Circuit board vertical blanking device based on buffer structure

Abstract

The utility model discloses a circuit board vertical blanking device based on a buffer structure, and the device comprises a workbench which is a hollow square housing, and the surface of the workbench is provided with an opening 1 in an embedded manner. A lower mold is fixedly connected to the surface of the workbench, side plates are symmetrically and fixedly connected to the surface of the lower mold, a second opening is formed in the surface of the lower mold in an embedded mode, a connecting frame is fixedly connected to the surface of the workbench, a second air cylinder is installed on the surface of the connecting frame, and a connecting plate is connected to the tail end of the second air cylinder. According to the circuit board vertical discharging device based on the buffer structure, the pressing mechanism is arranged to buffer the circuit board and prevent the circuit board from being damaged, the second air cylinder drives the upper die and the buffer ring to move downwards, at the moment, the buffer ring makes contact with the surface of the circuit board firstly, impact of the upper die on the circuit board is reduced, and the working efficiency is improved; chippings generated by blowing of air in the air bag fall down and fall into the collecting box.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board production, in particular to a circuit board vertical unloading device based on a buffer structure. Background Art

[0002] A circuit board is an electronic device. A circuit board can be called a printed circuit board or a printed circuit board. A circuit board is a PCB board without electronic components. It is a type of circuit board used for the connection and layout of electronic components. Circuit boards are divided into three major categories according to the number of layers: single-sided boards, double-sided boards, and multi-layer circuit boards. At the same time, circuit boards are mainly composed of pads, vias, mounting holes, wires, components, electrical boundaries, etc. When punching and grooving the circuit board, the surface of the circuit board cannot be buffered, which can easily cause damage to the circuit board. It is inconvenient to use, and it is not convenient to unload the debris generated by the circuit board, and it is not convenient to process the circuit board later. Utility Model Content

[0003] The purpose of the utility model is to provide a vertical unloading device for circuit boards based on a buffer structure, so as to solve the problems proposed in the above background technology that the surface of the circuit board cannot be buffered, which easily leads to damage of the circuit board, is inconvenient to use, is inconvenient to unload the debris generated by the circuit board, and is inconvenient for subsequent processing of the circuit board.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a circuit board vertical unloading device based on a buffer structure, comprising a workbench configured as a hollow square shell, and an opening 1 is embedded in the surface of the workbench;

[0005] The surface of the workbench is fixedly connected to the lower mold, and the surface of the lower mold is symmetrically fixedly connected to the side plate, and the surface of the lower mold is embedded with a second opening, the surface of the workbench is fixedly connected to a connecting frame, and the surface of the connecting frame is equipped with a second cylinder, the end of the second cylinder is connected to a connecting plate, and the bottom of the connecting plate is fixedly connected to the upper mold;

[0006] A pressing mechanism is provided inside the workbench, and the pressing mechanism includes: a spring is fixedly connected to the bottom of the connecting plate, and a buffer ring is fixedly connected to the other end of the spring, a collecting box is slidably connected to the inside of the workbench, a shift rod 1 is fixedly connected to the surface of the connecting plate, a cavity is embedded in the interior of the workbench, and a shift rod 2 is slidably connected to the inside of the cavity, and the end of the shift rod 2 passes through the surface of the workbench, a shift plate is installed on the inner bottom surface of the cavity, and an air bag is fixedly connected to the surface of the shift plate, and a nozzle is installed on the surface of the air bag.

[0007] Preferably, a moving mechanism is provided on the surface of the workbench, and the moving mechanism includes: a cylinder 1 is installed on the surface of the workbench, and the end of the cylinder 1 is fixedly connected to a baffle, the bottom of the baffle is in contact with the surface of the workbench, and the surface of the baffle is symmetrically fixedly connected to a receiving plate, and the end of the receiving plate is embedded in the surface of the lower mold, the surface of the baffle is symmetrically fixedly connected to a rack, and the surface of the rack is fixedly connected to a slider, one end of the slider is embedded in the surface of the side plate, an electromagnet is installed on the surface of the side plate, and the end of the electromagnet is inserted into the surface of the slider, a gear is rotatably installed on the surface of the side plate, and a screw is arranged inside the gear, the end of the screw passes through the side plate to connect to a limit block, and the surface of the limit block is embedded with a pressure sensor.

[0008] By adopting the above technical solution, the moving mechanism loads the circuit board and drives the circuit board to move to the inside of the lower mold.

[0009] Preferably, the lower mold is arranged correspondingly to the position of the upper mold, the lower mold is arranged correspondingly to the position of opening one, and opening one is through-connected with opening two, and opening one is arranged correspondingly to the position of the collection box.

[0010] By adopting the above technical solution, the upper mold moves downward, so that the upper mold presses the circuit board downward, and the circuit board moves to the inside of the lower mold to groove the circuit board.

[0011] Preferably, the baffle is slidably connected to the workbench, the receiving plate is slidably connected to the lower mold, the positions of the rack and the gear are correspondingly arranged, and the gear and the rack are meshingly connected, the gear is provided with a thread inside, and the gear and the screw are threadedly connected, and the ends of the two limit blocks are correspondingly arranged.

[0012] By adopting the above technical solution, the cylinder drives the baffle to move on the surface of the workbench, and the baffle drives the circuit board to move through the receiving plate.

[0013] Preferably, the slider is slidably connected to the side plate, and the slider is slidably connected to the electromagnet.

[0014] By adopting the above technical solution, the air cylinder drives the slider to move up and down inside the side plate, and the second air cylinder drives the slider to move more inside the side plate.

[0015] Preferably, the ends of the shift rod 1 and the shift rod 2 are both configured as L-shaped structures, and the ends of the shift rod 1 and the shift rod 2 are configured as arc-shaped planes, and the arc-shaped structures of the shift rod 1 and the shift rod 2 are configured correspondingly.

[0016] By adopting the above technical solution, the upward movement of the first shift rod drives the second shift rod to move upward, so that the second shift rod squeezes the airbag and ejects the gas inside the airbag.

[0017] Preferably, the second shift rod is slidably connected to the workbench, and the end of the nozzle is arranged inside the first opening.

[0018] By adopting the above technical solution, the second shift rod presses the airbag downward, and the gas inside the airbag is ejected through the nozzle.

[0019] Compared with the prior art, the utility model has the following beneficial effects: the circuit board vertical unloading device based on the buffer structure:

[0020] 1. A pressing mechanism is set up to buffer it and prevent the circuit board from being damaged. The second cylinder drives the upper mold and the buffer ring to move downward. At this time, the buffer ring first contacts the surface of the circuit board to reduce the impact of the upper mold on the circuit board and improve work efficiency. When the airbag is squeezed, the gas inside the airbag blows the debris to fall down and fall into the collection box;

[0021] 2. A moving mechanism is set up to fix the circuit board on the surface of the lower mold to prevent the lower mold from shifting during pressing. The cylinder drives the circuit board to move through the baffle to load the material. At the same time, the rack drives the gear to move, and the output wheel drives the limit block to move inward through the screw rod. The circuit board is clamped by the limit block to prevent the circuit board from shifting. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0023] Figure 2 This is a schematic diagram of the three-dimensional structure of the lower mold installation of the utility model;

[0024] Figure 3 This is a schematic diagram of the three-dimensional structure of the installation of the receiving plate of the utility model;

[0025] Figure 4 This is a schematic diagram of the three-dimensional structure of the collection box installed in the utility model;

[0026] Figure 5 This is a schematic diagram of the installation structure of the opening 1 and the opening 2 of the utility model;

[0027] Figure 6 It is a schematic diagram of the three-dimensional structure of the rack installation of the utility model.

[0028] In the figure: 10, workbench; 101, opening 1;

[0029] 20, lower mold; 201, side plate; 202, opening 2;

[0030] 30, cylinder 1; 301, baffle; 302, receiving plate; 303, rack; 304, slider; 305, electromagnet; 306, gear; 307, screw rod; 308, pressure sensor; 309, limit block;

[0031] 40, connecting frame; 401, cylinder 2; 402, connecting plate; 403, upper mold;

[0032] 50. Spring; 501. Buffer ring; 502. Collecting box; 503. Shift rod 1; 504. Cavity; 505. Shift rod 2; 506. Shift plate; 507. Air bag; 508. Nozzle. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0034] See also Figure 1-6 The utility model provides a technical solution: a circuit board vertical unloading device based on a buffer structure, including a workbench 10, an opening 101, a lower mold 20, a side plate 201, an opening 202, a cylinder 1 30, a baffle 301, a receiving plate 302, a rack 303, a slider 304, an electromagnet 305, a gear 306, a screw rod 307, a pressure sensor 308, a limit block 309, a connecting frame 40, a cylinder 2 401, a connecting plate 402, an upper mold 403, a spring 50, a buffer ring 501, a collection box 502, a shift rod 1 503, a cavity 504, a shift rod 2 505, a shift plate 506, an air bag 507 and a nozzle 508;

[0035] The circuit board vertical unloading device fixes the position of the circuit board, and the specific implementation method is as follows:

[0036] The surface of the workbench 10 is provided with a moving mechanism, which includes: a cylinder 30 is installed on the surface of the workbench 10, and the end of the cylinder 30 is fixedly connected to a baffle 301, the bottom of the baffle 301 is in contact with the surface of the workbench 10, and the surface of the baffle 301 is symmetrically fixedly connected to a receiving plate 302, and the end of the receiving plate 302 is embedded in the surface of the lower mold 20, the surface of the baffle 301 is symmetrically fixedly connected to a rack 303, and the surface of the rack 303 is fixedly connected to a slider 304, one end of the slider 304 is embedded in the surface of the side plate 201, an electromagnet 305 is installed on the surface of the side plate 201, and the end of the electromagnet 305 is inserted into the surface of the slider 304, and a gear 306 is rotatably installed on the surface of the side plate 201, and the gear 306 A screw rod 307 is arranged inside, and the end of the screw rod 307 passes through the side plate 201 to connect to the limit block 309, and a pressure sensor 308 is embedded on the surface of the limit block 309, the lower mold 20 is arranged corresponding to the position of the upper mold 403, the lower mold 20 is arranged corresponding to the position of the opening 101, and the opening 101 is connected with the through connection, the opening 101 is arranged corresponding to the position of the collection box 502, the baffle 301 is slidably connected to the workbench 10, the receiving plate 302 is slidably connected to the lower mold 20, the rack 303 is arranged corresponding to the position of the gear 306, and the gear 306 is meshed with the rack 303, the gear 306 is arranged with a thread inside, and the gear 306 is threadedly connected to the screw rod 307, and the ends of the two limit blocks 309 are arranged correspondingly.

[0037] Place the circuit board on the surface of the receiving plate 302 so that one end of the circuit board fits with the surface of the baffle 301, start the cylinder 30, and the cylinder 30 drives the baffle 301 to move on the surface of the workbench 10. The baffle 301 drives the circuit board on the surface to move to the surface of the lower mold 20 through the receiving plate 302. At the same time, the baffle 301 drives the rack 303 to move, and the rack 303 drives the slider 304 to move on the surface of the side plate 201. At this time, the circuit board moves between the two circuit boards, and the rack 303 drives the gear 306 to rotate on the surface of the side plate 201. The bottom of the limit block 309 fits with the surface of the lower mold 20. At this time, the screw rod 307 moves inward along the internal thread of the gear 306, and the screw rod 307 drives the limit block 309 to move inward, so that the limit The block 309 is fitted on the surface of the lower mold 20. When the ends of the two limit blocks 309 are fitted with the surface of the circuit board, the limit blocks 309 squeeze the circuit board inward to straighten the circuit board and prevent the circuit board from shifting. At this time, extrusion is formed between the circuit board and the limit blocks 309. The surface of the limit blocks 309 contacts the pressure sensor 308. At this time, the two pressure sensors 308 receive pressure, and the pressure sensor 308 turns on the electromagnet 305. The electromagnet 305 is energized, and the electromagnet 305 pushes the slider 304 to move downward on the surface of the side plate 201. The slider 304 drives the rack 303 to move downward, so that the rack 303 loses engagement with the gear 306. At this time, the position of the limit block 309 is fixed, and circuit boards of different sizes can be fixed.

[0038] The circuit board vertical unloading device buffers the circuit board to prevent damage to the circuit board and facilitates unloading. The specific implementation method is as follows:

[0039] The workbench 10 is configured as a hollow square shell, and an opening 101 is embedded in the surface of the workbench 10, a lower mold 20 is fixedly connected to the surface of the workbench 10, and a side plate 201 is symmetrically fixedly connected to the surface of the lower mold 20, and an opening 202 is embedded in the surface of the lower mold 20, a connecting frame 40 is fixedly connected to the surface of the workbench 10, and a cylinder 2 401 is installed on the surface of the connecting frame 40, a connecting plate 402 is connected to the end of the cylinder 2 401, and an upper mold 403 is fixedly connected to the bottom of the connecting plate 402; a pressing mechanism is provided inside the workbench 10, and the pressing mechanism includes: a spring 50 is fixedly connected to the bottom of the connecting plate 402, and a buffer ring 501 is fixedly connected to the other end of the spring 50, a collecting box 502 is slidably connected to the inside of the workbench 10, and the surface of the connecting plate 402 is fixedly connected There is a shift rod 503, a cavity 504 is embedded in the interior of the workbench 10, and a shift rod 505 is slidably connected to the interior 1 of the cavity 504, and the end of the shift rod 505 passes through the surface of the workbench 10, a shift plate 506 is installed on the inner bottom surface of the cavity 504, and an air bag 507 is fixedly connected to the surface of the shift plate 506, and a nozzle 508 is installed on the surface of the air bag 507, the slider 304 is slidably connected to the side plate 201, and the slider 304 is slidably connected to the electromagnet 305, the ends of the shift rod 1 503 and the shift rod 2 505 are both set to L-shaped structures, and the ends of the shift rod 1 503 and the shift rod 2 505 are set to arc planes, and the arc structures of the shift rod 1 503 and the shift rod 2 505 are set correspondingly, the shift rod 2 505 is slidably connected to the workbench 10, and the end of the nozzle 508 is set inside the opening 101.

[0040] When the circuit board moves to between the lower mold 20 and the upper mold 403, the cylinder 2 401 is started, and the end of the cylinder 2 401 drives the connecting plate 402 to move downward, and the connecting plate 402 drives the upper mold 403 and the buffer ring 501 to move downward, and the connecting plate 402 drives the shift rod 1 503 to move downward, so that the shift rod 1 503 and the shift rod 2 505 lose engagement. At this time, the shift rod 2 505 automatically falls due to gravity, and the squeezing of the airbag 507 by the shift rod 2 505 disappears. The bottom of the buffer ring 501 first contacts the surface of the circuit board. At this time, the cylinder 2 401 continues to drive the connecting plate 402 to move in detail, and the connecting plate 402 drives the upper mold 403 to move downward. At this time, the spring 50 is squeezed and contracted, and the upper mold 403 continues to move downward, so that the bottom of the upper mold 403 moves to the inside of the opening of the lower mold 20, and the circuit board is squeezed and slotted.

[0041] When the circuit board is slotted, Figure 4The end of the cylinder 2 401 drives the connecting plate 402 to move upward, and the connecting plate 402 drives the upper mold 403 to be taken out from the lower mold 20. At the same time, the connecting plate 402 drives the shift rod 1 503 to move upward, and the shift rod 1 503 drives the shift rod 2 505 to move upward inside the workbench 10. The shift rod 2 505 drives the shift plate 506 to move upward, and the end of the shift plate 506 squeezes the airbag 507. The gas inside the airbag 507 is ejected through the nozzle 508, driving the gas flow inside the opening 101. The nozzle 508 drives the debris generated by the circuit board to enter the interior of the opening 101 from the opening 202, and enter the interior of the collection box 502 through the opening 101.

[0042] Working principle: When using the vertical unloading device for circuit boards based on the buffer structure, a spring 50, a buffer ring 501, an air bag 507 and a nozzle 508 are provided to buffer the circuit board and prevent damage to the circuit board, while facilitating unloading thereof. A gear 306, a screw rod 307 and a pressure sensor 308 are provided to fix the position of the circuit board, thereby increasing the overall practicality.

[0043] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A circuit board vertical unloading device based on a buffer structure, comprising a workbench (10) configured as a hollow square shell, and an opening (101) is embedded in the surface of the workbench (10); Features: The surface of the workbench (10) is fixedly connected to a lower mold (20), and the surface of the lower mold (20) is symmetrically fixedly connected to a side plate (201), and the surface of the lower mold (20) is embedded with an opening 2 (202), the surface of the workbench (10) is fixedly connected to a connecting frame (40), and the surface of the connecting frame (40) is equipped with a cylinder 2 (401), the end of the cylinder 2 (401) is connected to a connecting plate (402), and the bottom of the connecting plate (402) is fixedly connected to an upper mold (403); The workbench (10) is provided with a pressing mechanism inside, and the pressing mechanism comprises: a spring (50) is fixedly connected to the bottom of the connecting plate (402), and the other end of the spring (50) is fixedly connected to a buffer ring (501); the inside of the workbench (10) is slidably connected to a collecting box (502); the surface of the connecting plate (402) is fixedly connected to a shift rod 1 (503); a cavity (504) is embedded in the workbench (10), and the inside of the cavity (504) is slidably connected to a shift rod 2 (505), and the end of the shift rod 2 (505) passes through the surface of the workbench (10); a shift plate (506) is installed on the inner bottom surface of the cavity (504), and an air bag (507) is fixedly connected to the surface of the shift plate (506); and a nozzle (508) is installed on the surface of the air bag (507).

2. According to claim 1, a circuit board vertical unloading device based on a buffer structure is characterized in that: The surface of the workbench (10) is provided with a moving mechanism, and the moving mechanism comprises: a cylinder (30) is installed on the surface of the workbench (10), and the end of the cylinder (30) is fixedly connected to a baffle (301), the bottom of the baffle (301) is in contact with the surface of the workbench (10), and the surface of the baffle (301) is symmetrically fixedly connected to a receiving plate (302), and the end of the receiving plate (302) is embedded in the surface of the lower mold (20), and the surface of the baffle (301) is symmetrically fixedly connected to a rack (303), and the surface of the rack (303) is fixedly connected to the surface of the lower mold (20). A slider (304) is connected, one end of the slider (304) is embedded in the surface of the side plate (201), an electromagnet (305) is installed on the surface of the side plate (201), and the end of the electromagnet (305) is inserted into the surface of the slider (304), a gear (306) is rotatably installed on the surface of the side plate (201), and a screw rod (307) is arranged inside the gear (306), the end of the screw rod (307) passes through the side plate (201) and is connected to a limit block (309), and a pressure sensor (308) is embedded in the surface of the limit block (309).

3. According to claim 1, a circuit board vertical unloading device based on a buffer structure is characterized in that: The lower mold (20) and the upper mold (403) are arranged in a corresponding position, the lower mold (20) and the opening one (101) are arranged in a corresponding position, and the opening one (101) and the opening two (202) are through-connected, and the opening one (101) and the collection box (502) are arranged in a corresponding position.

4. According to claim 2, a circuit board vertical unloading device based on a buffer structure is characterized in that: The baffle (301) is slidably connected to the workbench (10), the receiving plate (302) is slidably connected to the lower mold (20), the positions of the rack (303) and the gear (306) are correspondingly arranged, and the gear (306) and the rack (303) are meshingly connected, the gear (306) is provided with a thread inside, and the gear (306) and the screw rod (307) are threadedly connected, and the ends of the two limit blocks (309) are correspondingly arranged.

5. According to claim 2, a circuit board vertical unloading device based on a buffer structure is characterized in that: The slider (304) is slidably connected to the side plate (201), and the slider (304) is slidably connected to the electromagnet (305).

6. The circuit board vertical unloading device based on a buffer structure according to claim 1, characterized in that: The ends of the shift rod 1 (503) and the shift rod 2 (505) are both configured as L-shaped structures, and the ends of the shift rod 1 (503) and the shift rod 2 (505) are configured as arc-shaped planes, and the arc-shaped structures of the shift rod 1 (503) and the shift rod 2 (505) are configured correspondingly.

7. The circuit board vertical unloading device based on a buffer structure according to claim 1, characterized in that: The second shift rod (505) is slidably connected to the workbench (10), and the end of the nozzle (508) is arranged inside the first opening (101).

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