H-plane microstrip waveguide converter for millimeter wave radar

Abstract

The utility model discloses an H-plane microstrip waveguide converter for millimeter wave radar, which belongs to the technical field of waveguide converters and comprises a dielectric substrate, the dielectric substrate is provided with a waveguide cavity for electromagnetic wave propagation, the top of the dielectric substrate is fixedly connected with a microstrip patch, the top of the microstrip patch is electrically connected with a radio frequency chip, and the radio frequency chip is electrically connected with the waveguide cavity. The radio frequency chip is fixedly connected with the top of the dielectric substrate, the dielectric substrate is provided with a waveguide structure used for transmitting signals, the waveguide structure comprises through holes and waveguide media, the through holes are symmetrically formed in the middle of the dielectric substrate and are uniformly formed in the linear direction, and the waveguide media are fixedly installed between the symmetrically formed through holes; and the end part of the waveguide medium is electrically connected with the microstrip patch. Through the above mode, the H-plane microstrip waveguide converter effectively improves the impedance bandwidth, the impedance bandwidth is improved by 169%, and the H-plane microstrip waveguide converter has high stability.

Description

Technical Field

[0001] The utility model relates to the technical field of waveguide converters, in particular to an H-plane microstrip waveguide converter for millimeter wave radar. Background Art

[0002] The autonomous driving market is currently very hot, and solutions using millimeter-wave radar, lidar, and cameras as sensors are also the current mainstream solutions. Among them, millimeter-wave radar, as a sensor suitable for all-weather environments, is particularly important in the field of autonomous driving.

[0003] Chinese patent CN219979790U discloses a microstrip waveguide converter, including a substrate, a microstrip probe structure, an air cavity and a waveguide cavity. The microstrip probe structure and the air cavity are attached to the surface of the substrate, and the air cavity covers part of the microstrip probe structure. The microstrip probe structure feeds the microwave signal in the form of an electrically coupled probe, and the waveguide cavity is located on one side of the air cavity.

[0004] However, the existing devices still have the following problems: 1. The impedance bandwidth is small, which may cause circuit instability; 2. The structure is large and complex, which is not conducive to antenna arrangement.

[0005] Based on this, the utility model designs an H-plane microstrip waveguide converter for millimeter wave radar to solve the above problems. Utility Model Content

[0006] In view of the above-mentioned shortcomings of the prior art, the utility model provides an H-plane microstrip waveguide converter for millimeter wave radar.

[0007] In order to achieve the above objectives, the present invention is implemented through the following technical solutions:

[0008] An H-plane microstrip waveguide converter for millimeter wave radar, comprising a dielectric substrate;

[0009] A waveguide cavity for electromagnetic wave propagation is provided on the dielectric substrate;

[0010] A microstrip patch is fixedly connected to the top of the dielectric substrate, a radio frequency chip is electrically connected to the top of the microstrip patch, the radio frequency chip is fixedly connected to the top of the dielectric substrate, a waveguide structure for transmitting signals is arranged on the dielectric substrate, the waveguide structure includes vias and a waveguide medium, the vias are symmetrically arranged in the middle of the dielectric substrate and a plurality of vias are evenly arranged along a straight line direction, the waveguide medium is fixedly installed between the symmetrically arranged vias, and the end of the waveguide medium is electrically connected to the microstrip patch.

[0011] Furthermore, the waveguide cavity comprises an upper metal sheet and a lower metal sheet, wherein the upper metal sheet is covered and fixed on the top of the dielectric substrate, and the lower metal sheet is covered and fixed on the bottom of the dielectric substrate.

[0012] Furthermore, the edge of the microstrip patch is fed so that the microstrip patch and the waveguide cavity are matched for conversion from TEM mode to TE mode.

[0013] Furthermore, the RF chip end of the RF chip is fed by single-end, the H-plane of the rectangular waveguide is opened, and the outer edge of the microstrip patch is placed in the upper metal sheet.

[0014] Furthermore, the dielectric substrate is configured as a high-frequency plate material for a millimeter-wave automobile radar antenna, and the high-frequency plate material is provided with at least one layer.

[0015] Furthermore, the high-frequency board is configured as a PCB board.

[0016] Compared with the prior art, the utility model has the following beneficial effects:

[0017] 1. The H-plane microstrip waveguide converter provided by the present invention effectively improves the impedance bandwidth by 169% and has high stability.

[0018] 2. The microstrip waveguide converter for millimeter wave radar provided by the present invention realizes broadband and has a simple structure, and can have a wider frequency band to adapt to the waveguide antenna. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 This is the front view of the E-plane microstrip waveguide converter;

[0021] Figure 2 It is a three-dimensional image of an E-plane microstrip waveguide converter;

[0022] Figure 3 This is the front view of the H-plane microstrip waveguide converter;

[0023] Figure 4 It is a three-dimensional diagram of the H-plane microstrip waveguide converter;

[0024] Figure 5 This is a comparison chart of the impedance bandwidth of E-plane microstrip waveguide converter and H-plane microstrip waveguide converter.

[0025] The numbers in the figure represent:

[0026] 1. Dielectric substrate; 2. Waveguide cavity; 21. Upper metal sheet; 22. Lower metal sheet; 3. RF chip; 4. Waveguide structure; 41. Via hole; 42. Waveguide medium; 5. Microstrip patch; 6. High-frequency board; 61. PCB board. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] The terms “left”, “right”, “front”, “back”, “up” and “down” mentioned in the following description are oriented in the viewing direction of the front view.

[0029] Embodiment 1

[0030] In some embodiments, please refer to the attached instructions. Figure 1-5 , an H-plane microstrip waveguide converter for millimeter wave radar, comprising a dielectric substrate 1;

[0031] A waveguide cavity 2 for electromagnetic wave propagation is provided on the dielectric substrate 1;

[0032] A microstrip patch 5 is fixedly connected to the top of the dielectric substrate 1, and a radio frequency chip 3 is electrically connected to the top of the microstrip patch 5. The radio frequency chip 3 is fixedly connected to the top of the dielectric substrate 1. A waveguide structure 4 for transmitting signals is provided on the dielectric substrate 1. The waveguide structure 4 includes a via 41 and a waveguide medium 42. The vias 41 are symmetrically arranged in the middle of the dielectric substrate 1 and multiple vias are evenly arranged along a straight line. The waveguide medium 42 is fixedly installed between the symmetrically arranged vias 41, and the end of the waveguide medium 42 is electrically connected to the microstrip patch 5.

[0033] The waveguide medium 42 may be set as a light transparent medium, such as quartz glass, or may be set as a ceramic or metal plate;

[0034] When the utility model transmits waves, the signal is transmitted through the waveguide cavity 2, and the signal transmission and the signal interaction between the upper and lower ends of the dielectric substrate 1 are realized through the via hole 41. The signal is transmitted to the waveguide medium 42 through the via hole 41, and is transmitted to the microstrip patch 5 through the waveguide medium 42. The signal is transmitted to the RF chip 3 through the microstrip patch 5 and then converted by the RF chip 3 to realize microstrip waveguide conversion. The single-ended feeding structure of the original surface microstrip converter is retained, an opening is made from the H surface, and the microstrip patch 5 is placed in the waveguide cavity 2, so that the device structure is simpler and it is easier to arrange and process the antenna array.

[0035] The waveguide cavity 2 includes an upper metal sheet 21 and a lower metal sheet 22. The upper metal sheet 21 is covered and fixed on the top of the dielectric substrate 1, and the lower metal sheet 22 is covered and fixed on the bottom of the dielectric substrate 1.

[0036] The signal enters the waveguide ports of the upper metal sheet 21 and the lower metal sheet 22 from the H surface, and is matched with the waveguide by designing a special microstrip patch 5. There is no differential feeding structure, and the structural design is simple;

[0037] The edge of the microstrip patch 5 is fed so that the microstrip patch 5 and the waveguide cavity 2 are matched for conversion from TEM mode to TE mode;

[0038] The conversion from TEM mode to TE mode can better adapt to the waveguide antenna and can have a wider frequency band to adapt to the waveguide antenna;

[0039] The RF chip end of the RF chip 3 is fed by single-end, the H-surface of the rectangular waveguide is opened, and the outer edge of the microstrip patch 5 is placed inside the upper metal sheet 21;

[0040] Single-ended feeding from the RF chip does not require any differential structure, making the structure simple and easy to arrange and process the antenna array.

[0041] The signal enters the waveguide cavity from the H-plane without any differential structure and without limiting the form of the transmission line;

[0042] The dielectric substrate 1 is configured as a high-frequency plate 6 for a millimeter-wave automotive radar antenna, and the high-frequency plate 6 is provided with at least one layer;

[0043] The high frequency plate 6 is configured as a PCB board 61;

[0044] Figure 1 and Figure 2 They are all conventional E-plane microstrip waveguide converters, and their impedance bandwidth (S11<-10dB is 3.6GHz.

[0045] Figure 3 and Figure 4They are all H-plane microstrip waveguide converters, and their impedance bandwidth (S11<-10dB is 5.9GHz, which is 169% higher than that of E-plane microstrip waveguide converters.

[0046] from Figure 2 In the figure, we can see that the design is very simple, but it occupies a large area, which is not conducive to antenna arrangement. The main contradiction is the small impedance bandwidth.

[0047] from Figure 4 It can be seen from the figure that the designed broadband H-plane microstrip waveguide converter not only retains the single-ended feeding structure of the original E-plane microstrip waveguide converter, but also reduces the occupied area by feeding from the H-plane. Feeding is performed at the edge of the patch, which satisfies the matching between the microstrip patch 5 and the waveguide cavity 2.

[0048] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An H-plane microstrip waveguide converter for millimeter wave radar, characterized in that: It comprises a dielectric substrate (1); A waveguide cavity (2) for electromagnetic wave propagation is arranged on the dielectric substrate (1); A microstrip patch (5) is fixedly connected to the top of the dielectric substrate (1), a radio frequency chip (3) is electrically connected to the top of the microstrip patch (5), and the radio frequency chip (3) is fixedly connected to the top of the dielectric substrate (1). A waveguide structure (4) for transmitting signals is provided on the dielectric substrate (1), the waveguide structure (4) comprises a via hole (41) and a waveguide medium (42), the via holes (41) are symmetrically arranged in the middle of the dielectric substrate (1) and a plurality of via holes (41) are evenly arranged in a straight line direction, the waveguide medium (42) is fixedly installed between the symmetrically arranged via holes (41), and the end of the waveguide medium (42) is electrically connected to the microstrip patch (5).

2. The H-plane microstrip waveguide converter for millimeter wave radar according to claim 1, characterized in that: The waveguide cavity (2) comprises an upper metal sheet (21) and a lower metal sheet (22); the upper metal sheet (21) is covered and fixed on the top of the dielectric substrate (1); and the lower metal sheet (22) is covered and fixed on the bottom of the dielectric substrate (1).

3. The H-plane microstrip waveguide converter for millimeter wave radar according to claim 2, characterized in that: The edge of the microstrip patch (5) is fed, so that the microstrip patch (5) and the waveguide cavity (2) are matched to convert the TEM mode into the TE mode.

4. The H-plane microstrip waveguide converter for millimeter wave radar according to claim 3, characterized in that: The radio frequency chip end of the radio frequency chip (3) is fed by a single end, the H surface of the rectangular waveguide is opened, and the outer edge of the microstrip patch (5) is placed inside the upper metal sheet (21).

5. The H-plane microstrip waveguide converter for millimeter wave radar according to claim 4, characterized in that: The dielectric substrate (1) is configured as a high-frequency plate (6) for a millimeter-wave automobile radar antenna, and the high-frequency plate (6) is provided with at least one layer.

6. The H-plane microstrip waveguide converter for millimeter wave radar according to claim 5, characterized in that: The high-frequency plate (6) is configured as a PCB board (61).

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