Gluing nozzle mechanism for wafer gluing equipment

Abstract

The utility model relates to the technical field of wafer gluing, and discloses a gluing nozzle mechanism for wafer gluing equipment, which comprises a constant-temperature water pipeline, a glue solution pipeline, a glue solution seat and a nozzle seat, the constant-temperature water pipeline is sleeved on the outer side of the glue solution pipeline, the inner diameter of the constant-temperature water pipeline is larger than the outer diameter of the glue solution pipeline, and the nozzle seat is sleeved on the glue solution pipeline. A glue solution cavity is formed in the glue solution seat, the glue solution pipeline is communicated with the glue solution cavity, the spray head seat is connected with the glue solution seat, a spray head is arranged on the spray head seat, and the spray head is communicated with the glue solution cavity. The constant-temperature water pipeline is arranged on the outer side of the glue solution pipeline in a sleeving manner, and the constant-temperature pipeline and the glue solution pipeline are coaxial, so that the uniformity of the temperature of photoresist in the glue solution pipeline is ensured, the flowability and chemical performance of the photoresist are ensured, and the wafer gluing effect is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer gluing, in particular to a gluing nozzle mechanism for wafer gluing equipment. Background Art

[0002] In semiconductor manufacturing, photolithography is one of the most important process steps. Its main function is to copy the pattern on the mask onto the silicon wafer to prepare for the next step of etching or ion implantation. Photoresist coating is one of the most important process steps in the photolithography process. The quality of photoresist coating directly affects the quality of semiconductor devices. Photoresist is very sensitive to temperature. Temperature affects its fluidity and chemical properties. The effect of wafer coating directly affects the back-end manufacturing. Therefore, the temperature of the photoresist during coating is crucial. Utility Model Content

[0003] The utility model aims at solving the existing technical problems and provides a glue spraying head mechanism for wafer glue spraying equipment.

[0004] The technical solution of the utility model to solve the above-mentioned technical problems is as follows: a glue coating nozzle mechanism for wafer glue coating equipment, comprising a constant temperature water pipeline, a glue liquid pipeline, a glue liquid seat and a nozzle seat, the constant temperature water pipeline is sleeved on the outside of the glue liquid pipeline, the inner diameter of the constant temperature water pipeline is larger than the outer diameter of the glue liquid pipeline, a glue liquid cavity is provided in the glue liquid seat, the glue liquid pipeline is connected to the glue liquid cavity, the nozzle seat is connected to the glue liquid seat, a nozzle is provided on the nozzle seat, and the nozzle is connected to the glue liquid cavity.

[0005] On the basis of the above technical solution, the present invention can also make the following improvements to the above technical solution:

[0006] Preferably, the glue seat is provided with an annular boss 1, the glue pipeline is sleeved on the annular boss 1, the annular boss 1 is provided with a through hole, and the through hole is connected with the glue pipeline and the glue cavity.

[0007] Preferably, a buffer screen is provided in the glue liquid chamber, and the buffer screen is located between the liquid outlet of the glue liquid pipeline and the liquid inlet of the nozzle.

[0008] Preferably, the nozzle is arranged at an angle.

[0009] Preferably, the inclination angle θ of the nozzle is 45°-60°.

[0010] Preferably, it also includes a constant temperature seat, which is installed on the glue seat. A constant temperature cavity is arranged in the constant temperature seat, the constant temperature water pipeline is connected with the constant temperature cavity, and the glue pipeline runs through the constant temperature cavity.

[0011] Preferably, a cover plate is provided on one side of the constant temperature chamber, the cover plate is mounted on the constant temperature seat, and a water outlet is provided on the cover plate.

[0012] Preferably, it also includes a support assembly, which includes a threaded locking nut and a support platform, the support platform is installed on the constant temperature seat, the upper end of the support platform is provided with an annular boss 2, the end of the constant temperature water pipeline is located between the locking nut and the annular boss 2, a through groove is provided in the support platform, the glue pipeline passes through the through groove, and a gap is provided between the outer wall of the glue pipeline and the inner wall of the through groove, and the constant temperature water pipeline is connected with the constant temperature cavity through the gap.

[0013] Preferably, a gasket is provided on the outer side of the constant temperature water pipeline, and the gasket is located between the constant temperature seat and the glue seat.

[0014] Preferably, sealing rings are provided at the connection between the glue seat and the nozzle seat, and at the connection between the gasket and the constant temperature seat and the glue seat.

[0015] The beneficial effect of the utility model is that the constant temperature water pipeline is sleeved on the outside of the glue liquid pipeline, and the constant temperature pipeline and the glue liquid pipeline are coaxially arranged. When the photoresist flows in the glue liquid pipeline, the constant temperature water evenly heats the photoresist, thereby ensuring the uniformity of the temperature of the photoresist in the glue liquid pipeline, ensuring the fluidity and chemical properties of the photoresist, and ensuring the effect of wafer coating. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a cross-sectional schematic diagram of the glue spray nozzle mechanism of the utility model;

[0017] Figure 2 It is a three-dimensional schematic diagram of the glue spray head mechanism of the utility model;

[0018] Figure 3 It is a three-dimensional schematic diagram of the glue spray head mechanism of the utility model from another angle;

[0019] Figure 4 It is a side view schematic diagram of the glue spray nozzle mechanism of the utility model.

[0020] Figure numerals: 1. Constant temperature water pipeline; 2. Glue pipeline; 3. Locking nut; 4. Buffer screen; 5. Sprinkler; 6. Gasket; 7. Constant temperature seat; 8. Glue seat; 9. Support platform; 10. Glue chamber; 11. Sprinkler seat; 12. Constant temperature chamber; 13. Water outlet; 14. Annular boss one. DETAILED DESCRIPTION

[0021] In the description of the present invention, it should be understood that the directions or positional relationships indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", etc. are based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0022] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0023] like Figures 1 to 4 As shown, the utility model discloses a glue spray nozzle mechanism for wafer glue coating equipment, including a constant temperature water pipeline 1, a glue liquid pipeline 2, a glue liquid seat 8 and a nozzle seat 11, the constant temperature water pipeline 1 is sleeved on the outside of the glue liquid pipeline 2, the inner diameter of the constant temperature water pipeline 1 is larger than the outer diameter of the glue liquid pipeline 2, so that the constant temperature water in the constant temperature water pipeline 1 can heat the photoresist in the glue liquid pipeline 2 at a constant temperature, thereby ensuring the fluidity and temperature uniformity of the photoresist, the glue liquid seat 8 is provided with a glue liquid cavity 10, the glue liquid pipeline 2 is connected to the glue liquid cavity 10, the nozzle seat 11 is connected to the glue liquid seat 8, and a nozzle 5 is provided on the nozzle seat 11, and the nozzle 5 is connected to the glue liquid cavity 10, wherein, according to the use situation, the nozzle 5 is provided with one, two or more, to meet the use requirements in different environments. When there are multiple nozzles 5, the multiple nozzles 5 are evenly arranged along the length direction of the nozzle seat 11 to ensure the uniformity of the photoresist spraying.

[0024] Furthermore, according to the equipment space, the lengths of the constant temperature water pipeline 1 and the glue liquid pipeline 2 can be increased as much as possible, and further, the uniformity of the temperature of the photoresist in the glue liquid pipeline 2 can be ensured.

[0025] In this embodiment, an annular boss 14 is provided on the glue seat 8, and the end of the glue pipeline 2 is sleeved on the annular boss 14. A through hole is provided on the annular boss 14, and the through hole is connected with the glue pipeline 2 and the glue cavity 10. The annular boss 14 supports and fixes the glue pipeline 2, and facilitates the photoresist in the glue pipeline 2 to flow directly into the glue cavity 10 through the through hole, thereby ensuring the smoothness of the photoresist flow. The upper end of the annular boss 14 is provided with a rounded corner, which is convenient for installing the glue pipeline 2, improving the convenience of installation and reducing the difficulty of installation.

[0026] Furthermore, the number of the annular bosses 14 corresponds to the number of the glue pipelines 2. In the present embodiment, two annular bosses 14 and two glue pipelines 2 are provided to ensure that a sufficient amount of photoresist flows into the glue cavity 10 and make the overall structure compact.

[0027] In this embodiment, a buffer screen 4 is provided in the glue liquid chamber 10, and the buffer screen 4 is located between the liquid outlet of the glue liquid pipeline 2 and the liquid inlet of the nozzle 5. The buffer screen 4 is drilled with small holes of a certain size and number, and the diameter of the small holes is 1.5mm-2.5mm, which can not only slow down the flow rate of the photoresist, but also ensure that the two photoresists of different properties in the glue liquid pipeline 2 are mixed as evenly as possible before spraying, thereby ensuring the quality of wafer coating.

[0028] In this embodiment, the nozzle 5 is tilted, and further, the tilt angle θ of the nozzle 5 is 45°-60°, so as to avoid the photoresist directly hitting the wafer and causing sputtering during dispensing, and reduce the impact of the photoresist on the wafer.

[0029] The glue spray head mechanism also includes a constant temperature seat 7, which is detachably mounted on the glue liquid seat 8 by screws or bolts, and a constant temperature chamber 12 is provided in the constant temperature seat 7, and the constant temperature water pipeline 1 is connected to the constant temperature chamber 12, and the glue liquid pipeline 2 runs through the constant temperature chamber 12. The glue liquid pipeline 2 is uniformly and constantly heated by the constant temperature water in the constant temperature chamber 12, so as to further ensure the fluidity of the photoresist in the glue liquid pipeline 2 and ensure the quality of the wafer glue coating.

[0030] Furthermore, a cover plate is provided on one side of the constant temperature chamber 12, and the cover plate is mounted on the constant temperature seat 7, and a water outlet 13 is provided on the cover plate. The constant temperature water in the constant temperature chamber 12 is discharged through the water outlet 13, so that the constant temperature water circulates in the constant temperature water pipeline 1 and the constant temperature chamber 12, thereby ensuring the temperature of the constant temperature water, thereby ensuring the uniformity of heating of the photoresist.

[0031] The glue coating nozzle mechanism also includes a supporting component, which includes a locking nut 3 and a supporting platform 9 that are threadedly connected. The supporting platform 9 is installed on the constant temperature seat 7. An annular boss 2 is provided at the upper end of the supporting platform 9, and a through groove is provided in the supporting platform 9. The end of the constant temperature water pipeline 1 is located between the locking nut 3 and the annular boss 2. The locking nut 3 and the annular boss 2 cooperate to support and fix the constant temperature water pipeline 1. The glue pipeline 2 passes through the through groove, and a gap is provided between the outer wall of the glue pipeline 2 and the inner wall of the through groove. The constant temperature water pipeline 1 is connected to the constant temperature chamber 12 through the gap, so that the constant temperature water circulates between the constant temperature water pipeline 1 and the constant temperature chamber 12, thereby improving the uniformity of heating of the photoresist in the glue pipeline 2 and ensuring the quality of wafer coating.

[0032] In this embodiment, a gasket 6 is sleeved on the outer side of the constant temperature water pipeline 1, and the gasket 6 is located between the constant temperature seat 7 and the glue seat 8. The gasket 6 plays a sealing role to prevent the cooling water and the glue from mixing.

[0033] In this embodiment, specifically, sealing rings are provided at the connection between the glue seat 8 and the nozzle seat 11, and at the connection between the gasket 6 and the constant temperature seat 7 and the glue seat 8 to prevent water or photoresist leakage and improve the overall sealing.

[0034] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A glue spray head mechanism for wafer glue coating equipment, characterized in that: The invention comprises a constant temperature water pipeline (1), a glue pipeline (2), a glue seat (8) and a nozzle seat (11); the constant temperature water pipeline (1) is sleeved on the outside of the glue pipeline (2); the inner diameter of the constant temperature water pipeline (1) is larger than the outer diameter of the glue pipeline (2); a glue cavity (10) is provided in the glue seat (8); the glue pipeline (2) is connected to the glue cavity (10); the nozzle seat (11) is connected to the glue seat (8); a nozzle (5) is provided on the nozzle seat (11); and the nozzle (5) is connected to the glue cavity (10).

2. The glue spray head mechanism for wafer glue coating equipment according to claim 1, characterized in that: The glue seat (8) is provided with an annular boss (14), the end of the glue pipeline (2) is sleeved on the annular boss (14), and the annular boss (14) is provided with a through hole, which is connected to the glue pipeline (2) and the glue cavity (10).

3. The glue spray head mechanism for wafer glue coating equipment according to claim 1 or 2, characterized in that: A buffer screen (4) is provided in the glue liquid chamber (10), and the buffer screen (4) is located between the liquid outlet of the glue liquid pipeline (2) and the liquid inlet of the nozzle (5).

4. The glue spray head mechanism for wafer glue coating equipment according to claim 1, characterized in that: The spray head (5) is arranged at an angle.

5. The glue spray head mechanism for wafer glue coating equipment according to claim 4, characterized in that: The inclination angle θ of the nozzle (5) is 45°-60°.

6. The glue spray head mechanism for wafer glue coating equipment according to claim 1, characterized in that: It also includes a constant temperature seat (7), the constant temperature seat (7) is installed on the glue seat (8), a constant temperature chamber (12) is provided in the constant temperature seat (7), the constant temperature water pipeline (1) is connected to the constant temperature chamber (12), and the glue pipeline (2) runs through the constant temperature chamber (12).

7. The glue spray head mechanism for wafer glue coating equipment according to claim 6, characterized in that: A cover plate is provided on one side of the constant temperature chamber (12), the cover plate is mounted on the constant temperature seat (7), and a water outlet (13) is provided on the cover plate.

8. The glue spray head mechanism for wafer glue coating equipment according to claim 6, characterized in that: The invention also comprises a support assembly, wherein the support assembly comprises a locking nut (3) and a support platform (9) which are threadedly connected, wherein the support platform (9) is mounted on the thermostatic seat (7), wherein an annular boss 2 is provided at the upper end of the support platform (9), wherein the end of the thermostatic water pipeline (1) is located between the locking nut (3) and the annular boss 2, wherein a through groove is provided in the support platform (9), wherein the glue pipeline (2) passes through the through groove, and a gap is provided between the outer wall of the glue pipeline (2) and the inner wall of the through groove, wherein the thermostatic water pipeline (1) is connected to the thermostatic chamber (12) through the gap.

9. The glue spray head mechanism for wafer glue coating equipment according to claim 6, characterized in that: A gasket (6) is sleeved on the outer side of the constant temperature water pipeline (1), and the gasket (6) is located between the constant temperature seat (7) and the glue seat (8).

10. The glue spray head mechanism for wafer glue coating equipment according to claim 9, characterized in that: Sealing rings are provided at the connection between the glue seat (8) and the nozzle seat (11), and at the connection between the gasket (6) and the constant temperature seat (7) and the glue seat (8).

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