Thick film heating plate assembly

Abstract

The utility model discloses a thick film heating plate assembly, which comprises a heating plate main body and a wiring terminal strip fixedly connected to the side of the heating plate main body, the heating plate main body comprises a substrate and a heating layer arranged on the upper surface of the substrate, and at least one heating circuit is arranged in the heating layer; the wiring terminal strip comprises an insulating shell, a high-voltage positive terminal and a high-voltage negative terminal, and the high-voltage positive terminal and the high-voltage negative terminal are arranged in the insulating shell which is of an L-shaped structure. The two ends of the high-voltage positive terminal and the high-voltage negative terminal extend out of the two ends of the insulating shell respectively, and the ends used for being connected with the heating plate body are perpendicular to the end face of the insulating shell. The heating plate is simple and reasonable in structure, and the wiring terminal strip is connected with the heating plate main body and other parts in two directions in a right-angle manner, so that the space utilization rate of a product is improved, the connection reliability is ensured, and the assembly of the product is simplified.

Description

Technical Field

[0001] The utility model relates to the technical field of thick film heaters, in particular to a thick film heating plate assembly. Background Art

[0002] Thick film heating technology is a heating device that uses thick film screen printing technology on a substrate, such as stainless steel plate, ceramic, glass or aluminum alloy plate, to print the insulating dielectric layer, heating resistor layer, electrode layer and isolation layer on the substrate in sequence, and then sinter at high temperature. However, the existing thick heating plates are mostly connected to other components by flying wires, and the flying wire connection structure is relatively scattered, making the product assembly more complicated and less safe, and there is room for improvement. Utility Model Content

[0003] The utility model aims to overcome the defects in the prior art and provides a thick film heating plate assembly, which has the characteristics of high product space utilization, reliable connection and convenient production and assembly.

[0004] To achieve the above-mentioned purpose, the utility model provides a thick film heating plate assembly, including a heating plate body, and a terminal block fixedly connected to the side of the heating plate body;

[0005] The heating plate body comprises a substrate and a heating layer arranged on the upper surface of the substrate, wherein the heating layer has at least one heating circuit;

[0006] The terminal block includes an insulating shell, and a high-voltage positive terminal and a high-voltage negative terminal arranged in the insulating shell. The insulating shell is an L-shaped structure. Both ends of the high-voltage positive terminal and the high-voltage negative terminal extend from both ends of the insulating shell respectively, and the ends used to connect the heating plate body are perpendicular to the end surface of the insulating shell.

[0007] It is further configured as follows: the heating layer includes an insulating dielectric layer, a resistor layer, an electrode layer and an isolation layer which are printed and sintered in sequence in a non-co-firing form; the resistor layer includes a plurality of heating loads; and the electrode layer is used to electrically connect the heating loads of the resistor layer to form a heating circuit.

[0008] It is further configured that: the electrode layers connect the heating loads of the resistance layers in parallel in pairs and then connect them in series to form a heating circuit.

[0009] It is further configured as follows: the heating layer has two heating circuits which are arranged on the left and right sides of the heating plate body respectively; and the number of the terminal blocks is two which are fixed on the left and right sides of the heating plate body respectively.

[0010] It is further configured that: the heating layer also includes a high-voltage positive pin and a high-voltage negative pin connected to the heating circuit and used to be connected to the high-voltage positive terminal and the high-voltage negative terminal respectively.

[0011] It is further configured that: the heating plate body further comprises an NTC resistor for real-time monitoring of the temperature of the heating layer, and an NTC pin electrically connected to the NTC resistor;

[0012] The terminal block also includes an NTC terminal arranged in the insulating housing. Two ends of the NTC terminal extend from two ends of the insulating housing respectively, and the end portion used for connecting the NTC pin is perpendicular to the end surface of the insulating housing.

[0013] It is further configured that: a protrusion is provided between the ends of the insulating housing corresponding to adjacent terminals.

[0014] It is further configured as follows: a heat dissipation structure is provided on the lower surface of the substrate, and the heat dissipation structure is a fin structure.

[0015] It is further configured as follows: a mounting notch for embedding the terminal block is correspondingly arranged on the side of the substrate, and bayonet holes matching the mounting notch are correspondingly arranged on both sides of the insulating shell of the terminal block.

[0016] Compared with the prior art, the wiring terminal rows of the utility model are placed at right angles to connect the heating plate body and other components, which effectively simplifies the overall structure of the heating plate assembly, facilitates the production and assembly of the product, and also improves the overall space utilization of the product; furthermore, the heating circuit of the heating plate assembly is formed by connecting the heating loads in parallel in pairs and then in series, so that the load dissipates heat evenly, reduces the failure rate, and increases the service life of the thick film. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a three-dimensional schematic diagram of a thick film heating plate assembly of the utility model. Figure 1 ;

[0018] Figure 2 This is a schematic diagram of the three-dimensional structure of the thick film heating plate assembly. Figure 2 ;

[0019] Figure 3 is a side view of the thick film heating plate assembly;

[0020] Figure 4 It is a three-dimensional structural diagram of the terminal block;

[0021] Figure 5 is a schematic diagram of the arrangement structure of the heating layer on the substrate;

[0022] Figure 6 It is a schematic diagram of the connection between the electrode layer and the resistor layer.

[0023] The following reference numerals are marked on the drawings in conjunction with the drawings:

[0024] 100, heating plate body; 110, substrate; 111, installation notch; 120, heating layer; 121, insulating medium layer; 122, resistor layer; 1221, heating load; 123, electrode layer; 124, isolation layer; 125, high-voltage positive pin; 126, high-voltage negative pin; 130, NTC resistor; 131, NTC pin; 140, heat dissipation structure; 200, terminal block; 210, insulating shell; 211, raised portion; 212, bayonet; 220, high-voltage positive terminal; 230, high-voltage negative terminal; 240, NTC terminal. DETAILED DESCRIPTION

[0025] A specific implementation of the present utility model is described in detail below in conjunction with the accompanying drawings, but it should be understood that the protection scope of the present utility model is not limited by the specific implementation mode.

[0026] The utility model discloses a thick film heating plate assembly as follows Figure 1 and Figure 4 As shown, it is applied to a high-pressure liquid heater for an automobile, and includes a heating plate body 100, and a terminal block 200 fixedly connected to the side of the heating plate body 100; in this embodiment, there are two terminal blocks 200, which are respectively fixed on the left and right sides of the heating plate body 100, and the left and right sides of the heating plate body 100 are provided with mounting notches 111 for the terminal blocks 200 to be embedded, and the terminal blocks 200 are correspondingly provided with bayonet sockets 212 that match the mounting notches 111, so that the terminal blocks 200 can be simply, efficiently and stably fixed on the heating plate body 100.

[0027] In this embodiment, if Figure 1 and Figure 3 As shown, the heating plate body 100 includes a substrate 110, a heating layer 120 and an NTC terminal 240. The substrate 110 is formed by stamping stainless steel. The heating layer 120 is arranged on the upper surface of the substrate 110. The NTC terminal 240 is connected to the heating layer 120 for real-time monitoring of the temperature of the heating layer 120, and timely feedback during dry burning.

[0028] In the above scheme, if Figure 5As shown, the heating layer 120 includes an insulating dielectric layer 121, a resistor layer 122, an electrode layer 123 and an isolation layer 124 which are printed and sintered in sequence in a non-co-fired form. Specifically: the insulating dielectric layer 121 is first printed and sintered on the upper surface of the substrate 110. After this step is completed, the resistor layer 122 is printed and sintered on the upper surface of the insulating dielectric layer 121. The resistor layer 122 includes a plurality of heating loads 1221 for heating; after sintering, the electrode layer 123 is printed and sintered on the upper surface of the insulating dielectric layer 121, and the heating loads 1221 of the resistor layer 122 are electrically connected to form a heating circuit; finally, an isolation layer 124 is wrapped on the outside to seal the package in a humid and hot environment, block the invasion of moisture, etc., and insulate and protect the electrode layer 123 and the resistor layer 122.

[0029] Preferably Figure 6 As shown, the electrode layer 123 connects the heating loads 1221 of the resistance layer 122 in parallel and then in series to form a heating circuit; in this embodiment, there are two heating circuits and they are arranged on the left and right sides of the heating plate body 100.

[0030] In the above scheme, if Figure 2 and Figure 3 As shown, the heating plate body 100 also includes a heat dissipation structure 140 arranged on the lower surface of the substrate 110. In this embodiment, the heat dissipation structure 140 is preferably a fin structure formed by stamping a brazed composite aluminum alloy sheet, which is connected and fixed to the substrate 110 by brazing. It has a thin thickness and high heat conduction efficiency, and can effectively and quickly transfer the generated heat to reduce the temperature of the film heater.

[0031] In this embodiment, if Figure 4 and Figure 6 As shown, the terminal block 200 includes an insulating housing 210 (plastic housing), and a high-voltage positive terminal 220, a high-voltage negative terminal 230 and an NTC terminal 240 which are arranged in the insulating housing 210 and are arranged in parallel and spaced in the same direction; wherein the insulating housing 210 is an L-shaped structure, and both ends of the high-voltage positive terminal 220, the high-voltage negative terminal 230 and the NTC terminal 240 are respectively extended from both ends of the insulating housing 210 and the ends used for connecting the heating plate body 100 are perpendicular to the end surface of the insulating housing 210, and the heating plate body 100 is correspondingly provided with The high-voltage positive pin 125, the high-voltage negative pin 126 and the NTC pin 131 are respectively used to be connected to the high-voltage positive terminal 220, the high-voltage negative terminal 230 and the NTC terminal 240. The high-voltage positive pin 125 and the high-voltage negative pin 126 are connected to the heating circuit, and the NTC pin 131 is connected to the NTC resistor 130. In this way, the terminal block 200 is connected to the heating plate body 100 and other components at right angles in two directions, which makes the overall space utilization of the product higher, while ensuring the reliability of the connection and the convenience of production.

[0032] In the above scheme, preferably Figure 4 As shown, the end of the insulating housing 210 corresponds to the protrusion 211 between adjacent terminals to ensure a safe creepage distance, thereby improving the reliability of the product.

[0033] Compared with the prior art, the wiring terminal rows of the utility model are placed at right angles to connect the heating plate body and other components, which effectively simplifies the overall structure of the heating plate assembly, facilitates the production and assembly of the product, and also improves the overall space utilization of the product; furthermore, the heating circuit of the heating plate assembly is formed by connecting the heating loads in parallel in pairs and then in series, so that the load dissipates heat evenly, reduces the failure rate, and increases the service life of the thick film.

[0034] The above disclosure is only an embodiment of the present invention, but the present invention is not limited thereto, and any changes that can be conceived by those skilled in the art should fall within the protection scope of the present invention.

Claims

1. A thick film heating plate assembly, characterized in that: It includes a heating plate body and a terminal block fixedly connected to the side of the heating plate body; The heating plate body comprises a substrate and a heating layer arranged on the upper surface of the substrate, wherein the heating layer has at least one heating circuit; The terminal block includes an insulating shell, and a high-voltage positive terminal and a high-voltage negative terminal arranged in the insulating shell. The insulating shell is an L-shaped structure. Both ends of the high-voltage positive terminal and the high-voltage negative terminal extend from both ends of the insulating shell respectively, and the ends used to connect the heating plate body are perpendicular to the end surface of the insulating shell.

2. A thick film heating plate assembly according to claim 1, characterized in that: The heating layer includes an insulating medium layer, a resistor layer, an electrode layer and an isolation layer which are printed and sintered in sequence in a non-co-firing form. The resistor layer includes a plurality of heating loads, and the electrode layer is used to electrically connect the heating loads of the resistor layer to form a heating circuit.

3. A thick film heating plate assembly according to claim 2, characterized in that: The electrode layers connect the heating loads of the resistor layers in parallel in pairs and then in series to form a heating circuit.

4. A thick film heating plate assembly according to claim 2 or 3, characterized in that: The heating layer has two heating circuits which are arranged on the left and right sides of the heating plate body respectively. The number of the wiring terminal rows is two and they are fixed on the left and right sides of the heating plate body respectively.

5. A thick film heating plate assembly according to claim 4, characterized in that: The heating layer also includes a high-voltage positive pin and a high-voltage negative pin connected to the heating circuit and used to be connected to the high-voltage positive terminal and the high-voltage negative terminal respectively.

6. A thick film heating plate assembly according to claim 1, characterized in that: The heating plate body also includes an NTC resistor for real-time monitoring of the temperature of the heating layer, and an NTC pin electrically connected to the NTC resistor; The terminal block also includes an NTC terminal arranged in the insulating housing. Two ends of the NTC terminal extend from two ends of the insulating housing respectively, and the end portion used for connecting the NTC pin is perpendicular to the end surface of the insulating housing.

7. A thick film heating plate assembly according to claim 1 or 6, characterized in that: The ends of the insulating shell are provided with protrusions corresponding to adjacent terminals.

8. A thick film heating plate assembly according to claim 1, characterized in that: A heat dissipation structure is arranged on the lower surface of the substrate, and the heat dissipation structure is a fin structure.

9. A thick film heating plate assembly according to claim 1, characterized in that: The sides of the substrate are correspondingly provided with mounting notches for embedding the wiring terminal block, and the two sides of the insulating shell of the wiring terminal block are correspondingly provided with bayonet holes matched with the mounting notches.

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