Automatic edge grinding device for indium phosphide substrate slice

Abstract

The utility model discloses an automatic edge grinding device for an indium phosphide substrate slice, and relates to the technical field of semiconductor substrate material manufacturing. The automatic edge grinding device comprises a device main body, a feeding and discharging manipulator, an edge grinding mechanism and a feeding and discharging station; the at least two edge grinding mechanisms are mounted on the device main body; the at least two loading and unloading stations are mounted on the device main body; the loading and unloading manipulator is mounted on the device main body; the feeding and discharging mechanical arm is used for grabbing workpieces to be machined from the feeding and discharging station and conveying the workpieces to the edge grinding mechanism. The feeding and discharging mechanical arm is further used for grabbing the machined workpieces from the edge grinding mechanism and conveying the machined workpieces to the feeding and discharging station. The feeding and discharging mechanical arm can move between the at least two edge grinding mechanisms, the utilization rate of the feeding and discharging mechanical arm is increased, meanwhile, when manual feeding and discharging operation needs to be carried out on one feeding and discharging station, the feeding and discharging mechanical arm can still carry out feeding and discharging from the other feeding and discharging station, and therefore the whole device can operate normally and does not need to be stopped.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor substrate material manufacturing, and in particular to an automatic edge grinding device for an indium phosphide substrate sheet. Background Art

[0002] Indium phosphide substrates have an application market in the fields of manufacturing high-frequency and high-power devices, optical fiber communications, wireless transmission, radio astronomy and other RF devices. RF devices made using indium phosphide substrates have shown excellent performance in application scenarios such as satellites and radars. They are highly competitive in the RF front end of radar and communication systems, analog / mixed signal wide-bandwidth circuits, and are suitable for applications such as high-speed data processing and high-precision wide-bandwidth A / D conversion. In addition, indium phosphide-based RF device-related devices such as low-noise amplifiers, modules and receivers are also widely used in satellite communications, millimeter-wave radars, active and passive millimeter-wave imaging and other equipment. At bandwidth levels above 100 GHz, the use of indium phosphide-based RF devices has obvious advantages in wireless transmission in backhaul networks and point-to-point communication networks. In the future, in 6G communication and even 7G communication wireless transmission networks, indium phosphide substrates are expected to become the mainstream substrate material for RF devices. Therefore, how to improve the manufacturing process of indium phosphide substrates has also become an important research and development direction for manufacturers.

[0003] The edge grinding process is a part of the manufacturing process of indium phosphide substrates. The current edge grinding process is a single robot equipped with a set of edge grinding mechanisms. The robot needs to wait for the edge grinding mechanism to operate, resulting in low utilization rate. In addition, the loading and unloading stations of the existing edge grinding process are also single stations. The equipment needs to be stopped during loading and unloading, thereby reducing operating efficiency. Utility Model Content

[0004] In view of this, the purpose of the present application is to provide an automatic edge grinding device for an indium phosphide substrate sheet to solve the technical problems of low robot utilization and low operating efficiency in the existing edge grinding process.

[0005] In order to achieve the above technical purpose, the present application provides an automatic edge grinding device for an indium phosphide substrate sheet, comprising a device body, a loading and unloading manipulator, an edge grinding mechanism, and a loading and unloading station;

[0006] There are at least two edge grinding mechanisms installed on the device body;

[0007] There are at least two loading and unloading stations installed on the device body;

[0008] The loading and unloading manipulator is installed on the device body;

[0009] The loading and unloading manipulator is used to grab the workpiece to be processed from the loading and unloading station and transport it to the edge grinding mechanism;

[0010] The loading and unloading manipulator is also used to grab the processed workpiece from the edge grinding mechanism and transport it to the loading and unloading station.

[0011] Furthermore, the edge grinding mechanism includes an edge grinder and a rotating table;

[0012] The rotating table is used to fix the workpiece conveyed by the loading and unloading robot and drive the workpiece to rotate;

[0013] The edge grinder is arranged on one side of the rotating table and performs edge grinding on the workpiece on the rotating table.

[0014] Furthermore, there are two edge grinders.

[0015] Furthermore, the edging mechanism also includes a visual device and a control device;

[0016] The visual device is used to detect the actual grinding size of the workpiece in real time and provide feedback to the control device;

[0017] The control device is used to control the operation of the edge grinding mechanism based on the grinding size fed back by the visual device, so that the workpiece reaches the target grinding size.

[0018] Furthermore, the edge grinder comprises a three-axis displacement mechanism, an edge grinding motor and an edge grinding wheel;

[0019] The three-axis displacement mechanism is connected to the edge grinding motor to drive the edge grinding motor to move;

[0020] The output shaft of the edge grinding motor is connected to the edge grinding wheel to drive the edge grinding wheel to rotate.

[0021] Furthermore, a plurality of the edge grinding mechanisms are arranged in an array along a straight line.

[0022] Furthermore, the loading and unloading robot comprises a linear drive mechanism and a robot body;

[0023] The linear drive mechanism is connected to the manipulator body and is used to drive the manipulator body to move along the array direction of the edge grinding mechanism;

[0024] The end of the manipulator body is connected to a U-shaped fork claw for picking up workpieces;

[0025] The fork claws are provided with vacuum adsorption holes.

[0026] Furthermore, a support plate is provided below the table top of the device body;

[0027] The linear drive mechanism is mounted on the support plate;

[0028] An avoidance slot is provided on the table surface of the device body for the robot body to extend and move.

[0029] Furthermore, the edge grinding mechanism is arranged on the table of the device body and arranged on one side of the avoidance slot along the width direction of the avoidance slot;

[0030] The two loading and unloading stations are arranged on the table of the device body and are arranged on both sides of the avoidance slot along the length direction of the avoidance slot.

[0031] Furthermore, the loading and unloading station includes a loading support frame and a unloading support frame;

[0032] The loading support frame and the unloading support frame are arranged in an array.

[0033] It can be seen from the above technical solutions that the automatic edge grinding device for indium phosphide substrate sheets designed in this application has at least two edge grinding devices, and enables the loading and unloading manipulator to move between at least two edge grinding mechanisms. When one edge grinding mechanism is loaded, the next edge grinding mechanism can be loaded, thereby improving the utilization rate of the loading and unloading manipulator. At the same time, there are two loading and unloading stations. When manual loading and unloading operations are required at one loading and unloading station, the loading and unloading manipulator can still load and unload from another loading and unloading station, so that the device can operate normally as a whole without stopping, and the possibility of the manipulator causing harm to the operator is eliminated, thereby solving the technical problems of low utilization rate and low operating efficiency of the manipulator in the existing edge grinding process. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0035] Figure 1 A three-dimensional diagram of an automatic edge grinding device for an indium phosphide substrate provided in the present application;

[0036] Figure 2 A three-dimensional diagram of an edge grinding mechanism of an automatic edge grinding device for an indium phosphide substrate provided in the present application;

[0037] Figure 3 A three-dimensional diagram of an edge grinder of an automatic edge grinding device for an indium phosphide substrate provided in the present application;

[0038] Figure 4A three-dimensional diagram of the cooperation between the loading and unloading manipulator and the device body of an indium phosphide substrate automatic edge grinding device provided in the present application;

[0039] In the figure: 1. Device body; 11. Avoidance slot; 2. Edge grinding mechanism; 21. Edge grinder; 210. Three-axis displacement mechanism; 211. Vertical linear displacement module; 212. First horizontal linear displacement module; 213. Second horizontal linear displacement module; 214. Edge grinding motor; 215. Edge grinding wheel; 22. Rotating table; 23. Visual device; 3. Loading and unloading manipulator; 31. Linear drive mechanism; 32. Manipulator body; 321. Fork claw; 322. Main rotating motor; 323. First swing arm; 324. Second swing arm; 325. First joint servo; 326. Second joint servo; 4. Loading and unloading station; 41. Unloading support frame; 42. Loading support frame; 5. Workpiece. DETAILED DESCRIPTION

[0040] The technical solutions of the embodiments of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, not all of them. All other embodiments obtained by ordinary technicians in this field without creative work based on the embodiments in the embodiments of the present application are within the scope of protection of the embodiments of the present application.

[0041] In the description of the embodiments of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0042] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a replaceable connection, or an integral connection, it can be a mechanical connection, it can be an electrical connection, it can be a direct connection, it can be indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0043] The embodiment of the present application discloses an automatic edge grinding device for an indium phosphide substrate sheet.

[0044] See also Figure 1An embodiment of an automatic edge grinding device for an indium phosphide substrate provided in the embodiments of the present application includes:

[0045] The device comprises a main body 1, a loading and unloading manipulator 3, an edge grinding mechanism 2 and a loading and unloading station 4.

[0046] At least two edge grinding mechanisms 2 are installed on the device body 1 .

[0047] At least two loading and unloading stations 4 are installed on the device body 1 .

[0048] The loading and unloading robot 3 is installed on the device body 1. The loading and unloading robot 3 is used to grab the workpiece 5 to be processed from the loading and unloading station 4 and transport it to the edge grinding mechanism 2. The loading and unloading robot 3 is also used to grab the processed workpiece 5 from the edge grinding mechanism 2 and transport it to the loading and unloading station 4.

[0049] The automatic edge grinding device for indium phosphide substrate sheets designed in the present application has at least two edge grinding devices, and enables the loading and unloading manipulator 3 to move between at least two edge grinding mechanisms 2. When one edge grinding mechanism 2 is loaded, the next edge grinding mechanism 2 can be loaded, thereby improving the utilization rate of the loading and unloading manipulator 3. At the same time, there are two loading and unloading stations 4. When one loading and unloading station 4 needs to be manually loaded and unloaded, the loading and unloading manipulator 3 can still load and unload from another loading and unloading station 4, so that the device can operate normally as a whole without stopping, and the possibility of the manipulator causing harm to the operator is eliminated, thereby solving the technical problems of low utilization rate and low operation efficiency of the manipulator in the existing edge grinding process.

[0050] During operation, the loading and unloading robot 3 grabs the workpiece 5 from the loading and unloading station 4 and transports it to the edge grinding mechanism 2, and then the edge grinding mechanism 2 grinds the workpiece 5. After the edge grinding is completed, the workpiece 5 is transported back to the loading and unloading station 4 by the loading and unloading robot to realize automated edge grinding operation.

[0051] The above is an embodiment of the present invention provided by the embodiment of an indium phosphide substrate sheet automatic edge grinding device. The following is an embodiment of the present invention provided by the embodiment of an indium phosphide substrate sheet automatic edge grinding device. For details, please refer to Figures 1 to 4 .

[0052] Based on the solution of the above embodiment 1:

[0053] Furthermore, if Figure 2 As shown, the edge grinding mechanism 2 includes an edge grinder 21 and a rotating platform 22 .

[0054] The rotating table 22 is arranged vertically, that is, in the Z-axis direction, and is used to fix the workpiece 5 transported by the loading and unloading robot 3 and drive the workpiece 5 to rotate along the Z-axis; the rotating table 22 is an existing vacuum adsorption turntable design structure, which has a vacuum adsorption table surface, which is used to adsorb the workpiece 5 and can drive the workpiece 5 to rotate, and the details are not repeated here.

[0055] The edge grinder 21 is disposed on one side of the rotating table 22 and performs edge grinding on the workpiece 5 on the rotating table 22 . The workpiece 5 referred to in the present application is also an indium phosphide substrate sheet.

[0056] Furthermore, if Figure 2 As shown, the edge grinder 21 of the present application is designed as two. The double edge grinder 21 design can further improve the grinding effect, and it can also be designed that one edge grinder 21 is used to grind the upper edge of the workpiece 5 on the rotating table 22, and the other edge grinder 21 is used to grind the lower edge of the workpiece 5 on the rotating table 22, and the two edge grinders 21 are respectively arranged at the two sides of the rotating table 22. Of course, those skilled in the art can make changes in design as needed, and there is no specific limitation.

[0057] Furthermore, the edge grinding mechanism 2 also includes a visual device 23 and a control device.

[0058] The visual device 23 is used to detect the actual grinding size of the workpiece 5 in real time and provide feedback to the control device;

[0059] The control device controls the edge grinding mechanism 2 to operate based on the grinding size fed back by the visual device 23 , so that the workpiece 5 reaches the target grinding size. The control device is electrically connected to the visual device 23 , the edge grinder 21 and the rotary table 22 .

[0060] Taking the example that each edge grinding mechanism 2 is equipped with two edge grinders 21 , two corresponding visual devices 23 are also configured. It can be understood that each edge grinder 21 is correspondingly configured with one visual device 23 .

[0061] The visual device 23 may be a CCD camera, which obtains the image information of the workpiece 5 and determines the positioning size and the outer size of the workpiece according to the image information, and then determines the grinding size according to the positioning size and the outer size and feeds back to the control device. The control device controls the edge grinder 21 to operate according to the detected actual grinding size until the workpiece 5 reaches the target grinding size / target size to achieve the required grinding effect. After grinding, the edge grinder 21 is controlled to operate so that the edge grinding wheel 215 is away from the workpiece 5, and the operation of the rotary table 22 is stopped. It can be understood that by setting the visual device 23 to detect the actual grinding size of the workpiece 5 in real time and feed back to the control device, the control device compares the actual grinding size with the target grinding size, and controls the operation and adjustment of the edge grinder 21 according to the comparison, so as to realize the precise online closed-loop control of the grinding of the workpiece 5 and ensure the grinding accuracy.

[0062] Furthermore, if Figure 3 As shown, the edge grinder 21 includes a three-axis displacement mechanism 210 , an edge grinding motor 214 and an edge grinding wheel 215 .

[0063] The three-axis displacement mechanism 210 is connected to the edge grinding motor 214 to drive the edge grinding motor 214 to achieve three-axis movement.

[0064] The edge grinding motor 214 is a servo motor, and its output shaft is connected to the edge grinding wheel 215 to drive the edge grinding wheel 215 to rotate. The edge grinding wheel 215 is a grinding wheel.

[0065] Specifically, the three-axis displacement mechanism 210 includes a vertical linear displacement module 211, a first horizontal linear displacement module 212, and a second horizontal linear displacement module 213; the vertical linear displacement module 211 is connected to the first horizontal linear displacement module 212, and is used to drive the first horizontal linear displacement module 212 to move vertically, that is, to achieve movement in the Z-axis direction; the first horizontal linear displacement module 212 is connected to the second horizontal linear displacement module 213, and is used to drive the second horizontal linear displacement module 213 to move along the first horizontal linear direction, that is, to achieve movement in the Y-axis direction; and the second horizontal linear displacement module 213 is connected to the edge grinding motor 214, and is used to drive the edge grinding motor 214 to move along the second horizontal linear direction perpendicular to the first horizontal linear direction, that is, to achieve movement in the Z-axis direction, so as to achieve three-axis control of the edge grinding motor 214. The first horizontal linear displacement module 212 and the second horizontal linear displacement module 213 can be linear slides, and the vertical linear displacement module 211 can be a lifting cylinder, etc., which is not specifically limited.

[0066] Specifically, the control device controls the three-axis displacement mechanism 210 to adjust the grinding position according to the feedback data of the visual device 23, thereby realizing accurate control of the grinding size of the workpiece 5. The control device can be a PLC control module, a microprocessor or other control module, which is not specifically limited.

[0067] The present application adopts a three-axis displacement mechanism 210 design, which can flexibly adjust the edge grinding wheel 215, thereby improving the flexibility and efficiency of edge grinding.

[0068] In the present application, the rotation center line of the edge grinding wheel 215 can be set parallel to the second horizontal straight line direction, or set at an angle thereto. Of course, according to actual needs, a pitch angle adjustment mechanism (not shown in the figure) can be added, and the second horizontal straight line displacement module 212 is connected to the pitch angle adjustment mechanism, and the pitch angle adjustment mechanism is connected to the edge grinding motor 214 to adjust the pitch angle of the edge grinding motor 214, so that the position adjustment of the edge grinding wheel 215 is more diversified and more applicable. The pitch angle mechanism can include a pitch angle motor and a swing frame, the swing frame is connected to the output shaft of the pitch angle motor, and swings under the drive of the pitch angle motor, and the edge grinding motor 214 is installed on the swing frame, and the pitch angle motor can be a conventional servo motor.

[0069] Furthermore, if Figure 1 As shown, a plurality of edge grinding mechanisms 2 are arranged in an array along a straight line direction to improve the compactness of the overall device structure. The number of edge grinding mechanisms 2 can be designed to be 4, and there is no specific limitation.

[0070] Furthermore, if Figure 4 As shown, the design of the loading and unloading robot 3 includes a linear drive mechanism 31 and a robot body 32,

[0071] The linear drive mechanism 31 may be a linear motor, which is connected to the manipulator body 32 and is used to drive the manipulator body 32 to move along the array direction of the edge grinding mechanism 2 to make up for the insufficient displacement of the manipulator body 32 in the operating radius.

[0072] The end of the robot body 32 is connected to a U-shaped fork claw 321 for picking up the workpiece 5, and a vacuum adsorption hole is provided on the fork claw 321. The workpiece 5 is picked up by insertion, and then the workpiece 5 is adsorbed and fixed by the vacuum adsorption hole to prevent the workpiece 5 from falling during transfer. Of course, it can also be an electric clamping claw structure to pick up the workpiece 5 by clamping. The vacuum adsorption hole is connected to a vacuum pump, and the details are not repeated.

[0073] For the manipulator body 32, it can be a conventional multi-axis manipulator structure, for example, including a main rotating motor 322, a first swing arm 323, a first joint servo 325, a second swing arm 324 and a second joint servo 326. The main rotating motor 322 is connected to the first swing arm 323 to drive the first swing arm 323 to rotate. The first swing arm 323 is connected to the second swing arm 324 through the first joint servo 325 to drive the second swing arm 324 to rotate. The second swing arm 324 is connected to the fork claw 321 through the second joint servo 326 to drive the fork claw 321 to rotate. The details are not repeated here.

[0074] Furthermore, if Figure 4As shown, the device body 1 can be designed as a table, with a support plate provided under the table, the linear drive mechanism 31 is installed on the support plate, and an avoidance slot 11 is provided on the table for the manipulator body 32 to extend and move. Under this design, the vertical height of the entire device can be reduced, making the entire device more compact.

[0075] Furthermore, if Figure 1 As shown, the edge grinding mechanism 2 is arranged on the table of the device body 1 and arranged on one side of the avoidance slot 11 along the width direction of the avoidance slot 11; two loading and unloading stations 4 are arranged on the table of the device body 1 and arranged on both sides of the avoidance slot 11 along the length direction of the avoidance slot 11. With the above arrangement, the overall structure is more compact.

[0076] Furthermore, with respect to the design of the loading and unloading station 4, it includes a loading support frame 42 and a unloading support frame 41. The loading support frame 42 and the unloading support frame 41 are arranged in an array. The loading support frame 42 is used to place the workpiece 5 to be processed, and the unloading support frame 41 is used to place the processed workpiece 5.

[0077] The above is a detailed introduction to an automatic edge grinding device for an indium phosphide substrate provided by the present application. For a person skilled in the art, according to the idea of ​​the embodiments of the present application, there may be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. An automatic edge grinding device for an indium phosphide substrate sheet, characterized in that: It comprises a device body (1), a loading and unloading manipulator (3), an edge grinding mechanism (2) and a loading and unloading station (4); At least two of the edge grinding mechanisms (2) are installed on the device body (1); There are at least two loading and unloading stations (4), which are installed on the device body (1); The loading and unloading robot (3) is installed on the device body (1); The loading and unloading manipulator (3) is used to grab the workpiece (5) to be processed from the loading and unloading station (4) and transport it to the edge grinding mechanism (2); The loading and unloading manipulator (3) is also used to grab the processed workpiece (5) from the edge grinding mechanism (2) and transport it to the loading and unloading station (4).

2. The automatic edge grinding device for an indium phosphide substrate sheet according to claim 1, characterized in that: The edge grinding mechanism (2) comprises an edge grinder (21) and a rotating table (22); The rotating table (22) is used to fix the workpiece (5) transported by the loading and unloading robot (3) and drive the workpiece (5) to rotate; The edge grinder (21) is arranged on one side of the rotating table (22) and performs edge grinding on the workpiece (5) on the rotating table (22).

3. The automatic edge grinding device for an indium phosphide substrate sheet according to claim 2, characterized in that: There are two edge grinders (21).

4. An automatic edge grinding device for an indium phosphide substrate sheet according to claim 2 or 3, characterized in that: The edge grinding mechanism (2) further comprises a visual device (23) and a control device; The visual device (23) is used to detect the actual grinding size of the workpiece (5) in real time and provide feedback to the control device; The control device is used to control the operation of the edge grinding mechanism (2) based on the actual grinding size fed back by the visual device (23), so that the workpiece (5) reaches the target grinding size.

5. The automatic edge grinding device for an indium phosphide substrate sheet according to claim 2, characterized in that: The edge grinder (21) comprises a three-axis displacement mechanism (210), an edge grinding motor (214) and an edge grinding wheel (215); The three-axis displacement mechanism (210) is connected to the edge grinding motor (214) to drive the edge grinding motor (214) to move; The output shaft of the edge grinding motor (214) is connected to the edge grinding wheel (215) to drive the edge grinding wheel (215) to rotate.

6. The automatic edge grinding device for an indium phosphide substrate sheet according to claim 1, characterized in that: The plurality of edge grinding mechanisms (2) are arranged in an array along a straight line.

7. The automatic edge grinding device for an indium phosphide substrate sheet according to claim 6, characterized in that: The loading and unloading robot (3) comprises a linear drive mechanism (31) and a robot body (32); The linear drive mechanism (31) is connected to the manipulator body (32) and is used to drive the manipulator body (32) to move along the array direction of the edge grinding mechanism (2); A U-shaped fork claw (321) for picking up a workpiece (5) is connected to the end of the robot body (32); The fork claw (321) is provided with a vacuum adsorption hole.

8. The automatic edge grinding device for an indium phosphide substrate sheet according to claim 7, characterized in that: A support plate is provided below the table top of the device body (1); The linear drive mechanism (31) is mounted on the support plate; The table top of the device body (1) is provided with an avoidance slot (11) for the manipulator body (32) to extend and move.

9. The automatic edge grinding device for an indium phosphide substrate sheet according to claim 8, characterized in that: The edge grinding mechanism (2) is arranged on the table surface of the device body (1), and is arranged on one side of the avoidance slot (11) along the width direction of the avoidance slot (11); The two loading and unloading stations (4) are arranged on the table of the device body (1), and are arranged on both sides of the avoidance slot (11) along the length direction of the avoidance slot (11).

10. The automatic edge grinding device for an indium phosphide substrate sheet according to claim 1, characterized in that: The loading and unloading station (4) comprises a loading support frame (42) and a unloading support frame (41); The loading support frame (42) and the unloading support frame (41) are arranged in an array.

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