Double-object surface tenon joint structure

By making microstructures on the dual-object surface and surface modification, the problem of the dual-material connection in the prior art is solved, and the tight bonding and cost reduction of the dual-materials are achieved.

CN222818155UActive Publication Date: 2025-05-02COHPROS INT CO LTD
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Patent Information

Application Number
CN202421484110.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-26
Publication Date
2025-05-02
Estimated Expiration
2034-06-26

AI Technical Summary

Technical Problem

The prior art can easily damage material components when connecting dual materials or require multiple processing steps, increasing production costs.

Method used

The microstructure is made on the surface of the dual object by a laser unit and the surface is softened by the surface modification step, thereby achieving a tight bonding of the dual object surface.

Benefits of technology

The tight integration of dual-material components is achieved, reducing production costs and improving connection effects.

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Abstract

The utility model provides a double-object surface tenon joint structure which comprises a first object and a second object. The first surface of the first object is provided with a plurality of first microstructures, and the plurality of first microstructures are manufactured through a laser unit. The second surface of the second object is provided with a plurality of second microstructures, and the plurality of second microstructures are manufactured through two laser units. The first surface of the first object is combined with the second surface of the second object, and each first microstructure is connected with the corresponding second microstructure in a matched mode.
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Description

Technical Field

[0001] The utility model relates to a structure for making a double-object surface combination, in particular to a structure for making a double-object surface combination through a laser unit. Background Art

[0002] Material connection technology is used in various fields. In the semiconductor field, various connection methods have been developed according to its application requirements, such as welding, gluing and the recent hybrid bonding.

[0003] However, as material components become more sophisticated, it is increasingly difficult to create connections between two materials. This may damage the material components or require multiple processing steps, which in turn increases the cost of production.

[0004] Therefore, how to improve the bonding effect of dual-material components and reduce production costs through process improvements to overcome the above-mentioned defects has become one of the important issues that this business wants to solve. Utility Model Content

[0005] The technical problem to be solved by the utility model is to provide a method for making a double-object surface joint in view of the shortcomings of the prior art, which comprises: providing a first object, and making a plurality of first microstructures on a first surface of the first object by a laser unit. Providing a second object, and making a plurality of second microstructures on a second surface of the second object by a laser unit. Combining the first object and the second object, making the first surface and the second surface opposite to each other, and each first microstructure and the corresponding second microstructure are matched and connected with each other.

[0006] According to a feasible implementation scheme, when a plurality of first microstructures are produced on a first surface of a first object, a first surface modification step is also performed to soften the first surface; when a plurality of second microstructures are produced on a second surface of a second object, a second surface modification step is also performed to soften the second surface.

[0007] According to a feasible implementation scheme, in the step of combining the first object and the second object, a first surface modification step and a second surface modification step are respectively performed to modify the first microstructures and the second microstructures with the laser unit to soften the first surface and the second surface.

[0008] According to a feasible implementation, the first surface modification step and the second surface modification step are performed using a femtosecond laser.

[0009] According to a feasible embodiment, the plurality of first microstructures are arranged on the first surface in a regular or irregular manner, and the plurality of second microstructures are arranged on the second surface in a regular or irregular manner.

[0010] According to a feasible implementation manner, each first microstructure is a convex structure or a concave structure, and each second microstructure is a convex structure or a concave structure corresponding to the first microstructure.

[0011] According to a feasible implementation, the unit size of each first microstructure is 100 micrometers to 100 nanometers, and the unit size of each second microstructure is 100 micrometers to 100 nanometers.

[0012] According to a feasible implementation, the first object is a semiconductor, metal, plastic, glass or ceramic. The second object is a semiconductor, metal, plastic, glass or ceramic.

[0013] The utility model also provides a double-object surface mortise and tenon structure, including a first object and a second object. The first surface of the first object has a plurality of first microstructures, and the plurality of first microstructures are made by a laser unit. The second surface of the second object has a plurality of second microstructures, and the plurality of second microstructures are made by two laser units. The first object is combined with the second surface of the second object by the first surface, and each first microstructure is matched and connected with the corresponding second microstructure.

[0014] According to a feasible embodiment, the plurality of first microstructures are arranged on the first surface in a regular or irregular manner, and the plurality of second microstructures are arranged on the second surface in a regular or irregular manner.

[0015] According to a feasible implementation manner, each first microstructure is a convex structure or a concave structure, and each second microstructure is a convex structure or a concave structure corresponding to the first microstructure.

[0016] According to a feasible implementation, the unit size of each first microstructure is 100 micrometers to 100 nanometers, and the unit size of each second microstructure is 100 micrometers to 100 nanometers.

[0017] According to a feasible implementation, the first object is a semiconductor, metal, plastic, glass or ceramic. The second object is a semiconductor, metal, plastic, glass or ceramic.

[0018] One of the beneficial effects of the present invention is that the method for making a double-object surface tenon joint and the double-object surface tenon joint structure provided by the present invention can tightly combine the two objects through the technical solutions of "making a plurality of first microstructures on a first surface of the first object by a laser unit", "making a plurality of second microstructures on a second surface of the second object by the laser unit", and "combining the first object and the second object, making the first surface opposite to the second surface, and each first microstructure and the corresponding second microstructure match and connect with each other". According to some embodiments, the first object can be metal, plastic, glass or ceramic. The second object can be metal, plastic, glass or ceramic.

[0019] Furthermore, one of the beneficial effects of the present invention is that the method for making double-object surface mortise and tenon joints provided by the present invention also simultaneously performs a surface modification step when combining the first object and the second object to change the properties of the first surface and the second surface so that the first object and the second object can be more tightly combined.

[0020] In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 The present invention is a flowchart of the steps of a method for making a double-object surface tenon joint according to an embodiment of the present invention.

[0022] Figure 2 The present invention is a flowchart of the steps of a method for making a double-object surface tenon joint according to an embodiment of the present invention.

[0023] Figure 3 The present invention is a flowchart of the steps of a method for making a double-object surface tenon joint according to an embodiment of the present invention.

[0024] Figure 4 It is a partial schematic diagram of the first surface of the first object in one embodiment of the utility model.

[0025] Figure 5 It is a partial schematic diagram of the first surface of the first object in one embodiment of the utility model.

[0026] Figure 6 It is a partial schematic diagram of the first surface of the first object in one embodiment of the utility model.

[0027] Figure 7 It is a partial schematic diagram of the first surface of the first object in one embodiment of the utility model.

[0028] Figure 8 It is a partial schematic diagram of the first surface of the first object in one embodiment of the utility model.

[0029] Fig. 9 It is a partial schematic diagram of the first surface of the first object in one embodiment of the utility model.

[0030] Fig.10 It is a schematic diagram of the combination of the first object and the second object in one embodiment of the utility model. DETAILED DESCRIPTION

[0031] The following is an explanation of the implementation method of the "method for making double-object surface mortise and tenon joints and double-object surface mortise and tenon joint structure" disclosed in the present utility model through specific embodiments. Those skilled in the art can understand the advantages and effects of the present utility model from the contents disclosed in this specification. The present utility model can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present utility model. In addition, the drawings of the present utility model are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following implementation methods will further explain the relevant technical contents of the present utility model in detail, but the disclosed contents are not intended to limit the scope of protection of the present utility model.

[0032] See also Figure 1 , see also Fig. 9 . Figure 1 1 is a flow chart of the steps of a method 100 for making a double-object surface joint according to an embodiment of the present invention. Fig. 9 Schematic diagram of the combination of the first object and the second object in one embodiment of the utility model. The method 100 for making a double-object surface joint includes steps S1 to S3. Step S1: Provide a first object 1, and make a plurality of first microstructures 111 on the first surface 11 of the first object 1 by a laser unit. Step S2: Provide a second object 2, and make a plurality of second microstructures 211 on the second surface 21 of the second object 2 by a laser unit. Step S3: Combine the first object 1 and the second object 2, and make the first surface 11 and the second surface 21 opposite to each other, and each first microstructure 111 and the corresponding second microstructure 211 are matched and connected with each other.

[0033] According to some embodiments, the first object 1 is a semiconductor, metal, plastic, glass or ceramic. The second object 2 is a semiconductor, metal, plastic, glass or ceramic. The first object 1 and the second object 2 can be the same or different materials. The aforementioned semiconductor is, for example, a silicon wafer. The aforementioned metal includes an alloy. The aforementioned "microstructure" has a unit size of micrometer level or nanometer level, and the utility model is not limited. For example, the unit size of each first microstructure 111 is 100 micrometers to 100 nanometers. The unit size of each second microstructure 211 is 100 micrometers to 100 nanometers.

[0034] According to some embodiments, a plurality of first microstructures 111 are located on the first surface 11 in a regular or irregular manner. A plurality of second microstructures 211 are located on the second surface 21 in a regular or irregular manner. For example, the first microstructures 111 are arranged in a periodic manner on the first surface 11, and the first microstructures 111 are like crests, and each crest has a gap. Similarly, the second microstructures 211 are also arranged in a periodic manner on the second surface 21, and the second microstructures 211 are like crests, and each crest has a gap, as described below and in the accompanying drawings for details. The plurality of first microstructures 111 may also be located on the first surface 11 in an irregular manner, for example, each first microstructure 111 is a spike of different sizes, distributed throughout the first surface 11 (see Figure 8 The plurality of second microstructures 211 may also be arranged on the second surface 21 in an irregular manner. The second microstructures 211 may also be spikes of different sizes distributed all over the second surface 21 .

[0035] The first microstructure 111 and the corresponding second microstructure 211 are matched and connected to each other, and can be concave-convex matching (see Fig. 9 ), for example, each first microstructure 111 is a convex structure or a concave structure, and each second microstructure 211 is a convex structure or a concave structure corresponding to the first microstructure 111. However, it can also refer to that a plurality of first microstructures 111 are directly connected to a plurality of second microstructures 211. They are closely combined at the microscopic level. According to some other embodiments, each first microstructure 111 is "plugged" or "embedded" in the interval between adjacent second microstructures 211. Vice versa, the present invention is not limited thereto.

[0036] See also Figure 2 , is a flowchart of the steps of a method 200 for making a double-object surface tenon joint according to an embodiment of the present invention. Figure 1 The difference between the illustrated embodiments is that after step S1, a first surface modification step S11 is further performed, in which the laser unit is used to modify the plurality of first microstructures 111 to soften the first surface 11. After step S2, a second surface modification step S21 is further performed, in which the laser unit is used to modify the plurality of second microstructures 211 to soften the second surface 21. According to some embodiments, the first surface modification step S11 and the second surface modification step S21 are performed using a femtosecond laser. In some applications, the surface modification step can improve the properties of the first object 1 and the second object 2. For example, the first object 1 is a metal or an alloy. After the surface modification step, the resistance of the first object 1 can be reduced and its electrical properties (such as conductivity) can be improved. Similarly, the surface properties of the second object 2 can also be changed by the surface modification step.

[0037] It should be noted that, in some embodiments, the surface modification step includes plating a metal layer of Ti / Cu, Ti / NiV / Ag or NiTi / Ag on the first surface 11 and the second surface 21, and the total thickness of these metal layers is about 1um. For example, taking Ti / Cu as an example, Ti is 0.1um and Cu is 0.6um. Taking Ti / NiV / Ag as an example, Ti is 0.1um, Ni is 0.3um, and Ag is 0.6um. Taking NiTi / Ag as an example, NiTi is 0.3um and Ag is 0.6um.

[0038] See also Figure 3 , is a flowchart of the steps of a method 300 for making a double-object surface tenon joint according to an embodiment of the present invention. Figure 1 The difference of the illustrated embodiment is that before step S3 , a first surface modification step S11 and a second surface modification step S21 are respectively performed to modify the plurality of first microstructures 111 and the plurality of second microstructures 211 by the laser unit to soften the first surface 11 and the second surface 21 .

[0039] It should be noted that, according to some embodiments, the aforementioned surface modification step may be performed only on a portion (local area) of the first surface 11 and the second surface 21. In other words, the manufacturer may perform surface modification on a specific area or part according to its needs.

[0040] See also Figures 4 to 9 , are partial schematic diagrams of the first surface 11 of the first object 1 in an embodiment of the present invention. It should be noted that the first surface 11 of the first object 1 is taken as an example here, however, the same microstructure can also be provided on the second surface 21 of the second object 2. The first microstructure 111 has a variety of shapes and can be arranged on the first surface 11 in a regular or irregular manner. The first microstructure 111 can be a convex structure or a concave structure. In these figures, it is a convex structure, however, it can also refer to a concave structure next to a convex structure, and the present invention is not limited thereto. Figure 4 and Figure 5 In the illustrated embodiment, the first microstructure 111 is a regularly arranged wave crest structure, the wave valleys of adjacent wave crest structures are connected, and the surface of the wave crest is an irregular shape. Figure 6 In the embodiment shown, the first microstructure 111 is a regularly arranged square pillar (extending in the transverse direction), and adjacent square pillars have a spacing L1. Figure 7 In the embodiment shown, the first microstructure 111 is a regularly arranged square block, and there is a gap L2 between adjacent square blocks. Figure 8 In the embodiment shown, the first microstructure 111 is irregularly arranged wave crests, and the height of each wave crest may be the same or different. Fig. 9In the illustrated embodiment, the first microstructure 111 is a regularly arranged triangular prism (extending laterally). In this embodiment, the second microstructure 211 is a concave structure corresponding to the triangular prism of the first microstructure 111. Thus, the first microstructure 111 and the second microstructure 211 can be connected in a corresponding matching manner.

[0041] Please refer to Fig.10 In this embodiment, the first microstructure 111 is a tower structure, and adjacent tower structures have spaces for the second microstructure 211 to connect. Fig.10 As shown, the second microstructure 211 is a triangular prism-like structure corresponding to the aforementioned spatial shape. It should be particularly noted that: Fig.10 The interface between the first microstructure 111 and the second microstructure 211 is shown. However, in actual operation, it is difficult to see the interface. In other words, the first object 1 and the second object 2 are tightly combined. In addition, the first microstructure 111 and the second microstructure 211 are made by a laser unit. According to some embodiments, the first microstructure 111 and the second microstructure 211 are also subjected to a surface modification process so that the first surface 11 and the second surface 21 can be tightly combined.

[0042] Beneficial effects of the embodiments:

[0043] One of the beneficial effects of the present invention is that the method for making a double-object surface tenon joint and the double-object surface tenon joint structure provided by the present invention can tightly combine the two objects through the technical solutions of "making a plurality of first microstructures on a first surface of the first object by a laser unit", "making a plurality of second microstructures on a second surface of the second object by the laser unit", and "combining the first object and the second object, making the first surface opposite to the second surface, and each first microstructure and the corresponding second microstructure match and connect with each other". According to some embodiments, the first object can be metal, plastic, glass or ceramic. The second object can be metal, plastic, glass or ceramic.

[0044] Furthermore, one of the beneficial effects of the present invention is that the method for making double-object surface mortise and tenon joints provided by the present invention also simultaneously performs a surface modification step when combining the first object and the second object to change the properties of the first surface and the second surface so that the first object and the second object can be more tightly combined.

[0045] The contents disclosed above are only preferred feasible embodiments of the present utility model, and are not intended to limit the protection scope of the claims of the present utility model. Therefore, all equivalent technical changes made using the contents of the present utility model specification and drawings are included in the protection scope of the claims of the present utility model.

Claims

1. A double-object surface mortise and tenon structure, characterized in that: The double-object surface mortise and tenon structure comprises: a first object, a first surface of the first object having a plurality of first microstructures, wherein the plurality of first microstructures are produced by a laser unit; a second object having a plurality of second microstructures on a second surface thereof, wherein the plurality of second microstructures are produced by two laser units; and The first object is combined with the second surface of the second object via the first surface, and each of the first microstructures is matched and connected with the corresponding second microstructure.

2. The double-object surface mortise and tenon structure according to claim 1, characterized in that: The plurality of first microstructures are located on the first surface in a regular or irregular manner; the plurality of second microstructures are located on the second surface in a regular or irregular manner.

3. The double-object surface mortise and tenon structure according to claim 1, characterized in that: Each of the first microstructures is a convex structure or a concave structure, and each of the second microstructures is a convex structure or a concave structure corresponding to the first microstructure.

4. The double-object surface mortise and tenon structure according to claim 1, characterized in that: The unit size of each of the first microstructures is 100 micrometers to 100 nanometers; the unit size of each of the second microstructures is 100 micrometers to 100 nanometers.

5. The double-object surface mortise and tenon structure according to claim 1, characterized in that: The first object is a semiconductor, a metal, a plastic, a glass or a ceramic; the second object is a semiconductor, a metal, a plastic, a glass or a ceramic.