LED packaging structure

Abstract

The utility model discloses an LED packaging structure. The LED packaging structure comprises a packaging support, an LED chip and a packaging colloid. The packaging bracket comprises a base, a conductive terminal, a rubber cup and a packaging cavity; the LED chip is arranged on the base in the packaging cavity; the packaging colloid is arranged in the packaging cavity and covers the LED chip, the packaging colloid comprises a first packaging colloid and a second packaging colloid which are stacked in sequence, and the first packaging colloid is used for sealing the LED chip; and the second packaging colloid is used for scattering the light emitted by the LED. By adopting the LED packaging structure provided by the utility model, the air tightness and thermal shock resistance of the packaging structure can be improved, and the light emitting angle of the packaged LED is large.

Description

Technical Field

[0001] The utility model relates to the technical field of LED packaging, in particular to an LED packaging structure. Background Art

[0002] TOP LED is widely used in lighting, display and backlighting. Existing TOP LED devices include chips, brackets and packaging glue. The bracket is provided with a glue cup. The chip is set in the glue cup and electrically connected to the functional area of ​​the bracket. The packaging glue is set around the LED chip and covers the LED chip, and then it is blanked into RGB three-primary color lamp beads. However, the top of the packaging glue is flush with the top of the glue cup. The glue cup will block part of the light source emitted by the chip, resulting in insufficient brightness and luminous angle of the lamp beads. In addition, the packaging glue generally needs to add additives such as diffusion powder, which will cause light loss and a decrease in the airtightness of the device. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide an LED packaging structure, which can improve the air tightness and thermal shock performance of the packaging structure, and the light emitting angle of the packaged LED is large.

[0004] In order to solve the above technical problems, the utility model provides an LED packaging structure, including a packaging bracket, an LED chip and a packaging colloid;

[0005] The packaging bracket includes a base, a conductive terminal, a glue cup and a packaging cavity;

[0006] The LED chip is arranged on a base in the packaging cavity;

[0007] The packaging colloid is arranged in the packaging cavity and covers the LED chip. The packaging colloid includes a first packaging colloid and a second packaging colloid stacked in sequence. The first packaging colloid is used to seal the LED chip; the second packaging colloid is used to scatter the light emitted by the LED.

[0008] As an improvement of the above solution, the height of the first encapsulation colloid in the vertical direction is 50 μm to 600 μm, and the height of the second encapsulation colloid in the vertical direction is 10 μm to 900 μm.

[0009] As an improvement of the above solution, the shape of the first encapsulating colloid is one of a hemispherical shape, a truncated cone shape or a trapezoidal shape.

[0010] As an improvement of the above solution, a light-focusing convex mirror structure is provided on the first packaging colloid.

[0011] As an improvement of the above solution, the upper surface of the second encapsulating colloid is flush with the upper surface of the colloid cup.

[0012] As an improvement of the above solution, the glue cup is arranged on one side of the conductive terminal, and the glue cup and the conductive terminal are surrounded to form a packaging cavity for accommodating the LED chip and the packaging colloid.

[0013] As an improvement of the above solution, the packaging cavity is in the shape of an inverted pyramid.

[0014] As an improvement of the above solution, two adjacent side surfaces of the packaging cavity are transitioned through arc surfaces.

[0015] As an improvement of the above solution, the conductive terminal includes a crystal-bonding portion and a pin portion, the crystal-bonding portion is arranged at the top of the conductive terminal, and the pin portion is arranged at the bottom of the conductive terminal.

[0016] As an improvement of the above solution, the LED chips include a red LED chip, a green LED chip and a blue LED chip.

[0017] The implementation of this utility model has the following beneficial effects:

[0018] The LED packaging structure provided by the utility model has a first packaging colloid with good air tightness and thermal shock resistance, which can protect the main electrical materials in the device and improve the reliability of the device; the second packaging colloid can diffuse the light emitted by the first packaging colloid, expand the light-emitting angle, and improve the light-emitting efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of the LED packaging structure provided by the utility model;

[0020] Figure 2 It is a structural schematic diagram of another LED packaging structure provided by the utility model;

[0021] Figure 3 It is a light emitting schematic diagram of the LED packaging structure provided by the utility model. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solution and advantages of the utility model clearer, the utility model will be further described in detail with reference to the accompanying drawings. It is hereby stated that the directional words such as up, down, left, right, front, back, inside, outside, etc. that appear or will appear in the text of the utility model are only based on the accompanying drawings of the utility model, and are not specific limitations of the utility model.

[0023] like Figure 1 to Figure 3As shown, the embodiment of the utility model provides an LED packaging structure, including a packaging support 1, an LED chip 2 and a packaging colloid 3. The packaging support 1 includes a base 11, a conductive terminal 12, a glue cup 13 and a packaging cavity 14. The LED chip 2 is arranged on the base 11 in the packaging cavity. The packaging colloid 3 is arranged in the packaging cavity 14 and covers the LED chip 2. The packaging colloid 3 includes a first packaging colloid 31 and a second packaging colloid 32 stacked in sequence. The first packaging colloid is a transparent packaging colloid, which is used to seal the LED chip 2; the second packaging colloid 32 is a packaging colloid doped with a light diffuser, which is used to scatter the light emitted by the LED. The first packaging colloid is not doped with a light diffuser to avoid the influence of the light diffuser on the device performance. The first packaging colloid has good air tightness and thermal shock performance, which can protect the main electrical materials in the device and improve the reliability of the device. The second packaging colloid is doped with a light diffuser, which can diffuse the light emitted by the first packaging colloid, expand the light emitting angle, and improve the light emitting efficiency. The first encapsulating colloid can be selected from one of epoxy resin, polyurethane resin, silicone resin or silica gel. The second encapsulating colloid can be selected from one of epoxy resin doped with light diffusing agent, polyurethane resin doped with light diffusing agent, silicone resin doped with light diffusing agent or silica gel doped with light diffusing agent.

[0024] Specifically, the height h1 of the first encapsulation colloid 31 in the vertical direction is 50μm to 600μm, and is exemplarily 80μm, 100μm, 200μm, 400μm or 600μm, but not limited to this. If the thickness is less than 50μm, it is not conducive to forming a good package for the LED chip; if the thickness is greater than 600μm, it will affect the luminous efficiency. The height h2 of the second encapsulation colloid 32 in the vertical direction is 10μm to 900μm, and is exemplarily 50μm, 100μm, 300μm, 500μm or 800μm, but not limited to this. By matching the heights of the first encapsulation colloid and the second encapsulation colloid in the vertical direction, the light emitted by the LED chip is diffused to achieve high brightness and high reliability of the device.

[0025] In one embodiment, the first encapsulating colloid 31 is in a shape of a hemisphere, a truncated cone or a trapezoid. The trapezoid is easy to form and simple to operate; the hemisphere and the truncated cone can enhance the light and further improve the luminous brightness.

[0026] Preferably, a convex mirror structure for focusing light is provided on the first packaging colloid 31. The convex mirror formed inside the lamp bead has the functions of expanding the light-emitting angle and focusing light to increase the brightness of the lamp bead.

[0027] The upper surface of the second packaging colloid 32 is flush with the upper surface of the plastic cup 13 . The packaging colloid is restricted by the setting of the plastic cup. The material of the plastic cup can be one of PPA, PCT, EMC or SMC.

[0028] The glue cup is arranged on one side of the conductive terminal, and the glue cup and the conductive terminal are surrounded to form a packaging cavity for accommodating the LED chip and the packaging colloid. Preferably, the packaging cavity is in the shape of an inverted pyramid, which can well limit the packaging glue layer.

[0029] Two adjacent side surfaces of the packaging cavity are transitioned through arc surfaces.

[0030] The conductive terminal 12 includes a solid crystal portion 121 and a pin portion 122. The solid crystal portion 121 is arranged at the top of the conductive terminal 12 to fix the LED chip and form an electrical connection with the LED chip; the pin portion 122 is arranged at the bottom of the conductive terminal to provide an electrical connection between the LED chip and the external circuit.

[0031] The LED chips include a red LED chip, a green LED chip and a blue LED chip. Light emitted by the red LED chip, the green LED chip and the blue LED chip is mixed to form white light.

[0032] The above is a preferred embodiment of the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications are also considered to be within the protection scope of the present invention.

Claims

1. An LED packaging structure, characterized in that: Including packaging bracket, LED chip and packaging colloid; The packaging bracket includes a base, a conductive terminal, a glue cup and a packaging cavity; The LED chip is arranged on a base in the packaging cavity; The packaging colloid is arranged in the packaging cavity and covers the LED chip. The packaging colloid includes a first packaging colloid and a second packaging colloid stacked in sequence. The first packaging colloid is used to seal the LED chip; the second packaging colloid is used to scatter the light emitted by the LED.

2. The LED packaging structure according to claim 1, characterized in that: The height of the first encapsulation colloid in the vertical direction is 50 μm to 600 μm, and the height of the second encapsulation colloid in the vertical direction is 10 μm to 900 μm.

3. The LED packaging structure according to claim 1, characterized in that: The first encapsulating colloid has a shape of a hemisphere, a truncated cone or a trapezoid.

4. The LED packaging structure according to claim 3, characterized in that: A light-collecting convex mirror structure is provided on the upper surface of the first packaging colloid.

5. The LED packaging structure according to claim 1, characterized in that: The upper surface of the second packaging colloid is flush with the upper surface of the colloid cup.

6. The LED packaging structure according to claim 1, characterized in that: The glue cup is arranged on one side of the conductive terminal, and the glue cup and the conductive terminal are surrounded to form a packaging cavity for accommodating the LED chip and the packaging colloid.

7. The LED packaging structure according to claim 6, characterized in that: The packaging cavity is in the shape of an inverted pyramid.

8. The LED packaging structure according to claim 1, characterized in that: Two adjacent side surfaces of the packaging cavity are transitioned through arc surfaces.

9. The LED packaging structure according to claim 6, characterized in that: The conductive terminal comprises a die-bonding portion and a lead portion, wherein the die-bonding portion is arranged at the top of the conductive terminal, and the lead portion is arranged at the bottom of the conductive terminal.

10. The LED packaging structure according to claim 1, characterized in that: The LED chips include a red LED chip, a green LED chip and a blue LED chip.

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