Energy storage control equipment

Abstract

The utility model relates to energy storage control equipment. The energy storage control equipment comprises a first plate body and a second plate body which are oppositely arranged; the circuit board assembly is arranged in the shell and comprises a low-heating device and a high-heating device; a heat-conducting groove is formed in an area, directly facing the low-heating device, of the first plate body, and the bottom of the heat-conducting groove is in heat-conducting contact with the low-heating device; a heat conduction boss is arranged on the surface of the side, facing the high heating device, of the second plate body in the area directly facing the high heating device, the bottom of the heat conduction boss makes heat conduction contact with the high heating device, and second cooling fins are arranged on the surface of the side, deviating from the heat conduction boss, of the second plate body. In the application, the high heating device and the low heating device are conducted to the second plate body and the first plate body through the heat conduction boss and the heat conduction groove respectively, respective heat dissipation of heat sources with different heating powers is realized, and heat dissipation holes do not need to be formed in the shell, so that the dustproof grade is effectively improved; therefore, the energy storage control equipment can adapt to scenes with high altitude, high temperature and high dustproof requirements.

Description

Technical Field

[0001] The present application relates to the field of energy storage technology, and in particular to an energy storage control device. Background Art

[0002] Existing industrial and commercial energy storage or microgrid control equipment is designed mainly for low-altitude and low-dust environments, and has the following disadvantages: First, there is a risk of thermal runaway when used for a long time at high altitudes and high ambient temperatures; second, the control equipment is surrounded by heat dissipation holes, and the dustproof level is usually IP3X, which cannot be used in high-dust environments, limiting its application scenarios. Utility Model Content

[0003] Based on this, an energy storage control device is provided to solve the problems of thermal runaway risk and low dustproof level of existing energy storage control devices when used for a long time in high altitude and high temperature environments.

[0004] An energy storage control device, characterized in that the energy storage control device comprises:

[0005] A housing, the housing comprising a first plate body and a second plate body arranged opposite to each other;

[0006] A circuit board assembly, the circuit board assembly is arranged in the housing, the circuit board assembly includes a low-heat generating device arranged toward the first board body and a high-heat generating device arranged toward the second board body;

[0007] The area on the first plate body facing the low heat generating device is recessed toward the inside of the housing to form at least one heat conducting groove, the heat conducting groove and the first plate body are integrally formed, the depth of each heat conducting groove is adapted to the height of the corresponding low heat generating device, and the bottom of the heat conducting groove is in thermal contact with the low heat generating device;

[0008] A heat-conducting boss is provided on a surface of the second plate body facing the high-heat-generating device in an area opposite to the high-heat-generating device, and a bottom of the heat-conducting boss is in thermal contact with the high-heat-generating device. A second heat-dissipating fin is provided on a surface of the second plate body facing away from the heat-conducting boss.

[0009] In one embodiment, optionally, a first heat dissipation fin is provided in the heat conductive groove, and a height of the first heat dissipation fin is not higher than a depth of the heat conductive groove where the first heat dissipation fin is located.

[0010] In one embodiment, optionally, the heat-conducting boss is integrally formed with the second plate body; and / or the second heat dissipating fin is integrally formed with the second plate body.

[0011] In one embodiment, optionally, the thermally conductive boss is a solid thermally conductive boss.

[0012] In one embodiment, optionally, a height of the second heat dissipating fin is not greater than half of a thickness of the second plate body.

[0013] In one embodiment, optionally, the high-heat generating device includes at least one of a core board, a PCIE network port chip, and an FPGA, and the low-heat generating device includes at least one of a resistor, an inductor, and an optocoupler.

[0014] In one embodiment, optionally, the ratio of the fin height to the fin spacing of the second heat dissipating fins is greater than or equal to 1 and less than or equal to 1.2; and / or, the fin spacing of the second heat dissipating fins is greater than or equal to 6 mm.

[0015] In one embodiment, optionally, a first heat conducting member is provided between the heat conducting groove and the low heat generating device; and / or a second heat conducting member is provided between the heat conducting boss and the high heat generating device.

[0016] In one embodiment, optionally, the area of ​​the bottom of the heat conductive groove is not less than the upper surface area of ​​the corresponding low heat generating device.

[0017] In one embodiment, optionally, the circuit board assembly includes a first circuit board and a second circuit board that are stacked and spaced apart, and the low-heat generating device and the high-heat generating device are respectively disposed on two non-adjacent surfaces of the first circuit board and the second circuit board.

[0018] In the energy storage control device of the present application, at least one heat conduction groove is formed by inwardly recessing the first plate of the shell, and the bottom of the heat conduction groove is directly in heat conduction contact with the low-heat device on the circuit board assembly in the shell, and the heat generated by the low-heat device is directly transferred from the heat conduction groove to the first plate and the shell of the entire energy storage control device, which effectively expands the heat dissipation area and improves the heat conduction efficiency. A heat conduction boss is provided on the surface of the side of the second plate facing the high-heat device in the area directly opposite to the high-heat device and in heat conduction contact with the high-heat device, and a second heat dissipation fin is provided on the surface of the second plate facing away from the heat conduction boss. The heat generated by the high-heat device can also be quickly transferred to the second plate and the second heat dissipation fin thereon through the heat conduction boss to achieve efficient and rapid heat dissipation. Therefore, the high-heat device and the low-heat device are respectively conducted to the second plate and the first plate through the heat conduction boss and the heat conduction groove, so as to achieve separate heat dissipation of heat sources with different heat powers, and there is no need to open heat dissipation holes on the shell, and the dustproof level is effectively improved, so that the energy storage control device can adapt to scenes with high altitude, high temperature and high dustproof requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a structural diagram of the energy storage control device of this application.

[0020] Figure 2 It is a schematic structural diagram of the heat-conducting groove and the first heat dissipating fin on the first plate of the present application.

[0021] Figure 3 This is a schematic structural diagram of the second heat dissipation fins on the second plate of the present application.

[0022] Description of reference numerals:

[0023] A first board body 11, a circuit board assembly 12, a first circuit board 121, a second circuit board 122, a low heat generating device 13, and a heat conducting groove 14;

[0024] The second plate 15 , the high heat generating device 16 , the heat conducting boss 17 , the first heat conducting member 18 , the second heat conducting member 19 , the first heat dissipating fins 20 , and the second heat dissipating fins 21 . DETAILED DESCRIPTION

[0025] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0026] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0027] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0028] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0029] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0030] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0031] Existing industrial and commercial energy storage or microgrid control equipment is designed mainly for low altitude and low dust environments, and can only meet the requirements of low altitude and low dust protection scenarios. It has the following disadvantages: First, there is a risk of thermal runaway when used for a long time at high altitude and high ambient temperature; second, there are heat dissipation holes around the control equipment, and the dust protection level is usually IP3X, which cannot be used in high dust environments, limiting its application scenarios.

[0032] Based on the above problems, an embodiment of the present application provides an energy storage control device, which includes: a housing and a circuit board assembly 12, wherein the circuit board assembly 12 is arranged and fixed in the housing; the housing includes a first plate body 11 and a second plate body 15 arranged opposite to the first plate body 11, and the circuit board assembly 12 includes a low-heat-generating device 13 arranged toward the first plate body 11 and a high-heat-generating device 16 arranged toward the second plate body 15. Among them, the area on the first plate body 11 directly facing the low-heat-generating device 13 is recessed toward the inside of the housing to form at least one heat-conducting groove 14, that is, the heat-conducting groove 14 is integrally formed with the first plate body 11, and the depth of the heat-conducting groove 14 is adapted to the height of the corresponding low-heat-generating device 13, so that the bottom of the heat-conducting groove 14 is in thermal contact with the corresponding low-heat-generating device 13. In addition, a heat-conducting boss 17 is provided on the surface of the second plate body 15 on one side facing the high-heat-generating device 16 and in an area directly opposite to the high-heat-generating device 16. The bottom of the heat-conducting boss 17 is in thermal contact with the high-heat-generating device 16. A second heat-dissipating fin 21 is provided on the surface of the second plate body 15 on one side facing away from the heat-conducting boss 17. By arranging the second heat-dissipating fin 21 on the second plate body 15, the heat-dissipating area of ​​the shell can be further expanded, thereby improving the heat-dissipating effect.

[0033] In other words, in the embodiment of the present application, the circuit board assembly 12 includes a first surface facing the first board body 11 and a second surface facing the second board body 15, at least one low-heat-generating device 13 is arranged on the first surface, and the circuit board assembly 12 also includes a high-heat-generating device 16 arranged on the second surface; a heat-conducting boss 17 is arranged on one side of the second board body 15 adjacent to the high-heat-generating device 16, and the heat-conducting boss 17 is thermally connected to the high-heat-generating device 16. As a result, the heat generated by the high-heat-generating device 16 is directly transferred to the second board body 15 and then to the entire housing through the heat-conducting boss 17, which can further improve the heat dissipation efficiency inside the energy storage control device. In some embodiments of the present application, similarly, the number of heat-conducting bosses 17 can be specifically determined according to the number and arrangement positions of the high-heat-generating devices 16.

[0034] Therefore, in the energy storage control device in the embodiment of the present application, at least one heat conduction groove is formed by indenting the first plate of the shell inward, and the bottom of the heat conduction groove is directly in heat conduction contact with the low-heat device on the circuit board assembly in the shell, and the heat generated by the low-heat device is directly transferred from the heat conduction groove to the first plate and the shell of the entire energy storage control device, which effectively expands the heat dissipation area and improves the heat conduction efficiency. A heat conduction boss is provided on the surface of the side of the second plate facing the high-heat device in the area directly opposite to the high-heat device, and the heat conduction boss is in heat conduction contact with the high-heat device. A second heat dissipation fin is provided on the surface of the second plate away from the heat conduction boss. The heat generated by the high-heat device can also be quickly transferred to the second plate and the second heat dissipation fin thereon through the heat conduction boss to achieve efficient and rapid heat dissipation. Therefore, the high-heat device and the low-heat device are respectively conducted to the second plate and the first plate through the heat conduction boss and the heat conduction groove, so as to achieve separate heat dissipation of heat sources with different heat powers, and there is no need to open heat dissipation holes on the shell, and the dustproof level is effectively improved, so that the energy storage control device can adapt to the scenes of high altitude, high temperature and high dustproof requirements.

[0035] In some embodiments of the present application, the high-heat device 16 includes at least one of a core board, a PCIE network port chip, and an FPGA, and the low-heat device 13 includes at least one of a resistor, an inductor, and an optical coupler. According to the level of the heating power, different heat dissipation methods are adopted to meet the heat dissipation requirements of the corresponding devices. For example, in this embodiment, the low-heat device 13 is transferred to the first plate body by a heat-conducting groove, and the high-heat device 16 is transferred to the second plate body with a higher heat dissipation efficiency having a second heat dissipation fin through a heat-conducting boss, and there is no need to open additional heat dissipation holes or add heat dissipation components such as air cooling and water cooling, thereby reducing the volume of the whole machine. Among them, the core board may include components such as a microcontroller, storage, and power management.

[0036] In some embodiments of the present application, a first heat dissipation fin 20 is provided in the heat conduction groove 14, and the height of the first heat dissipation fin 20 is not higher than the depth of the heat conduction groove 14 where the first heat dissipation fin 20 is located. By arranging the first heat dissipation fin 20 in the heat conduction groove 14, the first heat dissipation fin 20 can be used to increase the heat dissipation area of ​​the shell, thereby further improving the heat dissipation effect of the energy storage control device. Optionally, the first heat dissipation fin 20 can be arranged in part of the heat conduction groove 14, or the first heat dissipation fin 20 can be arranged in all the heat conduction grooves 14, which can be specifically determined according to the heat dissipation requirements of the corresponding low-heat-generating device 13. Among them, the height of the first heat dissipation fin 20 should not be higher than the depth of the heat conduction groove 14 where the first heat dissipation fin 20 is located, that is, the first heat dissipation fin 20 does not protrude from the heat conduction groove 14, so that the side surface of the first plate body 11 is guaranteed to be flat, so as to ensure that the energy storage control device can be arranged relatively stably. Usually, the first plate body 11 is the bottom plate of the energy storage control device.

[0037] In some embodiments of the present application, the bottom area of ​​the heat-conducting groove 14 is not less than the upper surface area of ​​the corresponding low-heat-generating device 13, so as to ensure that the bottom surface of the heat-conducting groove 14 can fully contact the upper surface of the corresponding low-heat-generating device 13, thereby ensuring a good heat transfer effect between the two. Exemplarily, when a heat-conducting groove 14 corresponds to a low-heat-generating device 13, the bottom area of ​​the heat-conducting groove 14 can be adapted to the upper surface area of ​​the low-heat-generating device 13, such as the two are equal, or the bottom area of ​​the heat-conducting groove 14 is slightly larger; when a heat-conducting groove 14 corresponds to multiple low-heat-generating devices 13, considering the spacing between the low-heat-generating devices 13, the bottom area of ​​the heat-conducting groove 14 is preferably larger than the sum of the upper surface areas of the low-heat-generating devices 13.

[0038] In some embodiments of the present application, the number of the heat conduction grooves 14 may be one or more, which may be determined specifically according to the number and arrangement of the low heat generation components 13. For example, when a low heat generation component 13 is provided separately, a heat conduction groove 14 may be provided corresponding to the low heat generation component 13; when multiple low heat generation components 13 are arranged in parallel or concentrated in a certain area, the same heat conduction groove 14 may be provided corresponding to the multiple low heat generation components 13, that is, the heat conduction groove 14 corresponds to the area where the multiple low heat generation components 13 are concentrated.

[0039] In some embodiments of the present application, the depth of the heat-conducting groove 14 is adapted to the height of the corresponding low-heat-generating device 13, that is, in order to make the bottom of the heat-conducting groove 14 better in thermal contact with the corresponding low-heat-generating device 13, the depth of the heat-conducting groove 14 needs to be designed according to the height of the low-heat-generating device 13. It can be understood that the higher the height of the low-heat-generating device 13, the shallower the depth of the corresponding heat-conducting groove 14, and the lower the height of the low-heat-generating device 13, the deeper the depth of the corresponding heat-conducting groove 14.

[0040] In some embodiments of the present application, the heat-conducting boss 17 is integrally formed with the second plate 15. Integrally forming the heat-conducting boss 17 and the second plate 15 can reduce the thermal resistance between the heat-conducting boss 17 and the second plate 15, thereby further improving the heat conduction efficiency thereof. Optionally, the heat-conducting boss 17 can be a solid heat-conducting boss 17, which has a better heat conduction effect.

[0041] In some embodiments of the present application, optionally, the second heat dissipating fin 21 is integrally formed with the second plate body 15, and the height of the second heat dissipating fin 21 is not greater than half of the thickness of the second plate body 15. By arranging the second heat dissipating fin 21 and the second plate body 15 to be integrally formed, the thermal resistance between the second heat dissipating fin 21 and the second plate body 15 can be reduced, thereby further improving the thermal conductivity thereof. In addition, the height of the second heat dissipating fin 21 is not greater than half of the thickness of the second plate body 15, which can meet the overall strength and processing technology of the second heat dissipating fin 21, while ensuring the structural strength of the whole machine.

[0042] In some embodiments of the present application, the ratio of the fin height to the fin spacing of the second heat dissipating fins 21 is greater than or equal to 1 and less than or equal to 1.2; optionally, the fin spacing of the second heat dissipating fins 21 is greater than or equal to 6 mm. Setting the second heat dissipating fins 21 to the above parameters can ensure better heat dissipation effect.

[0043] In some embodiments of the present application, a first heat conducting member 18 is provided between the heat conducting groove 14 and the low heat generating device 13. Since there is inevitably a certain gap between the heat conducting groove 14 and the low heat generating device 13, which will lead to a high thermal resistance between the two, therefore, by providing the first heat conducting member 18 between the two, a certain error of the heat conducting groove 14 can be allowed, and the thermal resistance between the two can be reduced. Optionally, the first heat conducting member 18 can be a heat conducting glue, a heat conducting pad, etc.

[0044] In some other embodiments of the present application, a second heat-conducting member 19 is provided between the heat-conducting boss 17 and the high-heat-generating device 16. Similarly, since there is inevitably a certain gap between the heat-conducting boss 17 and the high-heat-generating device 16, the thermal resistance between the two will be high. Therefore, by providing the second heat-conducting member 19 between the two, a certain error in the heat-conducting groove 14 can be allowed, and the thermal resistance between the two can be reduced. Optionally, the second heat-conducting member 19 can be a heat-conducting glue, a heat-conducting pad, etc.

[0045] In some embodiments of the present application, the circuit board assembly 12 can be a single circuit board or two or more circuit boards. For example, in a specific embodiment of the present application, the circuit board assembly 12 includes a first circuit board and a second circuit board arranged in a stacked interval, and the low-heat-generating device 13 and the high-heat-generating device 16 are respectively arranged on two non-adjacent surfaces of the first circuit board 121 and the second circuit board 122. In this way, the position of the circuit board can be flexibly set, so that the devices with higher heat dissipation requirements can face the first plate body 11 and the second plate body 15, and use the heat-conducting boss 17 and the heat-conducting groove 14 to achieve rapid heat transfer and heat dissipation.

[0046] In summary, in the energy storage control device of the present application, at least one heat-conducting groove is formed by recessing the first plate body of the shell inward, and the bottom of the heat-conducting groove is directly in thermal contact with the low-heat-generating device on the circuit board assembly in the shell. The heat generated by the low-heat-generating device is directly transferred from the heat-conducting groove to the first plate body and even the shell of the entire energy storage control device, which effectively expands the heat dissipation area and improves the heat conduction efficiency. There is no need to open heat dissipation holes on the shell, and the dustproof level is effectively improved, so that the energy storage control device can adapt to scenes with high altitudes, high temperatures and high dustproof requirements.

[0047] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0048] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. An energy storage control device, characterized in that: The energy storage control device comprises: A housing, the housing comprising a first plate body and a second plate body arranged opposite to each other; A circuit board assembly, the circuit board assembly is arranged in the housing, the circuit board assembly includes a low-heat generating device arranged toward the first board body and a high-heat generating device arranged toward the second board body; The area on the first plate body facing the low heat generating device is recessed toward the inside of the housing to form at least one heat conducting groove, the heat conducting groove and the first plate body are integrally formed, the depth of each heat conducting groove is adapted to the height of the corresponding low heat generating device, and the bottom of the heat conducting groove is in thermal contact with the low heat generating device; A heat-conducting boss is provided on a surface of the second plate body facing the high-heat-generating device in an area opposite to the high-heat-generating device, and a bottom of the heat-conducting boss is in thermal contact with the high-heat-generating device. A second heat-dissipating fin is provided on a surface of the second plate body facing away from the heat-conducting boss.

2. The energy storage control device according to claim 1, characterized in that: A first heat dissipation fin is disposed in the heat conduction groove, and a height of the first heat dissipation fin is not greater than a depth of the heat conduction groove where the first heat dissipation fin is located.

3. The energy storage control device according to claim 1, characterized in that: The heat-conducting boss is integrally formed with the second plate body; and / or the second heat dissipating fins are integrally formed with the second plate body.

4. The energy storage control device according to claim 1, characterized in that: The heat-conducting boss is a solid heat-conducting boss.

5. The energy storage control device according to claim 1, characterized in that: The height of the second heat dissipating fin is no greater than half of the thickness of the second plate body.

6. The energy storage control device according to claim 1, characterized in that: The high-heat generating device includes at least one of a core board, a PCIE network port chip, and an FPGA, and the low-heat generating device includes at least one of a resistor, an inductor, and an optical coupler.

7. The energy storage control device according to claim 1, characterized in that: The ratio of the fin height to the fin pitch of the second heat dissipating fins is greater than or equal to 1 and less than or equal to 1.2; and / or the fin pitch of the second heat dissipating fins is greater than or equal to 6 mm.

8. The energy storage control device according to claim 1, characterized in that: A first heat conducting member is disposed between the heat conducting groove and the low heat generating device; and / or a second heat conducting member is disposed between the heat conducting boss and the high heat generating device.

9. The energy storage control device according to claim 1, characterized in that: The area of ​​the bottom of the heat-conducting groove is not less than the upper surface area of ​​the corresponding low-heat-generating component.

10. The energy storage control device according to claim 1, characterized in that: The circuit board assembly includes a first circuit board and a second circuit board which are stacked and spaced apart. The low-heat generating device and the high-heat generating device are respectively arranged on two non-adjacent surfaces of the first circuit board and the second circuit board.

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