Semiconductor refrigeration laser amplifier

Abstract

The utility model discloses a semiconductor refrigeration laser amplifier, comprising a housing which defines an accommodation space, the housing comprises a heat radiation plate, the heat radiation plate is provided with a channel, and the channel is used for circulation of a heat radiation medium; the refrigerating device is located in the containing space and connected to the shell, the refrigerating device comprises a refrigerating face and a heating face, and the heating face is connected to the heat dissipation plate; the clamp is provided with a containing cavity, and the clamp is connected to the refrigeration face and contained in the containing space; and the amplifier crystal is accommodated in the accommodating cavity. The refrigerating surface of the refrigerating device is attached to the bottom of the clamp, heat transfer is achieved through the clamp, the amplifier crystal is effectively cooled to guarantee normal work of the laser amplifier, the heating surface of the refrigerating device is connected with the bottom of the shell, heat emitted by the refrigerating device is transferred to the bottom of the shell, and heat transfer is achieved through a heat dissipation medium flowing in a channel. The refrigeration effect of the refrigeration device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of lasers, in particular to a semiconductor refrigeration laser amplifier. Background Art

[0002] Laser amplifiers are used to amplify laser pulse energy. Their core component is the amplifier crystal, a laser crystal that amplifies laser energy. As the laser energy increases, the amplifier crystal experiences heat buildup. This heat cannot be dissipated effectively, leading to a thermal lensing effect that can cause the laser amplifier to malfunction. Therefore, to ensure proper operation of the laser amplifier, the temperature of the amplifier crystal must be controlled within a fixed range.

[0003] Currently, laser amplifiers primarily use liquid nitrogen refrigeration or semiconductor refrigeration to control the temperature of the amplifier crystal. Due to the high cost, bulk, and difficulty in maintenance of liquid nitrogen refrigeration, most laser amplifiers use semiconductor refrigeration to cool the amplifier crystal.

[0004] In related technologies, semiconductor refrigeration devices consist of a cooling surface and a heating surface. When the semiconductor refrigeration device is operating, the cooling surface cools the amplifier crystal, while the heating surface generates heat. Because the heat generated by the refrigeration device affects the cooling effect, it is usually necessary to promptly remove the heat generated by the heating surface. However, current semiconductor refrigeration devices suffer from poor heat dissipation, which affects the cooling effect of the semiconductor refrigeration device. Utility Model Content

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a semiconductor cooling laser amplifier that can effectively improve the heat dissipation effect of a semiconductor cooling device.

[0006] According to the first embodiment of the present invention, a semiconductor cooling laser amplifier includes:

[0007] A housing defines a receiving space, the housing including a heat sink, the heat sink being provided with a passage for circulating a heat dissipation medium;

[0008] a refrigeration device, located in the accommodating space and connected to the housing, the refrigeration device comprising a cooling surface and a heating surface, the heating surface being connected to the heat sink;

[0009] A clamp having a receiving cavity, wherein the clamp is connected to the refrigeration surface and received in the receiving space;

[0010] The amplifier crystal is accommodated in the accommodating cavity.

[0011] The semiconductor refrigeration laser amplifier according to the embodiment of the present utility model has at least the following beneficial effects: the cooling surface of the refrigeration device is in contact with the bottom of the clamp, heat transfer is achieved through the clamp, and the amplifier crystal is effectively cooled to ensure the normal operation of the laser amplifier; the heating surface of the refrigeration device is connected to the bottom of the shell, and the heat generated by the refrigeration device is transferred to the bottom of the shell. Heat transfer is achieved through the heat dissipation medium flowing in the passage, thereby improving the cooling effect of the refrigeration device.

[0012] According to some embodiments of the present invention, the heat dissipation plate includes a plate body and a cover plate, the plate body is provided with a passage groove, and the cover plate is covered on the plate body to define the passage together with the passage groove.

[0013] According to some embodiments of the present invention, the passage includes multiple DC channels and guide channels, the multiple DC channels are arranged at intervals, the guide channels are curved, and the guide channels connect the adjacent DC channels to connect the multiple DC channels.

[0014] According to some embodiments of the present invention, the semiconductor cooling laser amplifier further includes a heat conducting layer, and the heat conducting layer is arranged between a side of the housing facing the heating surface and the heating surface.

[0015] According to some embodiments of the present invention, the clamp includes an upper cover and a lower cover, the accommodating cavity is formed between the upper cover and the lower cover, and the upper cover and the lower cover are detachably connected.

[0016] According to some embodiments of the present invention, a first protrusion is provided on the side of the upper cover facing the lower cover, and a second protrusion is provided on the side of the lower cover facing the upper cover. The first protrusion and the second protrusion are staggered, and the accommodating cavity is formed between the first protrusion and the second protrusion.

[0017] According to some embodiments of the present invention, a heat-conducting medium is provided in the accommodating cavity, the heat-conducting medium wraps the amplifier crystal, and the heat-conducting medium is used to fill the gap between the accommodating cavity and the amplifier crystal.

[0018] According to some embodiments of the present invention, the lower cover includes a heat sink surface and a fixed surface. The heat sink surface is used to contact the amplifier crystal. The heat sink surface is upwardly protruding relative to the fixed surface and is located above the fixed surface. The heat sink surface and the fixed surface adopt an inclined transition.

[0019] According to some embodiments of the present invention, the fixing surface extends outward to form a plurality of fixing portions, and each of the plurality of fixing portions is provided with a through hole.

[0020] According to some embodiments of the present invention, the clamp is made of copper material, and / or the outer surface of the clamp is provided with a gold-plated layer.

[0021] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0023] Figure 1 This is a schematic diagram of a semiconductor cooling laser amplifier according to an embodiment of the present utility model;

[0024] Figure 2 This is an exploded view of a semiconductor cooling laser amplifier according to an embodiment of the present utility model;

[0025] Figure 3 This is a schematic diagram of a housing according to an embodiment of the present utility model;

[0026] Figure 4 This is a schematic diagram of a housing according to an embodiment of the present invention;

[0027] Figure 5 This is a top view of the housing of an embodiment of the present utility model;

[0028] Figure 6 A schematic diagram of a clamp according to an embodiment of the present invention;

[0029] Figure 7 This is an exploded view of the clamp according to an embodiment of the present utility model;

[0030] Figure 8 This is a schematic diagram of the upper cover of an embodiment of the utility model;

[0031] Figure 9 This is a schematic diagram of the lower cover of an embodiment of the present utility model;

[0032] Figure 10 A schematic diagram of the outer periphery of the lower cover of an embodiment of the present utility model;

[0033] Reference numerals:

[0034] Semiconductor cooling laser amplifier 100; housing 200; accommodating space 201; heat sink 202; plate body 210; passage groove 211; groove wall 212; heat dissipation portion 213; first heat sink 2131; second heat sink 2132; passage 220; direct current channel 2201; guide channel 2202; cover 230; water inlet 240; water outlet 250; refrigeration device 300; cooling surface 310; heating surface 320; fixture 400; outer periphery 401; first boundary 402; second boundary 403; upper cover 410; first protrusion 411; accommodating cavity 420; lower cover 430; second protrusion 431; heat sink surface 440; fixing surface 450; fixing portion 451; through hole 452; inclined surface 460; amplifier crystal 500. DETAILED DESCRIPTION

[0035] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0036] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0037] In the description of this utility model, "several" means more than one, "plurality" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of the terms "first" and "second" is solely for the purpose of distinguishing technical features and is not to be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0038] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0039] In the description of the present invention, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the exemplary expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0040] The semiconductor cooling laser amplifier 100 of the present invention will be described below with reference to the accompanying drawings.

[0041] See Figures 1 to 4 As shown, a semiconductor cooling laser amplifier 100 according to an embodiment of the present invention includes a housing 200, a cooling device 300, a fixture 400, and an amplifier crystal 500. The housing 200 defines a storage space 201 and further includes a heat sink 202. The cooling device 300, the fixture 400, and the amplifier crystal 500 are all located within the storage space 201. In this embodiment, the heat sink 202 is the bottom wall structure of the storage space 201. A passage 220 for circulating a heat dissipation medium is provided at the bottom of the heat sink 202. The cooling device 300 is disposed above the passage 220, i.e., on the bottom wall structure of the storage space 201. The cooling device 300 is located within the storage space 201 and includes a cooling surface 310 and a heating surface 320. The heating surface 320 is located above the passage 220 and is interconnected with the heat sink 202. The heating surface 320 transfers heat to the heat dissipation medium in the passage 220 through the housing 200. The cooling surface 310 is attached to the underside of the fixture 400. This cools the fixture 400 and conducts heat transfer with the fixture 400, thereby cooling the fixture 400 and the amplifier crystal 500. The fixture 400 has a receiving cavity 420, which holds the amplifier crystal 500. When the amplifier crystal 500 is operating, it generates a significant amount of heat. This heat is transferred through the fixture 400 to the cooling surface 310, where it conducts heat to the fixture 400, achieving cooling.

[0042] In other embodiments (not shown in the figures), the heat sink 202 may be the side wall or the top wall of the accommodating space 201; in another embodiment (not shown in the figures), the heat sink 202 may also be a separate heat dissipation component, and the heat sink 202 may be located not only on the bottom wall of the accommodating space 201, but also on the side wall of the accommodating space, or on other locations such as the top wall of the accommodating space.

[0043] Specifically, the refrigeration device 300 utilizes semiconductor refrigeration, which utilizes direct current to pass through two different semiconductor materials to form a galvanic couple. The two ends of the galvanic couple absorb and release heat, respectively, thereby achieving cooling. This also allows the refrigeration device 300 to simultaneously generate heat while cooling. Heat generation is accomplished by the heating surface 320, which is transferred through the bottom of the housing 200 to the heat dissipation medium in the passage 220, thereby dissipating heat from the refrigeration device 300. This effectively improves the heat dissipation of the refrigeration device 300, resulting in a better cooling effect. This effectively dissipates heat from the amplifier crystal 500, allowing the laser amplifier to operate normally.

[0044] See Figure 2 and Figure 3 As shown, in some embodiments, the heat sink 202 further includes a plate body 210 and a cover plate 230. The plate body 210 is the main body of the heat sink 202. The passage 220 is provided on the plate body 210. The cover plate 230 is a plate that covers the passage 220 and is connected to the plate body 210. The plate body 210 is provided with a passage groove 211. The passage groove 211 defines the shape and structure of the passage 220 and the path of the heat dissipation medium. The passage 220 is provided below the plate body 210. The cover plate 230 is provided below the passage 220 and, together with the passage groove 211, defines the passage 220. Specifically, the cover plate 230 is provided on the plate body 210 to close the passage groove 211 at the bottom of the housing 200, thereby forming the passage 220 on the plate body 210 and preventing the heat dissipation medium in the passage 220 from escaping from the bottom of the housing 200 when the housing 200 is in the upright position.

[0045] Further, see Figure 3As shown, the passage 220 includes multiple direct current channels 2201 and multiple flow guide channels 2202. The direct current channels 2201 are spaced apart, and each end of the direct current channel 2201 is connected to a flow guide channel 2202. The flow guide channels 2202 have a curved structure, which is used to connect two adjacent direct current channels 2201. This allows the multiple direct current channels 2201 to be connected, thereby forming the passage 220. Specifically, one end of a direct current channel 2201 is connected to a flow guide channel 2202 for interconnection with an adjacent direct current channel 2201. Simultaneously, the other end of the direct current channel 2201 is also connected to a flow guide channel 2202 for interconnection with another direct current channel 2201. This allows the direct current channels 2201 to be connected to other direct current channels 2201 at both ends via the flow guide channels 2202. In some embodiments, the plate body 210 includes a groove wall 212 and a heat dissipation portion 213. The groove wall 212 has a curved structure, which not only reduces the resistance of the heat dissipation medium flowing through the passage 220 but also serves as a flow guide. The heat dissipation portion 213 has a thick structure. It not only guides the heat dissipation medium but also serves as a heat dissipation fin, significantly increasing the heat dissipation area of ​​the passage 220. The heat dissipation portion 213 includes a first heat dissipation element 2131 and a second heat dissipation element 2132. The first heat dissipation element 2131 and the second heat dissipation element 2132 are staggered on the plate body 210 to form spaced DC channels 2201. Staggered arrangement is defined as: a second heat dissipation element 2132 is positioned between two first heat dissipation elements 2131, or a first heat dissipation element 2131 is positioned between two second heat dissipation elements 2132. The groove wall 212 is formed on the sidewall of the plate body 210. The groove wall 212 has a curved structure, giving the guide channel 2202 a curved shape. Two adjacent first heat dissipation elements 2131 are connected to the groove wall 212 at the same end, thereby connecting the two adjacent DC channels 2201. The same end of two adjacent second heat sinks 2132 is also connected to the slot wall 212. This connects two adjacent DC channels 2201, further connecting one DC channel 2201, resulting in three DC channels 2201 being connected. It should be noted that the ends of the first and second heat sinks 2131 and 2132 connected to the slot wall 212 are positioned opposite each other and are not on the same side. This connection allows multiple DC channels 2201 to interconnect through the guide channel 2202 to form a passage 220, allowing the heat dissipation medium to flow through the passage 220.

[0046] Furthermore, the cover plate 230 is provided below the passage 220, and the cover plate 230 is fixed below the passage 220 by friction welding. In other embodiments, the cover plate 230 can be fixed below the passage 220 by threaded connection, or riveting. Specifically, a sink is provided on the plate body 210, and the sink is provided around the passage 220. The shape of the sink matches the shape of the cover plate 230. The cover plate 230 is provided in the sink to close the passage 220 and is coplanar with the bottom surface of the plate body 210, so that the bottom end of the shell 200 forms a flush structure. Then, the cover plate 230 and the plate body 210 are welded and fixed together by an aluminum alloy friction welding process to ensure that the cover plate 230 is not flushed under high pressure and high flow rate, and to prevent the shell 200 from leaking under long-term use.

[0047] In some embodiments (not shown), the bottom of the housing 200 includes only the plate body 210, and the passage 220 may be opened in the middle of the plate body 210, with the upper and lower end surfaces of the plate body 210 closing the passage 220. In another embodiment (not shown), the bottom of the housing 200 includes the plate body 210 and a cover plate 230, with the passage 220 opened above the plate body 210, and the cover plate 230 fixedly connected to the plate body 210 to close the passage 220.

[0048] In the embodiment of the present utility model, see Figure 3 and Figure 4 As shown, in order to prevent the heat dissipation medium in the passage 220 from splashing onto the refrigeration device 300, causing damage to the refrigeration device 300 and affecting the normal operation of the refrigeration device 300, the refrigeration device 300 and the passage 220 are separated by the plate body 210. The passage 220 and the refrigeration device 300 are not directly connected. Instead, through the heat conduction of the shell 200, the heat from the heating surface 320 is transferred to the passage 220 through the bottom of the shell 200. In other embodiments (not shown in the figure), the refrigeration device 300 can be directly connected to the passage 220, such as: a connecting plate is provided at the bottom of the heating surface 320, and the passage 220 can be directly set on the connecting plate to achieve direct connection between the passage 220 and the refrigeration device 300. The refrigeration device 300 can be provided with a waterproof function or other waterproof devices.

[0049] In some embodiments, passage 220 is used to circulate constant temperature liquid water. In other embodiments, passage 220 can also circulate refrigerant water, or other refrigeration gases, such as Freon, ammonia, and carbon dioxide.

[0050] In some embodiments, see Figure 3As shown, passage 220 utilizes a multi-stage "U"-shaped water channel design, increasing the contact area between water and the bottom surface of housing 200. Passage 220 is a single water channel, which can be understood as being formed by a single water channel folded in an annular shape. In other embodiments (not shown), there are multiple passages 220, each of which is interconnected by arc-shaped groove walls 212. The interconnected passages 220 form a water channel, thereby increasing the water cooling and heat dissipation area.

[0051] In some embodiments, see Figure 4 As shown, a water inlet 240 and a water outlet 250 are provided on one side of the shell 200, and the water inlet 240 and the water outlet 250 are both connected to the passage 220. The heat dissipation medium is continuously flowed and input and output through the water inlet 240 and the water outlet 250, thereby achieving a cooling effect for the heating surface 320.

[0052] In some embodiments, see Figure 4 and Figure 5 As shown, the refrigeration device 300, the fixture 400, and the amplifier crystal 500 are all located in the storage space 201. The heating surface 320 of the refrigeration device 300 is attached to the bottom of the housing 200, that is, the bottom wall of the storage space 201, and heat is transferred to the passage 220 at the bottom of the housing 200 through the housing 200. A thermally conductive layer is provided between the heating surface 320 and the bottom wall of the storage space 201. The heating surface 320 and the bottom wall of the storage space 201 are each tightly attached to the thermally conductive layer, with no gap between them. This increases thermal conductivity and allows the heat generated by the heating surface 320 to be transferred more quickly. In this embodiment, the thermally conductive layer is made of thermally conductive silicone grease, specifically Honeywell thermal grease. In other embodiments, the thermally conductive layer can also be made of other materials such as thermally conductive silicone or thermally conductive graphite.

[0053] In some embodiments, see Figure 2 and Figure 6 As shown, the fixture 400 includes an upper cover 410 and a lower cover 430, and the cooling surface 310 of the refrigeration device 300 is attached to the bottom of the lower cover 430. The bottom of the lower cover 430 is a square structure with a size of 50mm*50mm, and the size structure of the lower cover 430 is consistent with the size structure of the cooling surface 310. When the size of the cooling surface 310 is 50mm*50mm, the cooling surface 310 not only has an efficient cooling effect, but also has the highest economic benefits. A plurality of threaded holes are provided on the upper cover 410, and the upper cover 410 and the lower cover 430 are connected by screws. Optionally, in other embodiments, the upper cover 410 and the lower cover 430 can be connected by other means, such as: pin connection, key connection, or snap connection, or mortise and tenon connection, etc.

[0054] Further, see Figure 6 and Figure 7As shown, in some embodiments, the upper cover 410 and the lower cover 430 are respectively provided with a first protrusion 411 and a second protrusion 431. The first protrusion 411 is formed to protrude downward relative to the upper cover 410, and the second protrusion 431 is formed to protrude upward relative to the lower cover 430. The first protrusion 411 and the second protrusion 431 are staggered. When the upper cover 410 and the lower cover 430 are fixed by screws, the first protrusion 411 and the second protrusion 431 are staggered to form a receiving cavity 420. The amplifier crystal 500 is placed in the receiving cavity 420.

[0055] Specifically, when the upper cover 410 is set on the lower cover 430, the first protrusion 411 and the second protrusion 431 will have two surfaces arranged opposite to each other, and these two oppositely arranged surfaces together constitute the left and right side surfaces of the accommodating cavity 420. At the same time, the lower surface of the upper cover 410 will be engaged with the upper surface of the second protrusion 431, and the first protrusion 411 will also be engaged with the heat sink surface 440. The lower surface of the upper cover 410 and part of the heat sink surface 440 together constitute the upper and lower surfaces of the accommodating cavity 420, thereby forming the accommodating cavity 420.

[0056] Due to the staggered design of the first protrusion 411 and the second protrusion 431, when the amplifier crystal 500 is located in the accommodating cavity 420, the upper cover 410 is provided on the amplifier crystal 500 and does not generate additional pressure on the amplifier crystal 500, thereby reducing the assembly stress and thermal stress of the amplifier crystal 500.

[0057] Furthermore, a thermally conductive medium is provided within the accommodating cavity 420, encapsulating the amplifier crystal 500. The thermally conductive medium is heated and melted, then welded to secure the amplifier crystal 500 within the accommodating cavity 420. This heat dissipates air from the fixture, improving the thermal conductivity of the fixture 400. Heating and melting the thermally conductive medium eliminates any gaps or air between the amplifier crystal 500 and the accommodating cavity 420, thereby improving heat dissipation within the amplifier crystal 500.

[0058] In some embodiments, the thermal conductive medium is metallic indium because it has good thermal conductivity and is easier to handle during hot-melt welding. In other embodiments, metallic indium can be replaced by a thermal conductive medium such as gold, tin, or silver. Gold and tin can be filled into the gap of the receiving cavity 420 by welding, while silver can be filled by brazing.

[0059] Furthermore, a guide groove is provided on the lower cover 430, which is connected to the accommodating cavity 420. When the heat-conducting medium is hot-melted, the guide groove can remove excess heat-conducting medium, preventing the excess heat-conducting medium from contaminating the light-transmitting surface of the amplifier crystal 500 and affecting the operation of the amplifier crystal 500.

[0060] In some embodiments, see Figure 7 and Figure 8 As shown, the lower cover 430 includes a heat sink surface 440 and a fixing surface 450. The heat sink surface 440 contacts the amplifier crystal 500, and the second protrusion 431 is provided on the heat sink surface 440. A heat sink is an object that can maintain its temperature regardless of the amount of heat energy transferred to it. The heat sink surface 440 is primarily used to quickly dissipate the heat generated by the amplifier crystal 500 to ensure the normal operation of the core components.

[0061] Specifically, heat sink surface 440 is raised upward and positioned above fixed surface 450. Heat sink surface 440 is higher than fixed surface 450, creating a height difference between the two surfaces. A bevel 460 is used to create a transition between the two surfaces. Using bevel 460 allows for faster heat transfer from the amplifier crystal. If the angle between heat sink surface 440 and fixed surface 450 is right, heat from the amplifier crystal must first be transferred vertically downward to fixed surface 450, and then distributed across fixed surface 450 through translation. This reduces the thermal conductivity of fixture 400. The principle that the sum of two sides of a triangle is greater than the third indicates that using bevel 460 reduces the distance over which heat is transferred, resulting in faster heat transfer and improved thermal conductivity of fixture 400. Similarly, the low temperature generated by cooling surface 310 can be more quickly transferred to amplifier crystal 500 via bevel 460.

[0062] Further, see Figure 8 As shown, the fixing surface 450 extends outward to form a plurality of fixing portions 451, and the fixing portions 451 are in a suspended state relative to the bottom of the fixing surface 450, that is, the bottom of the fixing surface 450 is in contact with the cooling surface 310 of the cooling device 300, while the fixing portions 451 are not in contact with the cooling surface 310. The fixing portions 451 and the bottom of the fixing surface 450 have a stepped structure. At the same time, since the bottom of the clamp 400 is connected to the cooling surface 310, the entire clamp 400 is only supported by screws and arranged in the accommodating space 201. The clamp 400 is also in a suspended state relative to the shell 200. This design can reduce the contact between the clamp 400 and the shell 200, avoid the low-temperature heat generated by the cooling surface 310 from being directly lost inside the shell 200, thereby increasing the efficiency of the clamp 400 in conducting low temperature to the amplifier crystal 500.

[0063] Specifically, see Figure 5 and Figure 8As shown, the housing 200 has four threaded holes disposed within the receiving space 201, and corresponding through-holes 452 are provided on the fixing portion 451. When the through-holes 452 are connected to the threaded holes in the receiving space 201 via screws, the presence of the cooling device 300 causes the clamp 400 to be suspended in the receiving space 201, thereby reducing heat transfer between the clamp 400 and the housing 200. When the cooling surface 310 transfers cooling to the clamp 400, this reduces the amount of cooling lost to the housing 200, providing a better cooling and heat dissipation effect for the amplifier crystal 500. The through-holes 452 are round holes. The reason for using round holes rather than circular holes is that when the clamp 400 secures the amplifier crystal 500, the round holes can correct for some assembly errors. Specifically, the use of round holes allows the clamp 400 to have a certain amount of room for movement. Because the amplifier crystal 500 has a certain working life, when the laser is irradiated on a certain point of the amplifier crystal 500 for a long time, after a certain number of times, the entry point of the amplifier crystal 500 will be damaged. At this time, the movable fixture 400 can be used through the waist hole to change the direction of the amplifier crystal 500 and change the entry point of the laser into the amplifier crystal 500, so that the amplifier crystal 500 can continue to work normally.

[0064] In some embodiments, see Figure 8 and Figure 9 As shown, the upper cover 410 and lower cover 430 are designed to be irregular in shape, with the upper cover 410 being a raised, irregularly shaped structure. Since the fixture 400 serves as the primary heat conduction structure for the amplifier crystal 500, when the fixture 400 promptly conducts heat and cools the amplifier crystal 500, the amplifier crystal 500, as the core component of the semiconductor cooling laser amplifier 100, can only operate normally if the operating environment of the amplifier crystal 500 is normal.

[0065] The heat sink surface 440 and the second raised portion 431 of the lower cover 430 each have multiple boundary lines. Together, these boundary lines form the outer periphery 401 of the lower cover 430. The shape and structure of the upper cover 410 match the outer periphery 401. Since the clamp 400 not only holds the amplifier crystal 500 but also ensures proper operation of the amplifier crystal 500, the clamping portion of the clamp 400 is comprised of the upper cover 410, the heat sink surface 440, and the second raised portion 431. In actual operation, to ensure more accurate laser beam illumination on the amplifier crystal 500, the laser beam's location is determined by refracted laser beams, allowing the laser beam's impact position to be adjusted for optimal illumination. To ensure proper laser beam illumination on the amplifier crystal 500 without being blocked by the clamp 400, the shape and structure of the clamping portion corresponds to the shape and structure of the outer periphery 401.

[0066] Specifically, see Figure 8 and Figure 10 As shown, when amplifier crystal 500 is operating, laser light enters from the side of first boundary 402. In optimal conditions, the laser light strikes the light-transmitting end face of amplifier crystal 500 and passes through the interior of amplifier crystal 500, thereby amplifying the laser light's energy. However, due to scattering during irradiation, some laser light strikes amplifier crystal 500 and is refracted. The refracted laser light then exits toward second boundary 403. When laser light scatters, the light with the greatest scattering angle enters close to first boundary 402. Therefore, when the scattering angle is greatest, the plane of first boundary 402 does not block the normal entry of the laser light. Similarly, the plane of second boundary 403 does not block the normal refraction of the laser light. Therefore, the outer periphery 401 structure formed by multiple boundary lines does not block the normal entry and refraction of the laser light.

[0067] Because semiconductor refrigeration systems are small, they can reduce the thermal inertia of the semiconductor, enhance load adjustability, and enable high-precision control with quick and easy adjustment. Therefore, during the design process, most semiconductor refrigeration systems strive to minimize their size. However, while ensuring the small size of the housing 200, it is also important to maximize the volume of the fixture 400 within the relative space. Furthermore, increasing the size of the fixture 400 can improve its thermal conductivity. However, improving the performance of the semiconductor refrigeration system requires ensuring that the laser beam is not blocked from entering and refracting properly, allowing the amplifier crystal 500 to function properly. Under this premise, the shape and structure of the clamping portion, namely the shape and structure of the outer periphery 401, maximizes the size of the fixture 400. Because the outer periphery 401 formed by multiple boundary lines represents the largest possible shape and structure for the fixture portion, a clamping portion with a raised structure based on the shape and structure of the outer periphery 401 maximizes the size of the fixture 400.

[0068] In some embodiments (not shown in the figures), the upper cover 410 is provided with a thermistor temperature sensor, the thermistor temperature sensor is connected to the accommodating cavity 420, the thermistor temperature sensor and the refrigeration device 300 are both electrically connected to the external circuit, and the thermistor temperature sensor communicates with the external circuit.

[0069] Specifically, when the amplifier crystal 500 is operating, the thermistor temperature sensor detects the operating temperature of the amplifier crystal 500. When the temperature of the amplifier crystal 500 exceeds a set value, the thermistor temperature sensor transmits a temperature signal to an external circuit board. The circuit board controls the external circuit to provide a certain voltage and current to the refrigeration device 300, causing the refrigeration device 300 to operate. The cooling surface 310 of the refrigeration device 300 cools, while the heating surface 320 heats. The cooling surface 310 transfers low-temperature heat to the fixture 400, dissipating heat from the amplifier crystal 500. When the refrigeration device 300 is operating, the heating surface 320 also generates heat. This heat needs to be conducted through the housing 200 to the bottom of the housing 200. The heat is then carried out of the housing 200 by the flowing heat dissipation medium in the passage 220 at the bottom of the housing 200 through the heat exchange, thereby dissipating heat from the heating surface 320 and achieving the effect of lowering the temperature.

[0070] In an embodiment of the present invention, the clamp 400 is made of copper. Since copper has high thermal conductivity, is easy to process, and is moderately priced, and copper is purer than ordinary copper, it is more suitable for use as a heat-conducting clamp. At the same time, the use of a copper-gold-plated clamp 400 makes the heat conduction of the entire device more rapid, and promotes a more sensitive response to the heat exchange of the semiconductor refrigeration laser amplifier 100. At the same time, the outer surface of the copper is gold-plated so that the outer surface of the clamp 400 has a gold-plated layer, wherein the thickness of the gold-plated layer is between 2 microns and 3 microns. The gold plating can prevent the surface of the copper material from chemical reactions such as oxidation, thereby forming an oxide film, and the gold plating can enhance the surface stability of the copper, and has the advantages of oxidation resistance and high gloss. At the same time, it can fill the small pits on the surface of the clamp 400, improve the thermal conductivity of the clamp 400, and thus provide a better cooling effect for the amplifier crystal 500.

[0071] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various modifications can be made within the scope of knowledge possessed by a person skilled in the art without departing from the spirit of the present invention. In addition, the embodiments of the present invention and the features of the embodiments can be combined with each other unless there is a conflict.

Claims

1. A semiconductor cooling laser amplifier, characterized in that: include: A housing defines a receiving space, the housing includes a heat sink, the heat sink is provided with a passage, and the passage is used for circulating a heat dissipation medium; A refrigeration device, located in the accommodating space and connected to the shell, the refrigeration device comprising a refrigeration surface and a heating surface, the heating surface being connected to the heat sink; A clamp having a receiving cavity, wherein the clamp is connected to the refrigeration surface and received in the receiving space; The amplifier crystal is accommodated in the accommodating cavity.

2. The semiconductor cooling laser amplifier according to claim 1, characterized in that: The heat dissipation plate comprises a plate body and a cover plate, wherein the plate body is provided with a passage groove, and the cover plate is covered on the plate body to define the passage together with the passage groove.

3. The semiconductor cooling laser amplifier according to claim 1, characterized in that: The passage includes a plurality of direct current channels and a guide channel. The plurality of direct current channels are arranged at intervals. The guide channel is curved. The guide channel connects the adjacent direct current channels to make the plurality of direct current channels connected.

4. The semiconductor cooling laser amplifier according to claim 1, characterized in that: The semiconductor cooling laser amplifier further comprises a heat conducting layer, and the heat conducting layer is arranged between the heating surface and a side of the shell facing the heating surface.

5. The semiconductor cooling laser amplifier according to claim 1, characterized in that: The clamp comprises an upper cover and a lower cover, the accommodating cavity is formed between the upper cover and the lower cover, and the upper cover and the lower cover are detachably connected.

6. The semiconductor cooling laser amplifier according to claim 5, characterized in that: A first protrusion is provided on one side of the upper cover facing the lower cover, and a second protrusion is provided on one side of the lower cover facing the upper cover. The first protrusion and the second protrusion are staggered, and the accommodating cavity is formed between the first protrusion and the second protrusion.

7. The semiconductor cooling laser amplifier according to claim 6, characterized in that: A heat-conducting medium is arranged in the accommodating cavity, the heat-conducting medium wraps the amplifier crystal, and the heat-conducting medium is used to fill the gap between the accommodating cavity and the amplifier crystal.

8. The semiconductor cooling laser amplifier according to claim 5, characterized in that: The lower cover comprises a heat sink surface and a fixed surface. The heat sink surface is used to contact the amplifier crystal. The heat sink surface is upwardly protruding relative to the fixed surface and is located above the fixed surface. The heat sink surface and the fixed surface are transitioned by an inclined surface.

9. The semiconductor cooling laser amplifier according to claim 8, characterized in that: The fixing surface extends outward to form a plurality of fixing portions, and each of the plurality of fixing portions is provided with a through hole.

10. The semiconductor cooling laser amplifier according to claim 1, characterized in that: The clamp is made of copper material, and / or the outer surface of the clamp is provided with a gold-plated layer.

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