Pin type component SMT reflow soldering tool

Abstract

The utility model belongs to the technical field of SMT (Surface Mount Technology) tools, and discloses a pin type component SMT reflow soldering tool, which comprises a sunken carrier, a stepped cover plate and a stepped steel mesh, the sunken carrier is provided with a carrier plate and placing grooves, a plurality of placing grooves are formed in the surface of the carrier plate, a plurality of counter bores are formed in the placing grooves, and the stepped cover plate and the stepped steel mesh are arranged to be of stepped structures matched with the placing grooves of the carrier plate; a notch corresponding to the placing groove is formed in the stepped cover plate, and pressing plates are fixed to the two ends of the notch respectively; a solder paste printing area is arranged at the position, corresponding to the containing groove, of the stepped steel mesh, and a plurality of through holes are distributed in the solder paste printing area. According to the utility model, by combining the welding process of the patch type component and the pin type component, multiple technical effects of improving the production efficiency, reducing the labor cost, reducing the equipment investment, improving the product quality, enhancing the production flexibility, saving energy, protecting the environment and the like are realized.

Description

Technical Field

[0001] The utility model belongs to the technical field of SMT patch tooling, and in particular relates to a SMT reflow soldering tooling for pin-type components. Background Art

[0002] In the current electronic component manufacturing industry, surface mount components (SMT) and through-hole components (THT) are the two main types of components. SMT components are widely used in various electronic products due to their miniaturization, high integration and high degree of automation. However, through-hole components still occupy an indispensable position in some specific applications due to their unique plug-in method and high electrical connection reliability.

[0003] However, in the current manufacturing process, the mounting and welding processes of SMD components and pin components are usually separated. SMD components are mounted on the circuit board by automatic SMT machines, and the welding is completed through the SMT reflow soldering process. After the SMD components are welded, the pin components are inserted into the circuit board manually or by automatic insertion machines, and then soldered using processes such as spot welding or wave soldering. However, the welding of pin components needs to be carried out after the SMD components are welded, which reduces the overall efficiency of the production line. The insertion and welding of pin components usually require more manual operations, which increases labor costs. In order to complete the welding of pin components, additional spot welding or wave soldering equipment is required, which increases equipment investment.

[0004] Through the above analysis, the problems and defects of the existing technology are: the mounting and welding of existing pin-type components are carried out separately from those of surface-mount components, resulting in low production efficiency, large equipment investment and high labor costs. Utility Model Content

[0005] In order to overcome the problems existing in the related technology, the utility model provides a SMT reflow soldering tool for pin-type components.

[0006] The technical solution of the utility model is as follows:

[0007] A SMT reflow soldering tool for pin-type components is provided with:

[0008] sunken carrier, stepped cover sheet and stepped steel mesh;

[0009] The sinking type carrier is provided with a carrier plate and a placement groove, a plurality of placement grooves equidistantly distributed are provided on the surface of the carrier plate, a plurality of countersunk holes are provided in the placement groove, and the positions and depths of the countersunk holes correspond to the pins of the pin-type components;

[0010] The stepped cover sheet and the stepped steel mesh are both arranged as stepped structures matching the placement grooves of the carrier plate;

[0011] The stepped cover sheet is provided with a notch corresponding to the placement slot, and pressure plates are fixed at both ends of the notch; the stepped steel mesh is provided with a solder paste printing area at a position corresponding to the placement slot, and the solder paste printing area is provided with a plurality of through holes.

[0012] In one embodiment, a plurality of positioning posts are fixed to the upper surface of the sunken carrier, and the stepped cover plate and the stepped steel mesh are both provided with positioning holes corresponding to the positioning posts.

[0013] In one embodiment, a fixing plate is fixed to the outside of the sinking carrier, and a plurality of fixing holes are opened on the surface of the fixing plate.

[0014] In one embodiment, corresponding arc-shaped notches are provided at the edges of the sunken carrier and the stepped cover plate.

[0015] In one embodiment, a plurality of limiting protrusions are respectively fixed to the side walls at both ends of the placement groove, and the limiting protrusions on both sides are arranged alternately.

[0016] In one embodiment, the sunken carrier, the stepped cover plate and the stepped steel mesh are all provided with mounting holes aligned vertically.

[0017] Combined with the above technical solutions, the beneficial effects of the utility model are as follows: the utility model realizes one-time welding by merging the welding process of pin-type components and surface-mount components, thereby eliminating the separate welding step of pin-type components after the surface-mount components are welded in the traditional process, which not only reduces the waiting time in the production process, but also shortens the entire production cycle and improves production efficiency. Since the simultaneous welding of surface-mount components and pin-type components is realized, no additional manual work is required for the insertion and welding of pin-type components, thereby reducing labor costs. Since manual operations are reduced, the impact of human factors on product quality is also reduced. By utilizing existing SMT reflow soldering equipment, the welding of pin-type components can be completed without the need to purchase additional spot welding or wave soldering equipment, thereby reducing equipment investment. The precisely designed sunken carrier, stepped cover and stepped steel mesh ensure the accurate positioning of pin-type components and surface-mount components during the welding process, reduce the position offset between components, and thus improve product quality. By reducing the use of production processes and equipment, the tooling helps to reduce energy consumption and waste emissions, and is in line with the production concept of energy conservation and environmental protection.

[0018] In summary, this SMT reflow soldering tooling for plug-in components achieves multiple technical effects such as improving production efficiency, reducing labor costs, reducing equipment investment, improving product quality, enhancing production flexibility, and energy conservation and environmental protection by combining the soldering process of chip components and plug-in components. It is suitable for plug-in components of different sizes and shapes, and only needs to replace different specifications of carriers, covers and steel meshes to adapt to different production needs, which enhances production flexibility.

[0019] It should be understood that the above general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0021] Figure 1 It is a structural schematic diagram of the SMT reflow soldering tooling for pin-type components provided by the embodiment of the utility model;

[0022] Figure 2 It is a structural schematic diagram of a sinking type carrier provided by an embodiment of the utility model;

[0023] Figure 3 It is a schematic diagram of the structure of the countersunk hole provided in the embodiment of the utility model;

[0024] Figure 4 It is a structural schematic diagram of a stepped cover sheet provided by an embodiment of the utility model;

[0025] Figure 5 It is a schematic diagram of the structure of the stepped steel mesh provided by the embodiment of the utility model;

[0026] In the figure: 1. sunken carrier; 2. stepped cover; 3. stepped steel mesh; 4. carrier plate; 5. placement slot; 6. countersunk hole; 7. notch; 8. pressure plate; 9. solder paste printing area; 10. through hole; 11. positioning column; 12. positioning hole; 13. fixing plate; 14. fixing hole; 15. arc-shaped notch; 16. limiting protrusion; 17. mounting hole. DETAILED DESCRIPTION

[0027] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation of the utility model is described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific implementation disclosed below.

[0028] like Figure 1 As shown, the SMT reflow soldering tooling for pin-type components provided by the embodiment of the utility model includes a sunken carrier 1, a stepped cover plate 2 and a stepped steel mesh 3.

[0029] like Figure 2 and Figure 3 As shown, the sunken carrier 1 in the embodiment of the utility model is provided with a carrier plate 4 and a placement groove 5, the surface of the carrier plate 4 is provided with a plurality of placement grooves 5 distributed at equal intervals, a plurality of countersunk holes 6 are provided in the placement grooves 5, and the positions and depths of the countersunk holes 6 correspond to the pins of the pin-type components; a plurality of positioning posts 11 are fixed to the upper surface of the sunken carrier 1.

[0030] Preferably, a fixing plate 13 is fixed to the outside of the sinking carrier 1 in the embodiment of the utility model, and a plurality of fixing holes 14 are provided on the surface of the fixing plate 13. The fixing holes 14 can be used to firmly fix the carrier to the processing position of the reflow soldering equipment to prevent the carrier from moving or tilting due to vibration or improper operation during the soldering process, thereby ensuring the accuracy and consistency of the soldering.

[0031] Preferably, the side walls of the placement groove 5 at both ends of the utility model are respectively fixed with a plurality of limiting protrusions 16, and the limiting protrusions 16 on both sides are arranged alternately. The limiting protrusions 16 can be used to limit the position of the circuit board product to ensure the stability and accuracy of product placement.

[0032] Preferably, the sinking carrier 1, the stepped cover plate 2 and the stepped steel mesh 3 in the embodiment of the utility model are provided with mounting holes 17 aligned up and down. By using the mounting holes 17, the cover plate and the steel mesh can be accurately mounted on the carrier to form a complete welding tool, which not only improves the assembly efficiency of the tool, but also ensures the close fit between the cover plate and the steel mesh and the carrier, further improving the accuracy and stability of welding.

[0033] like Figure 4 As shown, the stepped cover sheet 2 in the embodiment of the utility model is provided with a notch 7 corresponding to the placement slot 5, and pressure plates 8 are fixed at both ends of the notch 7. The stepped steel mesh 3 is provided with a solder paste printing area 9 at a position corresponding to the placement slot 5, and the solder paste printing area 9 is provided with a plurality of through holes 10. The notch 7 corresponding to the placement slot 5 provided in the stepped cover sheet 2 can facilitate the printing of solder paste on the circuit board product using the stepped steel mesh 3. The pressure plates 8 fixed at both ends of the notch 7 can press and fix the two ends of the circuit board product, effectively improving the welding quality and stability.

[0034] like Figure 4 and Figure 5As shown, the stepped cover sheet 2 and the stepped steel mesh 3 in the embodiment of the utility model are both arranged as stepped structures that match the placement grooves 5 of the carrier plate 4. The stepped cover sheet 2 and the stepped steel mesh 3 are both provided with positioning holes 12 corresponding to the positioning posts 11. The positioning holes 12 correspond to the positioning posts 11, so that the cover sheet and the steel mesh can be accurately positioned on the carrier, further improving the accuracy and stability of welding.

[0035] like Figure 2 and Figure 4 As shown, the edge positions of the sinking carrier 1 and the stepped cover plate 2 in the embodiment of the utility model are both provided with corresponding arc-shaped notches 15. The arc-shaped notches 15 can facilitate the taking and placement of the stepped steel mesh 3, making the tooling assembly easier to operate during assembly and disassembly, thereby improving work efficiency.

[0036] The working principle of the utility model is as follows: when the utility model is used, the circuit board to be soldered is placed in the placement groove 5 of the carrier 4 to ensure that the pins of the pin-type components are aligned with the countersunk holes 6. The carrier is firmly fixed to the processing position of the reflow soldering equipment by using the fixing plate 13 on the outside of the sinking carrier 1 and the fixing holes 14 on its surface. The stepped cover sheet 2 and the stepped steel mesh 3 adopt a stepped structure that matches the placement groove 5 of the carrier 4 to ensure that they can fit tightly on the carrier 4. The stepped cover sheet 2 is placed on the carrier 4 so that its notch 7 corresponds to the placement groove 5, and the circuit board product is pressed and fixed by the pressing plate 8. The stepped steel mesh 3 is placed on the stepped cover sheet 2 to ensure that the solder paste printing area 9 is aligned with the placement groove 5, and the solder paste is printed by using the through holes 10 on the steel mesh. The corresponding design of the positioning hole 12 and the positioning column 11 enables the stepped cover sheet 2 and the stepped steel mesh 3 to be accurately positioned on the carrier to ensure the accuracy and stability of welding. In the solder paste printing area 9, the solder paste is evenly printed onto the soldering points on the circuit board through the through holes 10 of the steel mesh 3 to prepare for the subsequent soldering process. The carrier 1 containing the circuit board product, the stepped cover sheet 2 and the stepped steel mesh 3 is sent to the reflow soldering equipment. In the reflow soldering equipment, the components and solder paste on the circuit board go through the stages of preheating, infiltration, reflow and cooling to complete the soldering process. After the soldering is completed, the stepped steel mesh 3 is conveniently removed through the arc-shaped notch 15, and then the stepped cover sheet 2 is removed, and the soldered circuit board is taken out from the carrier 1. The soldered circuit board is inspected to ensure that the soldering quality and stability meet the requirements.

[0037] In the description of the present invention, unless otherwise specified, "multiple" means two or more; the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third" and the like are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0038] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it; although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in the field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents, and these modifications or replacements should be included in the protection scope of the utility model.

Claims

1. A SMT reflow soldering tool for pin-type components, characterized in that: The SMT reflow soldering tooling for pin-type components is provided with: A sunken carrier (1), a stepped cover plate (2) and a stepped steel mesh (3); The sinking carrier (1) is provided with a carrier plate (4) and a placement groove (5), the carrier plate (4) is provided with a plurality of placement grooves (5) distributed at equal intervals on its surface, the placement groove (5) is provided with a plurality of countersunk holes (6), and the positions and depths of the countersunk holes (6) correspond to the pins of the pin-type components; The stepped cover plate (2) and the stepped steel mesh (3) are both arranged as stepped structures that match the placement groove (5) of the carrier plate (4); The stepped cover plate (2) is provided with a notch (7) corresponding to the placement groove (5), and pressure plates (8) are respectively fixed at both ends of the notch (7). The stepped steel mesh (3) is provided with a solder paste printing area (9) at a position corresponding to the placement groove (5), and the solder paste printing area (9) is provided with a plurality of through holes (10).

2. The SMT reflow soldering tool for pin-type components according to claim 1, characterized in that: A plurality of positioning columns (11) are fixed to the upper surface of the sinking carrier (1), and the stepped cover plate (2) and the stepped steel mesh (3) are both provided with positioning holes (12) corresponding to the positioning columns (11).

3. The SMT reflow soldering tool for pin-type components according to claim 1, characterized in that: A fixing plate (13) is fixed on the outside of the sinking carrier (1), and a plurality of fixing holes (14) are provided on the surface of the fixing plate (13).

4. The SMT reflow soldering tool for pin-type components according to claim 1, characterized in that: Corresponding arc-shaped notches (15) are provided at the edges of the sunken carrier (1) and the stepped cover plate (2).

5. The SMT reflow soldering tool for pin-type components according to claim 1, characterized in that: A plurality of limiting protrusions (16) are respectively fixed to the side walls at both ends of the placement groove (5), and the limiting protrusions (16) on both sides are arranged in a staggered manner.

6. The SMT reflow soldering tool for pin-type components according to claim 1, characterized in that: The sunken carrier (1), the stepped cover plate (2) and the stepped steel mesh (3) are all provided with mounting holes (17) aligned vertically.

Images