LED COB lamp panel

Abstract

The utility model provides an LED COB lamp panel, comprising a substrate, a transparent packaging glue layer and an LED chip, the LED chip is arranged on the substrate, the transparent packaging glue layer is arranged corresponding to the LED chip, the transparent packaging glue layer is covered on the LED chip, one end of the transparent packaging glue layer far away from the LED chip is recessed towards the LED chip, the LED chip is packaged through the transparent packaging glue layer, and the LED chip is packaged through the transparent packaging glue layer. The top of the transparent packaging adhesive layer is provided with the concave part, and when the light emitted by the LED chip is in contact with the top of the transparent packaging adhesive layer, the light is diffused outwards from the center of the transparent packaging adhesive layer, so that the light intensity of the central position of the transparent packaging adhesive layer is reduced, the light intensity of positions except the center of the transparent packaging adhesive layer is improved, and the uniformity of the emitted light is improved. Meanwhile, the transparent packaging adhesive layer is a transparent adhesive layer, and light emitted by the LED chip is further diffused under the action of the transparent adhesive layer.

Description

Technical Field

[0001] The utility model relates to the technical field of LED packaging, in particular to an LED COB lamp board. Background Art

[0002] Conventional LED COB packaging first solidifies the LED on the substrate, and then applies a layer of packaging glue on the substrate to form a packaging structure. However, the front side of the LED emits strong light, resulting in uneven effects and poor bright spots and stripes on the front side.

[0003] A patent document in China with application number 202310539018.8 and publication date 2023.8.1 discloses a new Mini-TV-COB packaging structure and process, including a substrate, an ink layer is provided on the top of the substrate, an LED chip is provided on the ink layer, and the outer side of the LED chip is packaged with an arc-shaped transparent packaging glue layer; a light-shielding dot glue layer is provided on the upper end of the transparent packaging glue layer.

[0004] The glue dispensing layer is white silicone, which blocks the light intensity on the front of the LED chip, so that the light from the LED chip is reflected to the side and bottom. In this packaging structure, the light emitted by part of the LED chip is blocked by the white glue layer. The light emitted by part of the LED chip is reflected by the white glue layer and then emitted from the side of the transparent packaging glue layer, so the overall light intensity of the packaging structure is reduced. At the same time, the transparent packaging glue layer in this structure is a ball head structure, and the glue dispensing layer is also a ball head structure, so it is necessary to dispense glue twice, and the structure is complicated. Summary of the invention

[0005] The utility model provides an LED COB lamp panel, which reduces the central light intensity and improves uniformity, while not affecting the overall light intensity of the lamp panel and has a simple structure.

[0006] To achieve the above-mentioned purpose, the technical solution of the utility model is: an LED COB light board, comprising a substrate, a transparent encapsulation layer and an LED chip, the LED chip is arranged on the substrate, the transparent encapsulation layer is arranged corresponding to the LED chip, the transparent encapsulation layer is coated on the LED chip, and a recessed portion recessed toward the LED chip is arranged on one end of the transparent encapsulation layer away from the LED chip, the bottom of the recessed portion is spaced from the top surface of the LED chip, and the recessed portion is located on the top of the LED chip.

[0007] The above arrangement realizes encapsulation of the LED chip through the transparent encapsulation adhesive layer. By providing a recessed portion on the top of the transparent encapsulation adhesive layer, when the light emitted by the LED chip contacts the top of the transparent encapsulation adhesive layer, since the recessed portion is recessed downward, its structure is different from that of the transparent encapsulation adhesive layer. On the one hand, it will diffuse outward from the center of the transparent encapsulation adhesive layer, thereby reducing the light intensity at the center of the transparent encapsulation adhesive layer, increasing the light intensity at positions outside the center of the transparent encapsulation adhesive layer, and improving the uniformity of light output. On the other hand, the transparent encapsulation adhesive layer is a transparent adhesive layer, and the light emitted by the LED chip diffuses outward under the action of the transparent adhesive layer due to the action of the recessed portion. The light emitted by the LED chip is not reflected or blocked in the process of light output, and the overall light output intensity of the lamp panel is large. At the same time, only a recess needs to be formed on the transparent encapsulation adhesive layer, and the structure is simple.

[0008] Furthermore, the transparent encapsulation adhesive layer includes a first light emitting area and a second light emitting area; the second light emitting area is arranged outside the first light emitting area and located at the first light emitting area, and the first light emitting area is arranged to be recessed inwardly.

[0009] The above configuration increases the diffusion effect of the light emitted by the LED chip in the first light emitting area by setting the first light emitting area concave. The diffusion degree of the light emitted by the LED chip in the first light emitting area is greater than the diffusion degree of the LED chip in the second light emitting area.

[0010] Furthermore, the width of the first light emitting area is greater than the width of the LED chip.

[0011] With the above arrangement, all the light energy emitted from the front side of the LED chip can interact with the first light emitting area.

[0012] Furthermore, the LED chip is a blue light LED, and a fluorescent glue layer is provided between the surface of the LED chip and the transparent packaging glue layer.

[0013] In the above arrangement, by providing a fluorescent adhesive layer, the light emitted by the blue light LED reacts with the fluorescent adhesive layer to form white light; thus, the light board emits white light.

[0014] Furthermore, the fluorescent glue layer covers the top surface and side surfaces of the LED chip.

[0015] With the above arrangement, the fluorescent adhesive layer covers the top and side surfaces of the LED chip, and the light emitted from the front and side surfaces of the LED chip can interact with the fluorescent adhesive layer, so that the white light has good uniformity.

[0016] Furthermore, the transparent packaging adhesive layer is a ball head structure.

[0017] The above configuration, by providing a transparent encapsulation adhesive layer of the ball head structure, makes the refraction angle of light in the LENS adhesive layer greater than the incident angle, thereby increasing the light emitting angle of the light panel.

[0018] Furthermore, the cross section of the recessed portion is arc-shaped.

[0019] The above arrangement prevents the light from being concentrated at a certain position after passing through the recessed portion, thereby achieving a better light output effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the utility model.

[0021] Figure 2 It is a schematic diagram of the optical path in the utility model. DETAILED DESCRIPTION

[0022] The utility model is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0023] like Figure 1-2 As shown, an LED COB light board includes a substrate 1, a transparent encapsulation layer 2 and an LED chip 3. The LED chip 3 is arranged on the substrate 1, the transparent encapsulation layer 2 is arranged corresponding to the LED chip 3, the transparent encapsulation layer 2 is covered on the LED chip 3, and the transparent encapsulation layer 2 includes a first light emitting area 21 and a second light emitting area 22; the first light emitting area 21 is arranged at the top center of the transparent encapsulation layer 2, the second light emitting area 22 is arranged outside the first light emitting area 21 and is located at the first light emitting area 21, and the first light emitting area 21 is recessed inwardly. In this embodiment, the first light emitting area 21 is a recessed portion on the transparent encapsulation layer that is recessed toward the LED chip 3, the bottom of the recessed portion is spaced from the top surface of the LED chip, and the recessed portion is located at the top of the LED chip 3, the cross-section of the recessed portion is arc-shaped, the depth of the recessed portion is 0.1-0.4mm, and the arc of the recessed portion is 0.8-1.3mm. The recessed portion can be formed by molding or cutting after the transparent encapsulation layer is formed by dispensing.

[0024] In this embodiment, the depth of the recessed portion is 0.4 mm, and the curvature of the recessed portion is 0.8 mm.

[0025] The first light emitting area 21 is concavely arranged to increase the diffusion effect of the light emitted by the LED chip 3 in the first light emitting area 21. The diffusion degree of the light emitted by the LED chip 3 in the first light emitting area 21 is greater than the diffusion degree of the LED chip 3 in the second light emitting area 22.

[0026] The transparent encapsulation adhesive layer 2 is a ball head structure. By setting the ball head structure as the transparent encapsulation adhesive layer 2, the transparent encapsulation adhesive layer 2 is a LENS adhesive layer, and the refraction angle of light in the LENS adhesive layer is greater than the incident angle, thereby increasing the light emitting angle of the light board. The LENS adhesive layer is a prior art and will not be described here.

[0027] In this embodiment, the width of the first light emitting area 21 is greater than the width of the LED chip 3 , so that the light energy emitted from the front side of the LED chip 3 can all interact with the first light emitting area 21 .

[0028] The LED chip 3 is a blue light LED chip, and a fluorescent glue layer is also provided on the surface of the LED chip 3. By providing the fluorescent glue layer, the light emitted by the blue light LED reacts with the fluorescent glue layer to form white light; thus, the light board emits white light. The fluorescent glue layer covers the top and side surfaces of the LED chip 3. The light emitted from the front and side surfaces of the LED chip 3 can react with the fluorescent glue layer, and the white light has good light uniformity, and the efficiency of converting blue light into white light is high.

[0029] The working principle of the utility model is as follows: the LED chip 3 is encapsulated by the transparent encapsulation adhesive layer 2. By providing a recessed portion on the top of the transparent encapsulation adhesive layer 2, when the light emitted by the LED chip 3 contacts the top of the transparent encapsulation adhesive layer 2, it will diffuse outward from the center of the transparent encapsulation adhesive layer 2, thereby reducing the light intensity at the center of the transparent encapsulation adhesive layer 2, increasing the light intensity at positions outside the center of the transparent encapsulation adhesive layer 2, and improving the uniformity of the light output. At the same time, the transparent encapsulation adhesive layer 2 is a transparent adhesive layer, and the light emitted by the LED chip 3 is further diffused under the action of the transparent adhesive layer. The light emitted by the LED chip is blocked without reflection during the light output process, and the overall light output intensity of the light board is large.

Claims

1. An LED COB light board, comprising a substrate, a transparent encapsulation layer and an LED chip, wherein the LED chip is arranged on the substrate, characterized in that: A transparent encapsulation adhesive layer is arranged corresponding to the LED chip, the transparent encapsulation adhesive layer is covered on the LED chip, a recessed portion is arranged on one end of the transparent encapsulation adhesive layer away from the LED chip, the bottom of the recessed portion is spaced from the top surface of the LED chip, and the recessed portion is located on the top of the LED chip; the LED chip is a blue light LED, and a fluorescent adhesive layer is further arranged between the surface of the LED chip and the transparent encapsulation adhesive layer; the transparent encapsulation adhesive layer comprises a first light emitting area and a second light emitting area; the second light emitting area is arranged outside the first light emitting area and is arranged in the first light emitting area, the first light emitting area is recessed inwardly, the cross-section of the recessed portion is an arc, the second light emitting area is convex outwardly in a circular arch shape, the depth of the recessed portion is 0.1-0.4mm, and the diffusion degree of the light emitted by the LED chip in the first light emitting area is greater than the diffusion degree of the LED chip in the second light emitting area.

2. The LED COB light board according to claim 1, characterized in that: The width of the first light emitting area is greater than the width of the LED chip.

3. The LED COB light board according to claim 1, characterized in that: The fluorescent glue layer covers the top and side surfaces of the LED chip.

4. The LED COB light board according to claim 1, characterized in that: The transparent packaging adhesive layer is a ball head structure.

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