Mounting suction nozzle and chip mounting equipment

Abstract

The utility model provides a mounting suction nozzle and chip mounting equipment, the mounting suction nozzle comprises a main body, the main body is provided with an adsorption channel, one surface, deviating from the adsorption channel, of the main body is provided with an accommodating groove, and the adsorption channel is communicated with the accommodating groove; the connecting pipe is arranged in the adsorption channel in a penetrating manner; the adsorption part is rotatably arranged in the containing groove, the adsorption part is connected with one end of the connecting pipe, the adsorption part is provided with an adsorption opening connected with the connecting pipe, and the adsorption opening extends out of a groove opening of the containing groove; the elastic assembly comprises a first elastic piece and a second elastic piece, the first elastic piece and the second elastic piece are both located between the bottom wall of the containing groove and the adsorption piece and are in a compressed state, and the first elastic piece and the second elastic piece are located on the two sides of the rotating axis of the adsorption piece respectively. According to the surface-mount suction nozzle provided by the embodiment of the invention, the chip can be adaptively adsorbed, and the welding effect is improved.

Description

Technical Field

[0001] The present application belongs to the field of chip production technology, and more specifically, to a mounting nozzle and a chip mounting device. Background Art

[0002] Semiconductor laser chips are mounted on substrates, the chips are sucked from the raw material box and then welded on the substrate at high temperature. The suction nozzle used in this process is extremely critical to process control. The current mainstream suction nozzles are made of metal alloy blocks and high-temperature resistant ceramics. The height and angle of this type of nozzle are fixed, and it is impossible to adaptively balance according to the contact height between the two ends of the chip and the substrate, resulting in a high solder void rate after mounting and poor welding effect. Utility Model Content

[0003] The embodiment of the present application provides a mounting nozzle that can adaptively absorb chips and improve welding effects.

[0004] The technical solution adopted in the embodiment of the present application is: to provide a mounting nozzle, including:

[0005] A main body, wherein the main body is provided with an adsorption channel, a side of the main body facing away from the adsorption channel is provided with a receiving groove, and the adsorption channel is communicated with the receiving groove;

[0006] A connecting pipe is inserted into the adsorption channel;

[0007] An adsorption member is rotatably mounted in the receiving groove, the adsorption member is connected to one end of the connecting pipe, the adsorption member is provided with an adsorption port connected to the connecting pipe, and the adsorption port extends out of the notch of the receiving groove; and

[0008] The elastic component includes a first elastic member and a second elastic member, wherein the first elastic member and the second elastic member are both located between the bottom wall of the accommodating groove and the adsorbent and are in a compressed state, and the first elastic member and the second elastic member are respectively located on both sides of the rotation axis of the adsorbent.

[0009] Furthermore, it also includes a limiting member, wherein the limiting member is fixed to the side wall of the containing groove;

[0010] A mounting hole is provided on one side of the adsorption member close to the accommodating groove, and one end of the limiting member is conical and inserted into the mounting hole.

[0011] Furthermore, a through hole is provided on the side wall of the accommodating groove, and one end of the limiting member away from the adsorption member is inserted into the through hole.

[0012] Furthermore, two positioning holes are provided on the bottom wall of the accommodating groove, and ends of the first elastic member and the second elastic member away from the adsorption member are inserted into the positioning holes.

[0013] Furthermore, the main body also includes a tube portion extending in the same direction as the connecting tube, and the adsorption channel is arranged on the tube portion.

[0014] Furthermore, the depth of the accommodating groove is greater than the thickness of the adsorbent.

[0015] Furthermore, both ends of the accommodating groove pass through the main body.

[0016] Furthermore, one end of the adsorption channel is located on the bottom wall of the containing groove.

[0017] An embodiment of the present application also provides a chip mounting device, including the mounting nozzle as described above.

[0018] The beneficial effect of the mounting nozzle provided by the embodiment of the present application is that: the mounting nozzle of the embodiment of the present application is provided with an adsorbent that is rotatably arranged in the receiving groove of the main body, and a first elastic member and a second elastic member are provided on both sides of the rotation axis of the adsorbent. When mounting the chip, the adsorbent can absorb the chip and press it on the substrate (with solder between the two). If there is a gap between the chip and the substrate, under the action of the first elastic member and the second elastic member, the adsorbent will carry the chip to rotate around the rotation axis adaptively, press the gap, reduce the solder void rate, and improve the welding effect. The connecting tube that passes through the adsorption channel ensures the adsorption effect of the elastic member after rotation, and prevents the chip from falling off the adsorbent during rotation. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0020] Figure 1 A schematic diagram of the three-dimensional structure of a mounting nozzle provided in an embodiment of the present application;

[0021] Figure 2 A cross-sectional view of a mounting nozzle provided in an embodiment of the present application;

[0022] Figure 3 Another cross-sectional view of the mounting nozzle provided in the embodiment of the present application;

[0023] Figure 4 An exploded view of a mounting nozzle provided in an embodiment of the present application.

[0024] Among them, the reference numerals in the figure are:

[0025] 10. Main body; 11. Accommodation groove; 12. Adsorption channel; 13. Through hole; 14. Positioning hole; 15. Tube;

[0026] 20. Connecting pipe;

[0027] 30. adsorption member; 31. adsorption port; 32. mounting hole;

[0028] 40. elastic component; 41. first elastic member; 42. second elastic member;

[0029] 50. Limiting member; 51. Conical structure. DETAILED DESCRIPTION

[0030] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0031] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0032] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0033] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0034] See also Figure 1 The mounting nozzle provided in the embodiment of the present application is now described. The mounting nozzle provided in the embodiment of the present application includes a main body 10, a connecting tube 20, a suction piece 30 and an elastic component 40.

[0035] Reference Figure 1 and Figure 4The main body 10 is provided with an adsorption channel 12, and a receiving groove 11 is provided on one side of the main body away from the adsorption channel 12, and the adsorption channel 12 is connected to the receiving groove 11. The main body 10 is a basic structure for installing an adsorption member 30, a connecting pipe 20 and an elastic component 40. The adsorption member 30 can be installed in the receiving groove 11, and the connecting pipe 20 can be installed in the adsorption channel 12 to connect the connecting pipe 20 with the adsorption member 30.

[0036] Reference Figure 2 and Figure 4 The connecting tube 20 is passed through the adsorption channel 12. One end of the connecting tube 20 can be connected to a negative pressure system or a vacuum pump, and the other end can be connected to an adsorption member 30, so that the chip is adsorbed by the adsorption member 30. The adsorption channel 12 provides a channel for connecting the connecting tube 20 with the adsorption member 30. The connecting tube 20 can be a rubber vacuum tube, which is sealed and connected to the adsorption member 30.

[0037] Reference Figure 1 and Figure 2 , the adsorbent 30 is rotatably installed in the receiving groove 11, and the adsorbent 30 is provided with an adsorption port 31 connected to the connecting tube 20, and the adsorption port 31 extends out of the notch of the receiving groove 11. The adsorbent 30 is installed in the receiving groove 11, and is connected to the connecting tube 20, so as to adsorb the chip through the adsorption port 31. In the process of bonding and welding with the substrate after the chip is adsorbed, if the flatness of the substrate is poor, or the thickness of the chip itself is greatly different before and after the design, or the heating table of the equipment is uneven, it will cause gaps between the substrate and the chip due to unevenness. If these gaps are not eliminated, there will be voids in the solder, which will reduce the welding effect. In the embodiment of the present application, since the adsorbent 30 is rotatable in the receiving groove 11, when the chip is bonded to the substrate, the bonding pressure can make the adsorbent 30 rotate and adapt, so that the chip and the substrate are more bonded, the gap is eliminated, and the welding quality is ensured.

[0038] Reference Figure 3 The elastic component 40 includes a first elastic member 41 and a second elastic member 42. The first elastic member 41 and the second elastic member 42 are both located between the bottom wall of the receiving groove 11 and the adsorbent 30 and are in a compressed state. The first elastic member 41 and the second elastic member 42 are respectively located on both sides of the rotation axis of the adsorbent 30. Among them, the bottom wall of the receiving groove 11 refers to the groove wall opposite to the notch of the receiving groove 11, and the groove wall is close to the adsorption channel 12. The elastic force of the first elastic member 41 and the second elastic member 42 is basically balanced, so that the adsorbent 30 is in a flat state when not bonded. During bonding, if there is a gap between the chip and the substrate, under the elastic force of the two elastic members, it can rotate with only a slight force, and perform adaptive balance, thereby modulating the posture of the chip, eliminating the gap, and making the solder free of voids during contact welding, thereby ensuring the welding quality.

[0039] Reference Figure 2 and Figure 4 , the mounting nozzle also includes a limiter 50, which is fixed to the side wall of the receiving groove 11; the side of the adsorbent 30 close to the receiving groove 11 is provided with a mounting hole 32, and one end of the limiter 50 is conical and inserted into the mounting hole 32. That is, through the cooperation between the limiter 50 and the mounting hole 32, the adsorbent 30 can rotate in the receiving groove 11. The conical design at one end of the limiter 50 can be self-positioned when installed with the adsorbent 30. The tip of the cone first enters the hole. With further insertion, the conical structure 51 gradually fits tightly with the inner wall of the hole to achieve precise positioning. It should be noted that there are two limiters 50, which are respectively located on both sides of the adsorbent 30. Correspondingly, mounting holes 32 are provided on both sides of the adsorbent 30, so that the conical part of the limiter 50 can be inserted. The mounting hole 32 can be a blind hole.

[0040] Reference Figure 2 and Figure 4 The side wall of the receiving groove 11 is provided with a through hole 13, and one end of the stopper 50 away from the adsorption member 30 is inserted into the through hole 13. The provision of the through hole 13 facilitates the stopper 50 to pass through the through hole 13 and be matched with the adsorption member 30 for installation.

[0041] Reference Figure 3 and Figure 4 The bottom wall of the receiving groove 11 is provided with two positioning holes 14, and the ends of the first elastic member 41 and the second elastic member 42 away from the adsorption member 30 are inserted into the positioning holes 14. The positioning holes 14 can be provided to position the first elastic member 41 and the second elastic member 42 to prevent the adsorption member 30 from deviating during the rotation process. The first elastic member 41 and the second elastic member 42 are compression springs.

[0042] Reference Figure 1 and Figure 2 The main body 10 further includes a tube portion 15 extending in the same direction as the connecting tube 20, and the adsorption channel 12 is provided in the tube portion 15. The provision of the tube portion 15 can reduce the material usage of the main body 10 and reduce the weight of the main body 10. The main body 10 is generally block-shaped, with a groove at one end and the other end connected to the tube portion 15. The adsorption member 30 is also generally block-shaped and embedded in the receiving groove 11, and the end face of the adsorption member 30 is substantially flush with the end face of the main body 10.

[0043] Reference Figure 3 The depth of the receiving groove 11 is greater than the thickness of the adsorbent 30 , so that there is a certain space between the receiving groove 11 and the adsorbent 30 , and the rotation of the adsorbent 30 in the receiving groove 11 is not restricted.

[0044] Reference Figure 3 and Figure 4 The two ends of the receiving groove 11 pass through the main body 10 . The direct through-going setting reduces the groove walls at both ends, leaving space for the adsorption member 30 to rotate.

[0045] Reference Figure 4 One end of the adsorption channel 12 is located at the bottom wall of the accommodating groove 11 to facilitate the connection between the connecting pipe 20 and the adsorption member 30 .

[0046] An embodiment of the present application also provides a chip mounting device, including the mounting nozzle in any of the above embodiments.

[0047] The chip mounting equipment of the embodiment of the present application includes the mounting nozzle in any of the above embodiments, and thus has the beneficial effects brought by the mounting nozzle in any of the above embodiments, which will not be described in detail here.

[0048] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A mounting nozzle, characterized in that: include: A main body, wherein the main body is provided with an adsorption channel, a side of the main body facing away from the adsorption channel is provided with a receiving groove, and the adsorption channel is communicated with the receiving groove; A connecting pipe is inserted into the adsorption channel; An adsorption member is rotatably mounted in the receiving groove, the adsorption member is connected to one end of the connecting pipe, the adsorption member is provided with an adsorption port connected to the connecting pipe, and the adsorption port extends out of the notch of the receiving groove; as well as The elastic component includes a first elastic member and a second elastic member, wherein the first elastic member and the second elastic member are both located between the bottom wall of the accommodating groove and the adsorbent and are in a compressed state, and the first elastic member and the second elastic member are respectively located on both sides of the rotation axis of the adsorbent.

2. The mounting nozzle according to claim 1, characterized in that: It also includes a limiting member, which is fixed to the side wall of the containing groove; A mounting hole is provided on one side of the adsorption member close to the accommodating groove, and one end of the limiting member is conical and inserted into the mounting hole.

3. The mounting nozzle according to claim 2, characterized in that: A through hole is provided on the side wall of the accommodating groove, and one end of the limiting member away from the adsorption member is inserted into the through hole.

4. The mounting nozzle according to claim 1, characterized in that: Two positioning holes are provided on the bottom wall of the accommodating groove, and one end of the first elastic member and the second elastic member away from the adsorption member is inserted into the positioning holes.

5. The mounting nozzle according to claim 1, characterized in that: The main body also includes a tube portion extending in the same direction as the connecting tube, and the adsorption channel is arranged on the tube portion.

6. The mounting nozzle according to claim 1, characterized in that: The depth of the accommodating groove is greater than the thickness of the adsorbing member.

7. The mounting nozzle according to claim 1, characterized in that: Both ends of the accommodating groove pass through the main body.

8. The mounting nozzle according to claim 1, characterized in that: One end of the adsorption channel is located on the bottom wall of the containing groove.

9. A chip bonding device, characterized in that: It comprises a mounting nozzle as claimed in any one of claims 1 to 8.

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