Smart card package and smart card

Abstract

The utility model relates to the technical field of intelligent cards, and discloses an intelligent card package and an intelligent card. The smart card package includes: a carrier; the intelligent card chip is provided with an electrode terminal, and the electrode terminal is welded on the carrier plate through a solder ball; the reinforcing member is connected with the carrier plate and is arranged around the intelligent card chip; and the plastic packaging layer is used for filling and curing the intelligent card chip and the reinforcing member on the carrier plate. According to the intelligent card package provided by the utility model, when the intelligent card package is subjected to an external force, the risk that the electrical connection between the intelligent card chip and the carrier plate is disconnected can be reduced, and the risk that the intelligent card chip falls off from the carrier plate can be reduced. Therefore, compared with an intelligent card package manufactured by a related technology, the intelligent card package provided by the invention is higher in mechanical stress bearing capability and higher in reliability.

Description

Technical Field

[0001] The present application relates to the technical field of smart cards, for example, to a smart card package and a smart card. Background Art

[0002] In the related art, when making a smart card package, the smart card chip is usually glued to a strip serving as a carrier, and then the electrode terminals of the smart card chip are welded to the strip through gold wires, and finally the chip and the gold wires are coated with UV glue for packaging.

[0003] In the process of implementing the embodiments of the present disclosure, it is found that the related technology has at least the following problems:

[0004] The smart card package produced by the related technical solution has a weak ability to withstand mechanical stress. When the smart card package is subjected to external force, the smart card chip is easy to fall off the carrier, and the gold wire used to weld the smart card chip terminal to the strip is easy to break, resulting in the electrical connection between the smart card chip and the carrier being disconnected. Therefore, how to improve the reliability of the smart card package has become a technical problem that needs to be solved urgently.

[0005] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present application, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Utility Model Content

[0006] In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not an extensive review, nor is it intended to identify key / critical elements or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.

[0007] The embodiments of the present disclosure provide a smart card package and a smart card. Compared with smart card packages made by related technologies, the smart card package has a stronger ability to withstand mechanical stress and a higher reliability.

[0008] In some embodiments, the smart card package includes: a carrier; a smart card chip, the smart card chip is provided with electrode terminals, and the electrode terminals are soldered to the carrier through solder balls; a reinforcement piece, the reinforcement piece is connected to the carrier board and is arranged around the smart card chip; and a plastic packaging layer, used to fill and solidify the smart card chip and the reinforcement piece on the carrier board.

[0009] Optionally, the reinforcement member includes a plurality of reinforcement blocks, and the plurality of reinforcement blocks are arranged around the smart card chip.

[0010] Optionally, the reinforcement member includes a reinforcement ring, and the reinforcement ring is provided with a smart card chip.

[0011] Optionally, a wiring groove is provided on the carrier board, and the smart card chip is arranged in the wiring groove.

[0012] Optionally, a plurality of through holes are provided in the area where the carrier board is connected to the smart card chip, and the plurality of through holes are arranged in a staggered manner with the solder balls.

[0013] Optionally, the smart card package further includes: a heat dissipation component, which is disposed at the bottom of the carrier board and abuts against the smart card chip through a through hole.

[0014] Optionally, the heat dissipation assembly includes: a heat conducting member, wherein the plurality of heat conducting members are correspondingly arranged in the plurality of through holes; and a first heat dissipation member, which is arranged at the bottom of the carrier board and connected to the plurality of heat conducting members.

[0015] Optionally, the smart card package further includes: a second heat sink, disposed on the upper portion of the smart card chip, for dissipating heat for the smart card chip.

[0016] Optionally, the carrier board is a PCB circuit board made of FR-4 material or insulating thermal conductive material.

[0017] In some embodiments, a smart card includes: a card body; and the smart card package as described above is installed on the card body.

[0018] The smart card package and smart card provided by the embodiments of the present disclosure can achieve the following technical effects:

[0019] The smart card package provided by the embodiment of the present disclosure uses solder balls to weld the terminals of the smart card chip to the carrier board, thereby reducing the risk of disconnection of the electrical connection between the smart card chip and the carrier board when the smart card package is subjected to external force. By arranging a reinforcement member around the chip on the carrier board, and filling and curing the smart card chip and the reinforcement member on the carrier board through a plastic sealing layer, the firmness of the connection between the smart card chip and the carrier board can be improved, and the risk of the smart card chip falling off the carrier board when the smart card package is subjected to external force can be reduced. Therefore, the smart card package provided by the embodiment of the present disclosure has a stronger ability to withstand mechanical stress and higher reliability than the smart card package produced by related technologies.

[0020] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] One or more embodiments are exemplarily described by corresponding drawings, which do not limit the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements, and the drawings do not constitute a scale limitation, and wherein:

[0022] Figure 1 is a schematic diagram of a smart card package provided by an embodiment of the present disclosure;

[0023] Figure 2is a schematic diagram of another smart card package provided by an embodiment of the present disclosure;

[0024] Figure 3 is a schematic diagram of another smart card package provided by an embodiment of the present disclosure;

[0025] Figure 4 is a schematic diagram of another smart card package provided by an embodiment of the present disclosure;

[0026] Figure 5 is a schematic diagram of another smart card package provided by an embodiment of the present disclosure;

[0027] Figure 6 is a schematic diagram of another smart card package provided by an embodiment of the present disclosure;

[0028] Figure 7 is a schematic diagram of another smart card package provided by an embodiment of the present disclosure;

[0029] Figure 8 It is a schematic diagram of a smart card provided in an embodiment of the present disclosure.

[0030] Description of reference numerals:

[0031] 10. Smart card packaging;

[0032] 100, carrier board; 110, wiring groove; 120, through hole;

[0033] 200, smart card chip; 210, solder ball;

[0034] 300, reinforcement member; 310, reinforcement block; 320, reinforcement ring;

[0035] 400, plastic sealing layer;

[0036] 500, heat dissipation component; 510, heat conduction element; 520, first heat dissipation element;

[0037] 600, a second heat dissipation element;

[0038] 800. smart card; 810. card body. DETAILED DESCRIPTION

[0039] In order to be able to understand the features and technical contents of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The attached drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.

[0040] The terms "first", "second", etc. in the specification and claims of the embodiments of the present disclosure and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchanged where appropriate, so that the embodiments of the embodiments of the present disclosure described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0041] Unless otherwise stated, the term "plurality" means two or more.

[0042] In the embodiment of the present disclosure, the character " / " indicates that the preceding and following objects are in an "or" relationship. For example, A / B indicates: A or B.

[0043] The term "and / or" is a description of the association relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or, A and B.

[0044] The term "correspondence" may refer to an association relationship or a binding relationship. The correspondence between A and B means that there is an association relationship or a binding relationship between A and B.

[0045] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.

[0046] like Figure 1 As shown, the smart card package 10 provided in the embodiment of the present disclosure includes: a carrier 100, a smart card chip 200, a reinforcement 300 and a plastic encapsulation layer 400. The smart card chip 200 is provided with electrode terminals, and the electrode terminals are soldered to the carrier 100 through solder balls 210. The reinforcement 300 is connected to the carrier 100 and is arranged around the smart card chip 200. The plastic encapsulation layer 400 is used to fill and solidify the smart card chip 200 and the reinforcement 300 on the carrier 100.

[0047] Specifically, the carrier 100 represents a packaging substrate or an IC (Integrated Circuit) carrier 100, which is a substrate used to package the smart card chip 200, a bridge used to connect the smart card chip 200 with other components, used to protect, fix and support the smart card chip 200, and can provide a heat dissipation channel for the smart card chip 200.

[0048] Specifically, the smart card chip 200 represents a chip product pasted or embedded in various smart cards 800 such as CPU cards, logic encryption cards, RFID tags, etc. The smart card chip 200 is internally provided with a microprocessor, an input / output device interface and a memory, and can perform data calculation, access control and data storage.

[0049] Specifically, the reinforcement 300 is a component for enhancing the stability and mechanical stress resistance of the overall structure of the smart card package 10. The reinforcement 300 is made of metal materials (eg, steel, aluminum, and copper) or composite materials (eg, carbon fiber and glass fiber).

[0050] Specifically, by providing electrode terminals on the smart card chip 200 and soldering the electrode terminals to the carrier 100 through the solder balls 210, it is no longer necessary to electrically connect the electrode terminals of the smart card chip 200 to the carrier 100 through gold wires, thereby improving the firmness of the electrical connection between the smart card chip 200 and the carrier 100, and soldering the electrode terminals to the carrier 100 with the solder balls 210 will not cause the pins of the smart card chip 200 to be exposed.

[0051] Specifically, by setting the reinforcement 300 around the smart card chip 200 on the carrier 100, and filling and curing the smart card chip 200 and the reinforcement 300 on the carrier 100 through the plastic packaging layer 400, more connection points are provided between the smart card chip 200 and the carrier 100, thereby improving the firmness of the connection between the smart card chip 200 and the carrier 100.

[0052] Optionally, the solder balls 210 of the electrode terminals of the smart card chip 200 are soldered to the carrier 100 by reflow soldering.

[0053] Specifically, reflow soldering (SMT, Surface Mount Technology), also known as surface mount soldering, is a soldering method that directly solders electronic components on the surface of a PCB board to achieve high-density, high-speed, and high-precision mounting and soldering of electronic components.

[0054] Specifically, the solder balls 210 of the electrode terminals of the smart card chip 200 are soldered to the carrier 100 by reflow soldering, so that the firmness of the connection between the smart card chip 200 and the carrier 100 can be improved.

[0055] Optionally, the plastic packaging layer 400 is an adhesive layer filled and cured with an adhesive such as UV glue and used to wrap the chip and the reinforcement 300 .

[0056] The smart card package 10 provided in the embodiment of the present disclosure solders the terminals of the smart card chip 200 to the carrier 100 through the solder balls 210, thereby reducing the risk of disconnection of the electrical connection between the smart card chip 200 and the carrier 100 when the smart card package 10 is subjected to external force. By arranging the reinforcement member 300 around the chip on the carrier 100, and filling and curing the smart card chip 200 and the reinforcement member 300 on the carrier 100 through the plastic sealing layer 400, the risk of the smart card chip 200 falling off the carrier 100 when the smart card package 10 is subjected to external force is reduced. Therefore, the smart card package 10 provided in the embodiment of the present disclosure has a stronger ability to withstand mechanical stress and higher reliability than the smart card package made by the related art.

[0057] like Figure 2 As shown, in some embodiments, the reinforcement member 300 includes a plurality of reinforcement blocks 310 , and the plurality of reinforcement blocks 310 are disposed around the smart card chip 200 .

[0058] Specifically, by configuring the reinforcement 300 as a plurality of reinforcement blocks 310, and configuring the plurality of reinforcement blocks 310 around the smart card chip 200, a plurality of connection points can be provided around the smart card chip 200 for the smart card chip 200 and the carrier 100, so that the plastic encapsulation layer 400 can connect the carrier 100 and the smart card chip 200 more firmly.

[0059] Optionally, the plurality of reinforcement blocks 310 are integrally formed with the carrier plate 100 .

[0060] Specifically, by integrating the plurality of reinforcement blocks 310 with the carrier board 100, the manufactured smart card package 10 can better disperse and resist external mechanical stress, and can simplify the subsequent steps of packaging the smart card chip 200. In this way, the integrity and stability of the smart card package 10 are enhanced.

[0061] Optionally, a plurality of reinforcement blocks 310 are provided separately from the carrier plate 100 .

[0062] Specifically, by separately arranging the reinforcing block 310 and the carrier 100, the production of the carrier 100 and the reinforcing block 310 is facilitated. When the smart card chip 200 is subsequently packaged, the reinforcing block 310 and the carrier 100 can be connected to the carrier 100 by welding or screws. Therefore, by separately arranging the reinforcing block 310 and the carrier 100, the flexibility of the step of packaging the smart card chip 200 can be improved.

[0063] In the disclosed embodiment, by configuring the reinforcement member 300 as a plurality of reinforcement blocks 310 surrounding the smart card chip 200, a plurality of connection points can be provided for the smart card chip 200 and the carrier 100, so that the plastic encapsulation layer 400 connects the carrier 100 and the smart card chip 200 more firmly, thereby improving the reliability of the manufactured smart card package 10.

[0064] like Figure 3 As shown, in some embodiments, the reinforcement member 300 includes a reinforcement ring 320 , and the reinforcement ring 320 is disposed around the smart card chip 200 .

[0065] Specifically, by setting the reinforcement member 300 as a reinforcement ring 320, and setting the reinforcement ring 320 to be sleeved on the smart card chip 200, a connection surface can be provided for the smart card chip 200 and the carrier 100 around the smart card chip 200, so that the plastic packaging layer 400 can connect the carrier 100 and the smart card chip 200 more firmly.

[0066] Optionally, the reinforcement ring 320 and the carrier plate 100 are integrally formed.

[0067] Specifically, by integrating the reinforcement ring 320 with the carrier 100, the carrier 100 can better disperse and resist external mechanical stress, and can simplify the subsequent steps of packaging the smart card chip 200. In this way, the integrity and stability of the smart card package 10 are enhanced.

[0068] Optionally, the reinforcement ring 320 and the carrier plate 100 are provided separately.

[0069] Specifically, by separately arranging the reinforcement ring 320 and the carrier 100, the production of the carrier 100 and the reinforcement ring 320 is facilitated. When the smart card chip 200 is subsequently packaged, the reinforcement ring 320 and the carrier 100 can be connected to the carrier 100 by welding or screws. Therefore, by separately arranging the reinforcement ring 320 and the carrier 100, the flexibility of the step of packaging the smart card chip 200 can be improved.

[0070] In the disclosed embodiment, by configuring the reinforcement member 300 as a reinforcement ring 320 for sleeve-mounting the smart card chip 200, a connection surface can be provided for the smart card chip 200 and the carrier 100, so that the plastic encapsulation layer 400 connects the carrier 100 and the smart card chip 200 more firmly, thereby improving the reliability of the manufactured smart card package 10.

[0071] In some embodiments, the reinforcement member 300 is disposed in a region of the carrier 100 where the mechanical stress tolerance is less than a set threshold.

[0072] Specifically, if the ability of a certain area on the carrier 100 to withstand mechanical stress is less than a set threshold, it indicates that the area is very likely to be damaged when receiving an external force. Therefore, it is necessary to set the reinforcement member 300 in the area of ​​the carrier 100 where the ability to withstand mechanical stress is less than the set threshold. In this way, the ability of the carrier 100 to withstand external forces is improved, the mechanical strength of the carrier 100 is improved, and thus the reliability of the manufactured smart card package 10 is improved.

[0073] like Figure 4 As shown, in some embodiments, a wiring groove 110 is disposed on the carrier 100 , and the smart card chip 200 is disposed in the wiring groove 110 .

[0074] Specifically, the wiring groove 110 is a groove structure opened in the middle of the carrier 100 and having a size matching the size of the smart card chip 200. The size of the wiring groove 110 is larger than the size of the smart card chip 200, and the depth of the wiring groove 110 is smaller than the thickness of the smart card chip 200.

[0075] Specifically, by opening a wiring groove 110 on the carrier 100 and setting the smart card chip 200 in the wiring groove 110, the smart card chip 200 can be connected to the carrier 100 by welding in addition to the bottom surface, and part of the side surface can also be tightly connected to the carrier 100 through the plastic packaging layer 400.

[0076] In the embodiment of the present disclosure, by opening the wiring groove 110 on the carrier 100 and disposing the smart card chip 200 in the wiring groove 110 , the firmness of the connection between the smart card chip 200 and the carrier 100 is further improved.

[0077] like Figure 5 As shown, in some embodiments, a plurality of through holes 120 are disposed in the area where the carrier 100 is connected to the smart card chip 200 , and the plurality of through holes 120 and the solder balls 210 are arranged in a staggered manner.

[0078] Specifically, the through hole 120 is arranged through the thickness direction of the carrier 100 , is located at the bottom of the smart card chip 200 , and is staggered with the electrode terminal of the smart card chip 200 and the solder ball 210 of the carrier 100 .

[0079] Specifically, by opening a plurality of through holes 120 along the thickness direction of the carrier 100 in the area on which the smart card chip 200 is placed, the surface of the smart card chip 200 can be in contact with the external air, and the heat generated by the smart card chip 200 during operation can be transferred to the outside of the smart card package 10 by using the through holes 120, thereby achieving efficient heat dissipation of the smart card chip 200.

[0080] In the embodiment of the present disclosure, a plurality of through holes 120 are provided along the thickness direction of the carrier board 100 in the area where the smart card chip 200 is placed on the carrier board 100 , thereby improving the heat dissipation capability of the smart card chip 200 .

[0081] like Figure 6 As shown, in some embodiments, the smart card package 10 further includes a heat dissipation component 500 . The heat dissipation component 500 is disposed at the bottom of the carrier 100 and abuts against the smart card chip 200 through the through hole 120 .

[0082] Specifically, the heat dissipation component 500 is a component used to ensure that the smart card chip 200 can effectively dissipate the heat generated by the smart card chip 200 when working.

[0083] Specifically, by setting a heat dissipation component 500 at the bottom of the carrier 100 and abutting the heat dissipation component 500 against the smart card chip 200 through the through hole 120, the heat generated by the smart card chip 200 during operation can be absorbed and dissipated to the outside through the heat dissipation surface of the heat dissipation component 500, forming a top-down heat transfer path consisting of the smart card chip 200, the through hole 120 and the heat dissipation component 500, thereby improving the heat dissipation efficiency of the smart card chip 200.

[0084] In the disclosed embodiment, a heat dissipation assembly 500 is disposed at the bottom of the carrier 100 , and the heat dissipation assembly 500 is abutted against the smart card chip 200 through the through hole 120 , thereby improving the heat dissipation efficiency of the smart card chip 200 .

[0085] like Figure 6 As shown, in some embodiments, the heat dissipation assembly 500 includes: a heat conductive member 510 and a first heat dissipation member 520. The plurality of heat conductive members 510 are correspondingly disposed in the plurality of through holes 120. The first heat dissipation member 520 is disposed at the bottom of the carrier 100 and connected to the plurality of heat conductive members 510.

[0086] Specifically, the heat conducting member 510 is a component made of a heat conducting material (eg, heat conducting silicone grease, heat conducting glue or heat conducting metal) and is capable of efficiently transferring and dissipating heat.

[0087] Specifically, the first heat sink 520 is a component that can effectively transfer, dissipate or dissipate the heat generated by the smart card chip 200, such as a heat sink, a heat pipe, and a vapor chamber.

[0088] Specifically, by arranging a heat conductive member 510 in each through hole 120 and connecting the plurality of heat conductive members 510 to the first heat sink 520 arranged at the bottom of the carrier 100, the heat generated by the smart card chip 200 during operation can be transferred downward to the first heat sink 520 through the carrier 100 by means of the through holes 120 and the heat conductive members 510, thereby forming a heat transfer path of the smart card chip 200, the heat conductive member 510 and the first heat sink 520, and the heat transfer path is from top to bottom, thereby improving the heat dissipation efficiency of the smart card chip 200 and achieving the purpose of efficiently dissipating the heat of the smart card chip 200.

[0089] Optionally, a thermally conductive adhesive is used as the thermally conductive member 510, and a heat sink is used as the first heat sink 520. This allows the installation of the heat dissipation component 500 of the smart card package 10 to be completed by injecting the thermally conductive adhesive into the through hole 120 and attaching the heat sink to the thermally conductive adhesive when manufacturing the smart card package 10. This helps to simplify the steps of manufacturing the smart card package 10.

[0090] In the embodiment of the present disclosure, by disposing a heat conductive member 510 in each through hole 120 and connecting the plurality of heat conductive members 510 to a first heat sink 520 disposed at the bottom of the carrier 100, a top-down heat transfer path is formed among the smart card chip 200, the heat conductive member 510 and the first heat sink 520, thereby further improving the heat dissipation efficiency of the smart card chip 200.

[0091] In some embodiments, the smart card package 10 further includes a second heat sink 600 . The second heat sink 600 is disposed on the upper portion of the smart card chip 200 to dissipate heat for the smart card chip 200 .

[0092] Specifically, the second heat sink 600 is a component that can effectively transfer, dissipate or dissipate the heat generated by the smart card chip 200, such as a heat sink, a heat pipe, and a vapor chamber.

[0093] Specifically, by disposing the second heat sink 600 on the upper part of the smart card chip 200, the heat dissipation efficiency of the smart card chip 200 during operation can be improved, the risk of the smart card chip 200 failing to operate due to overheating can be reduced, and the reliability of the smart card package 10 can be improved.

[0094] In some embodiments, the carrier 100 is a PCB circuit board made of FR-4 material.

[0095] Specifically, by using a PCB circuit board made of FR-4 material as the carrier 100 , compared with using a strip as the carrier 100 in the related art, the manufacturing cost of the smart card package 10 can be effectively reduced.

[0096] In some embodiments, the carrier 100 is a PCB circuit board made of insulating thermal conductive material.

[0097] Specifically, by using a PCB circuit board made of insulating thermal conductive material as the carrier 100, the carrier 100 can have high thermal conductivity and good electrical insulation performance. In this way, the low heat dissipation efficiency of the smart card chip 200 during operation caused by the plastic sealing layer 400 being coated on the surface of the smart card chip 200 is overcome.

[0098] like Figure 8As shown, in some embodiments, the smart card 800 includes: a card body 810 and the smart card package 10 as described above. The smart card package 10 is installed in the card body 810 .

[0099] Optionally, the smart card includes but is not limited to a transportation card, an access card, a bank card, and a medical card.

[0100] In some embodiments, the smart card package described above is prepared according to the following steps.

[0101] First, design the flash / RAM and other circuits. The specific number of metal layers is set according to the performance of the chip to be designed and the process used.

[0102] Second, a passivation layer is set on the wafer to globally protect the front side of the wafer to prevent damage to the unprocessed side of the wafer during wafer processing.

[0103] Third, the ball implantation process is used to implant the PAD layout of the designed circuit to the corresponding position on the wafer.

[0104] Fourth, CMP thinning and polishing is performed according to the designed thickness and process capabilities of the smart card chip.

[0105] Fifth, the smart card chip is cut according to the designed size and process capability to separate the smart card chip from the wafer.

[0106] Sixth, a steel reinforcement member is welded on the carrier plate, wherein the reinforcement member may be a plurality of reinforcement blocks or a reinforcement ring.

[0107] Seventh, solder the smart card chip with solder balls to the carrier board using the SMT process.

[0108] Eighth, a filling UV glue is applied at the position where the smart card chip is welded to form a plastic sealing layer to fill and solidify the smart card chip and the reinforcement member on the carrier board.

[0109] The above description and the accompanying drawings fully illustrate the embodiments of the present disclosure so that those skilled in the art can practice them. Other embodiments may include structural, logical, electrical, process and other changes. The embodiments represent only possible changes. Unless explicitly required, separate components and functions are optional, and the order of operations may vary. Parts and features of some embodiments may be included in or replace parts and features of other embodiments. Moreover, the words used in this application are only used to describe the embodiments and are not used to limit the claims. As used in the description of the embodiments and the claims, unless the context clearly indicates, the singular forms of "a", "an" and "the" are intended to include plural forms as well. Similarly, the term "and / or" as used in this application refers to any and all possible combinations of one or more associated listings. In addition, when used in this application, the term "comprise" and its variants "comprises" and / or comprising refer to the presence of stated features, wholes, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or groups thereof. In the absence of further restrictions, the elements defined by the sentence "including one..." do not exclude the presence of other identical elements in the process, method or device including the elements. In this article, each embodiment may focus on the differences from other embodiments, and the same and similar parts between the embodiments may refer to each other. For the methods, products, etc. disclosed in the embodiments, if they correspond to the method part disclosed in the embodiments, then the relevant parts can refer to the description of the method part.

[0110] The flowchart and block diagram in the accompanying drawings show the possible architecture, function and operation of the system, method and computer program product according to the embodiment of the present disclosure. In this regard, each box in the flowchart or block diagram can represent a module, a program segment or a part of the code, and the module, the program segment or a part of the code contains one or more executable instructions for realizing the specified logical function. In some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, which can depend on the functions involved. In the description corresponding to the flowchart and the block diagram in the accompanying drawings, the operations or steps corresponding to different boxes can also occur in a different order from the order disclosed in the description, and sometimes there is no specific order between different operations or steps. For example, two consecutive operations or steps can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, which can depend on the functions involved. Each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, may be implemented by a dedicated hardware-based system that performs the specified functions or actions, or may be implemented by a combination of dedicated hardware and computer instructions.

Claims

1. A smart card package, characterized in that: include: Carrier board; A smart card chip, wherein the smart card chip is provided with electrode terminals, and the electrode terminals are soldered to the carrier board through solder balls; A reinforcing member connected to the carrier board and arranged around the smart card chip; The plastic sealing layer is used to fill and solidify the smart card chip and the reinforcement member on the carrier board.

2. The smart card package according to claim 1, characterized in that: The reinforcement member comprises a plurality of reinforcement blocks, and the plurality of reinforcement blocks are arranged around the smart card chip.

3. The smart card package according to claim 1, characterized in that: The reinforcement part comprises a reinforcement ring, and the reinforcement ring is provided with a smart card chip.

4. The smart card package according to any one of claims 1 to 3, characterized in that: A wiring groove is arranged on the carrier board, and the smart card chip is arranged in the wiring groove.

5. The smart card package according to any one of claims 1 to 3, characterized in that: A plurality of through holes are arranged in the area where the carrier board is connected to the smart card chip, and the plurality of through holes and the solder balls are arranged in a staggered manner.

6. The smart card package according to claim 5, characterized in that: Smart card packaging also includes: The heat dissipation component is arranged at the bottom of the carrier board and abuts against the smart card chip through the through hole.

7. The smart card package according to claim 6, characterized in that: The heat dissipation components include: A heat conducting member, wherein the plurality of heat conducting members are correspondingly arranged in the plurality of through holes; The first heat dissipation element is arranged at the bottom of the carrier plate and connected with a plurality of heat conducting elements.

8. The smart card package according to any one of claims 1 to 3, characterized in that: Smart card packaging also includes: The second heat sink is arranged on the upper part of the smart card chip and is used for dissipating the heat of the smart card chip.

9. The smart card package according to any one of claims 1 to 3, characterized in that: The carrier board is a PCB circuit board made of FR-4 material or insulating thermal conductive material.

10. A smart card, characterized in that: include: Card body; The smart card package according to any one of claims 1 to 9, mounted on a card body.

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