the matrix switch unit can realize the injection of open circuit fault by controlling the on and off of each X-axis channel, so that a part of the circuit of the object to be tested is disconnected, resulting in infinite resistance, and the current cannot pass normally, thereby realizing fault injection into the object to be tested.
[0085] Controlling the on and off of each X-axis channel may be controlling the on and off of some of the required X-axis channels.
[0086] Furthermore, the object under test sends a response signal of the fault injection to the matrix switch unit, the matrix switch unit receives the response signal, and transmits the response signal to the measuring instrument through the measuring probe, and the measuring instrument analyzes the response signal to realize the test of the interface under test.
[0087] It should be noted that the measuring instrument can also control the signal generator to generate a fault injection signal.
[0088] The measuring instrument sends the fault injection signal to the matrix switch unit through the measuring probe. The matrix switch unit receives the fault injection signal and transmits the fault injection signal to the interface of the object to be tested, thereby realizing the fault injection to the object to be tested.
[0089] Based on the above, this embodiment provides a low-cost matrix switch unit that can accurately control the on and off of channels, which provides convenience for interface testing. At the same time, during the test process, open circuit fault injection can be performed through the matrix switch unit, which meets the test requirements of the integrated test interface of the motor controller system, power supply system, etc., and improves the test efficiency, test accuracy and test quality.
[0090] Further, based on the first and second embodiments, a third embodiment is provided:
[0091] In a third embodiment, the interface test platform further includes a hardware-in-the-loop (HIL) simulation device, and the interface to be tested includes a signal interface required in the loop.
[0092] It should be noted that the object to be tested includes the hardware to be tested, and the hardware to be tested includes a control board. The control board or the hardware-in-the-loop simulation device can send out the required signal in the loop.
[0093] Among them, the required signal interface in the loop is an interface in the software and hardware interface that cannot directly process the measured signal; usually, the hardware interface can directly process the measured signal, and the object to be tested includes a control board and a driver board. In the process of testing the hardware interface, the driver board transmits the measured signal to the control board through the matrix switch unit, and the control board processes the measured signal and sends instructions to the driver board to realize operation; while some software and hardware interfaces cannot directly process some measured signals; therefore, for the required signal interface in the loop, the control board needs to send the required signal in the loop to the hardware-in-the-loop simulation device through the matrix switch unit, and the hardware-in-the-loop simulation device realizes the processing of the required signal in the loop by simulating the load required to drive the object to be tested.
[0094] The hardware-in-the-loop simulation device is also used to interact with the required-in-the-loop signal interface in the software and hardware interface through the switching unit and the matrix switch unit.
[0095] In the case where the required in-loop signal is sent by the control board, the control board can send the required in-loop signal to the hardware-in-loop simulation device through the matrix switch unit. The hardware-in-loop simulation device processes the required in-loop signal and sends the processed required in-loop signal to the control board of the object to be tested through the matrix switch unit, thereby realizing the interaction of the required in-loop signal.
[0096] When the required in-loop signal is sent by the hardware-in-loop simulation device, the hardware-in-loop simulation device processes the required in-loop signal and sends the required in-loop signal to the control board through the matrix switch unit and the switching unit, thereby realizing the interaction of the required in-loop signal.
[0097] Furthermore, the matrix switch unit obtains the required in-loop signals interacting between the hardware-in-the-loop simulation device and the interface to be tested, and transmits the required in-loop signals to the measuring instrument through the measuring probe; specifically, the matrix switch unit can obtain part of the required in-loop signals interacting between the hardware-in-the-loop simulation device and the interface to be tested.
[0098] In this embodiment, the signals required for hardware-in-the-loop are processed by a hardware-in-the-loop simulation device, thereby implementing testing of some software and hardware interfaces that cannot directly process the signals required for hardware-in-the-loop, thereby increasing the scope of test application.
[0099] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or system including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or system. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or system including the element.
[0100] The serial numbers of the above-mentioned embodiments of the present application are for description only and do not represent the advantages or disadvantages of the embodiments.
[0101] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present application, or the part that contributes to the prior art, can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) as above, and includes a number of instructions for a terminal device (which can be a mobile phone, computer, server, air conditioner, or network device, etc.) to execute the methods of each embodiment of the present application.
[0102] The above are only preferred embodiments of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.
Claims
1. An interface testing platform, characterized in that: The interface test platform comprises an interface switching device and a measuring instrument, wherein the interface switching device comprises a matrix switch unit, wherein the matrix switch unit comprises a plurality of channels, and the matrix switch unit is connected to the measuring instrument and is connected to at least one interface to be tested through the plurality of channels; The matrix switch unit switches the interface to be tested by controlling the on and off of each channel.
2. The interface testing platform according to claim 1, characterized in that: The plurality of channels include a plurality of X-axis channels, a first channel among the plurality of X-axis channels is communicatively connected to at least one of the interfaces to be tested, and a second channel among the plurality of X-axis channels is connected to a reference ground of at least one of the interfaces to be tested; The first channel is used for signal transmission with at least one of the interfaces to be tested.
3. The interface testing platform according to claim 2, characterized in that: The plurality of channels also include a plurality of Y-axis channels; The plurality of Y-axis channels are used for signal transmission with the measuring instrument; An input end of each of the X-axis channels is connected to a third channel among the plurality of Y-axis channels, and an output end of each of the X-axis channels is connected to a fourth channel among the plurality of Y-axis channels.
4. The interface testing platform according to claim 3, characterized in that: The matrix switch unit further includes a control unit, a driver chip cascade circuit, a first driver unit and a second driver unit, wherein the control unit is provided with a multiplexing pin, the first driver unit is communicatively connected with the control unit via the multiplexing pin, and the driver chip cascade circuit is communicatively connected with the second driver unit; The control unit is used to control the on and off of the first channel through the multiplexing pin and the first driving unit; The driving chip cascade circuit is used to control the on and off of each of the Y-axis channels through the second driving unit.
5. The interface testing platform according to claim 4, characterized in that: The control unit also includes a multi-channel SPI communication interface, the driver chip cascade circuit includes a first driver chip cascade circuit and a second driver chip cascade circuit, one of the multi-channel SPI communication interfaces is communicatively connected to the first driver chip cascade circuit, and the other SPI communication interfaces in the multi-channel SPI communication interface are communicatively connected to the second driver chip cascade circuit; The first driver chip cascade circuit is used to control the on and off of the third channel through one of the SPI communication interfaces, the first driver chip cascade circuit, and the second driver unit; The second driver chip cascade circuit is used to control the on and off of the fourth channel through the other SPI communication interfaces, the second driver chip cascade circuit, and the second driver unit.
6. The interface testing platform according to claim 1, characterized in that: The interface switching device also includes a switching unit, which is respectively connected to the interface to be tested, multiple channels of the matrix switch unit, and the measuring instrument to achieve switching between the interface to be tested and the matrix switch unit, and between the interface to be tested and the measuring instrument.
7. The interface testing platform according to claim 6, characterized in that: The adapter unit includes a plurality of adapter terminal interfaces, and the plurality of adapter terminal interfaces are used to connect with different interfaces to be tested.
8. The interface testing platform according to claim 7, characterized in that: The matrix switch unit is connected to the interface to be tested via an interface connection harness and at least one adapter terminal interface.
9. The interface testing platform according to claim 6, characterized in that: The interface test platform also includes a hardware-in-the-loop simulation device, and the interface to be tested includes a signal interface required in the loop; The hardware-in-the-loop simulation device is used to interact with the required signal interface in the loop through the switching unit and the matrix switch unit; The matrix switch unit is used to obtain the required in-loop signal interacting between the hardware-in-the-loop simulation device and the interface to be tested, and transmit the required in-loop signal to the measuring instrument.