Fingerprint module and electronic equipment

Abstract

The utility model discloses a fingerprint module and an electronic device, and the fingerprint module comprises a pedestal which is internally provided with a chip; the cover plate is arranged above the chip; the cover plate is arranged in the base; a buffer layer is arranged on the outer ring of the base. The buffer layer is arranged on the outer ring of the base, so that collision and damage when the base and the whole machine mechanism are assembled are avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic equipment, in particular to a fingerprint module and electronic equipment. Background Art

[0002] The fingerprint module is a very light and thin component, which is usually assembled in the whole machine in an embedded form, leaving only the part that matches the fingerprint to unlock, and the rest of the parts are inside the whole machine. The part where the fingerprint module and the whole machine are assembled is the base, and the base is usually a metal base. The metal base and the whole machine mechanism are both hard parts. During assembly, there may be bumps and damages, and due to tolerance reasons, there will be assembly gaps and other problems, which will affect the aesthetic effect of the whole machine.

[0003] How to solve the above-mentioned technical problems has become a technical problem that needs to be solved urgently in the industry. Summary of the invention

[0004] In order to at least solve the above technical problems, the purpose of the utility model is to provide a fingerprint module, which avoids the occurrence of collision damage when the base and the whole machine mechanism are assembled by arranging a buffer layer on the outer ring of the base.

[0005] In order to achieve the above purpose, the fingerprint module provided by this application includes:

[0006] A base, wherein a chip is arranged in the base;

[0007] A cover plate, arranged above the chip;

[0008] The cover plate is arranged in the base;

[0009] The outer ring of the base is provided with a buffer layer.

[0010] Furthermore, the buffer layer is a rubber ring.

[0011] Furthermore, the base is L-shaped along the axial cross section, and the inner angle of the L-shape faces outward.

[0012] Furthermore, the rubber ring is arranged at the inner corner of the base.

[0013] Furthermore, the cross section of the rubber ring is triangular.

[0014] Furthermore, the cross section of the rubber ring is an isosceles right triangle.

[0015] Furthermore, an FPC is provided below the chip.

[0016] Furthermore, the FPC is arranged below the base.

[0017] Furthermore, a reinforcing plate is provided below the FPC.

[0018] To achieve the above objectives, the present application also provides an electronic device, including: the above fingerprint module.

[0019] The fingerprint module of the embodiment of the present application includes: a base, a chip is arranged inside the base; a cover plate is arranged above the chip; the cover plate is arranged inside the base; and a buffer layer is arranged on the outer ring of the base. By arranging the buffer layer on the outer ring of the base, the base is prevented from being damaged by collision when being assembled with the whole machine mechanism; at the same time, the buffer layer prevents the appearance of the whole machine from being affected by the assembly gap caused by tolerance reasons; the buffer layer also enhances the sealing performance when the fingerprint module is assembled with the whole machine, and improves the dustproof and waterproof effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings are used to provide a further understanding of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the accompanying drawings:

[0021] Figure 1 It is a cross-sectional view of the fingerprint module of an embodiment of the present application.

[0022] Description of reference numerals:

[0023] 101 - base; 102 - cover plate; 103 - chip; 104 - FPC; 105 - reinforcement plate; 106 - buffer layer. DETAILED DESCRIPTION

[0024] The embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although certain embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be construed as being limited to the embodiments described herein. Instead, these embodiments are provided to provide a more thorough and complete understanding of the present application. It should be understood that the drawings and embodiments of the present application are only for exemplary purposes and are not intended to limit the scope of protection of the present application.

[0025] It should be understood that the various steps described in the method implementation of the present application can be performed in different orders and / or performed in parallel. In addition, the method implementation may include additional steps and / or omit the steps shown. The scope of the present application is not limited in this respect.

[0026] The term "including" and its variations used herein are open inclusions, i.e., "including but not limited to". The term "based on" means "based at least in part on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". The relevant definitions of other terms will be given in the following description.

[0027] It should be noted that the modifications of "one" and "plurality" mentioned in this application are illustrative rather than restrictive, and those skilled in the art should understand that unless otherwise clearly indicated in the context, it should be understood as "one or more". "Plurality" should be understood as two or more.

[0028] Hereinafter, embodiments of the present application will be described in detail with reference to the accompanying drawings.

[0029] The present application provides a fingerprint module, including:

[0030] A base, wherein a chip is arranged in the base;

[0031] A cover plate, arranged above the chip;

[0032] The cover plate is arranged in the base;

[0033] The outer ring of the base is provided with a buffer layer.

[0034] Example 1

[0035] Figure 1 This is a cross-sectional view of the fingerprint module of the embodiment of the present application. Figure 1 , the fingerprint module structure of the embodiment of the present application is described in detail.

[0036] In an exemplary implementation, the fingerprint module of the embodiment of the present application includes: a base 101 .

[0037] In an exemplary embodiment, as required, the base 101 is made of, for example, stainless steel.

[0038] In an exemplary embodiment, the shape of the base 101 is set as needed, for example, the base 101 is set to be oval or circular. Of course, if necessary, the shape of the base 101 can also be set to be rectangular.

[0039] In an exemplary embodiment, a chip 103 is disposed in the base 101 .

[0040] In an exemplary embodiment, a cover plate 102 is further disposed in the base 101 .

[0041] In an exemplary embodiment, the cover plate 102 is disposed above the chip 103 .

[0042] In an exemplary embodiment, the cover plate 102 is disposed within the base 101 .

[0043] In an exemplary embodiment, the cover plate 102 covers the chip 103 .

[0044] In an exemplary embodiment, a buffer layer 106 is disposed on the outer ring of the base 101 .

[0045] In an exemplary embodiment, the buffer layer 106 is a rubber ring.

[0046] In an exemplary embodiment, the base 101 is L-shaped along the axial cross section, and the inner corner of the L-shape faces outward, such as Figure 1 As shown, the base 101 is L-shaped in an axial cross section, and the inner angles of the L-shapes on both sides are outward, or the two L-shapes are facing back to back.

[0047] In an exemplary embodiment, the rubber ring is disposed at an inner corner of the base 101 .

[0048] In an exemplary embodiment, the cross section of the rubber ring is an isosceles right triangle.

[0049] In an exemplary embodiment, an adhesive layer is provided between the cover plate 102 and the chip 103 , and the adhesive layer is formed by coating glue, for example.

[0050] In an exemplary embodiment, an FPC 104 is further disposed below the chip 103 .

[0051] In an exemplary embodiment, the FPC 104 is disposed below the base 101 , that is, the FPC 104 is not disposed in the base 101 .

[0052] In an exemplary embodiment, the FPC 104 is provided with an extended portion, and the projection of the extended portion does not fall on the cover plate 102 .

[0053] In an exemplary embodiment, the extension portion is provided with a component area.

[0054] In an exemplary embodiment, components are disposed on the component area.

[0055] In some exemplary embodiments, the components include capacitors and / or resistors and / or diodes.

[0056] In some exemplary embodiments, the capacitor plays a role of voltage stabilization or filtering.

[0057] In some exemplary embodiments, the resistor plays a role of pull-up or electrostatic protection.

[0058] In some exemplary embodiments, the diode plays a role in electrostatic protection or preventing voltage backflow.

[0059] In an exemplary embodiment, a reinforcing plate 105 is provided below the FPC 104 .

[0060] In an exemplary embodiment, the reinforcement plate 105 is, for example, a steel sheet reinforcement plate. Of course, the reinforcement plate 105 may also be a reinforcement plate made of a non-metallic material if necessary.

[0061] In an exemplary embodiment, an adhesive layer is provided between the chip 103 and the FPC 104 , and the adhesive layer is formed by coating glue, for example.

[0062] In an exemplary embodiment, an adhesive layer is provided between the FPC 104 and the reinforcing plate 105 , and the adhesive layer is formed by coating glue, for example.

[0063] Example 2

[0064] Embodiment 2 is an electronic device including a fingerprint recognition function.

[0065] In an exemplary implementation, the electronic device according to the embodiment of the present application includes the fingerprint recognition module according to the above embodiment.

[0066] Although the implementation methods disclosed in the utility model are as above, the content is only an implementation method adopted to facilitate the understanding of the utility model, and is not used to limit the utility model. Any technician in the field to which the utility model belongs can make any modifications and changes in the form and details of implementation without departing from the spirit and scope disclosed in the utility model, but the scope of patent protection of the utility model shall still be based on the scope defined in the attached claims.

Claims

1. A fingerprint module, characterized in that: include: A base, wherein a chip is arranged in the base; A cover plate, arranged above the chip; The cover plate is arranged in the base; The outer ring of the base is provided with a buffer layer.

2. The fingerprint module according to claim 1, characterized in that: The buffer layer is a rubber ring.

3. The fingerprint module according to claim 2, characterized in that: The base is L-shaped along the axial section, and the inner angle of the L-shape faces outwards.

4. The fingerprint module according to claim 3, characterized in that: The rubber ring is arranged at the inner corner of the base.

5. The fingerprint module according to claim 4, characterized in that: The cross section of the rubber ring is triangular.

6. The fingerprint module according to claim 5, characterized in that: The cross section of the rubber ring is an isosceles right triangle.

7. The fingerprint module according to claim 6, characterized in that: An FPC is also provided below the chip.

8. The fingerprint module according to claim 7, characterized in that: The FPC is arranged below the base.

9. The fingerprint module according to claim 8, characterized in that: A reinforcing plate is provided below the FPC.

10. An electronic device, characterized in that: A fingerprint module comprising any one of claims 1 to 9.

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