Electronic device

Abstract

The utility model provides an electronic device. The electronic equipment comprises a mainboard, a chip assembly, a metal part and a grounding part. The chip assembly comprises a chip main body and a shielding case, the chip main body and the shielding case are assembled on the mainboard, and the chip main body is accommodated in an accommodating space formed by the shielding case. The metal part is located on the side, away from the mainboard, of the shielding cover in the thickness direction of the mainboard, the grounding piece comprises a first part and a second part connected with the first part, the first part abuts against the side face, back to the shielding cover, of the metal part, and the second part is conductively connected with the shielding cover. The first part of the grounding piece abuts against the side face, back to the shielding cover, of the metal part, the metal part supports the grounding piece, and the abutting stable connection effect is obtained in the supporting process. The shielding case is in conductive connection with the grounding piece, the metal part supports the grounding piece in the abutting direction, abutting acting force is prevented from being transmitted to the shielding case through the grounding piece, and the chip body is protected against pressure under the condition that the metal part is grounded.

Description

Technical Field

[0001] The present disclosure relates to the field of electronic technology, and in particular to electronic equipment. Background Art

[0002] For example, in electronic devices such as mobile phones, tablet computers, and wearable devices, shielding covers are usually used to protect some chips on the motherboard.

[0003] However, since the chip inside the shielding cover is easily damaged by pressure, the metal structure above the shielding cover cannot be conductively connected to the shielding cover through elastic abutment to achieve grounding. Directly connecting the metal structure to the motherboard will occupy space on the motherboard. Utility Model Content

[0004] The present disclosure provides an electronic device to solve the related technical problems.

[0005] The present disclosure provides an electronic device, comprising:

[0006] Motherboard;

[0007] The chip assembly comprises a chip body and a shielding cover; the chip body and the shielding cover are assembled on the mainboard, and the chip body is accommodated in a receiving space formed by the shielding cover;

[0008] A metal component located on a side of the shielding cover away from the mainboard in the thickness direction of the mainboard;

[0009] The grounding member comprises a first part and a second part connected to the first part; the first part is pressed against the side of the metal component facing away from the shielding cover, and the second part is conductively connected to the shielding cover.

[0010] Optionally, the metal component comprises a plate-like structure, and the metal component is provided with a through hole penetrating the plate-like structure in a thickness direction;

[0011] The first portion is pressed against a side surface of the plate-like structure facing away from the shielding cover, and the second portion extends from the through hole toward the shielding cover to be electrically connected with the shielding cover.

[0012] Optionally, the electronic device further comprises a shell arranged on a side of the metal component away from the shielding cover; an assembly space is provided between the shell and the metal component, the first part is accommodated in the assembly space and is respectively tightly pressed against the shell and the metal component.

[0013] Optionally, the metal component includes a plate-like body and an extension structure arranged on the plate-like body; the first part is respectively pressed against the side of the plate-like body and the extension structure facing away from the shielding cover, and the second part extends from the first part toward the shielding cover to be conductively connected to the shielding cover.

[0014] Optionally, the second portion is connected to a middle region of the first portion to form a T-shaped structure.

[0015] Optionally, the second part is connected to either end of the first part to form an L-shaped structure.

[0016] Optionally, the second part is bonded and fixed to the shielding cover by conductive adhesive.

[0017] Optionally, the electronic device further includes a connecting structure; the mainboard includes a first area and a second area located outside the first area, the chip assembly is assembled in the first area, and the metal component and the second area are assembled through the connecting structure to support the mainboard.

[0018] Optionally, the electronic device further includes a plastic structure, and the metal component is arranged on the plastic structure.

[0019] Optionally, the grounding element is made of conductive foam.

[0020] The technical solution provided by the present disclosure can at least achieve the following beneficial effects:

[0021] The first part of the grounding member of the electronic device disclosed herein abuts against the side of the metal component facing away from the shielding cover, so that the metal component supports the grounding member, and a stable connection effect of abutment is obtained during the support process. The shielding cover is conductively connected to the grounding member, and the metal component supports the grounding member in the abutting direction, thereby preventing the abutting force from being transmitted to the shielding cover through the grounding member, and protecting the chip body from being compressed when the metal component is grounded.

[0022] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the specification and, together with the description, serve to explain the principles of the specification.

[0024] Figure 1 is a schematic diagram of a partial cross-sectional structure of an electronic device in an exemplary embodiment of the present disclosure;

[0025] Figure 2is a schematic diagram of a partial cross-sectional structure of an electronic device in another exemplary embodiment of the present disclosure;

[0026] Figure 3 It is a schematic diagram of a partial cross-sectional structure of an electronic device in yet another exemplary embodiment of the present disclosure. DETAILED DESCRIPTION

[0027] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments do not represent all implementations consistent with this specification. Instead, they are merely examples of devices and methods consistent with some aspects of this specification as detailed in the appended claims.

[0028] The terms used in this disclosure are only for the purpose of describing specific embodiments and are not intended to limit the disclosure. Unless otherwise defined, the technical terms or scientific terms used in this specification should be understood by people with ordinary skills in the field to which the disclosure belongs. The words "first", "second" and similar words used in this specification and claims do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one" or "one" do not indicate a quantitative limit, but indicate the existence of one. "Multiple" or "several" means two and more than two. Unless otherwise specified, words such as "front", "rear", "lower" and / or "upper" are only for the convenience of explanation and are not limited to one position or one spatial orientation. Words such as "include" or "comprise" mean that the elements or objects appearing in front of "include" or "comprise" include the elements or objects listed after "include" or "comprise" and their equivalents, and do not exclude other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, and can include electrical connections, whether direct or indirect.

[0029] The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit the present disclosure. The singular forms of "a", "the" and "the" used in this specification and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0030] For example, electronic devices such as mobile phones, tablet computers, and wearable devices usually use shielding covers to protect some chips on the motherboard. However, since the chips inside the shielding cover are easily damaged by pressure, the metal structure above the shielding cover cannot be electrically connected to the shielding cover through elastic abutment to achieve grounding, and directly connecting the metal structure to the motherboard will occupy space on the motherboard.

[0031] The present disclosure provides an electronic device. Figure 1 is a schematic diagram of a partial cross-sectional structure of an electronic device in an exemplary embodiment of the present disclosure, such as Figure 1 As shown, Figure 1 The dashed arrow in the middle can represent the thickness direction of the electronic device. Figure 1 The solid bold arrow in the middle can represent the direction of the supporting force of the metal component on the grounding member. The electronic device 1 includes a main board 11, a chip assembly 12, a metal component 13 and a grounding member 14. The chip assembly 12 includes a chip body 121 and a shielding cover 122. The chip body 121 and the shielding cover 122 are assembled on the main board 11, and the chip body 121 is accommodated in the accommodation space formed by the shielding cover 122. The metal component 13 is located on the side of the shielding cover 122 away from the main board 11 in the thickness direction of the main board 11. The grounding member 14 includes a first part 141 and a second part 142 connected to the first part 141. The first part 141 is pressed against the side of the metal component 13 facing away from the shielding cover 122, and the second part 142 is conductively connected to the shielding cover 122.

[0032] Since the first part 141 of the grounding member 14 abuts against the side of the metal component 13 facing away from the shielding cover 122, the grounding member 14 is supported by the metal component 13, and a stable connection effect of abutment is obtained during the support process. The shielding cover 122 is conductively connected to the grounding member 14, and the metal component 13 supports the grounding member 14 in the abutting direction, so that the abutting force is prevented from being transmitted to the shielding cover 122 through the grounding member 14, and the chip body 121 is protected from being compressed when the metal component 13 is grounded.

[0033] It should be noted that the chip body 121 can be a radio frequency chip or other chips of the electronic device 1, and the present disclosure does not limit this. The material of the shielding cover 122 is a conductive material, and the metal component 13 can be connected to the shielding cover 122 assembled on the mainboard 11 to achieve grounding.

[0034] In addition, the metal component 13 may be a bracket for supporting the mainboard 11. The metal component 13 may also be a structural member for realizing other functions in the electronic device 1, and the present disclosure does not limit this.

[0035] In some embodiments, Figure 1As shown, the metal component 13 includes a plate-like structure, and the metal component 13 is provided with a through hole 131 that penetrates the plate-like structure in the thickness direction. The first part 141 is pressed against the side of the plate-like structure that is opposite to the shielding cover 122, and the second part 142 extends from the through hole 131 to the shielding cover 122 to be conductively connected with the shielding cover 122. By providing the through hole 131 on the plate-like structure of the metal component 13, the second part 142 of the grounding member 14 passes through the through hole 131 and is conductively connected with the shielding cover 122. The first part 141 of the grounding member 14 is directly pressed against the side of the plate-like structure that is opposite to the shielding cover 122 to support the grounding member 14, thereby simplifying the structural setting of the metal component 13 and the grounding member 14 and ensuring reliable abutment. During the assembly process, the metal component 13 can be installed first, and then the grounding member 14, which also simplifies the assembly process.

[0036] In the above embodiment, the electronic device 1 further includes a housing 15 disposed on a side of the metal component 13 away from the shielding cover 122, an assembly space 17 is provided between the housing 15 and the metal component 13, and the first portion 141 is accommodated in the assembly space 17 and is respectively pressed against the housing 15 and the metal component 13. The housing 15 presses the grounding member 14 against the assembly space 17 between the housing 15 and the metal component 13, thereby improving the connection stability between the grounding member 14 and the metal component 13. The housing 15 may be a battery cover of the electronic device 1.

[0037] In other embodiments, Figure 2 As shown, Figure 2 The dotted arrow in the middle may represent the thickness direction of the electronic device. The metal component 13 includes a plate-shaped body 133 and an extension structure 134 disposed on the plate-shaped body 133. The first portion 141 is respectively pressed against the plate-shaped body 133 and the extension structure 134 on the side facing away from the shielding cover 122. The second portion 142 extends from the first portion 141 toward the shielding cover 122 to be conductively connected to the shielding cover 122. By disposing the extension structure 134 on the plate-shaped body 133 of the metal component 13, the side of the extension structure 134 facing away from the shielding cover 122 is used to support the first portion 141, and the first portion 141 is respectively pressed against the plate-shaped body 133 and the extension structure 134, so that the metal component 13 supports and abuts against the grounding member 14.

[0038] In the above embodiment, the second portion 142 is connected to the middle area of ​​the first portion 141 to form a Figure 1 The T-shaped structure shown is used to achieve abutment with the side of the metal component 13 facing away from the shielding cover 122 through the horizontally arranged first part 141 in the T-shaped structure, and the abutment stability is improved by using the first part 141 symmetrical to the second part 142.

[0039] Alternatively, the second part 142 is connected to either end of the first part 141 to form an L-shaped structure, and the first part 141 horizontally arranged in the L-shaped structure is abutted against the side of the metal component 13 facing away from the shielding cover 122, thereby simplifying the structural setting and space occupation of the grounding member 14.

[0040] Alternatively, the grounding member 14 may also adopt other structures formed by a first portion 141 and a second portion 142 that are relatively bent, so as to utilize the structural characteristic of the first portion 141 being bent relative to the second portion 142 to achieve abutment with the metal component 13 .

[0041] In some other embodiments, Figure 3 As shown, Figure 3 The dashed arrow in the middle may represent the thickness direction of the electronic device. The metal component 13 may be a plate-like structure. A through hole 131 may be provided in the thickness direction of the plate-like structure. A limiting structure 132 is provided inside the through hole 131. The first portion 141 of the grounding member 14 is received in the through hole 131. The first portion 141 and the limiting structure 132 are opposite to the side of the shielding cover 122. The second portion 142 passes through the through hole 131 and is conductively connected to the shielding cover 122. The structure of the grounding member 14 and the matching relationship with the metal component 13 avoid the grounding member 14 occupying the space on the side of the metal component 13 opposite to the shielding cover 122, which helps to improve the lightness and thinness of the electronic device 1.

[0042] The limiting structure 132 may be a protruding structure arranged around the inner wall of the through hole 131 , the first portion 141 and the second portion 142 may be columnar structures, and the cross-sectional area of ​​the first portion 141 is greater than the cross-sectional area of ​​the second portion 142 .

[0043] In some further embodiments, the metal component 13 may be provided with a threaded hole, and the first part 141 of the grounding member 14 may be provided with a threaded structure, and the threaded structure abuts against the side of the thread in the threaded hole facing away from the shielding cover 122 to form a stable abutting connection relationship. The abutting support of multiple turns of the threaded structure improves the connection reliability between the metal component 13 and the grounding member 14, and facilitates assembly.

[0044] The threaded hole may be disposed on a side of the metal component 13 facing the shielding cover 122 , or may be a through hole 131 penetrating the thickness of the metal component 13 , and the present disclosure does not limit this.

[0045] In some embodiments, the second portion 142 and the shielding cover 122 are bonded and fixed by conductive adhesive, and the adhesive connection ensures the conductive connection between the grounding member 14 and the shielding cover 122 and prevents the shielding cover 122 from being subjected to stress or pressure.

[0046] In the above embodiment, the electronic device 1 may further include a connection structure 16, the mainboard 11 includes a first area 111 and a second area 112 outside the first area 111, the chip assembly 12 is assembled in the first area 111, and the metal component 13 and the second area 112 are assembled through the connection structure 16 to support the mainboard 11. The metal structure is connected to the second area 112 of the mainboard 11 through the connection structure 16, so that the metal component 13 supports the mainboard 11 and avoids the first area 111 from being subjected to pressure. Among them, the connection structure 16 may be a threaded connector such as a screw.

[0047] In some embodiments, the electronic device 1 may further include a plastic structural member, and the metal component 13 is disposed on the plastic structural member. The combination of the metal component 13 and the plastic structural member enhances the structural strength of the plastic structural member and reduces the overall weight of the electronic device 1 .

[0048] It should be noted that the material of the grounding member 14 can be conductive foam, or conductive materials such as metal and graphite, and the present disclosure is not limited to this.

[0049] It should be noted that the electronic device 1 may be a mobile phone, a tablet computer, a wearable device, a vehicle-mounted terminal, a medical terminal, etc.

[0050] The above is only a preferred embodiment of the present disclosure and does not limit the present disclosure in any form. Although the present disclosure has been disclosed as a preferred embodiment as above, it is not used to limit the present disclosure. Any technician familiar with this profession can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present disclosure. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present disclosure without departing from the content of the technical solution of the present disclosure are still within the scope of the technical solution of the present disclosure.

Claims

1. An electronic device, characterized in that: include: Motherboard; The chip assembly comprises a chip body and a shielding cover; the chip body and the shielding cover are assembled on the mainboard, and the chip body is accommodated in a receiving space formed by the shielding cover; A metal component located on a side of the shielding cover away from the mainboard in the thickness direction of the mainboard; The grounding member comprises a first part and a second part connected to the first part; the first part is pressed against the side of the metal component facing away from the shielding cover, and the second part is conductively connected to the shielding cover.

2. The electronic device according to claim 1, characterized in that: The metal component comprises a plate-like structure, and the metal component is provided with a through hole penetrating the plate-like structure in a thickness direction; The first portion is pressed against a side surface of the plate-like structure facing away from the shielding cover, and the second portion extends from the through hole toward the shielding cover to be electrically connected with the shielding cover.

3. The electronic device according to claim 2, characterized in that: It also includes a shell arranged on a side of the metal component away from the shielding cover; an assembly space is provided between the shell and the metal component, the first part is accommodated in the assembly space, and is respectively tightly pressed against the shell and the metal component.

4. The electronic device according to claim 1, characterized in that: The metal component includes a plate-shaped body and an extension structure arranged on the plate-shaped body; the first part is respectively pressed against the side of the plate-shaped body and the extension structure facing away from the shielding cover, and the second part extends from the first part to the shielding cover to be conductively connected to the shielding cover.

5. The electronic device according to claim 1, characterized in that: The second portion is connected to a middle region of the first portion to form a T-shaped structure.

6. The electronic device according to claim 1, characterized in that: The second part is connected to either end of the first part to form an L-shaped structure.

7. The electronic device according to claim 1, characterized in that: The second part is bonded and fixed to the shielding cover by conductive adhesive.

8. The electronic device according to claim 1, characterized in that: It also includes a connecting structure; the mainboard includes a first area and a second area outside the first area, the chip assembly is assembled in the first area, and the metal component and the second area are assembled through the connecting structure to support the mainboard.

9. The electronic device according to claim 1, characterized in that: It also includes a plastic structural component, and the metal component is arranged on the plastic structural component.

10. The electronic device according to claim 1, characterized in that: The material of the grounding element includes conductive foam.

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