Circuit board assembly and socket
By using heat dissipation boards to replace glue-filled heat dissipation in circuit board components, the problems of complex processes and high costs in the prior art are solved, and the effects of simplifying manufacturing processes, improving production efficiency and reducing material costs and socket weight are achieved.
Patent Information
- Application Number
- CN202421739520.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-22
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2034-07-22
AI Technical Summary
Existing circuit board components use potting glue for heat dissipation during assembly, which is complex in the process, resulting in low production efficiency, high material costs and increased socket weight.
The heat dissipation plate is used to dissipate heat, instead of glue filling and heat dissipation, simplify manufacturing processes, improve production efficiency, and reduce material costs and socket weight. The specific implementation method is to achieve the heat dissipation effect by connecting the first primary board, the second primary board, the secondary board and the interface board to the end, and installing the heat dissipation plate sleeve on the first primary board, and the secondary board is located outside the heat dissipation plate to achieve the heat dissipation effect.
The manufacturing process is simplified, the production efficiency is improved, the material cost and socket weight are reduced, and the problems of complex and high cost of glue filling process in the existing technology are effectively solved.
Smart Images
Figure CN222827427U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of household electrical appliances, and in particular to a circuit board assembly and a socket. Background Art
[0002] During the assembly process of the circuit board assembly, potting glue is usually injected. After the potting glue solidifies, it can transfer heat and dissipate heat. However, the existing potting process is complicated, which leads to low production efficiency; and the high density of the potting glue will increase the material cost and make the socket heavier. Utility Model Content
[0003] The utility model provides a circuit board assembly and a socket, which can dissipate heat through a heat dissipation plate, replacing the glue-filling heat dissipation in the prior art, thereby simplifying the manufacturing process, improving production efficiency, and reducing material costs and socket weight.
[0004] The embodiments of the present invention can be implemented as follows:
[0005] An embodiment of the utility model provides a circuit board assembly, which includes:
[0006] a first primary board, a second primary board, a secondary board, an interface board, and a heat sink;
[0007] The first primary board, the second primary board, the secondary board and the interface board are connected end to end in sequence, the heat sink is sleeved on the first primary board, and the secondary board is located on the outer side of the heat sink.
[0008] Optionally, the heat sink includes a first heat sink and a second heat sink that are detachably connected, and the first heat sink and the second heat sink are respectively covered on two sides of the first primary plate.
[0009] Optionally, the second heat sink is located between the first primary board and the secondary board, and connecting pieces bent toward the first primary board are provided on both sides of the second heat sink, and the height of the connecting pieces is greater than the distance between the first primary board and the secondary board.
[0010] Optionally, the first heat sink is farther away from the secondary board than the second heat sink, a first positioning piece is bent on the first heat sink, a first positioning hole is formed on the first primary board, and the first positioning piece is accommodated in the first positioning hole.
[0011] Optionally, a buckle piece is stamped on the first heat sink, and a buckle hole is formed on the second heat sink, and the buckle piece is accommodated in the buckle hole.
[0012] Optionally, the circuit board assembly further includes an insulating sheet, which is sleeved on the first primary board and located between the first heat sink and the second heat sink.
[0013] Optionally, a limiting surface is formed on the insulating sheet, and the limiting surface abuts against the inner side of the first positioning sheet.
[0014] Optionally, the first primary board is plugged and matched with the second primary board and the interface board at the same time;
[0015] And / or, the secondary board is plugged and matched with the second primary board and the interface board at the same time.
[0016] Optionally, the first primary board and the second primary board are both provided with electronic components, and the electronic components are accommodated inside the heat dissipation plate.
[0017] Optionally, an electrical connection port is provided on a side of the secondary plate away from the heat sink, and the electrical connection port is used for connecting electrical components.
[0018] The embodiment of the utility model further provides a socket, comprising:
[0019] A housing, an electrical component and the circuit board assembly, wherein the electrical component and the circuit board assembly are both arranged in the housing, and the circuit board assembly is electrically connected to the electrical component through an electrical connection port.
[0020] The beneficial effects of the circuit board assembly and the socket of the embodiment of the utility model include, for example:
[0021] The circuit board assembly includes a first primary board, a second primary board, a secondary board, an interface board and a heat sink; wherein the first primary board, the second primary board, the secondary board and the interface board are connected end to end in sequence, the heat sink is sleeved on the first primary board, and the secondary board is located on the outside of the heat sink. During use, the first primary board, the second primary board, the secondary board and the interface board are connected end to end and fixed to each other, and the heat sink is sleeved on the first primary board to play a heat dissipation role, replacing the glue injection heat dissipation in the prior art, thereby simplifying the manufacturing process, improving production efficiency, and reducing material costs and socket weight.
[0022] The socket comprises a shell, electrical components and a circuit board assembly. The shell is used for containing and protecting the components. The socket has all the functions of the circuit board assembly. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0024] Figure 1 A schematic diagram of the assembly structure of a circuit board assembly provided in an embodiment of the utility model;
[0025] Figure 2 It is a schematic diagram of the exploded structure of the circuit board assembly provided in the embodiment of the utility model;
[0026] Figure 3 A schematic diagram of the structure of a heat sink provided in an embodiment of the present utility model;
[0027] Figure 4 It is a schematic diagram of the structure of the insulating sheet provided in the embodiment of the utility model;
[0028] Figure 5 A schematic diagram of the external structure of a socket provided in an embodiment of the utility model;
[0029] Figure 6 The figure is a schematic diagram of the internal structure of the socket provided in the embodiment of the utility model.
[0030] Icons: 100-circuit board assembly; 110-first primary board; 111-first positioning hole; 112-second positioning hole; 119-electrical connection groove; 120-second primary board; 121-second positioning plate; 130-secondary board; 131-electrical connection interface; 132-third positioning hole; 140-interface board; 141-third positioning plate; 150-heat sink; 151-first heat sink; 1511-first positioning plate; 1512-snap-on plate; 152-second heat sink; 1521-snap-on hole; 1522-connecting plate; 160-insulating plate; 161-limiting surface; 170-electronic component; 200-housing; 300-electrical component; 1000-socket. DETAILED DESCRIPTION
[0031] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.
[0032] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0033] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0034] In the description of the present utility model, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the accompanying drawings, or is the orientation or position relationship in which the utility model product is usually placed when used. It is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present utility model.
[0035] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.
[0036] The terms "comprises," "comprising," or any other variation thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.
[0037] Unless otherwise clearly specified and limited, the terms "disposed", "connected" and the like should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.
[0038] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention may be combined with each other.
[0039] Please refer to Figure 1 and Figure 5The circuit board assembly 100 and the socket 1000 provided in the embodiment of the utility model can solve the above-mentioned problems, which will be described in detail below.
[0040] refer to Figure 1 and Figure 2 , the circuit board assembly 100 includes a first primary board 110, a second primary board 120, a secondary board 130, an interface board 140 and a heat sink 150;
[0041] Among them, the first primary board 110, the second primary board 120, the secondary board 130 and the interface board 140 are connected end to end in sequence, the heat sink 150 is sleeved on the first primary board 110, the secondary board 130 is located on the outside of the heat sink 150, and an electrical connection port 131 is provided on the side of the secondary board 130 away from the heat sink 150.
[0042] During use, the first primary board 110, the second primary board 120, the secondary board 130 and the interface board 140 are connected end to end and then fixed to each other, and the electrical connection port 131 provided on the secondary board 130 is electrically connected to the external components, and the heat sink 150 is mounted on the first primary board 110 to dissipate heat, replacing the glue pouring heat dissipation in the prior art, thereby simplifying the manufacturing process, improving production efficiency, and reducing material costs and the weight of the socket 1000.
[0043] In this embodiment, the electrical connection port 131 is arranged on the secondary board 130 close to the interface board 140; in other embodiments of the utility model, the electrical connection port 131 can be arranged in the middle position of the secondary board 130, or arranged on the secondary board 130 close to the second primary board 120, and the specific setting position of the electrical connection port 131 is not limited.
[0044] It is worth noting that electronic components 170 are disposed on the first primary board 110 and the second primary board 120. The electronic components 170 are accommodated on the inner side of the heat sink 150. When the electronic components 170 generate heat during operation, the heat sink 150 can also dissipate heat therefrom, thereby improving the heat dissipation effect.
[0045] To improve the connection stability of each board, the first primary board 110 can be plugged with the second primary board 120 and the interface board 140 at the same time, and the secondary board 130 can be plugged with the second primary board 120 and the interface board 140 at the same time.
[0046] Specifically, the first primary board 110 is provided with second positioning holes 112 near both ends, the second primary board 120 is provided with second positioning plates 121 near both ends, the secondary board 130 is provided with third positioning holes 132 near both ends, and the interface board 140 is provided with third positioning plates 141 near both ends. Both the second positioning plates 121 and the third positioning plates 141 can be used to insert into the second positioning holes 112 and the third positioning holes 132 to achieve plug-in fit between adjacent panels.
[0047] In this embodiment, the number of the second positioning holes 112, the third positioning holes 132, the second positioning plates 121 and the third positioning plates 141 are all multiple, and the shapes of the same holes or plates can be different, and there is no limitation on the shapes and numbers of the specific holes and plates.
[0048] refer to Figure 2 and Figure 3 The heat sink 150 includes a first heat sink 151 and a second heat sink 152 that are detachably connected. The first heat sink 151 and the second heat sink 152 are respectively covered on both sides of the first primary plate 110. By making the first heat sink 151 and the second heat sink 152 detachably connected, the convenience of disassembly and assembly of the heat sink 150 can be improved.
[0049] In this embodiment, the first heat sink 151 and the second heat sink 152 are both U-shaped, with their openings arranged opposite to each other and their U-shaped ends overlapping, thereby facilitating the first positioning piece 1511 to match with the first positioning hole 111 .
[0050] Specifically, a buckle piece 1512 is stamped on the first heat sink 151, and a buckle hole 1521 is formed on the second heat sink 152, and the buckle piece 1512 is accommodated in the buckle hole 1521. A guide slope is formed on the buckle piece 1512, which can play a guiding role during the assembly process to reduce the assembly resistance of the first heat sink 151 and the second heat sink 152.
[0051] Furthermore, the first heat sink 151 is away from the secondary board 130 relative to the second heat sink 152, a first positioning piece 1511 is bent on the first heat sink 151, a first positioning hole 111 is provided on the first primary board 110, and the first positioning piece 1511 is accommodated in the first positioning hole 111. When the first heat sink 151 is placed on the upper side of the first primary board 110, the first positioning piece 1511 can be inserted into the first positioning hole 111, thereby improving the connection stability between the first heat sink 151 and the first primary board 110.
[0052] In this embodiment, the number of the first positioning pieces 1511 and the number of the first positioning holes 111 are both two, and the two first positioning pieces 1511 are respectively located at the positions of the same end portion on the first heat sink 151 close to both sides, and the two first positioning holes 111 are respectively located at the positions of the same end portion on the first primary plate 110 close to both sides. In other embodiments of the utility model, the number of the first positioning pieces 1511 and the first positioning holes 111 can also be one, three, five, etc., and the specific number of the two is not limited.
[0053] Furthermore, the second heat sink 152 is located between the first primary plate 110 and the secondary plate 130. Connecting pieces 1522 bent toward the first primary plate 110 are provided on both sides of the second heat sink 152. The height of the connecting piece 1522 is greater than the distance between the first primary plate 110 and the secondary plate 130. Even if the first heat sink 151 and the second heat sink are separated, the second heat sink 152 can be ensured not to fall off easily, thereby continuing to play a heat dissipation role.
[0054] refer to Figure 2 and Figure 4 The circuit board assembly 100 further includes an insulating sheet 160, which is sleeved on the first primary board 110 and located between the first heat sink 151 and the second heat sink 152. The insulating sheet 160 is used to insulate between the heat sink 150 and the first primary board 110 to prevent the heat sink 150 from being charged and affecting the heat dissipation performance.
[0055] Furthermore, in order to improve the relative position stability between the insulating sheet 160 and the first heat sink 151, a limited surface 161 may be formed on the insulating sheet 160, and the limited surface 161 abuts against the inner side of the first positioning sheet 1511. Then, the outer side of the insulating sheet 160 is bonded to the inner side of the first heat sink 151 to prevent the insulating sheet 160 from being easily separated from the first heat sink 151.
[0056] In this embodiment, the insulating sheet 160 is U-shaped, and the two ends of the insulating sheet 160 are used to approach each other during the process of being sleeved on the first primary board 110, so that the U-shaped opening is closed. It can be understood that when the U-shaped opening of the insulating sheet 160 is open, the first primary board 110 is first placed inside the U of the insulating sheet 160, and then the two ends of the U of the insulating sheet 160 overlap to close the opening, thereby achieving the sleeve of the insulating sheet 160 on the first primary board 110.
[0057] It is worth noting that because the insulating sheet 160 and the heat sink 150 are simultaneously provided on both sides of the first primary board 110, in order to ensure the electrical connection capability of the first primary board 110, the first primary board 110 can be provided with an electrical connection groove 119 at the end away from the interface board 140. The electrical connection groove 119 is used to accommodate electrical connectors of other components, and the connection stability between the electrical connector and the electrical connection groove 119 is ensured by soldering.
[0058] refer to Figure 5 and Figure 6 The embodiment of the utility model further provides a socket 1000, including a shell 200, an electrical component 300 and a circuit board assembly 100, wherein the electrical component 300 and the circuit board assembly 100 are both arranged in the shell 200, and the circuit board assembly 100 is electrically connected to the electrical component 300 through an electrical connection port 131.
[0059] It should be noted that the electrical component 300 can specifically be a socket component, a switch component or a screen component, and its specific type is not limited; the circuit board assembly 100 in this embodiment is connected to the screen component through the electrical connection port 131.
[0060] In summary, the circuit board assembly 100 and the socket 1000 provided by the embodiment of the present invention have at least the following advantages:
[0061] (1) The circuit board assembly 100 can connect the first primary board 110, the second primary board 120, the secondary board 130 and the interface board 140 end to end and fix them to each other, and the heat sink 150 is mounted on the first primary board 110 to play a heat dissipation role, replacing the glue pouring heat dissipation in the prior art, thereby simplifying the manufacturing process, improving production efficiency, and reducing material costs and the weight of the socket 1000.
[0062] (2) The circuit board assembly 100 allows the first primary board 110 to be plugged and matched with the second primary board 120 and the interface board 140 at the same time, and allows the secondary board 130 to be plugged and matched with the second primary board 120 and the interface board 140 at the same time, thereby improving the connection stability of each board.
[0063] (3) The circuit board assembly 100 is provided with a detachably connected first heat sink 151 and a second heat sink 152, so that the two can be conveniently connected and sleeved on the first primary board 110, thereby improving the convenience of disassembly and assembly while ensuring the heat dissipation performance.
[0064] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the utility model should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.
Claims
1. A circuit board assembly, characterized in that: include: A first primary board (110), a second primary board (120), a secondary board (130), an interface board (140) and a heat sink (150); The first primary board (110), the second primary board (120), the secondary board (130) and the interface board (140) are connected end to end in sequence, the heat sink (150) is sleeved on the first primary board (110), and the secondary board (130) is located on the outer side of the heat sink (150).
2. The circuit board assembly according to claim 1, characterized in that: The heat dissipation plate (150) comprises a first heat dissipation fin (151) and a second heat dissipation fin (152) which are detachably connected, and the first heat dissipation fin (151) and the second heat dissipation fin (152) are respectively covered on two sides of the first primary plate (110).
3. The circuit board assembly according to claim 2, characterized in that: The second heat sink (152) is located between the first primary plate (110) and the secondary plate (130), and connecting plates (1522) bent toward the first primary plate (110) are provided on both sides of the second heat sink (152), and the height of the connecting plates (1522) is greater than the distance between the first primary plate (110) and the secondary plate (130).
4. The circuit board assembly according to claim 2, characterized in that: The first heat sink (151) is away from the secondary plate (130) relative to the second heat sink (152), a first positioning plate (1511) is bent on the first heat sink (151), a first positioning hole (111) is opened on the first primary plate (110), and the first positioning plate (1511) is accommodated in the first positioning hole (111).
5. The circuit board assembly according to claim 4, characterized in that: A buckle plate (1512) is stamped on the first heat sink (151), a buckle hole (1521) is opened on the second heat sink (152), and the buckle plate (1512) is accommodated in the buckle hole (1521).
6. The circuit board assembly according to claim 4, characterized in that: The circuit board assembly further comprises an insulating sheet (160), wherein the insulating sheet (160) is sleeved on the first primary board (110) and is located between the first heat sink (151) and the second heat sink (152).
7. The circuit board assembly according to claim 6, characterized in that: A limiting surface (161) is formed on the insulating sheet (160), and the limiting surface (161) is pressed against the inner side of the first positioning sheet (1511).
8. The circuit board assembly according to any one of claims 1 to 7, characterized in that: The first primary board (110) is plugged and matched with the second primary board (120) and the interface board (140) at the same time; And / or, the secondary board (130) is plug-matched with the second primary board (120) and the interface board (140) at the same time.
9. The circuit board assembly according to any one of claims 1 to 7, characterized in that: The first primary board (110) and the second primary board (120) are both provided with electronic components (170), and the electronic components (170) are accommodated inside the heat dissipation plate (150).
10. The circuit board assembly according to any one of claims 1 to 7, characterized in that: An electrical connection port (131) is provided on a side of the secondary plate (130) away from the heat dissipation plate (150), and the electrical connection port is used to connect an electrical component (300).
11. A socket, characterized in that: include: A housing (200), an electrical component (300), and a circuit board assembly as claimed in any one of claims 1 to 10, wherein the electrical component (300) and the circuit board assembly are both arranged in the housing (200), and the circuit board assembly is electrically connected to the electrical component (300) via an electrical connection port (131).