Sensor interconnection structure and sensing assembly
By using an anisotropic conductive adhesive film between the flexible sensor and the collector, an electrical connection without a connector is achieved, which solves the problems of high cost and large space occupancy in the prior art, and realizes a sensor interconnection structure with lower cost and smaller space occupancy.
Patent Information
- Application Number
- CN202421589414.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-05
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2034-07-05
AI Technical Summary
In the prior art, the electrical connection between flexible sensors and electrical devices is achieved by using connectors, which has problems such as high cost and large space occupancy.
By using an anisotropic conductive adhesive film between the flexible sensor outlet and the collector outlet, an electrical connection between the flexible sensor and the collector is achieved without the need to set up a connector.
It reduces the manufacturing cost of sensor interconnect structure, reduces space consumption, and is easy to connect.
Smart Images
Figure CN222826618U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of sensors, and particularly relates to a sensor interconnection structure and a sensor component. Background Art
[0002] Flexible sensors have the advantages of being light, portable, bendable, stretchable, having excellent electrical performance and high integration, and are increasingly being used in the fields of robots, medical devices, vehicles, etc. Flexible sensors usually use fabrics, printing, etc. to manufacture flexible substrates, and need to lead out multiple leads on the flexible substrate to connect to external electrical devices (circuit boards, etc.). Since the leads on the flexible substrates manufactured by fabrics, printing, etc. cannot be interconnected to external electrical devices through welding processes, flexible sensors in the prior art usually use connectors to interconnect external electrical devices.
[0003] However, using connectors to achieve electrical connection between flexible sensors and electrical devices has disadvantages such as high cost and large space occupation. Utility Model Content
[0004] The utility model aims at the technical problems of using connectors in the prior art to realize electrical connection between flexible sensors and electrical devices, such as high cost and large occupied space, and provides a sensor interconnection structure and a sensor component.
[0005] In view of the above technical problems, the embodiment of the utility model provides a sensor interconnection structure, including a flexible sensor output terminal, a collector output terminal and an anisotropic conductive film; the flexible sensor output terminal includes a flexible sensor substrate and a plurality of first wires spaced apart on the flexible sensor substrate, and the collector output terminal includes a collection substrate and a plurality of second wires spaced apart on the collection substrate;
[0006] The flexible sensing substrate is attached to the collection substrate via the anisotropic conductive adhesive film, and the first conductive wires are electrically connected to the second conductive wires in a one-to-one correspondence via the anisotropic conductive adhesive film.
[0007] Optionally, the sensor interconnection structure further includes a protection plate, and the protection plate is attached to a surface of the flexible sensor substrate facing away from the anisotropic conductive adhesive film.
[0008] Optionally, the flexible sensing substrate includes a first flexible substrate and a second flexible substrate connected to the first flexible substrate, the first conductive line includes a first line segment, a first bending segment and a second line segment connected in sequence, the first line segment and the first bending segment are both arranged on the first flexible substrate, and the second line segment is arranged on the second flexible substrate;
[0009] The collecting substrate includes a first substrate and a second substrate connected to the first substrate, the second conductive line includes a third line segment, a second bending segment and a fourth line segment connected in sequence, the third line segment and the second bending segment are both arranged on the second substrate, and the fourth line segment is arranged on the second substrate;
[0010] The second flexible substrate is attached to the second substrate via the anisotropic conductive adhesive film, and the second line segments are electrically connected to the fourth line segments in a one-to-one correspondence via the anisotropic conductive adhesive film.
[0011] Optionally, the distance between two adjacent first line segments is greater than the distance between two adjacent second line segments; and the distance between two adjacent third line segments is greater than the distance between two adjacent fourth line segments.
[0012] Optionally, the distance between two adjacent second line segments is equal to the distance between two adjacent fourth line segments.
[0013] Optionally, a plurality of the first conducting wires are arranged at intervals along the first direction;
[0014] Along a first direction, a width of the first flexible substrate is greater than a width of the second flexible substrate, and a width of the first substrate is greater than a width of the second substrate.
[0015] Optionally, a width of the second flexible substrate is equal to a width of the second substrate.
[0016] Another embodiment of the utility model further provides a sensor assembly, including the above-mentioned sensor interconnection structure.
[0017] In the utility model, the flexible sensor output terminal includes a flexible sensor substrate and a plurality of first wires spaced apart on the flexible sensor substrate; the collector output terminal includes a collection substrate and a plurality of second wires spaced apart on the collection substrate; the flexible sensor substrate is attached to the collection substrate through the anisotropic conductive adhesive film, and the first wires are electrically connected to the second wires one by one through the anisotropic conductive adhesive film. No connector is required, and the electrical connection between the flexible sensor output terminal and the collector output terminal can be achieved through the anisotropic conductive adhesive film, which reduces the manufacturing cost of the sensor interconnection structure, and the sensor interconnection structure occupies a small space and has simple connection operation. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] The utility model is further described below in conjunction with the accompanying drawings and embodiments.
[0019] Figure 1 It is a structural schematic diagram of a sensor interconnection structure provided by an embodiment of the utility model;
[0020] Figure 2 It is a schematic diagram of the explosion structure of gas in the sensor interconnection structure provided by one embodiment of the utility model.
[0021] The reference numerals in the specification are as follows:
[0022] 1. Flexible sensor outlet; 11. Flexible sensing substrate; 111. First flexible substrate; 112. Second flexible substrate; 12. First conductor; 121. First line segment; 122. First bending segment; 123. Second line segment; 2. Collector outlet; 21. Collecting substrate; 211. First substrate; 212. Second substrate; 22. Second conductor; 221. Third line segment; 222. Second bending segment; 223. Fourth line segment; 3. Anisotropic conductive film; 4. Protective plate. DETAILED DESCRIPTION
[0023] In order to make the technical problems, technical solutions and beneficial effects solved by the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.
[0024] It should be understood that the directions or positional relationships indicated by terms such as "upper", "lower", "left", "right", "front", "back", and "middle" are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation of the present invention.
[0025] like Figure 1 and Figure 2As shown, a sensor interconnection structure provided by an embodiment of the utility model includes a flexible sensor output terminal 1, a collector output terminal 2 and an anisotropic conductive film 3; the anisotropic conductive film 3 has the characteristics of being conductive in the vertical direction but not conductive in the horizontal direction; usually the anisotropic conductive film 3 can achieve the above-mentioned vertical conductivity and horizontal insulation characteristics after being compressed (that is, the anisotropic conductive film 3 is conductive in its thickness direction and has insulation characteristics in its length and width directions); further, the anisotropic conductive film 3 can contain thermosetting material, so that the anisotropic conductive film 3 can permanently maintain the vertical conductivity and horizontal insulation characteristics after being compressed and heated for a certain period of time; the flexible sensor output terminal 1 includes a flexible sensor The flexible sensor substrate 11 and a plurality of first wires 12 are spaced apart on the flexible sensor substrate 11, and the collector outlet 2 includes a collection substrate 21 and a plurality of second wires 22 are spaced apart on the collection substrate 21; it can be understood that the flexible sensor substrate 11 includes but is not limited to a substrate made of flexible non-conductive materials such as a soft PCB board and a fabric; the collection substrate 21 includes but is not limited to a hard PCB board, a soft PCB board and a substrate made of any other non-conductive material; the flexible sensor outlet 1 can be a part of a flexible sensor, and its function is to sense sensor signals so as to collect and process sensor signals; the collector outlet 2 can be a part of a collection circuit board, which is used to connect a flexible sensor through the flexible sensor outlet 1 to collect and process signals.
[0026] The flexible sensing substrate 11 is attached to the collecting substrate 21 through the anisotropic conductive film 3, and the first wire 12 is electrically connected to the second wire 22 through the anisotropic conductive film. It can be understood that the anisotropic conductive film 3 is arranged between the flexible sensing substrate 11 and the collecting substrate 21; the anisotropic conductive film 3 is a material that can be conductive in the vertical direction but not conductive in the horizontal direction after being processed, and the anisotropic conductive film 3 can be in the form of a flowing glue, or a thin film formed by coating or dispensing process, or directly in the form of a film.
[0027] In the utility model, the flexible sensor outlet terminal 1 includes a flexible sensor substrate 11 and a plurality of first wires 12 spaced apart on the flexible sensor substrate 11; the collector outlet terminal 2 includes a collection substrate 21 and a plurality of second wires 22 spaced apart on the collection substrate 21; the flexible sensor substrate 11 is attached to the collection substrate 21 through the anisotropic conductive adhesive film 3, and the first wires 12 are electrically connected to the second wires 22 one by one through the anisotropic conductive adhesive film 3. No connector is required, and the electrical connection between the flexible sensor outlet terminal 1 and the collector outlet terminal 2 can be achieved through the anisotropic conductive adhesive film, which reduces the manufacturing cost of the sensor interconnection structure, and the sensor interconnection structure occupies a small space and has a simple connection operation.
[0028] In one embodiment, if Figure 2 As shown, the sensor interconnection structure further includes a protection plate 4, and the protection plate 4 is attached to the plate surface of the flexible sensor substrate 11 away from the anisotropic conductive adhesive film 3. It can be understood that the protection plate 4 has a certain hardness and flexibility, and the protection plate 4 can be attached to the flexible sensor substrate 11 by bonding, and the protection plate 4 is located directly below or directly above the anisotropic conductive adhesive film 3. In this embodiment, the protection plate 4 can enhance the hardness of the connection between the flexible sensor output terminal 1 and the collector output terminal 2, thereby extending the service life of the sensor interconnection structure.
[0029] In one embodiment, if Figure 2 As shown, the flexible sensing substrate 11 includes a first flexible substrate 111 and a second flexible substrate 112 connected to the first flexible substrate 111, the first wire 12 includes a first line segment 121, a first bending segment 122 and a second line segment 123 connected in sequence, the first line segment 121 and the first bending segment 122 are both arranged on the first flexible substrate 111, and the second line segment 123 is arranged on the second flexible substrate 112; it can be understood that the first flexible substrate 111 and the second flexible substrate 112 are an integrally formed part, and the first line segment 121, the first bending segment 122 and the second line segment 123 are an integrally formed part.
[0030] The collecting substrate 21 includes a first substrate 211 and a second substrate 212 connected to the first substrate 211, the second conductive wire 22 includes a third line segment 221, a second bending segment 222 and a fourth line segment 223 connected in sequence, the third line segment 221 and the second bending segment 222 are both arranged on the second substrate 212, and the fourth line segment 223 is arranged on the second substrate 212; it can be understood that the first substrate 211 and the second substrate 212 are an integrally formed part, and the third line segment 221, the second bending segment 222 and the fourth line segment 223 are an integrally formed part.
[0031] The second flexible substrate 112 is attached to the second substrate 212 through the anisotropic conductive film 3, and the second line segment 123 is electrically connected to the fourth line segment 223 in a one-to-one correspondence through the anisotropic conductive film 3. In this embodiment, the flexible sensor output terminal 1 and the collector output terminal 2 have simple structures and low manufacturing costs.
[0032] In one embodiment, if Figure 2 As shown, the distance between two adjacent first line segments 121 is greater than the distance between two adjacent second line segments 123; the distance between two adjacent third line segments 221 is greater than the distance between two adjacent fourth line segments 223. It can be understood that the density of the first line segments 121 is greater than the density of the second line segments 123, and the density of the third line segments 221 is greater than the density of the fourth line segments 223. Since the second line segments 123 and the fourth line segments 223 are butted together, the density of the second line segments 123 and the fourth line segments 223 is relatively large, thereby ensuring the precision and stability of the butt joint of the sensor interconnection structure.
[0033] In one embodiment, if Figure 2 As shown, the distance between two adjacent second line segments 123 is equal to the distance between two adjacent fourth line segments 223 ; at this time, the accuracy of the docking between the second line segment 123 and the fourth line segment 223 can be guaranteed.
[0034] In one embodiment, if Figure 2As shown, a plurality of first conductive wires 12 and a plurality of second conductive wires are arranged at intervals along the first direction; along the first direction, the width of the first flexible substrate 111 is greater than the width of the second flexible substrate 112, and the width of the first substrate 211 is greater than the width of the second substrate 212. In this embodiment, the first flexible substrate 111 and the first substrate 211 both have a large area, so that the density of the first line segments 121 on the first flexible substrate 111 is large, and the density of the third line segments 221 on the first substrate 211 is large; and the widths of the second flexible substrate 112 and the second substrate 212 are small, so that the width of the docking portion of the flexible sensor outlet terminal 1 and the collector outlet terminal 2 is small, thereby improving the stability of the docking of the flexible sensor outlet terminal 1 and the collector outlet terminal 2.
[0035] In one embodiment, if Figure 2 As shown, the width of the second flexible substrate 112 is equal to the width of the second substrate 212; at this time, it is convenient for the second flexible substrate 112 to be attached to the second substrate 212 through the anisotropic conductive adhesive film 3. Preferably, the width of the second flexible substrate 112 is equal to the width of the anisotropic conductive adhesive film 3.
[0036] Another embodiment of the utility model further provides a sensor assembly, including the above-mentioned sensor interconnection structure.
[0037] The above are merely embodiments of the sensor interconnection structure and sensor assembly of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.
Claims
1. A sensor interconnection structure, characterized in that: It includes a flexible sensor output terminal, a collector output terminal and an anisotropic conductive adhesive film; the flexible sensor output terminal includes a flexible sensor substrate and a plurality of first wires spaced apart on the flexible sensor substrate, and the collector output terminal includes a collection substrate and a plurality of second wires spaced apart on the collection substrate; The flexible sensing substrate is attached to the collection substrate via the anisotropic conductive adhesive film, and the first conductive wires are electrically connected to the second conductive wires in a one-to-one correspondence via the anisotropic conductive adhesive film.
2. The sensor interconnection structure according to claim 1, characterized in that: The sensor interconnection structure further includes a protection plate, which is attached to a plate surface of the flexible sensor substrate that is away from the anisotropic conductive adhesive film.
3. The sensor interconnection structure according to claim 1, characterized in that: The flexible sensing substrate comprises a first flexible substrate and a second flexible substrate connected to the first flexible substrate, the first conductive line comprises a first line segment, a first bending segment and a second line segment connected in sequence, the first line segment and the first bending segment are both arranged on the first flexible substrate, and the second line segment is arranged on the second flexible substrate; The collecting substrate includes a first substrate and a second substrate connected to the first substrate, the second conductive line includes a third line segment, a second bending segment and a fourth line segment connected in sequence, the third line segment and the second bending segment are both arranged on the second substrate, and the fourth line segment is arranged on the second substrate; The second flexible substrate is attached to the second substrate via the anisotropic conductive adhesive film, and the second line segments are electrically connected to the fourth line segments in a one-to-one correspondence via the anisotropic conductive adhesive film.
4. The sensor interconnection structure according to claim 3, characterized in that: The distance between two adjacent first line segments is greater than the distance between two adjacent second line segments; the distance between two adjacent third line segments is greater than the distance between two adjacent fourth line segments.
5. The sensor interconnection structure according to claim 3, characterized in that: The distance between two adjacent second line segments is equal to the distance between two adjacent fourth line segments.
6. The sensor interconnection structure according to claim 3, characterized in that: A plurality of the first conducting wires are arranged at intervals along a first direction; Along a first direction, a width of the first flexible substrate is greater than a width of the second flexible substrate, and a width of the first substrate is greater than a width of the second substrate.
7. The sensor interconnection structure according to claim 6, characterized in that: The width of the second flexible substrate is equal to the width of the second substrate.
8. A sensor component, characterized in that: Comprising the sensor interconnection structure as described in any one of claims 1 to 7.